JP5821689B2 - 基板処理装置、基板処理方法及び記憶媒体 - Google Patents

基板処理装置、基板処理方法及び記憶媒体 Download PDF

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Publication number
JP5821689B2
JP5821689B2 JP2012038947A JP2012038947A JP5821689B2 JP 5821689 B2 JP5821689 B2 JP 5821689B2 JP 2012038947 A JP2012038947 A JP 2012038947A JP 2012038947 A JP2012038947 A JP 2012038947A JP 5821689 B2 JP5821689 B2 JP 5821689B2
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substrate
control
job
control job
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Japanese (ja)
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JP2012235087A (ja
JP2012235087A5 (enExample
Inventor
丈志 松本
丈志 松本
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2012038947A priority Critical patent/JP5821689B2/ja
Priority to KR1020120040979A priority patent/KR101842242B1/ko
Priority to TW101113942A priority patent/TWI525733B/zh
Priority to US13/450,590 priority patent/US9396978B2/en
Publication of JP2012235087A publication Critical patent/JP2012235087A/ja
Publication of JP2012235087A5 publication Critical patent/JP2012235087A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2012038947A 2011-04-20 2012-02-24 基板処理装置、基板処理方法及び記憶媒体 Active JP5821689B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012038947A JP5821689B2 (ja) 2011-04-20 2012-02-24 基板処理装置、基板処理方法及び記憶媒体
KR1020120040979A KR101842242B1 (ko) 2011-04-20 2012-04-19 기판 처리 장치, 기판 처리 방법 및 기억 매체
TW101113942A TWI525733B (zh) 2011-04-20 2012-04-19 A substrate processing apparatus, a substrate processing method, and a memory medium
US13/450,590 US9396978B2 (en) 2011-04-20 2012-04-19 Substrate processing apparatus, substrate processing method and storage medium

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011094015 2011-04-20
JP2011094015 2011-04-20
JP2012038947A JP5821689B2 (ja) 2011-04-20 2012-02-24 基板処理装置、基板処理方法及び記憶媒体

Publications (3)

Publication Number Publication Date
JP2012235087A JP2012235087A (ja) 2012-11-29
JP2012235087A5 JP2012235087A5 (enExample) 2014-03-06
JP5821689B2 true JP5821689B2 (ja) 2015-11-24

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JP2012038947A Active JP5821689B2 (ja) 2011-04-20 2012-02-24 基板処理装置、基板処理方法及び記憶媒体

Country Status (4)

Country Link
US (1) US9396978B2 (enExample)
JP (1) JP5821689B2 (enExample)
KR (1) KR101842242B1 (enExample)
TW (1) TWI525733B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5128918B2 (ja) * 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP6097569B2 (ja) * 2013-01-17 2017-03-15 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置および基板処理列制御方法
JP5987796B2 (ja) * 2013-07-24 2016-09-07 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6216193B2 (ja) * 2013-09-11 2017-10-18 株式会社荏原製作所 ユニット制御盤、基板の受け渡しテスト方法、及び基板処理装置
US10522472B2 (en) 2016-09-08 2019-12-31 Asml Netherlands B.V. Secure chips with serial numbers
US10418324B2 (en) 2016-10-27 2019-09-17 Asml Netherlands B.V. Fabricating unique chips using a charged particle multi-beamlet lithography system
JP7170438B2 (ja) * 2018-07-03 2022-11-14 東京エレクトロン株式会社 基板処理装置及び判定方法
US12276027B2 (en) * 2019-03-28 2025-04-15 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP7235597B2 (ja) * 2019-06-03 2023-03-08 株式会社ディスコ 加工装置
JP7454467B2 (ja) * 2020-08-03 2024-03-22 株式会社荏原製作所 基板処理システム、基板処理システムの制御装置及び基板処理システムの運転方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6714832B1 (en) * 1996-09-11 2004-03-30 Hitachi, Ltd. Operating method of vacuum processing system and vacuum processing system
JP2001093791A (ja) * 1999-09-20 2001-04-06 Hitachi Ltd 真空処理装置の運転方法及びウエハの処理方法
US6618682B2 (en) * 2001-04-20 2003-09-09 International Business Machines Corporation Method for test optimization using historical and actual fabrication test data
JP4557986B2 (ja) * 2004-11-24 2010-10-06 株式会社日立国際電気 基板処理装置及び半導体デバイスの製造方法
US9305814B2 (en) * 2004-12-20 2016-04-05 Tokyo Electron Limited Method of inspecting substrate processing apparatus and storage medium storing inspection program for executing the method
JP4560022B2 (ja) * 2006-09-12 2010-10-13 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体
JP4828503B2 (ja) * 2007-10-16 2011-11-30 東京エレクトロン株式会社 基板処理装置、基板搬送方法、コンピュータプログラムおよび記憶媒体
JP5552265B2 (ja) * 2009-06-24 2014-07-16 東京エレクトロン株式会社 基板処理装置の制御方法及び記憶媒体
JP5575507B2 (ja) * 2010-03-02 2014-08-20 株式会社日立国際電気 基板処理装置、基板搬送方法、半導体装置の製造方法および基板処理装置のメンテナンス方法

Also Published As

Publication number Publication date
US20120271444A1 (en) 2012-10-25
KR101842242B1 (ko) 2018-05-14
TWI525733B (zh) 2016-03-11
JP2012235087A (ja) 2012-11-29
KR20120120051A (ko) 2012-11-01
TW201308477A (zh) 2013-02-16
US9396978B2 (en) 2016-07-19

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