JPWO2020172244A5 - - Google Patents

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Publication number
JPWO2020172244A5
JPWO2020172244A5 JP2021571641A JP2021571641A JPWO2020172244A5 JP WO2020172244 A5 JPWO2020172244 A5 JP WO2020172244A5 JP 2021571641 A JP2021571641 A JP 2021571641A JP 2021571641 A JP2021571641 A JP 2021571641A JP WO2020172244 A5 JPWO2020172244 A5 JP WO2020172244A5
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JP
Japan
Prior art keywords
transportable
wafer
rack
vtm
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021571641A
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English (en)
Japanese (ja)
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JP2022521860A (ja
Publication date
Application filed filed Critical
Priority claimed from PCT/US2020/018786 external-priority patent/WO2020172244A1/en
Publication of JP2022521860A publication Critical patent/JP2022521860A/ja
Publication of JPWO2020172244A5 publication Critical patent/JPWO2020172244A5/ja
Pending legal-status Critical Current

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JP2021571641A 2019-02-19 2020-02-19 自動バッチ生産の薄膜付着システム及びその使用方法 Pending JP2022521860A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962807612P 2019-02-19 2019-02-19
US62/807,612 2019-02-19
PCT/US2020/018786 WO2020172244A1 (en) 2019-02-19 2020-02-19 Automated batch production thin film deposition systems and methods of using the same

Publications (2)

Publication Number Publication Date
JP2022521860A JP2022521860A (ja) 2022-04-12
JPWO2020172244A5 true JPWO2020172244A5 (ko) 2023-02-15

Family

ID=72143899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021571641A Pending JP2022521860A (ja) 2019-02-19 2020-02-19 自動バッチ生産の薄膜付着システム及びその使用方法

Country Status (7)

Country Link
US (1) US20220076976A1 (ko)
EP (1) EP3918106A4 (ko)
JP (1) JP2022521860A (ko)
KR (1) KR20210118950A (ko)
CN (1) CN113474485A (ko)
SG (1) SG11202108920SA (ko)
WO (1) WO2020172244A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102411440B1 (ko) * 2021-10-21 2022-06-22 주식회사 기가레인 웨이퍼 처리 시스템 및 웨이퍼 처리 방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62222625A (ja) * 1986-03-25 1987-09-30 Shimizu Constr Co Ltd 半導体製造装置
US5186594A (en) * 1990-04-19 1993-02-16 Applied Materials, Inc. Dual cassette load lock
US5516732A (en) * 1992-12-04 1996-05-14 Sony Corporation Wafer processing machine vacuum front end method and apparatus
US6712577B2 (en) * 1994-04-28 2004-03-30 Semitool, Inc. Automated semiconductor processing system
US20010052392A1 (en) * 1998-02-25 2001-12-20 Masahiko Nakamura Multichamber substrate processing apparatus
US20020159864A1 (en) * 2001-04-30 2002-10-31 Applied Materials, Inc. Triple chamber load lock
KR100443121B1 (ko) * 2001-11-29 2004-08-04 삼성전자주식회사 반도체 공정의 수행 방법 및 반도체 공정 장치
WO2006055984A2 (en) * 2004-11-22 2006-05-26 Applied Materials, Inc. Substrate processing apparatus using a batch processing chamber
KR100814238B1 (ko) * 2006-05-03 2008-03-17 위순임 기판 반송 장치 및 이를 이용한 기판 처리 시스템
TWI476855B (zh) * 2006-05-03 2015-03-11 Gen Co Ltd 基板傳輸設備、和使用該設備的高速基板處理系統
US7833351B2 (en) * 2006-06-26 2010-11-16 Applied Materials, Inc. Batch processing platform for ALD and CVD
US7661544B2 (en) * 2007-02-01 2010-02-16 Tokyo Electron Limited Semiconductor wafer boat for batch processing
US9175388B2 (en) 2008-11-01 2015-11-03 Ultratech, Inc. Reaction chamber with removable liner
US9328417B2 (en) 2008-11-01 2016-05-03 Ultratech, Inc. System and method for thin film deposition
JP5274339B2 (ja) * 2009-03-30 2013-08-28 大日本スクリーン製造株式会社 基板処理装置および基板搬送方法
US9378994B2 (en) * 2013-03-15 2016-06-28 Applied Materials, Inc. Multi-position batch load lock apparatus and systems and methods including same

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