JP5709592B2 - 基板搬送方法、その基板搬送方法を実行させるためのプログラムを記録した記録媒体及び基板搬送装置 - Google Patents

基板搬送方法、その基板搬送方法を実行させるためのプログラムを記録した記録媒体及び基板搬送装置 Download PDF

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JP5709592B2
JP5709592B2 JP2011050747A JP2011050747A JP5709592B2 JP 5709592 B2 JP5709592 B2 JP 5709592B2 JP 2011050747 A JP2011050747 A JP 2011050747A JP 2011050747 A JP2011050747 A JP 2011050747A JP 5709592 B2 JP5709592 B2 JP 5709592B2
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substrate
fork
spacer member
wafer
claw portion
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JP2012190850A (ja
Inventor
大祐 山岸
大祐 山岸
小山　勝彦
勝彦 小山
正孝 佐藤
正孝 佐藤
竹内　靖
靖 竹内
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2011050747A priority Critical patent/JP5709592B2/ja
Priority to TW101106521A priority patent/TWI557827B/zh
Priority to US13/410,368 priority patent/US9368384B2/en
Priority to KR1020120023234A priority patent/KR101520995B1/ko
Priority to CN201210063579.7A priority patent/CN102683252B/zh
Publication of JP2012190850A publication Critical patent/JP2012190850A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Robotics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
JP2011050747A 2011-03-08 2011-03-08 基板搬送方法、その基板搬送方法を実行させるためのプログラムを記録した記録媒体及び基板搬送装置 Active JP5709592B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011050747A JP5709592B2 (ja) 2011-03-08 2011-03-08 基板搬送方法、その基板搬送方法を実行させるためのプログラムを記録した記録媒体及び基板搬送装置
TW101106521A TWI557827B (zh) 2011-03-08 2012-02-29 基板運送方法、記錄有用以執行該基板運送方法之程式的記錄媒體、及基板運送裝置
US13/410,368 US9368384B2 (en) 2011-03-08 2012-03-02 Substrate conveying method, recording medium in which program is recorded for causing substrate conveying method to be executed, and substrate conveyor
KR1020120023234A KR101520995B1 (ko) 2011-03-08 2012-03-07 기판 반송 방법, 그 기판 반송 방법을 실행시키기 위한 프로그램을 기록한 기록 매체 및 기판 반송 장치
CN201210063579.7A CN102683252B (zh) 2011-03-08 2012-03-08 基板输送方法及基板输送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011050747A JP5709592B2 (ja) 2011-03-08 2011-03-08 基板搬送方法、その基板搬送方法を実行させるためのプログラムを記録した記録媒体及び基板搬送装置

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JP2012190850A JP2012190850A (ja) 2012-10-04
JP5709592B2 true JP5709592B2 (ja) 2015-04-30

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US (1) US9368384B2 (ko)
JP (1) JP5709592B2 (ko)
KR (1) KR101520995B1 (ko)
CN (1) CN102683252B (ko)
TW (1) TWI557827B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5797176B2 (ja) 2012-09-14 2015-10-21 東京エレクトロン株式会社 スペーサ、スペーサの搬送方法、処理方法、及び、処理装置
JP5935676B2 (ja) * 2012-12-07 2016-06-15 東京エレクトロン株式会社 基板処理装置、基板装置の運用方法及び記憶媒体
JP6054213B2 (ja) 2013-03-11 2016-12-27 東京エレクトロン株式会社 支持部材及び半導体製造装置
CN103207529B (zh) * 2013-03-22 2015-04-29 京东方科技集团股份有限公司 曝光方法及曝光设备
JP2017183665A (ja) * 2016-03-31 2017-10-05 芝浦メカトロニクス株式会社 基板搬送装置、基板処理装置及び基板処理方法
CN106625585A (zh) * 2016-11-29 2017-05-10 武汉华星光电技术有限公司 一种液晶玻璃基板搬运机器人
JP6862163B2 (ja) * 2016-12-09 2021-04-21 東京エレクトロン株式会社 基板処理装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3157738B2 (ja) * 1997-02-27 2001-04-16 山形日本電気株式会社 ウエハ移載装置および移載方法
JP2001274232A (ja) 2000-03-27 2001-10-05 Tokyo Electron Ltd 基板処理装置
JP4467208B2 (ja) 2001-06-01 2010-05-26 芝浦メカトロニクス株式会社 ロボット装置及び処理装置
JP2003100727A (ja) * 2001-09-20 2003-04-04 Dainippon Screen Mfg Co Ltd シートフィルム保持機構、カセット、搬送機構、薄膜形成装置ならびにシートフィルム搬送方法
JP2004172374A (ja) * 2002-11-20 2004-06-17 Shin Etsu Handotai Co Ltd 保持治具、半導体ウェーハの製造装置、半導体基板及び保持治具の搭載方法
JP2005175413A (ja) * 2003-11-18 2005-06-30 Tokyo Seimitsu Co Ltd 搬送システム及び搬送方法
JP4642787B2 (ja) * 2006-05-09 2011-03-02 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
JP2008124091A (ja) * 2006-11-09 2008-05-29 Fuji Electric Device Technology Co Ltd 半導体装置の処理装置および処理方法
JP4726776B2 (ja) 2006-12-27 2011-07-20 大日本スクリーン製造株式会社 反転装置およびそれを備えた基板処理装置
JP4966800B2 (ja) * 2007-09-26 2012-07-04 東京エレクトロン株式会社 熱処理装置
JP4971089B2 (ja) * 2007-09-26 2012-07-11 東京エレクトロン株式会社 熱処理方法及び熱処理装置
JP4821756B2 (ja) 2007-10-19 2011-11-24 東京エレクトロン株式会社 被処理体の移載機構、被処理体の移載方法及び被処理体の処理システム

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Publication number Publication date
CN102683252A (zh) 2012-09-19
US9368384B2 (en) 2016-06-14
US20120230805A1 (en) 2012-09-13
JP2012190850A (ja) 2012-10-04
TW201306149A (zh) 2013-02-01
KR101520995B1 (ko) 2015-05-15
TWI557827B (zh) 2016-11-11
CN102683252B (zh) 2015-08-19
KR20120102533A (ko) 2012-09-18

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