JP5845143B2 - エピタキシャルシリコンウェーハの製造方法、および、エピタキシャルシリコンウェーハ - Google Patents

エピタキシャルシリコンウェーハの製造方法、および、エピタキシャルシリコンウェーハ Download PDF

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JP5845143B2
JP5845143B2 JP2012146636A JP2012146636A JP5845143B2 JP 5845143 B2 JP5845143 B2 JP 5845143B2 JP 2012146636 A JP2012146636 A JP 2012146636A JP 2012146636 A JP2012146636 A JP 2012146636A JP 5845143 B2 JP5845143 B2 JP 5845143B2
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silicon wafer
epitaxial
manufacturing
single crystal
crystal ingot
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JP2014011293A (ja
JP2014011293A5 (enExample
Inventor
正 川島
正 川島
直哉 野中
直哉 野中
正行 品川
正行 品川
剛 上園
剛 上園
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Sumco Techxiv Corp
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Sumco Techxiv Corp
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Priority to JP2012146636A priority Critical patent/JP5845143B2/ja
Priority to US13/925,267 priority patent/US9425264B2/en
Priority to KR1020130072869A priority patent/KR101473784B1/ko
Publication of JP2014011293A publication Critical patent/JP2014011293A/ja
Publication of JP2014011293A5 publication Critical patent/JP2014011293A5/ja
Priority to US14/850,194 priority patent/US9755022B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/834—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge further characterised by the dopants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H01L21/02576—N-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02658—Pretreatments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Recrystallisation Techniques (AREA)
JP2012146636A 2012-06-29 2012-06-29 エピタキシャルシリコンウェーハの製造方法、および、エピタキシャルシリコンウェーハ Active JP5845143B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012146636A JP5845143B2 (ja) 2012-06-29 2012-06-29 エピタキシャルシリコンウェーハの製造方法、および、エピタキシャルシリコンウェーハ
US13/925,267 US9425264B2 (en) 2012-06-29 2013-06-24 Method for growing an epitaxial film on a phosphorous-doped silicon wafer
KR1020130072869A KR101473784B1 (ko) 2012-06-29 2013-06-25 에피택셜 실리콘 웨이퍼의 제조 방법 및, 에피택셜 실리콘 웨이퍼
US14/850,194 US9755022B2 (en) 2012-06-29 2015-09-10 Epitaxial silicon wafer having reduced stacking faults

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JP2012146636A JP5845143B2 (ja) 2012-06-29 2012-06-29 エピタキシャルシリコンウェーハの製造方法、および、エピタキシャルシリコンウェーハ

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JP2014011293A5 JP2014011293A5 (enExample) 2015-04-23
JP5845143B2 true JP5845143B2 (ja) 2016-01-20

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12046469B2 (en) 2020-02-19 2024-07-23 Globalwafers Japan Co., Ltd. Manufacturing method for semiconductor silicon wafer
US12308228B2 (en) 2020-02-19 2025-05-20 Globalwafers Japan Co., Ltd. Manufacturing method for semiconductor silicon wafer

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US10233562B2 (en) 2013-04-24 2019-03-19 Sumco Techxiv Corporation Method for producing single crystal, and method for producing silicon wafer
CN106797207B (zh) * 2014-12-17 2021-04-20 株式会社村田制作所 压电振子以及压电振动装置
JP6477210B2 (ja) 2015-04-30 2019-03-06 株式会社Sumco エピタキシャルシリコンウェーハの製造方法
JP6369388B2 (ja) * 2015-05-13 2018-08-08 信越半導体株式会社 シリコン単結晶基板の評価方法
JP6432879B2 (ja) * 2015-11-13 2018-12-05 信越半導体株式会社 エピタキシャルウェーハの製造方法
JP6447960B2 (ja) * 2016-04-01 2019-01-09 信越半導体株式会社 シリコンエピタキシャルウェーハの製造方法
JP6372709B2 (ja) * 2016-04-20 2018-08-15 信越半導体株式会社 エピタキシャルウェーハの製造方法
JP6598140B2 (ja) * 2016-05-19 2019-10-30 信越半導体株式会社 エピタキシャルウェーハの製造方法
CN110603350B (zh) 2017-04-06 2021-07-16 胜高股份有限公司 外延硅晶片的制造方法及外延硅晶片
JP6897764B2 (ja) 2017-04-25 2021-07-07 株式会社Sumco シリコン単結晶の製造方法、および、エピタキシャルシリコンウェーハの製造方法
CN108878310B (zh) * 2017-05-12 2022-01-25 无锡华润安盛科技有限公司 芯片切割系统及其控制电路
CN109509704B (zh) * 2017-09-15 2024-08-09 胜高股份有限公司 外延硅晶片的制备方法
JP6835006B2 (ja) * 2018-02-16 2021-02-24 株式会社Sumco エピタキシャルシリコンウェーハにおける積層欠陥の発生予測方法及びエピタキシャルシリコンウェーハの製造方法
JP6713493B2 (ja) * 2018-02-26 2020-06-24 株式会社Sumco エピタキシャルシリコンウェーハの製造方法及びエピタキシャルシリコンウェーハ
JP7491705B2 (ja) * 2020-02-19 2024-05-28 グローバルウェーハズ・ジャパン株式会社 半導体シリコンウェーハの製造方法
EP4154320A1 (en) * 2020-07-02 2023-03-29 Atomera Incorporated Method for making a semiconductor device using superlattices with different non-semiconductor thermal stabilities
CN112426527B (zh) * 2020-11-30 2021-09-28 南京大学 一种具有抗肿瘤功能的二维红磷纳米材料
JP7757916B2 (ja) * 2021-11-04 2025-10-22 株式会社Sumco シリコンウェーハおよびエピタキシャルシリコンウェーハ
JP7757917B2 (ja) * 2021-11-04 2025-10-22 株式会社Sumco シリコンウェーハおよびエピタキシャルシリコンウェーハ
JP7775800B2 (ja) * 2022-09-08 2025-11-26 株式会社Sumco シリコンウェーハおよびエピタキシャルシリコンウェーハ

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12046469B2 (en) 2020-02-19 2024-07-23 Globalwafers Japan Co., Ltd. Manufacturing method for semiconductor silicon wafer
US12308228B2 (en) 2020-02-19 2025-05-20 Globalwafers Japan Co., Ltd. Manufacturing method for semiconductor silicon wafer

Also Published As

Publication number Publication date
US9425264B2 (en) 2016-08-23
KR101473784B1 (ko) 2014-12-17
JP2014011293A (ja) 2014-01-20
US20150380493A1 (en) 2015-12-31
US9755022B2 (en) 2017-09-05
US20140001605A1 (en) 2014-01-02
KR20140002509A (ko) 2014-01-08

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