TWI525733B - A substrate processing apparatus, a substrate processing method, and a memory medium - Google Patents
A substrate processing apparatus, a substrate processing method, and a memory medium Download PDFInfo
- Publication number
- TWI525733B TWI525733B TW101113942A TW101113942A TWI525733B TW I525733 B TWI525733 B TW I525733B TW 101113942 A TW101113942 A TW 101113942A TW 101113942 A TW101113942 A TW 101113942A TW I525733 B TWI525733 B TW I525733B
- Authority
- TW
- Taiwan
- Prior art keywords
- control
- workpiece
- substrate
- executed
- workpieces
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims description 79
- 239000000758 substrate Substances 0.000 title claims description 78
- 238000003672 processing method Methods 0.000 title claims description 11
- 238000012790 confirmation Methods 0.000 claims description 55
- 238000000034 method Methods 0.000 claims description 22
- 230000032258 transport Effects 0.000 claims description 21
- 238000012546 transfer Methods 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 16
- 230000007246 mechanism Effects 0.000 claims description 13
- 230000007723 transport mechanism Effects 0.000 claims description 7
- 238000009472 formulation Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 238000004590 computer program Methods 0.000 claims 1
- 238000010276 construction Methods 0.000 claims 1
- 238000004140 cleaning Methods 0.000 description 66
- 235000012431 wafers Nutrition 0.000 description 63
- 239000007788 liquid Substances 0.000 description 10
- 238000005406 washing Methods 0.000 description 10
- 230000006870 function Effects 0.000 description 8
- 239000013078 crystal Substances 0.000 description 4
- 101150075071 TRS1 gene Proteins 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 101100365087 Arabidopsis thaliana SCRA gene Proteins 0.000 description 2
- 101150105073 SCR1 gene Proteins 0.000 description 2
- 101100134054 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) NTG1 gene Proteins 0.000 description 2
- 238000004380 ashing Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011094015 | 2011-04-20 | ||
| JP2012038947A JP5821689B2 (ja) | 2011-04-20 | 2012-02-24 | 基板処理装置、基板処理方法及び記憶媒体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201308477A TW201308477A (zh) | 2013-02-16 |
| TWI525733B true TWI525733B (zh) | 2016-03-11 |
Family
ID=47021940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101113942A TWI525733B (zh) | 2011-04-20 | 2012-04-19 | A substrate processing apparatus, a substrate processing method, and a memory medium |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9396978B2 (enExample) |
| JP (1) | JP5821689B2 (enExample) |
| KR (1) | KR101842242B1 (enExample) |
| TW (1) | TWI525733B (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5006122B2 (ja) | 2007-06-29 | 2012-08-22 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP5128918B2 (ja) * | 2007-11-30 | 2013-01-23 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP5001828B2 (ja) | 2007-12-28 | 2012-08-15 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP5179170B2 (ja) | 2007-12-28 | 2013-04-10 | 株式会社Ｓｏｋｕｄｏ | 基板処理装置 |
| JP6097569B2 (ja) * | 2013-01-17 | 2017-03-15 | 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ | 基板処理装置および基板処理列制御方法 |
| JP5987796B2 (ja) * | 2013-07-24 | 2016-09-07 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
| JP6216193B2 (ja) * | 2013-09-11 | 2017-10-18 | 株式会社荏原製作所 | ユニット制御盤、基板の受け渡しテスト方法、及び基板処理装置 |
| US10522472B2 (en) | 2016-09-08 | 2019-12-31 | Asml Netherlands B.V. | Secure chips with serial numbers |
| US10418324B2 (en) | 2016-10-27 | 2019-09-17 | Asml Netherlands B.V. | Fabricating unique chips using a charged particle multi-beamlet lithography system |
| JP7170438B2 (ja) * | 2018-07-03 | 2022-11-14 | 東京エレクトロン株式会社 | 基板処理装置及び判定方法 |
| US12276027B2 (en) * | 2019-03-28 | 2025-04-15 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
| JP7235597B2 (ja) * | 2019-06-03 | 2023-03-08 | 株式会社ディスコ | 加工装置 |
| JP7454467B2 (ja) * | 2020-08-03 | 2024-03-22 | 株式会社荏原製作所 | 基板処理システム、基板処理システムの制御装置及び基板処理システムの運転方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6714832B1 (en) * | 1996-09-11 | 2004-03-30 | Hitachi, Ltd. | Operating method of vacuum processing system and vacuum processing system |
| JP2001093791A (ja) * | 1999-09-20 | 2001-04-06 | Hitachi Ltd | 真空処理装置の運転方法及びウエハの処理方法 |
| US6618682B2 (en) * | 2001-04-20 | 2003-09-09 | International Business Machines Corporation | Method for test optimization using historical and actual fabrication test data |
| JP4557986B2 (ja) * | 2004-11-24 | 2010-10-06 | 株式会社日立国際電気 | 基板処理装置及び半導体デバイスの製造方法 |
| US9305814B2 (en) * | 2004-12-20 | 2016-04-05 | Tokyo Electron Limited | Method of inspecting substrate processing apparatus and storage medium storing inspection program for executing the method |
| JP4560022B2 (ja) * | 2006-09-12 | 2010-10-13 | 東京エレクトロン株式会社 | 塗布、現像装置及び塗布、現像装置の制御方法並びに記憶媒体 |
| JP4828503B2 (ja) * | 2007-10-16 | 2011-11-30 | 東京エレクトロン株式会社 | 基板処理装置、基板搬送方法、コンピュータプログラムおよび記憶媒体 |
| JP5552265B2 (ja) * | 2009-06-24 | 2014-07-16 | 東京エレクトロン株式会社 | 基板処理装置の制御方法及び記憶媒体 |
| JP5575507B2 (ja) * | 2010-03-02 | 2014-08-20 | 株式会社日立国際電気 | 基板処理装置、基板搬送方法、半導体装置の製造方法および基板処理装置のメンテナンス方法 |
-
2012
- 2012-02-24 JP JP2012038947A patent/JP5821689B2/ja active Active
- 2012-04-19 US US13/450,590 patent/US9396978B2/en active Active
- 2012-04-19 TW TW101113942A patent/TWI525733B/zh active
- 2012-04-19 KR KR1020120040979A patent/KR101842242B1/ko active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20120271444A1 (en) | 2012-10-25 |
| KR101842242B1 (ko) | 2018-05-14 |
| JP2012235087A (ja) | 2012-11-29 |
| KR20120120051A (ko) | 2012-11-01 |
| TW201308477A (zh) | 2013-02-16 |
| US9396978B2 (en) | 2016-07-19 |
| JP5821689B2 (ja) | 2015-11-24 |
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