JP5679397B2 - 薄膜トランジスタ基板の製造方法 - Google Patents

薄膜トランジスタ基板の製造方法 Download PDF

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JP5679397B2
JP5679397B2 JP2007265748A JP2007265748A JP5679397B2 JP 5679397 B2 JP5679397 B2 JP 5679397B2 JP 2007265748 A JP2007265748 A JP 2007265748A JP 2007265748 A JP2007265748 A JP 2007265748A JP 5679397 B2 JP5679397 B2 JP 5679397B2
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Japan
Prior art keywords
metal layer
photoresist pattern
film transistor
thin film
forming
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JP2007265748A
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Japanese (ja)
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JP2008098642A5 (enExample
JP2008098642A (ja
Inventor
徳 重 李
徳 重 李
大 昊 宋
大 昊 宋
京 燮 金
京 燮 金
庸 懿 李
庸 懿 李
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Samsung Display Co Ltd
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Samsung Display Co Ltd
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/021Manufacture or treatment of multiple TFTs
    • H10D86/0231Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441Interconnections, e.g. scanning lines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thin Film Transistor (AREA)
JP2007265748A 2006-10-12 2007-10-11 薄膜トランジスタ基板の製造方法 Active JP5679397B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2006-0099187 2006-10-12
KR1020060099187A KR101229277B1 (ko) 2006-10-12 2006-10-12 박막 트랜지스터 기판의 제조 방법

Publications (3)

Publication Number Publication Date
JP2008098642A JP2008098642A (ja) 2008-04-24
JP2008098642A5 JP2008098642A5 (enExample) 2011-10-27
JP5679397B2 true JP5679397B2 (ja) 2015-03-04

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Family Applications (1)

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JP2007265748A Active JP5679397B2 (ja) 2006-10-12 2007-10-11 薄膜トランジスタ基板の製造方法

Country Status (6)

Country Link
US (1) US7803673B2 (enExample)
EP (1) EP1912256A1 (enExample)
JP (1) JP5679397B2 (enExample)
KR (1) KR101229277B1 (enExample)
CN (1) CN101162710A (enExample)
TW (1) TWI423394B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070038610A (ko) * 2005-10-06 2007-04-11 삼성전자주식회사 표시 장치의 수리 장치 및 수리 방법
US8791001B2 (en) * 2008-09-08 2014-07-29 Taiwan Semiconductor Manufacturing Company, Ltd. N2 based plasma treatment and ash for HK metal gate protection
KR101042957B1 (ko) * 2010-03-19 2011-06-20 삼성모바일디스플레이주식회사 트랜지스터 기판, 및 이의 제조 방법
US8163620B2 (en) * 2010-04-21 2012-04-24 Institute of Microelectronics, Chinese Academy of Sciences Method for etching Mo-based metal gate stack with aluminium nitride barrier
US8329518B1 (en) * 2011-08-11 2012-12-11 Shenzhen China Star Optoelectronics Technology Co., Ltd. Methods for manufacturing thin film transistor array substrate and display panel
KR102245497B1 (ko) * 2014-08-08 2021-04-29 삼성디스플레이 주식회사 표시 기판 및 이의 제조 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6472329B1 (en) * 1999-08-16 2002-10-29 Applied Komatsu Technology, Inc. Etching aluminum over refractory metal with successive plasmas
JP4683688B2 (ja) 2000-03-16 2011-05-18 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
TW490857B (en) 2001-02-05 2002-06-11 Samsung Electronics Co Ltd Thin film transistor array substrate for liquid crystal display and method of fabricating same
JP4603190B2 (ja) 2001-04-16 2010-12-22 株式会社日立製作所 液晶表示装置
JP4920140B2 (ja) * 2001-05-18 2012-04-18 ゲットナー・ファンデーション・エルエルシー 液晶表示装置及びその製造方法
JP4050503B2 (ja) * 2001-11-29 2008-02-20 株式会社日立製作所 表示装置
JP4221314B2 (ja) * 2004-02-10 2009-02-12 Nec液晶テクノロジー株式会社 薄膜トランジスタとそれを用いた液晶表示装置およびその薄膜トランジスタの製造方法
KR101090252B1 (ko) * 2004-09-24 2011-12-06 삼성전자주식회사 박막 트랜지스터 표시판 및 그의 제조 방법
KR101136026B1 (ko) * 2004-09-24 2012-04-18 주식회사 동진쎄미켐 포토레지스트용 박리제 및 상기 박리제를 이용한 박막트랜지스터 표시판의 제조 방법
KR20060081470A (ko) * 2005-01-07 2006-07-13 삼성전자주식회사 박막트랜지스터 기판과 그 제조방법
KR20060089526A (ko) * 2005-02-04 2006-08-09 삼성전자주식회사 박막 트랜지스터 표시판과 그 제조 방법

Also Published As

Publication number Publication date
US20080090342A1 (en) 2008-04-17
TW200828505A (en) 2008-07-01
CN101162710A (zh) 2008-04-16
KR101229277B1 (ko) 2013-02-04
TWI423394B (zh) 2014-01-11
KR20080033590A (ko) 2008-04-17
US7803673B2 (en) 2010-09-28
EP1912256A1 (en) 2008-04-16
JP2008098642A (ja) 2008-04-24

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