JP5771221B2 - 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 - Google Patents
光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 Download PDFInfo
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- JP5771221B2 JP5771221B2 JP2012550744A JP2012550744A JP5771221B2 JP 5771221 B2 JP5771221 B2 JP 5771221B2 JP 2012550744 A JP2012550744 A JP 2012550744A JP 2012550744 A JP2012550744 A JP 2012550744A JP 5771221 B2 JP5771221 B2 JP 5771221B2
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- 150000003918 triazines Chemical class 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 150000007964 xanthones Chemical class 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical class O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0041—Photosensitive materials providing an etching agent upon exposure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials For Photolithography (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012550744A JP5771221B2 (ja) | 2010-12-28 | 2011-06-17 | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010292815 | 2010-12-28 | ||
| JP2010292815 | 2010-12-28 | ||
| PCT/JP2011/063913 WO2012090532A1 (ja) | 2010-12-28 | 2011-06-17 | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
| JP2012550744A JP5771221B2 (ja) | 2010-12-28 | 2011-06-17 | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014262618A Division JP5876925B2 (ja) | 2010-12-28 | 2014-12-25 | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2012090532A1 JPWO2012090532A1 (ja) | 2014-06-05 |
| JP5771221B2 true JP5771221B2 (ja) | 2015-08-26 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012550744A Active JP5771221B2 (ja) | 2010-12-28 | 2011-06-17 | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
| JP2014262618A Active JP5876925B2 (ja) | 2010-12-28 | 2014-12-25 | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014262618A Active JP5876925B2 (ja) | 2010-12-28 | 2014-12-25 | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP5771221B2 (zh) |
| KR (2) | KR20160003294A (zh) |
| CN (1) | CN103299242B (zh) |
| TW (1) | TWI514074B (zh) |
| WO (1) | WO2012090532A1 (zh) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012255925A (ja) * | 2011-06-09 | 2012-12-27 | Hitachi Chem Co Ltd | 感光性樹脂組成物、並びにこれを用いた感光性エレメント及び永久レジスト |
| CN104380197B (zh) * | 2012-05-17 | 2019-01-01 | 太阳油墨制造株式会社 | 碱显影型的热固化性树脂组合物、印刷电路板 |
| JP5458215B1 (ja) * | 2013-03-11 | 2014-04-02 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物、そのドライフィルムおよび硬化物、並びにそれらを用いて形成された硬化皮膜を有するプリント配線板 |
| JP5576545B1 (ja) * | 2013-03-11 | 2014-08-20 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物、そのドライフィルムおよび硬化物、並びにそれらを用いて形成された硬化皮膜を有するプリント配線板 |
| JP5852633B2 (ja) * | 2013-07-04 | 2016-02-03 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、その硬化物、これを有するプリント配線板、及び硬化物の製造方法 |
| JP5882510B2 (ja) | 2014-06-30 | 2016-03-09 | 太陽インキ製造株式会社 | 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法 |
| JP6227617B2 (ja) * | 2014-06-30 | 2017-11-08 | 太陽インキ製造株式会社 | 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法 |
| JP6424150B2 (ja) * | 2014-09-30 | 2018-11-14 | 富士フイルム株式会社 | 凹凸構造を有する物品の製造方法および凹凸構造を有する物品 |
| WO2016052026A1 (ja) * | 2014-09-30 | 2016-04-07 | 富士フイルム株式会社 | 凹凸構造を有する物品の製造方法及び凹凸構造を有する物品 |
| JP6321059B2 (ja) * | 2015-02-18 | 2018-05-09 | 株式会社タムラ製作所 | 感光性樹脂組成物 |
| JP6538390B2 (ja) * | 2015-03-24 | 2019-07-03 | 株式会社タムラ製作所 | 感光性樹脂組成物 |
| JP6260566B2 (ja) * | 2015-03-25 | 2018-01-17 | 株式会社オートネットワーク技術研究所 | 回路構成体 |
| CN106226996A (zh) * | 2016-09-20 | 2016-12-14 | 深圳市容大感光科技股份有限公司 | 光致抗蚀抗电镀剂组合物、其应用及包括其膜层的基材 |
| JP6677203B2 (ja) | 2017-03-28 | 2020-04-08 | 味の素株式会社 | 感光性樹脂組成物、感光性フィルム、支持体付き感光性フィルム、プリント配線板及び半導体装置 |
| TW201940342A (zh) * | 2018-02-26 | 2019-10-16 | 日商旭化成股份有限公司 | 轉印膜、使用轉印膜之樹脂圖案之製造方法、及硬化膜圖案之製造方法 |
| US11820915B2 (en) * | 2018-12-14 | 2023-11-21 | Swimc Llc | Fusion bonded epoxy rebar powder coatings |
| KR102608843B1 (ko) * | 2019-09-30 | 2023-12-04 | 다이요 홀딩스 가부시키가이샤 | 배선 기판용 기재의 재이용 방법 |
| JP7354963B2 (ja) * | 2020-08-25 | 2023-10-03 | 味の素株式会社 | 感光性樹脂組成物 |
| KR20240007526A (ko) * | 2022-07-08 | 2024-01-16 | 엘지이노텍 주식회사 | 수지 조성물 및 이를 포함하는 조명장치 |
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| JPH11240930A (ja) * | 1997-11-28 | 1999-09-07 | Hitachi Chem Co Ltd | 光硬化性樹脂組成物及びこれを用いた感光性エレメント |
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-
2011
- 2011-06-17 CN CN201180063164.3A patent/CN103299242B/zh active Active
- 2011-06-17 KR KR1020157035295A patent/KR20160003294A/ko not_active Application Discontinuation
- 2011-06-17 KR KR1020137019865A patent/KR20130099219A/ko active Application Filing
- 2011-06-17 JP JP2012550744A patent/JP5771221B2/ja active Active
- 2011-06-17 WO PCT/JP2011/063913 patent/WO2012090532A1/ja active Application Filing
- 2011-07-08 TW TW100124203A patent/TWI514074B/zh active
-
2014
- 2014-12-25 JP JP2014262618A patent/JP5876925B2/ja active Active
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| JPH11240930A (ja) * | 1997-11-28 | 1999-09-07 | Hitachi Chem Co Ltd | 光硬化性樹脂組成物及びこれを用いた感光性エレメント |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP5876925B2 (ja) | 2016-03-02 |
| JPWO2012090532A1 (ja) | 2014-06-05 |
| TWI514074B (zh) | 2015-12-21 |
| CN103299242A (zh) | 2013-09-11 |
| WO2012090532A1 (ja) | 2012-07-05 |
| CN103299242B (zh) | 2016-08-10 |
| JP2015064612A (ja) | 2015-04-09 |
| TW201227172A (en) | 2012-07-01 |
| KR20160003294A (ko) | 2016-01-08 |
| KR20130099219A (ko) | 2013-09-05 |
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