JP5770038B2 - 粘着シート - Google Patents

粘着シート Download PDF

Info

Publication number
JP5770038B2
JP5770038B2 JP2011162390A JP2011162390A JP5770038B2 JP 5770038 B2 JP5770038 B2 JP 5770038B2 JP 2011162390 A JP2011162390 A JP 2011162390A JP 2011162390 A JP2011162390 A JP 2011162390A JP 5770038 B2 JP5770038 B2 JP 5770038B2
Authority
JP
Japan
Prior art keywords
sensitive adhesive
pressure
adhesive sheet
anchor coat
coat layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011162390A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013023665A (ja
JP2013023665A5 (OSRAM
Inventor
由希 衛藤
由希 衛藤
和幸 田村
和幸 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=47597436&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP5770038(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2011162390A priority Critical patent/JP5770038B2/ja
Priority to US13/557,439 priority patent/US20130029137A1/en
Priority to KR1020120081210A priority patent/KR20130012575A/ko
Publication of JP2013023665A publication Critical patent/JP2013023665A/ja
Publication of JP2013023665A5 publication Critical patent/JP2013023665A5/ja
Application granted granted Critical
Publication of JP5770038B2 publication Critical patent/JP5770038B2/ja
Priority to KR1020190082766A priority patent/KR102106145B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/003—Presence of (meth)acrylic polymer in the primer coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2011162390A 2011-07-25 2011-07-25 粘着シート Active JP5770038B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011162390A JP5770038B2 (ja) 2011-07-25 2011-07-25 粘着シート
US13/557,439 US20130029137A1 (en) 2011-07-25 2012-07-25 Adhesive Sheet
KR1020120081210A KR20130012575A (ko) 2011-07-25 2012-07-25 점착 시트
KR1020190082766A KR102106145B1 (ko) 2011-07-25 2019-07-09 점착 시트

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011162390A JP5770038B2 (ja) 2011-07-25 2011-07-25 粘着シート

Publications (3)

Publication Number Publication Date
JP2013023665A JP2013023665A (ja) 2013-02-04
JP2013023665A5 JP2013023665A5 (OSRAM) 2014-07-03
JP5770038B2 true JP5770038B2 (ja) 2015-08-26

Family

ID=47597436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011162390A Active JP5770038B2 (ja) 2011-07-25 2011-07-25 粘着シート

Country Status (3)

Country Link
US (1) US20130029137A1 (OSRAM)
JP (1) JP5770038B2 (OSRAM)
KR (2) KR20130012575A (OSRAM)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5946708B2 (ja) * 2012-07-11 2016-07-06 積水化学工業株式会社 粘着テープ
JP6095468B2 (ja) * 2013-05-07 2017-03-15 三井化学株式会社 プラスチック偏光レンズ及びその製造方法
WO2016100021A1 (en) * 2014-12-19 2016-06-23 3M Innovative Properties Company Adhesive article comprising a poly(meth)acrylate-based primer layer and methods of making same
WO2017078037A1 (ja) * 2015-11-04 2017-05-11 リンテック株式会社 硬化性樹脂フィルム、第１保護膜形成用シート及びバンプ形成面保護方法
JP6126722B2 (ja) * 2016-04-14 2017-05-10 積水化学工業株式会社 粘着テープ
JP7042667B2 (ja) 2018-03-28 2022-03-28 古河電気工業株式会社 半導体チップの製造方法
CN110305592A (zh) * 2019-05-23 2019-10-08 南通康尔乐复合材料有限公司 一种重工泡棉双面胶带及制作工艺
JP7490399B2 (ja) * 2020-03-13 2024-05-27 日東電工株式会社 再剥離粘着テープ
DE102020118671A1 (de) * 2020-07-15 2022-01-20 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung eines bauelements und optoelektronisches bauelement
JP7626648B2 (ja) 2021-03-31 2025-02-04 マクセル株式会社 ワーク加工用粘着テープ
JP7626647B2 (ja) 2021-03-31 2025-02-04 マクセル株式会社 ワーク加工用粘着テープ
CN118077037A (zh) * 2021-10-20 2024-05-24 电化株式会社 用于具有凸部的半导体晶圆的加工用粘合片的基材
JP2025148220A (ja) 2024-03-25 2025-10-07 リンテック株式会社 ワーク加工用テープおよび積層体の製造方法
JP2025148219A (ja) 2024-03-25 2025-10-07 リンテック株式会社 ワーク加工用テープおよび積層体の製造方法

Family Cites Families (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4867330A (OSRAM) * 1971-12-20 1973-09-14
US4724026A (en) * 1985-02-05 1988-02-09 Omnicrom Systems Corporation Process for selective transfer of metallic foils to xerographic images
JPS6279649A (ja) * 1985-10-03 1987-04-13 Mitsui Toatsu Chem Inc 半導体ダイシング方法
US5187007A (en) * 1985-12-27 1993-02-16 Lintec Corporation Adhesive sheets
FR2602777B1 (fr) * 1986-08-12 1988-11-10 Rhone Poulenc Films Procede de revetement de films en polyester et nouveaux films comportant un revetement de surface
JPH01232301A (ja) * 1988-03-14 1989-09-18 Nippon Zeon Co Ltd 防眩フィルター
US5096767A (en) * 1989-02-03 1992-03-17 Mitsubishi Paper Mills Limited Alkali-removable label support and label
US5002976A (en) * 1989-02-23 1991-03-26 Radcure Specialties, Inc. Radiation curable acrylate polyesters
EP0475592A3 (en) * 1990-09-10 1992-08-19 Minnesota Mining And Manufacturing Company Coated article having improved adhesion to organic coatings
US5445871A (en) * 1990-10-30 1995-08-29 Kansai Paint Co., Ltd. Surface-modified plastic plate
US5275918A (en) * 1991-02-27 1994-01-04 E. I. Du Pont De Nemours And Company Ultraviolet curable heat activatable transfer toners
JP3262607B2 (ja) * 1992-11-09 2002-03-04 日本カーバイド工業株式会社 活性エネルギー線硬化型粘接着性組成物及びテープ
JPH07171491A (ja) * 1993-12-21 1995-07-11 Sekisui Finechem Co Ltd 光硬化性塗料の塗布硬化方法
JP3372332B2 (ja) * 1993-12-27 2003-02-04 三井化学株式会社 半導体ウエハ裏面研削用フィルムの製造方法
JPH07193032A (ja) * 1993-12-27 1995-07-28 Mitsui Toatsu Chem Inc 半導体ウエハ裏面研削用フィルムの製造方法
US6887640B2 (en) * 2002-02-28 2005-05-03 Sukun Zhang Energy activated electrographic printing process
TW311927B (OSRAM) * 1995-07-11 1997-08-01 Minnesota Mining & Mfg
US5700302A (en) * 1996-03-15 1997-12-23 Minnesota Mining And Manufacturing Company Radiation curable abrasive article with tie coat and method
US5891530A (en) * 1996-04-19 1999-04-06 Minnesota Mining And Manufacturing Company Method for producing a coating
JPH09328663A (ja) * 1996-06-10 1997-12-22 Toyo Chem Co Ltd 半導体ウエハ固定用シート
US5905012A (en) * 1996-07-26 1999-05-18 Agfa-Gevaert, N.V. Radiation curable toner particles
DE19743564A1 (de) * 1996-10-26 1998-04-30 Henkel Kgaa Lösungsmittelfreie strahlungshärtbare Primer
EP1017794A1 (en) * 1997-02-06 2000-07-12 Novo Nordisk A/S Polypeptide-polymer conjugates having added and/or removed attachment groups
JPH10279891A (ja) * 1997-04-10 1998-10-20 Sliontec:Kk 接着シート及び該シートを用いた装飾骨材搭載シート
TW442537B (en) * 1997-04-24 2001-06-23 Ind Tech Res Inst Mixed emulsion composition and method for making the same
JPH11279408A (ja) * 1997-06-02 1999-10-12 Dainippon Ink & Chem Inc 水性樹脂の製造法、水性硬化性樹脂組成物および水性塗料
JP3659795B2 (ja) * 1998-03-17 2005-06-15 電気化学工業株式会社 粘着シート
US6235387B1 (en) * 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
US6174061B1 (en) * 1998-03-31 2001-01-16 Raytheon Company Compact electro-optical sensor assembly having single aperture for multiple detectors
EP0960900B1 (en) * 1998-05-25 2004-01-14 Toyo Boseki Kabushiki Kaisha Thermoplastic laminate film
JP3739570B2 (ja) * 1998-06-02 2006-01-25 リンテック株式会社 粘着シートおよびその利用方法
CA2239671C (en) * 1998-06-04 2007-10-02 H.B. Fuller Licensing & Financing, Inc. Waterborne primer and oxygen barrier coating with improved adhesion
JP3669196B2 (ja) * 1998-07-27 2005-07-06 日東電工株式会社 紫外線硬化型粘着シート
US6165609A (en) * 1998-10-30 2000-12-26 Avery Dennison Corporation Security coatings for label materials
CN1137028C (zh) * 1998-11-20 2004-02-04 琳得科株式会社 压敏粘合片及其使用方法
JP2000158859A (ja) * 1998-11-30 2000-06-13 Toppan Forms Co Ltd 感圧接着性プリント用シート
JP3727192B2 (ja) * 1999-03-01 2005-12-14 株式会社きもと 透明導電性薄膜易接着フィルム及びこれを用いたタッチパネル
JP4531883B2 (ja) * 1999-03-25 2010-08-25 リンテック株式会社 帯電防止性粘着シート
JP2000281991A (ja) * 1999-03-30 2000-10-10 Toyo Chem Co Ltd 半導体ウエハ固定用シート
DE19920799A1 (de) * 1999-05-06 2000-11-16 Basf Coatings Ag Thermisch und mit aktinischer Strahlung härtbarer Beschichtungsstoff und seine Verwendung
US7641966B2 (en) * 1999-06-14 2010-01-05 Nitto Denko Corporation Re-release adhesive and re-release adhesive sheet
DE19961402A1 (de) * 1999-12-20 2001-07-05 Basf Coatings Ag Verfahren zur Herstellung von Beschichtungen aus thermisch und mit aktinischer Strahlung härtbaren Beschichtungstoffen
GB0005612D0 (en) * 2000-03-09 2000-05-03 Avecia Bv Aqueous polymer compositions
DE10012580A1 (de) * 2000-03-15 2001-09-27 Basf Coatings Ag Verfahren zur Herstellung von Beschichtungen, Klebschichten und Dichtungen aus mit aktinischer Strahlung härtbaren Beschichtungsstoffen, Klebstoffen und Dichtungsmassen
JP4597323B2 (ja) * 2000-07-07 2010-12-15 リンテック株式会社 紫外線硬化型粘着剤組成物および紫外線硬化性粘着シート
JP2002060529A (ja) * 2000-08-22 2002-02-26 Fuji Photo Film Co Ltd 高密着ハードコートフィルム
DE10064552B4 (de) * 2000-12-22 2004-10-07 Nexpress Solutions Llc Verfahren und Maschine zum Bedrucken und/oder Beschichten eines Substrats
US20020156144A1 (en) * 2001-02-09 2002-10-24 Williams Kevin Alan UV-curable, non-chlorinated adhesion promoters
JP5201379B2 (ja) * 2001-03-26 2013-06-05 リケンテクノス株式会社 アンカーコート剤、易接着性基材フィルム及び積層フィルム
US6720042B2 (en) * 2001-04-18 2004-04-13 3M Innovative Properties Company Primed substrates comprising radiation cured ink jetted images
JP4812963B2 (ja) * 2001-05-18 2011-11-09 リンテック株式会社 半導体ウエハ加工用粘着シートおよび半導体ウエハの加工方法
JP3926117B2 (ja) * 2001-07-17 2007-06-06 リンテック株式会社 ハードコートフィルム
US7201969B2 (en) * 2002-03-27 2007-04-10 Mitsui Chemicals, Inc. Pressure-sensitive adhesive film for the surface protection of semiconductor wafers and method for protection of semiconductor wafers with the film
KR100490885B1 (ko) 2002-04-17 2005-05-19 중앙대학교 산학협력단 직각 교차 실린더를 이용한 영상기반 렌더링 방법
JP2005255706A (ja) * 2004-03-09 2005-09-22 Lintec Corp 粘接着剤組成物、光ディスク製造用シートおよび光ディスク
JP4367769B2 (ja) * 2004-04-13 2009-11-18 日東電工株式会社 半導体ウエハ保持保護用粘着シートおよび半導体ウエハの裏面研削方法
DE102004023637A1 (de) * 2004-05-10 2005-12-08 Tesa Ag UV-vernetzende Blockcopolymere
JP4574234B2 (ja) * 2004-06-02 2010-11-04 リンテック株式会社 半導体加工用粘着シートおよび半導体チップの製造方法
US20060252234A1 (en) * 2004-07-07 2006-11-09 Lintec Corporation Hardenable pressure sensitive adhesive sheet for dicing/die-bonding and method for manufacturing semiconductor device
JP2006143915A (ja) * 2004-11-22 2006-06-08 Lintec Corp 粘着シート及びその製造方法
TWI333672B (en) * 2005-03-29 2010-11-21 Furukawa Electric Co Ltd Wafer-dicing adhesive tape and method of producing chips using the same
EP1879941A1 (en) * 2005-05-04 2008-01-23 Cytec Surface Specialties, S.A. Radiation curable methacrylate polyesters
US7544458B2 (en) * 2005-07-27 2009-06-09 Hewlett-Packard Development Company, L.P. Composition, method and device for liquid electrophotographic printing
JP5063016B2 (ja) * 2006-03-23 2012-10-31 リンテック株式会社 粘着シート及び剥離シート
US7935424B2 (en) * 2006-04-06 2011-05-03 Lintec Corporation Adhesive sheet
JP5283838B2 (ja) * 2006-11-04 2013-09-04 日東電工株式会社 熱剥離性粘着シート及び被着体回収方法
JP5049620B2 (ja) * 2007-03-20 2012-10-17 リンテック株式会社 粘着シート
TW200909549A (en) * 2007-04-13 2009-03-01 3M Innovative Properties Co Antistatic optically clear pressure sensitive adhesive
JP5032231B2 (ja) * 2007-07-23 2012-09-26 リンテック株式会社 半導体装置の製造方法
EP2025506B1 (de) * 2007-08-13 2010-11-03 Tesa Se Klebeband mit einem Träger aus zumindest einer Schaumschicht
JP5608957B2 (ja) * 2007-09-27 2014-10-22 横浜ゴム株式会社 硬化性樹脂組成物
US20090123746A1 (en) * 2007-11-12 2009-05-14 Lintec Corporation Adhesive sheet
KR101139099B1 (ko) * 2008-03-10 2012-04-30 미쓰이 가가쿠 가부시키가이샤 프라이머 조성물
JP2010053239A (ja) * 2008-08-28 2010-03-11 Dow Corning Toray Co Ltd 光硬化型プライマー組成物、該組成物からなるプライマー層を備えた構造体およびその製造方法
US20100051165A1 (en) * 2008-08-28 2010-03-04 Tombs Thomas N Electrographic digitally patterning of metal films
US8417171B2 (en) * 2008-10-24 2013-04-09 Eastman Kodak Company Method and apparatus for printing embossed reflective images
JP2010194796A (ja) * 2009-02-24 2010-09-09 Dic Corp 活性エネルギー線硬化性転写シート
JP6085076B2 (ja) * 2009-03-16 2017-02-22 リンテック株式会社 粘着シートおよび半導体ウエハの加工方法、半導体チップの製造方法
KR101812998B1 (ko) * 2010-02-11 2017-12-28 아라까와 가가꾸 고교 가부시끼가이샤 활성에너지선 경화 피막을 포함하는 플라스틱 필름용 언더코트제 및 활성에너지선 경화 피막을 포함하는 플라스틱필름
JP5681374B2 (ja) * 2010-04-19 2015-03-04 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
JP5439264B2 (ja) * 2010-04-19 2014-03-12 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
US20120058317A1 (en) * 2010-09-03 2012-03-08 Michelman, Inc. Energy curable primer coating
JP2012180494A (ja) * 2011-02-10 2012-09-20 Nitto Denko Corp 自発巻回性粘着シート及び切断体の製造方法

Also Published As

Publication number Publication date
US20130029137A1 (en) 2013-01-31
KR102106145B1 (ko) 2020-04-29
KR20130012575A (ko) 2013-02-04
JP2013023665A (ja) 2013-02-04
KR20190084933A (ko) 2019-07-17

Similar Documents

Publication Publication Date Title
JP5770038B2 (ja) 粘着シート
TWI471401B (zh) And a method for manufacturing a dicing film and a wafer having a protective film forming layer
KR101880644B1 (ko) 표면 보호 시트
KR101570959B1 (ko) 보호막 형성용 복합 시트
JP6274588B2 (ja) 保護膜形成層付ダイシングシートおよびチップの製造方法
KR20150097483A (ko) 보호막 형성용 필름
JP5464635B2 (ja) 半導体ウエハ加工用粘着シートおよびその使用方法
WO2014069638A1 (ja) 粘着シート
JP6006936B2 (ja) 保護膜形成層付ダイシングシートおよびチップの製造方法
US20160326403A1 (en) Composite Sheet For Protective-Film Formation
JP6210827B2 (ja) 半導体加工用シート
JP7387510B2 (ja) 保護膜形成フィルム、保護膜形成用複合シート、及び保護膜形成フィルム付きワークの搬送方法
JP2017183547A (ja) リワーク方法
TWI694129B (zh) 樹脂膜形成用薄片、樹脂膜形成用複合薄片、及矽晶圓之再生方法
KR20180022532A (ko) 보호막 형성용 복합 시트
JP7404073B2 (ja) 半導体加工用粘着テープ
JP2025029095A (ja) 第三積層体の製造方法
JP7764362B2 (ja) 裏面保護膜形成用複合体、第三積層体の製造方法、及び裏面保護膜付き半導体装置の製造方法
JP2022146567A (ja) 保護膜形成フィルム、保護膜形成用複合シート、保護膜付きワーク加工物の製造方法、及び保護膜付きワークの製造方法
TWI905373B (zh) 保護膜形成膜、保護膜形成用複合片、以及晶圓之再生方法
JP7591453B2 (ja) 支持シート、樹脂膜形成用複合シート、キット、及び、樹脂膜付きチップの製造方法
WO2014017473A1 (ja) 保護膜形成層、保護膜形成用シート及び半導体装置の製造方法
TW202237770A (zh) 保護膜形成膜、保護膜形成用複合片、以及晶圓之再生方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140509

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140509

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20140509

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150119

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150303

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150501

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150526

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150624

R150 Certificate of patent or registration of utility model

Ref document number: 5770038

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R157 Certificate of patent or utility model (correction)

Free format text: JAPANESE INTERMEDIATE CODE: R157

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250