JP2012528478A - 基板の微粒子なしハンドリングのためのデバイス - Google Patents
基板の微粒子なしハンドリングのためのデバイス Download PDFInfo
- Publication number
- JP2012528478A JP2012528478A JP2012512357A JP2012512357A JP2012528478A JP 2012528478 A JP2012528478 A JP 2012528478A JP 2012512357 A JP2012512357 A JP 2012512357A JP 2012512357 A JP2012512357 A JP 2012512357A JP 2012528478 A JP2012528478 A JP 2012528478A
- Authority
- JP
- Japan
- Prior art keywords
- axis
- active component
- stationary
- inner tube
- drive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 10
- 230000008878 coupling Effects 0.000 claims abstract description 6
- 238000010168 coupling process Methods 0.000 claims abstract description 6
- 238000005859 coupling reaction Methods 0.000 claims abstract description 6
- 230000005540 biological transmission Effects 0.000 claims abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 12
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- 230000006698 induction Effects 0.000 claims description 3
- 230000000284 resting effect Effects 0.000 claims description 2
- 230000005520 electrodynamics Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 28
- 230000032258 transport Effects 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000003339 best practice Methods 0.000 description 1
- 230000000739 chaotic effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
- B25J9/041—Cylindrical coordinate type
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C32/00—Bearings not otherwise provided for
- F16C32/04—Bearings not otherwise provided for using magnetic or electric supporting means
- F16C32/0406—Magnetic bearings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H49/00—Other gearings
- F16H49/005—Magnetic gearings with physical contact between gears
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Non-Mechanical Conveyors (AREA)
- Manipulator (AREA)
Abstract
Description
2 受動コンポーネント
3 能動コンポーネント
4 磁気軸受け
5 磁気軸受け
6 電磁結合デバイス
7 ドライブモータ
8 永久磁石
9 コイル
10 リフトユニット
11 外側チューブ
12 磁気軸受け
13 内側チューブ
14 リフトモータ
15 コイル配置構成
16 磁化可能バー
17 ロータリドライブ
18 自由端
19 ハンドラ
20 フォーク
21 シリコンウェハ
22 磁気軸受け
23 電磁ドライブ
Claims (12)
- クリーンルーム条件下のミニエンバイロンメント内でのマイクロ技術の基板の微粒子なしハンドリングのためのデバイスであって、いくつかの自由度が前記デバイスのために設計され、それにより、少なくともx軸、y軸、z軸、およびφ方向が、磁気的にかつ非接触で支持され、かつ/または、誘導され、それにより、前記軸および前記方向のそれぞれの支持および駆動が、非接触で電磁的に実行され、支持および駆動のためのエネルギーの伝送が非接触で実行され、少なくとも1つの能動コンポーネント(3)および少なくとも1つの受動コンポーネント(2)が設計されることを特徴とするデバイス。
- 磁石軸受けのための電磁石型磁気軸受け、電気力学型磁気軸受け、または永久磁石型磁気軸受けが設計されることを特徴とする請求項1に記載のデバイス。
- 前記エネルギーが、誘導によってまたは変圧器によって伝達されることを特徴とする請求項1に記載のデバイス。
- 前記軸が位置センサを備え、前記位置センサが前記センサデータを非接触で転送することを特徴とする請求項1〜3のいずれか一項に記載のデバイス。
- 前記センサデータが無線で転送されることを特徴とする請求項4に記載のデバイス。
- 作動要素が固定され、搬送ユニットが、前記作動要素によって非接触で移動させられることを特徴とする請求項1〜5のいずれか一項に記載のデバイス。
- 前記作動要素が、前記搬送ユニットと共に動くことを特徴とする請求項1〜5のいずれか一項に記載のデバイス。
- 可動の能動ユニット(3)が、前記固定静置受動コンポーネント(2)上の磁気軸受け(4,5)にわたって懸垂保持しながら誘導され、それにより、前記能動コンポーネント(3)に配設されたドライブモータ(7)が、結合ユニット(6)を通じてエネルギー供給部に接続され、前記能動コンポーネントに、ハンドラ(19)を有するリフトロータリユニット(10)が配設されることを特徴とする請求項1〜7のいずれか一項に記載のデバイス。
- 前記リフトロータリユニット(10)が、前記能動コンポーネント(3)上に固定静置された外側チューブ(11)を備え、1つまたは複数のレベル内で、前記外側チューブ(11)の内側表面上に規則的に配設された磁気軸受け(12)が配設されて、内側チューブ(13)を、非接触でかつ2つの端部位置間で垂直方向に誘導することを特徴とする請求項8記載のデバイス。
- 前記内側チューブ(13)内に中央リフトモータ(14)が配設され、前記内側チューブ内に固定静置されるバー(16)に機能的に接続されることを特徴とする請求項9記載のデバイス。
- 前記内側チューブ(13)内に電磁ロータリドライブ(17)が配設されて、前記固定静置バー(16)と反対の前記内側チューブ(13)の制御可能な回転が実施されることを特徴とする請求項9記載のデバイス。
- 電磁可動フォーク(20)が、シリコンウェハ(21)を支持するために前記ハンドラ(19)に配設される請求項8〜11に記載のデバイス。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009022987 | 2009-05-28 | ||
DE102009022987.6 | 2009-05-28 | ||
DE102009038756.0 | 2009-08-27 | ||
DE102009038756A DE102009038756A1 (de) | 2009-05-28 | 2009-08-27 | Vorrichtung zur partikelfreien Handhabung von Substraten |
PCT/EP2010/057236 WO2010136488A1 (en) | 2009-05-28 | 2010-05-26 | Device for particle free handling of substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012528478A true JP2012528478A (ja) | 2012-11-12 |
JP5773536B2 JP5773536B2 (ja) | 2015-09-02 |
Family
ID=43049402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012512357A Expired - Fee Related JP5773536B2 (ja) | 2009-05-28 | 2010-05-26 | 基板の微粒子なしハンドリングのためのデバイス |
Country Status (11)
Country | Link |
---|---|
US (1) | US20120121371A1 (ja) |
EP (1) | EP2436030B1 (ja) |
JP (1) | JP5773536B2 (ja) |
KR (1) | KR101401007B1 (ja) |
CN (1) | CN102449753A (ja) |
DE (1) | DE102009038756A1 (ja) |
IL (1) | IL216150A0 (ja) |
RU (1) | RU2510546C2 (ja) |
SG (1) | SG176030A1 (ja) |
TW (1) | TWI453854B (ja) |
WO (1) | WO2010136488A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019205342A (ja) * | 2015-04-09 | 2019-11-28 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 物体を保持、位置づけし、移動させるための装置 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012200220A1 (de) * | 2011-06-20 | 2012-12-20 | Semilev Gmbh | Verfahren zum Kalibrieren eines aktiv magnetgelagerten Roboters |
BR112015028396A2 (pt) * | 2013-05-13 | 2017-07-25 | Gardner James Joseph | sistema de acionamento magnético para mudar a direção de uma força comunicada através do mesmo, dispositivo, acoplamento magnético para comunicar força entre uma montagem alternada e uma montagem oscilante, e, método para a configuração de um acoplamento magnético |
DE102014003882B4 (de) * | 2014-03-19 | 2017-07-13 | Applied Materials, Inc. (N.D.Ges.D. Staates Delaware) | Transportvorrichtung zum Bewegen und/oder Positionieren von Objekten |
DE102014005547B4 (de) * | 2014-04-16 | 2016-09-15 | Mecatronix Ag | Vorrichtung und Verfahren zum Halten, Positionieren und/oder Bewegen eines Objekts |
DE102014005897B3 (de) * | 2014-04-25 | 2015-09-17 | Mecatronix Ag | Vorrichtung zum Halten, Positionieren und/oder Bewegen eines Objekts |
CN111466017B (zh) * | 2017-12-21 | 2023-10-20 | 东京毅力科创株式会社 | 基板支承构件、基板处理装置以及基板输送装置 |
DE102022123236A1 (de) | 2022-09-12 | 2024-03-14 | Mafu Robotics GmbH | Behandlung von Werkstücken insbesondere von Wafern |
WO2024079111A1 (de) * | 2022-10-12 | 2024-04-18 | Vacom Vakuum Komponenten & Messtechnik Gmbh | Vorrichtung zum halten, positionieren und/oder bewegen eines objektes in einem vakuum |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6149673A (ja) * | 1984-08-15 | 1986-03-11 | Nippon Telegr & Teleph Corp <Ntt> | 磁気浮上案内装置 |
JPH01153638U (ja) * | 1988-04-04 | 1989-10-23 | ||
JPH024024U (ja) * | 1988-06-20 | 1990-01-11 | ||
JPH05228881A (ja) * | 1992-02-21 | 1993-09-07 | Ebara Corp | ロボット |
JPH05277970A (ja) * | 1992-03-30 | 1993-10-26 | Ebara Corp | 搬送装置 |
JPH0623687A (ja) * | 1992-02-21 | 1994-02-01 | Ebara Corp | ロボット |
JPH0957672A (ja) * | 1995-08-22 | 1997-03-04 | Ebara Corp | ロボットアームのリニアアクチュエータ |
JPH11286331A (ja) * | 1998-03-31 | 1999-10-19 | Matsushita Electric Ind Co Ltd | ウエハ搬送装置 |
US20080181758A1 (en) * | 2007-01-29 | 2008-07-31 | Woodruff Daniel J | Microfeature workpiece transfer devices with rotational orientation sensors, and associated systems and methods |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SU966794A1 (ru) * | 1980-09-18 | 1982-10-15 | Предприятие П/Я Р-6707 | Устройство дл транспортировани деталей |
JP2732562B2 (ja) | 1986-05-14 | 1998-03-30 | 株式会社東芝 | 浮上式搬送装置 |
US5379212A (en) * | 1990-01-29 | 1995-01-03 | United States Voting Machines, Inc. | Locking memory device |
US5081439A (en) | 1990-11-16 | 1992-01-14 | International Business Machines Corporation | Thin film resistor and method for producing same |
JPH0828416B2 (ja) | 1991-02-20 | 1996-03-21 | 株式会社荏原製作所 | ウエハ移送ロボット |
JPH07114231B2 (ja) * | 1991-02-22 | 1995-12-06 | 株式会社荏原製作所 | ウエハ移送ロボット |
JPH0596478A (ja) | 1991-10-03 | 1993-04-20 | Seiko Seiki Co Ltd | 磁気浮上型搬送装置 |
JP3306890B2 (ja) * | 1992-01-24 | 2002-07-24 | 株式会社ダイフク | 移動体の無接触給電設備およびそのピックアップユニット |
US5397212A (en) * | 1992-02-21 | 1995-03-14 | Ebara Corporation | Robot with dust-free and maintenance-free actuators |
EP0626724B1 (en) | 1992-12-14 | 2000-07-26 | Ebara Corporation | System for transferring wafer |
JPH1159901A (ja) | 1997-08-11 | 1999-03-02 | Murata Mach Ltd | キャリヤー移動装置 |
JPH11121585A (ja) * | 1997-10-17 | 1999-04-30 | Olympus Optical Co Ltd | ウェハ搬送装置 |
JP2000286318A (ja) * | 1999-01-27 | 2000-10-13 | Shinko Electric Co Ltd | 搬送システム |
CN1996552B (zh) * | 2001-08-31 | 2012-09-05 | 克罗辛自动化公司 | 晶片机 |
TW579564B (en) * | 2001-08-31 | 2004-03-11 | Asyst Technologies | Unified frame, system for transferring semiconductor wafers and related substrate objects, and system for transporting wafers |
TWI492826B (zh) * | 2007-06-27 | 2015-07-21 | Brooks Automation Inc | 具有磁浮主軸軸承的自動機械驅動器 |
-
2009
- 2009-08-27 DE DE102009038756A patent/DE102009038756A1/de not_active Withdrawn
-
2010
- 2010-05-26 KR KR1020117031328A patent/KR101401007B1/ko not_active IP Right Cessation
- 2010-05-26 JP JP2012512357A patent/JP5773536B2/ja not_active Expired - Fee Related
- 2010-05-26 SG SG2011083318A patent/SG176030A1/en unknown
- 2010-05-26 US US13/266,648 patent/US20120121371A1/en not_active Abandoned
- 2010-05-26 WO PCT/EP2010/057236 patent/WO2010136488A1/en active Application Filing
- 2010-05-26 EP EP10726021A patent/EP2436030B1/en not_active Not-in-force
- 2010-05-26 RU RU2011153241/28A patent/RU2510546C2/ru not_active IP Right Cessation
- 2010-05-26 CN CN2010800233321A patent/CN102449753A/zh active Pending
- 2010-05-27 TW TW099116948A patent/TWI453854B/zh not_active IP Right Cessation
-
2011
- 2011-11-03 IL IL216150A patent/IL216150A0/en unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6149673A (ja) * | 1984-08-15 | 1986-03-11 | Nippon Telegr & Teleph Corp <Ntt> | 磁気浮上案内装置 |
JPH01153638U (ja) * | 1988-04-04 | 1989-10-23 | ||
JPH024024U (ja) * | 1988-06-20 | 1990-01-11 | ||
JPH05228881A (ja) * | 1992-02-21 | 1993-09-07 | Ebara Corp | ロボット |
JPH0623687A (ja) * | 1992-02-21 | 1994-02-01 | Ebara Corp | ロボット |
JPH05277970A (ja) * | 1992-03-30 | 1993-10-26 | Ebara Corp | 搬送装置 |
JPH0957672A (ja) * | 1995-08-22 | 1997-03-04 | Ebara Corp | ロボットアームのリニアアクチュエータ |
JPH11286331A (ja) * | 1998-03-31 | 1999-10-19 | Matsushita Electric Ind Co Ltd | ウエハ搬送装置 |
US20080181758A1 (en) * | 2007-01-29 | 2008-07-31 | Woodruff Daniel J | Microfeature workpiece transfer devices with rotational orientation sensors, and associated systems and methods |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019205342A (ja) * | 2015-04-09 | 2019-11-28 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 物体を保持、位置づけし、移動させるための装置 |
Also Published As
Publication number | Publication date |
---|---|
RU2011153241A (ru) | 2013-07-27 |
IL216150A0 (en) | 2012-01-31 |
KR20120031183A (ko) | 2012-03-30 |
SG176030A1 (en) | 2011-12-29 |
US20120121371A1 (en) | 2012-05-17 |
CN102449753A (zh) | 2012-05-09 |
KR101401007B1 (ko) | 2014-05-29 |
EP2436030A1 (en) | 2012-04-04 |
JP5773536B2 (ja) | 2015-09-02 |
TW201101410A (en) | 2011-01-01 |
RU2510546C2 (ru) | 2014-03-27 |
WO2010136488A1 (en) | 2010-12-02 |
EP2436030B1 (en) | 2013-03-27 |
TWI453854B (zh) | 2014-09-21 |
DE102009038756A1 (de) | 2010-12-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5773536B2 (ja) | 基板の微粒子なしハンドリングのためのデバイス | |
KR101041685B1 (ko) | 다축 진공 모터 조립체 | |
JP4543181B2 (ja) | 超電導磁気浮上による非接触搬送装置 | |
TWI707754B (zh) | 包括間隔上臂與交錯腕部的雙機器人以及包括該者之方法 | |
TWI724239B (zh) | 高架搬送系統及高架搬送車 | |
KR101854034B1 (ko) | 비접촉 주행 모듈 및 이를 포함하는 이송 장치 | |
WO2007069433A1 (ja) | 非接触型回転処理装置 | |
KR20130026363A (ko) | 로봇용 자기적 회전 하드스톱 | |
JP4671292B2 (ja) | 磁気的浮上回転処理装置 | |
JPWO2009084406A1 (ja) | 液処理装置、液処理方法および記憶媒体 | |
WO2021106799A1 (ja) | 基板搬送装置及び基板処理システム | |
KR20130093534A (ko) | 반송 장치 | |
US11545387B2 (en) | Magnetic integrated lift pin system for a chemical processing chamber | |
JP2007019216A (ja) | 基板の搬送ロボット | |
CN111432986B (zh) | 具有单独附件馈通的衬底运输装置 | |
JP4644766B2 (ja) | 非接触型被処理物回転処理装置 | |
TW202245120A (zh) | 基板搬運裝置、基板搬運方法及基板處理系統 | |
JP2024511791A (ja) | 非接触式の搬送装置 | |
KR100731997B1 (ko) | 자기부상 반송장치 및 그것을 사용한 기판 처리 시스템 | |
KR20210017168A (ko) | 캐리어 반송 장치 및 이를 구비하는 반송체 제어 시스템 | |
JP2020027849A (ja) | 基板回転装置、基板洗浄装置および基板処理装置ならびに基板回転装置の制御方法 | |
KR20230048947A (ko) | 기판 이송 장치 | |
JPH04264749A (ja) | ウエハ移送ロボット | |
KR20240056123A (ko) | 자기 부상형 구동 장치 및 이를 포함하는 반도체 제조 설비 | |
JP2023072556A (ja) | 基板搬送装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130531 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130618 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130917 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130925 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20131017 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20131024 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131101 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140422 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140708 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140715 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140819 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140826 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140919 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140929 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141017 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20141224 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150114 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150311 |
|
R155 | Notification before disposition of declining of application |
Free format text: JAPANESE INTERMEDIATE CODE: R155 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150629 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5773536 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |