CN101162710A - 薄膜晶体管基底的制造方法 - Google Patents

薄膜晶体管基底的制造方法 Download PDF

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Publication number
CN101162710A
CN101162710A CNA2007101524343A CN200710152434A CN101162710A CN 101162710 A CN101162710 A CN 101162710A CN A2007101524343 A CNA2007101524343 A CN A2007101524343A CN 200710152434 A CN200710152434 A CN 200710152434A CN 101162710 A CN101162710 A CN 101162710A
Authority
CN
China
Prior art keywords
metal layer
photoresist pattern
layer
dry etching
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007101524343A
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English (en)
Chinese (zh)
Inventor
李德重
宋大昊
金京燮
李庸懿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of CN101162710A publication Critical patent/CN101162710A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0231—Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thin Film Transistor (AREA)
CNA2007101524343A 2006-10-12 2007-10-12 薄膜晶体管基底的制造方法 Pending CN101162710A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060099187A KR101229277B1 (ko) 2006-10-12 2006-10-12 박막 트랜지스터 기판의 제조 방법
KR1020060099187 2006-10-12

Publications (1)

Publication Number Publication Date
CN101162710A true CN101162710A (zh) 2008-04-16

Family

ID=38941886

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007101524343A Pending CN101162710A (zh) 2006-10-12 2007-10-12 薄膜晶体管基底的制造方法

Country Status (6)

Country Link
US (1) US7803673B2 (enExample)
EP (1) EP1912256A1 (enExample)
JP (1) JP5679397B2 (enExample)
KR (1) KR101229277B1 (enExample)
CN (1) CN101162710A (enExample)
TW (1) TWI423394B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102194891A (zh) * 2010-03-19 2011-09-21 三星移动显示器株式会社 晶体管基底及其制造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070038610A (ko) * 2005-10-06 2007-04-11 삼성전자주식회사 표시 장치의 수리 장치 및 수리 방법
US8791001B2 (en) * 2008-09-08 2014-07-29 Taiwan Semiconductor Manufacturing Company, Ltd. N2 based plasma treatment and ash for HK metal gate protection
US8163620B2 (en) * 2010-04-21 2012-04-24 Institute of Microelectronics, Chinese Academy of Sciences Method for etching Mo-based metal gate stack with aluminium nitride barrier
US8329518B1 (en) * 2011-08-11 2012-12-11 Shenzhen China Star Optoelectronics Technology Co., Ltd. Methods for manufacturing thin film transistor array substrate and display panel
KR102245497B1 (ko) * 2014-08-08 2021-04-29 삼성디스플레이 주식회사 표시 기판 및 이의 제조 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6472329B1 (en) * 1999-08-16 2002-10-29 Applied Komatsu Technology, Inc. Etching aluminum over refractory metal with successive plasmas
JP4683688B2 (ja) 2000-03-16 2011-05-18 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
TW490857B (en) 2001-02-05 2002-06-11 Samsung Electronics Co Ltd Thin film transistor array substrate for liquid crystal display and method of fabricating same
JP4603190B2 (ja) 2001-04-16 2010-12-22 株式会社日立製作所 液晶表示装置
JP4920140B2 (ja) * 2001-05-18 2012-04-18 ゲットナー・ファンデーション・エルエルシー 液晶表示装置及びその製造方法
JP4050503B2 (ja) * 2001-11-29 2008-02-20 株式会社日立製作所 表示装置
JP4221314B2 (ja) * 2004-02-10 2009-02-12 Ｎｅｃ液晶テクノロジー株式会社 薄膜トランジスタとそれを用いた液晶表示装置およびその薄膜トランジスタの製造方法
KR101090252B1 (ko) * 2004-09-24 2011-12-06 삼성전자주식회사 박막 트랜지스터 표시판 및 그의 제조 방법
KR101136026B1 (ko) * 2004-09-24 2012-04-18 주식회사 동진쎄미켐 포토레지스트용 박리제 및 상기 박리제를 이용한 박막트랜지스터 표시판의 제조 방법
KR20060081470A (ko) * 2005-01-07 2006-07-13 삼성전자주식회사 박막트랜지스터 기판과 그 제조방법
KR20060089526A (ko) * 2005-02-04 2006-08-09 삼성전자주식회사 박막 트랜지스터 표시판과 그 제조 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102194891A (zh) * 2010-03-19 2011-09-21 三星移动显示器株式会社 晶体管基底及其制造方法
CN102194891B (zh) * 2010-03-19 2015-04-29 三星显示有限公司 晶体管基底及其制造方法

Also Published As

Publication number Publication date
US20080090342A1 (en) 2008-04-17
TW200828505A (en) 2008-07-01
JP5679397B2 (ja) 2015-03-04
KR101229277B1 (ko) 2013-02-04
TWI423394B (zh) 2014-01-11
KR20080033590A (ko) 2008-04-17
US7803673B2 (en) 2010-09-28
EP1912256A1 (en) 2008-04-16
JP2008098642A (ja) 2008-04-24

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Open date: 20080416