JP5773536B2 - 基板の微粒子なしハンドリングのためのデバイス - Google Patents
基板の微粒子なしハンドリングのためのデバイス Download PDFInfo
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- JP5773536B2 JP5773536B2 JP2012512357A JP2012512357A JP5773536B2 JP 5773536 B2 JP5773536 B2 JP 5773536B2 JP 2012512357 A JP2012512357 A JP 2012512357A JP 2012512357 A JP2012512357 A JP 2012512357A JP 5773536 B2 JP5773536 B2 JP 5773536B2
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- 239000000758 substrate Substances 0.000 title claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 13
- 229910052710 silicon Inorganic materials 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 13
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 28
- 230000032258 transport Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 3
- 230000006698 induction Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003339 best practice Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000739 chaotic effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C32/00—Bearings not otherwise provided for
- F16C32/04—Bearings not otherwise provided for using magnetic or electric supporting means
- F16C32/0406—Magnetic bearings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H49/00—Other gearings
- F16H49/005—Magnetic gearings with physical contact between gears
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Non-Mechanical Conveyors (AREA)
- Manipulator (AREA)
Description
2 受動コンポーネント
3 能動コンポーネント
4 磁気軸受け
5 磁気軸受け
6 電磁結合デバイス
7 ドライブモータ
8 永久磁石
9 コイル
10 リフトユニット
11 外側チューブ
12 磁気軸受け
13 内側チューブ
14 リフトモータ
15 コイル配置構成
16 磁化可能バー
17 ロータリドライブ
18 自由端
19 ハンドラ
20 フォーク
21 シリコンウェハ
22 磁気軸受け
23 電磁ドライブ
Claims (9)
- クリーンルーム条件下のミニエンバイロンメント内でのマイクロ技術の基板を微粒子なしでハンドリングするためのデバイスであって、
前記デバイスが、ハンドラでもってx軸、y軸およびz軸に沿って基板を搬送するのに適合しており、このハンドラがその自由端に電磁可動フォークを備えており、
前記ハンドラが垂直なリフトロータリユニットに支持されており、かつ昇降可能および水平方向に旋回可能であるデバイスにおいて、
一つの能動コンポーネント(3)が、側面に固定された第一の磁気軸受け(4,5)により受動コンポーネント(2)内で支持されており、この第一の磁気軸受けが受動コンポーネント(2)上で可動の能動コンポーネント(3)を平衡状態かつ非接触状態で保持し、前記能動コンポーネント(3)が、前記リフトロータリユニット(10)を備え、このリフトロータリユニットが前記能動コンポーネント(3)上で起立して固定された外側チューブ(11)を備えており、外側チューブ(11)の内側には、一つあるいは複数の高さに第二の磁気軸受け(12)が配置されており、これらの第二の磁気軸受けは外側チューブ(11)の内周面に規則正しく配置されて、内側チューブ(13)を非接触でかつ二つの端部位置の間で案内することを特徴とするデバイス。 - 前記可動の能動コンポーネント(3)が、起立して固定された前記受動コンポーネント(2)上の第一の磁気軸受け(4,5)にわたって懸垂保持しながら誘導され、前記能動コンポーネント(3)に配設されたドライブモータ(7)が、電磁結合デバイス(6)を通じてエネルギー供給部に接続され、前記能動コンポーネントに、ハンドラ(19)を有するリフトロータリユニット(10)が配設されていること、および
前記電磁結合デバイスが、前記能動コンポーネント(3)上で、前記受動コンポーネント(2)に固定されたコイル(9)に向い合って配置されており、このコイルが、前記能動コンポーネント(3)にエネルギーを伝達するための送信アンテナとして使用されることを特徴とする請求項1に記載のデバイス。 - 前記能動コンポーネント(3)が、この能動コンポーネント上に配置されたドライブモータ(7)を備え、このドライブモータがリニアモータとして設計されていることを特徴とする請求項1または2に記載のデバイス。
- 中央リフトモータ(14)が、前記内側チューブ(13)内に配設されており、起立して固定されたコイル機構(15)と磁化可能な内側バー(16)が、内側チューブ(13)に垂直に配設可能であることを特徴とする請求項1〜3のいずれか一つに記載のデバイス。
- 前記内側バー(16)の周囲に配置され、かつこの内側バーから間隔をおいた内側チューブ(13)を制御可能に回転させるために、電磁ロータリドライブ(17)が、前記内側チューブ(13)内に配設されていることを特徴とする請求項4に記載のデバイス。
- 前記リフトロータリユニット(10)が、外側チューブ(11)の内側円周表面に4つの第二の磁気軸受け(12)を備えており、これら第二の磁気軸受けが、1つまたは複数の高さに配置され、かつ磁気軸受け間で各々90°の角度オフセットをもって配設され、垂直方向に接触することなく内側チューブ(13)を支持し、内側チューブが2つの端部位置間で支持されて可動であることを特徴とする請求項1〜5のいずれか一つに記載のデバイス。
- 前記内側チューブ(13)の上側自由端(18)が、シリコンウェハ(21)を保持し搬送するためのハンドラ(19)のような更なるコンポーネントを保持するために使用されることを特徴とする請求項1〜6のいずれか一つに記載のデバイス。
- 電磁可動フォーク(20)が、シリコンウェハ(21)を支持するためにハンドラ(19)に配設されていることを特徴とする請求項1〜7のいずれか一つに記載のデバイス。
- 前記ハンドラ(19)が、電磁可動フォーク(20)を後退させるかあるいは引出すために第三の磁気軸受け(22)と電磁ドライブ(23)を備えていることを特徴とする請求項8に記載のデバイス。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009022987 | 2009-05-28 | ||
DE102009022987.6 | 2009-05-28 | ||
DE102009038756.0 | 2009-08-27 | ||
DE102009038756A DE102009038756A1 (de) | 2009-05-28 | 2009-08-27 | Vorrichtung zur partikelfreien Handhabung von Substraten |
PCT/EP2010/057236 WO2010136488A1 (en) | 2009-05-28 | 2010-05-26 | Device for particle free handling of substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012528478A JP2012528478A (ja) | 2012-11-12 |
JP5773536B2 true JP5773536B2 (ja) | 2015-09-02 |
Family
ID=43049402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012512357A Expired - Fee Related JP5773536B2 (ja) | 2009-05-28 | 2010-05-26 | 基板の微粒子なしハンドリングのためのデバイス |
Country Status (11)
Country | Link |
---|---|
US (1) | US20120121371A1 (ja) |
EP (1) | EP2436030B1 (ja) |
JP (1) | JP5773536B2 (ja) |
KR (1) | KR101401007B1 (ja) |
CN (1) | CN102449753A (ja) |
DE (1) | DE102009038756A1 (ja) |
IL (1) | IL216150A0 (ja) |
RU (1) | RU2510546C2 (ja) |
SG (1) | SG176030A1 (ja) |
TW (1) | TWI453854B (ja) |
WO (1) | WO2010136488A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012200220A1 (de) * | 2011-06-20 | 2012-12-20 | Semilev Gmbh | Verfahren zum Kalibrieren eines aktiv magnetgelagerten Roboters |
BR112015028396A2 (pt) * | 2013-05-13 | 2017-07-25 | Gardner James Joseph | sistema de acionamento magnético para mudar a direção de uma força comunicada através do mesmo, dispositivo, acoplamento magnético para comunicar força entre uma montagem alternada e uma montagem oscilante, e, método para a configuração de um acoplamento magnético |
DE102014003882B4 (de) * | 2014-03-19 | 2017-07-13 | Applied Materials, Inc. (N.D.Ges.D. Staates Delaware) | Transportvorrichtung zum Bewegen und/oder Positionieren von Objekten |
DE102014005547B4 (de) * | 2014-04-16 | 2016-09-15 | Mecatronix Ag | Vorrichtung und Verfahren zum Halten, Positionieren und/oder Bewegen eines Objekts |
DE102014005897B3 (de) * | 2014-04-25 | 2015-09-17 | Mecatronix Ag | Vorrichtung zum Halten, Positionieren und/oder Bewegen eines Objekts |
DE102015004582B4 (de) * | 2015-04-09 | 2017-02-09 | Mecatronix Ag | Vorrichtung zum Halten, Positionieren und Bewegen eines Objekts |
CN111466017B (zh) * | 2017-12-21 | 2023-10-20 | 东京毅力科创株式会社 | 基板支承构件、基板处理装置以及基板输送装置 |
DE102022123236A1 (de) | 2022-09-12 | 2024-03-14 | Mafu Robotics GmbH | Behandlung von Werkstücken insbesondere von Wafern |
WO2024079111A1 (de) * | 2022-10-12 | 2024-04-18 | Vacom Vakuum Komponenten & Messtechnik Gmbh | Vorrichtung zum halten, positionieren und/oder bewegen eines objektes in einem vakuum |
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JPH0648845Y2 (ja) * | 1988-04-04 | 1994-12-12 | 日新電機株式会社 | ウエハ搬送装置 |
JPH024024U (ja) * | 1988-06-20 | 1990-01-11 | ||
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JPH0623687A (ja) * | 1992-02-21 | 1994-02-01 | Ebara Corp | ロボット |
US5397212A (en) * | 1992-02-21 | 1995-03-14 | Ebara Corporation | Robot with dust-free and maintenance-free actuators |
JPH05277970A (ja) * | 1992-03-30 | 1993-10-26 | Ebara Corp | 搬送装置 |
EP0626724B1 (en) | 1992-12-14 | 2000-07-26 | Ebara Corporation | System for transferring wafer |
JP3350310B2 (ja) * | 1995-08-22 | 2002-11-25 | 株式会社荏原製作所 | ロボットアームのリニアアクチュエータ |
JPH1159901A (ja) | 1997-08-11 | 1999-03-02 | Murata Mach Ltd | キャリヤー移動装置 |
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JP3519595B2 (ja) * | 1998-03-31 | 2004-04-19 | 松下電器産業株式会社 | ウエハ搬送装置 |
JP2000286318A (ja) * | 1999-01-27 | 2000-10-13 | Shinko Electric Co Ltd | 搬送システム |
CN1996552B (zh) * | 2001-08-31 | 2012-09-05 | 克罗辛自动化公司 | 晶片机 |
TW579564B (en) * | 2001-08-31 | 2004-03-11 | Asyst Technologies | Unified frame, system for transferring semiconductor wafers and related substrate objects, and system for transporting wafers |
US20080181758A1 (en) * | 2007-01-29 | 2008-07-31 | Woodruff Daniel J | Microfeature workpiece transfer devices with rotational orientation sensors, and associated systems and methods |
TWI492826B (zh) * | 2007-06-27 | 2015-07-21 | Brooks Automation Inc | 具有磁浮主軸軸承的自動機械驅動器 |
-
2009
- 2009-08-27 DE DE102009038756A patent/DE102009038756A1/de not_active Withdrawn
-
2010
- 2010-05-26 KR KR1020117031328A patent/KR101401007B1/ko not_active IP Right Cessation
- 2010-05-26 JP JP2012512357A patent/JP5773536B2/ja not_active Expired - Fee Related
- 2010-05-26 SG SG2011083318A patent/SG176030A1/en unknown
- 2010-05-26 US US13/266,648 patent/US20120121371A1/en not_active Abandoned
- 2010-05-26 WO PCT/EP2010/057236 patent/WO2010136488A1/en active Application Filing
- 2010-05-26 EP EP10726021A patent/EP2436030B1/en not_active Not-in-force
- 2010-05-26 RU RU2011153241/28A patent/RU2510546C2/ru not_active IP Right Cessation
- 2010-05-26 CN CN2010800233321A patent/CN102449753A/zh active Pending
- 2010-05-27 TW TW099116948A patent/TWI453854B/zh not_active IP Right Cessation
-
2011
- 2011-11-03 IL IL216150A patent/IL216150A0/en unknown
Also Published As
Publication number | Publication date |
---|---|
RU2011153241A (ru) | 2013-07-27 |
IL216150A0 (en) | 2012-01-31 |
KR20120031183A (ko) | 2012-03-30 |
SG176030A1 (en) | 2011-12-29 |
US20120121371A1 (en) | 2012-05-17 |
CN102449753A (zh) | 2012-05-09 |
KR101401007B1 (ko) | 2014-05-29 |
EP2436030A1 (en) | 2012-04-04 |
TW201101410A (en) | 2011-01-01 |
RU2510546C2 (ru) | 2014-03-27 |
JP2012528478A (ja) | 2012-11-12 |
WO2010136488A1 (en) | 2010-12-02 |
EP2436030B1 (en) | 2013-03-27 |
TWI453854B (zh) | 2014-09-21 |
DE102009038756A1 (de) | 2010-12-09 |
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