JP5679397B2 - 薄膜トランジスタ基板の製造方法 - Google Patents
薄膜トランジスタ基板の製造方法 Download PDFInfo
- Publication number
- JP5679397B2 JP5679397B2 JP2007265748A JP2007265748A JP5679397B2 JP 5679397 B2 JP5679397 B2 JP 5679397B2 JP 2007265748 A JP2007265748 A JP 2007265748A JP 2007265748 A JP2007265748 A JP 2007265748A JP 5679397 B2 JP5679397 B2 JP 5679397B2
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- photoresist pattern
- film transistor
- thin film
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0231—Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2006-0099187 | 2006-10-12 | ||
| KR1020060099187A KR101229277B1 (ko) | 2006-10-12 | 2006-10-12 | 박막 트랜지스터 기판의 제조 방법 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008098642A JP2008098642A (ja) | 2008-04-24 |
| JP2008098642A5 JP2008098642A5 (enExample) | 2011-10-27 |
| JP5679397B2 true JP5679397B2 (ja) | 2015-03-04 |
Family
ID=38941886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007265748A Active JP5679397B2 (ja) | 2006-10-12 | 2007-10-11 | 薄膜トランジスタ基板の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7803673B2 (enExample) |
| EP (1) | EP1912256A1 (enExample) |
| JP (1) | JP5679397B2 (enExample) |
| KR (1) | KR101229277B1 (enExample) |
| CN (1) | CN101162710A (enExample) |
| TW (1) | TWI423394B (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070038610A (ko) * | 2005-10-06 | 2007-04-11 | 삼성전자주식회사 | 표시 장치의 수리 장치 및 수리 방법 |
| US8791001B2 (en) * | 2008-09-08 | 2014-07-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | N2 based plasma treatment and ash for HK metal gate protection |
| KR101042957B1 (ko) * | 2010-03-19 | 2011-06-20 | 삼성모바일디스플레이주식회사 | 트랜지스터 기판, 및 이의 제조 방법 |
| US8163620B2 (en) * | 2010-04-21 | 2012-04-24 | Institute of Microelectronics, Chinese Academy of Sciences | Method for etching Mo-based metal gate stack with aluminium nitride barrier |
| US8329518B1 (en) * | 2011-08-11 | 2012-12-11 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Methods for manufacturing thin film transistor array substrate and display panel |
| KR102245497B1 (ko) * | 2014-08-08 | 2021-04-29 | 삼성디스플레이 주식회사 | 표시 기판 및 이의 제조 방법 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6472329B1 (en) * | 1999-08-16 | 2002-10-29 | Applied Komatsu Technology, Inc. | Etching aluminum over refractory metal with successive plasmas |
| JP4683688B2 (ja) | 2000-03-16 | 2011-05-18 | 株式会社半導体エネルギー研究所 | 液晶表示装置の作製方法 |
| TW490857B (en) | 2001-02-05 | 2002-06-11 | Samsung Electronics Co Ltd | Thin film transistor array substrate for liquid crystal display and method of fabricating same |
| JP4603190B2 (ja) | 2001-04-16 | 2010-12-22 | 株式会社日立製作所 | 液晶表示装置 |
| JP4920140B2 (ja) * | 2001-05-18 | 2012-04-18 | ゲットナー・ファンデーション・エルエルシー | 液晶表示装置及びその製造方法 |
| JP4050503B2 (ja) * | 2001-11-29 | 2008-02-20 | 株式会社日立製作所 | 表示装置 |
| JP4221314B2 (ja) * | 2004-02-10 | 2009-02-12 | Nec液晶テクノロジー株式会社 | 薄膜トランジスタとそれを用いた液晶表示装置およびその薄膜トランジスタの製造方法 |
| KR101090252B1 (ko) * | 2004-09-24 | 2011-12-06 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그의 제조 방법 |
| KR101136026B1 (ko) * | 2004-09-24 | 2012-04-18 | 주식회사 동진쎄미켐 | 포토레지스트용 박리제 및 상기 박리제를 이용한 박막트랜지스터 표시판의 제조 방법 |
| KR20060081470A (ko) * | 2005-01-07 | 2006-07-13 | 삼성전자주식회사 | 박막트랜지스터 기판과 그 제조방법 |
| KR20060089526A (ko) * | 2005-02-04 | 2006-08-09 | 삼성전자주식회사 | 박막 트랜지스터 표시판과 그 제조 방법 |
-
2006
- 2006-10-12 KR KR1020060099187A patent/KR101229277B1/ko active Active
-
2007
- 2007-10-11 JP JP2007265748A patent/JP5679397B2/ja active Active
- 2007-10-11 EP EP07019889A patent/EP1912256A1/en not_active Ceased
- 2007-10-12 US US11/871,457 patent/US7803673B2/en active Active
- 2007-10-12 TW TW096138226A patent/TWI423394B/zh active
- 2007-10-12 CN CNA2007101524343A patent/CN101162710A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20080090342A1 (en) | 2008-04-17 |
| TW200828505A (en) | 2008-07-01 |
| CN101162710A (zh) | 2008-04-16 |
| KR101229277B1 (ko) | 2013-02-04 |
| TWI423394B (zh) | 2014-01-11 |
| KR20080033590A (ko) | 2008-04-17 |
| US7803673B2 (en) | 2010-09-28 |
| EP1912256A1 (en) | 2008-04-16 |
| JP2008098642A (ja) | 2008-04-24 |
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