JP2013539218A5 - - Google Patents
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- Publication number
- JP2013539218A5 JP2013539218A5 JP2013527470A JP2013527470A JP2013539218A5 JP 2013539218 A5 JP2013539218 A5 JP 2013539218A5 JP 2013527470 A JP2013527470 A JP 2013527470A JP 2013527470 A JP2013527470 A JP 2013527470A JP 2013539218 A5 JP2013539218 A5 JP 2013539218A5
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- pcb
- ground layer
- support substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 60
- 239000002184 metal Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 11
- 230000003071 parasitic effect Effects 0.000 claims description 11
- MINPZZUPSSVGJN-UHFFFAOYSA-N 1,1,1,4,4,4-hexachlorobutane Chemical compound ClC(Cl)(Cl)CCC(Cl)(Cl)Cl MINPZZUPSSVGJN-UHFFFAOYSA-N 0.000 claims description 9
- 101150049492 DVR gene Proteins 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 claims 8
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 claims 8
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 claims 2
- 238000001465 metallisation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 6
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010035453.8 | 2010-08-26 | ||
| DE102010035453A DE102010035453A1 (de) | 2010-08-26 | 2010-08-26 | Mehrebenenleiterplatte für Hochfrequenz-Anwendungen |
| PCT/DE2011/001625 WO2012025100A1 (de) | 2010-08-26 | 2011-08-17 | Mehrebenenleiterplatte für hochfrequenz-anwendungen |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013539218A JP2013539218A (ja) | 2013-10-17 |
| JP2013539218A5 true JP2013539218A5 (enExample) | 2015-09-03 |
| JP5863801B2 JP5863801B2 (ja) | 2016-02-17 |
Family
ID=45420519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013527470A Active JP5863801B2 (ja) | 2010-08-26 | 2011-08-17 | 高周波に使用するための多平面印刷配線板 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8878074B2 (enExample) |
| EP (1) | EP2609796B1 (enExample) |
| JP (1) | JP5863801B2 (enExample) |
| DE (2) | DE102010035453A1 (enExample) |
| WO (1) | WO2012025100A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104125760A (zh) * | 2013-04-29 | 2014-10-29 | 鸿富锦精密工业（深圳）有限公司 | 防电磁辐射的显示装置 |
| WO2015122203A1 (ja) * | 2014-02-12 | 2015-08-20 | 株式会社村田製作所 | プリント基板 |
| JP6244958B2 (ja) * | 2014-02-12 | 2017-12-13 | 株式会社村田製作所 | 半導体装置 |
| CN107404806B (zh) * | 2016-05-18 | 2020-12-01 | 德昌电机(深圳)有限公司 | 印刷电路板及电机 |
| JP2018018935A (ja) * | 2016-07-27 | 2018-02-01 | イビデン株式会社 | プリント配線板及びその製造方法 |
| KR102636487B1 (ko) | 2018-10-26 | 2024-02-14 | 삼성전자주식회사 | 신호 전송기 및 이를 구비하는 반도체 소자 검사 장치 |
| CN113727542B (zh) * | 2021-08-30 | 2023-06-20 | 四创电子股份有限公司 | 一种超低损耗及高散热的高频印制电路板的制作方法 |
| CN117320254A (zh) * | 2022-06-24 | 2023-12-29 | 华为技术有限公司 | 电路板及终端 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0758663B2 (ja) * | 1989-12-19 | 1995-06-21 | 松下電器産業株式会社 | 厚膜コンデンサ |
| JPH0427201A (ja) * | 1990-05-22 | 1992-01-30 | Maspro Denkoh Corp | 妨害波除去フィルタ |
| JP3160929B2 (ja) * | 1991-04-24 | 2001-04-25 | ソニー株式会社 | 高周波処理装置 |
| US5886597A (en) * | 1997-03-28 | 1999-03-23 | Virginia Tech Intellectual Properties, Inc. | Circuit structure including RF/wideband resonant vias |
| US6104258A (en) * | 1998-05-19 | 2000-08-15 | Sun Microsystems, Inc. | System and method for edge termination of parallel conductive planes in an electrical interconnecting apparatus |
| US6775150B1 (en) * | 2000-08-30 | 2004-08-10 | Intel Corporation | Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture |
| DE10042653A1 (de) * | 2000-08-31 | 2002-03-28 | Bosch Gmbh Robert | Keramische Mehrlagenschaltung |
| JP2003060359A (ja) * | 2001-08-20 | 2003-02-28 | Tdk Corp | 多層回路基板 |
| TWI220070B (en) * | 2002-12-31 | 2004-08-01 | Advanced Semiconductor Eng | High-frequency substrate |
| DE10347284A1 (de) * | 2003-10-08 | 2005-05-25 | Innosent Gmbh | Elektronischer Schaltkreis |
| US7183651B1 (en) | 2004-06-15 | 2007-02-27 | Storage Technology Corporation | Power plane decoupling |
| JP2006303020A (ja) * | 2005-04-18 | 2006-11-02 | Mitsubishi Electric Corp | コンデンサ内蔵プリント配線板 |
| TWI295102B (en) * | 2006-01-13 | 2008-03-21 | Ind Tech Res Inst | Multi-functional substrate structure |
| WO2008018875A1 (en) | 2006-08-09 | 2008-02-14 | Geomat Insights, Llc | Integral charge storage basement and wideband embedded decoupling structure for integrated circuit |
| JP5155582B2 (ja) * | 2007-03-30 | 2013-03-06 | 京セラ株式会社 | 配線基板および電子装置 |
| US8492658B2 (en) * | 2010-11-16 | 2013-07-23 | International Business Machines Corporation | Laminate capacitor stack inside a printed circuit board for electromagnetic compatibility capacitance |
-
2010
- 2010-08-26 DE DE102010035453A patent/DE102010035453A1/de not_active Withdrawn
-
2011
- 2011-08-17 WO PCT/DE2011/001625 patent/WO2012025100A1/de not_active Ceased
- 2011-08-17 JP JP2013527470A patent/JP5863801B2/ja active Active
- 2011-08-17 DE DE112011102175T patent/DE112011102175A5/de not_active Withdrawn
- 2011-08-17 EP EP11802260.7A patent/EP2609796B1/de active Active
- 2011-08-17 US US13/819,052 patent/US8878074B2/en active Active
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