JP5763280B2 - 有機ｅｌ素子用面封止剤およびその硬化物 - Google Patents

有機ｅｌ素子用面封止剤およびその硬化物 Download PDF

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Publication number
JP5763280B2
JP5763280B2 JP2014547612A JP2014547612A JP5763280B2 JP 5763280 B2 JP5763280 B2 JP 5763280B2 JP 2014547612 A JP2014547612 A JP 2014547612A JP 2014547612 A JP2014547612 A JP 2014547612A JP 5763280 B2 JP5763280 B2 JP 5763280B2
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organic
sealing agent
surface sealing
component
thermosetting composition
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JPWO2014199626A1 (ja
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祐五 山本
祐五 山本
潤 岡部
潤 岡部
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Mitsui Chemicals Inc
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Mitsui Chemicals Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/08—Saturated oxiranes
    • C08G65/10—Saturated oxiranes characterised by the catalysts used
    • C08G65/105—Onium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0041—Optical brightening agents, organic pigments
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2014547612A 2013-06-10 2014-06-10 有機ｅｌ素子用面封止剤およびその硬化物 Active JP5763280B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014547612A JP5763280B2 (ja) 2013-06-10 2014-06-10 有機ｅｌ素子用面封止剤およびその硬化物

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013121808 2013-06-10
JP2013121808 2013-06-10
JP2014547612A JP5763280B2 (ja) 2013-06-10 2014-06-10 有機ｅｌ素子用面封止剤およびその硬化物
PCT/JP2014/003074 WO2014199626A1 (ja) 2013-06-10 2014-06-10 熱硬化性組成物、有機ｅｌ素子用面封止剤およびその硬化物

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JP5763280B2 true JP5763280B2 (ja) 2015-08-12
JPWO2014199626A1 JPWO2014199626A1 (ja) 2017-02-23

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JP (1) JP5763280B2 (zh)
KR (1) KR101697892B1 (zh)
CN (1) CN105026493B (zh)
TW (1) TWI601783B (zh)
WO (1) WO2014199626A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114555653A (zh) * 2019-11-18 2022-05-27 电化株式会社 组合物、固化物、有机电致发光显示元件用密封材料及有机电致发光显示装置
US11667786B2 (en) 2020-03-19 2023-06-06 Samsung Display Co., Ltd. Encapsulating or filling composition for electronic devices and electronic apparatus

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JP6419213B2 (ja) * 2014-12-09 2018-11-07 三井化学株式会社 有機ｅｌ素子用の面封止材及びその硬化物
TWI565117B (zh) * 2015-06-10 2017-01-01 Wisechip Semiconductor Inc Organic light emitting diode module with optical signal transmission
DE102015212058A1 (de) 2015-06-29 2016-12-29 Tesa Se Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
JP6776609B2 (ja) * 2016-02-22 2020-10-28 デクセリアルズ株式会社 異方性導電フィルム
KR102363322B1 (ko) * 2016-02-22 2022-02-15 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름
JP6822863B2 (ja) * 2016-03-31 2021-01-27 三井化学株式会社 熱硬化性組成物、これを含む封止剤、有機ｅｌ素子用枠封止剤、及び有機ｅｌ素子用面封止剤、並びにその硬化物
CN105957977B (zh) * 2016-05-13 2019-02-05 京东方科技集团股份有限公司 一种封装材料、封装盖板、烧结设备、烧结方法及显示装置
KR102008177B1 (ko) * 2016-05-24 2019-08-07 삼성에스디아이 주식회사 유기발광소자 봉지용 조성물 및 이로부터 제조된 유기발광소자 표시장치
US11377518B2 (en) 2016-09-30 2022-07-05 Lg Chem, Ltd. Adhesive composition
KR102118365B1 (ko) 2017-04-21 2020-06-04 주식회사 엘지화학 유기전자소자 봉지용 조성물
JP6894290B2 (ja) * 2017-05-17 2021-06-30 東京応化工業株式会社 硬化性組成物、硬化膜、表示パネル、及び硬化物の製造方法
KR20200115573A (ko) * 2018-01-26 2020-10-07 아지노모토 가부시키가이샤 밀봉용 경화성 수지 조성물
JP2019130719A (ja) * 2018-01-30 2019-08-08 株式会社ミマキエンジニアリング 印刷装置及び印刷方法
DE102018202545A1 (de) 2018-02-20 2019-08-22 Tesa Se Zusammensetzung zur Erzeugung einer Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung
CN108873536B (zh) * 2018-06-01 2022-01-18 Oppo广东移动通信有限公司 壳体及其制备方法、电子设备
JP7128716B2 (ja) * 2018-10-22 2022-08-31 アイカ工業株式会社 光カチオン硬化型エポキシ樹脂組成物
CN112955488A (zh) 2018-11-28 2021-06-11 积水化学工业株式会社 固化性树脂组合物、固化物及有机el显示元件
JP7412430B2 (ja) * 2019-07-05 2024-01-12 三井化学株式会社 有機ｅｌ表示素子用封止剤および有機ｅｌ表示装置
WO2024195590A1 (ja) * 2023-03-17 2024-09-26 デンカ株式会社 組成物、硬化体、表示装置及び表示装置の製造方法
WO2024195593A1 (ja) * 2023-03-17 2024-09-26 デンカ株式会社 組成物、硬化体、表示装置及び表示装置の製造方法

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JP2005240005A (ja) * 2004-01-30 2005-09-08 Dainippon Ink & Chem Inc 硬化性樹脂組成物、転写材及び保護層の形成方法
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JP2009203431A (ja) * 2008-02-29 2009-09-10 Kyocera Chemical Corp 注形用エポキシ樹脂組成物および高熱伝導コイル
JP2010100736A (ja) * 2008-10-24 2010-05-06 Toyo Ink Mfg Co Ltd 紫外線硬化型缶用塗料組成物及びその利用
JP2010248387A (ja) * 2009-04-16 2010-11-04 Sekisui Chem Co Ltd 光学部材用光硬化性樹脂組成物、接着剤、及び、タッチパネル
JP2012057124A (ja) * 2010-09-13 2012-03-22 Jsr Corp 光ファイバ素線の最外層被覆用液状硬化性樹脂組成物及び光ファイバ素線
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114555653A (zh) * 2019-11-18 2022-05-27 电化株式会社 组合物、固化物、有机电致发光显示元件用密封材料及有机电致发光显示装置
US11667786B2 (en) 2020-03-19 2023-06-06 Samsung Display Co., Ltd. Encapsulating or filling composition for electronic devices and electronic apparatus

Also Published As

Publication number Publication date
TW201502193A (zh) 2015-01-16
KR20150119935A (ko) 2015-10-26
CN105026493A (zh) 2015-11-04
JPWO2014199626A1 (ja) 2017-02-23
WO2014199626A1 (ja) 2014-12-18
TWI601783B (zh) 2017-10-11
CN105026493B (zh) 2017-07-07
KR101697892B1 (ko) 2017-01-18

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