JP5656611B2 - 半導体装置及び固体撮像装置 - Google Patents

半導体装置及び固体撮像装置 Download PDF

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Publication number
JP5656611B2
JP5656611B2 JP2010283771A JP2010283771A JP5656611B2 JP 5656611 B2 JP5656611 B2 JP 5656611B2 JP 2010283771 A JP2010283771 A JP 2010283771A JP 2010283771 A JP2010283771 A JP 2010283771A JP 5656611 B2 JP5656611 B2 JP 5656611B2
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conductive member
wiring
pad
circuit
pads
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JP2010283771A
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Japanese (ja)
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JP2012134257A (ja
JP2012134257A5 (enExample
Inventor
小倉　正徳
正徳 小倉
秀央 小林
秀央 小林
享裕 黒田
享裕 黒田
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2010283771A priority Critical patent/JP5656611B2/ja
Priority to US13/316,308 priority patent/US8581361B2/en
Priority to CN201110420964.8A priority patent/CN102569253B/zh
Publication of JP2012134257A publication Critical patent/JP2012134257A/ja
Publication of JP2012134257A5 publication Critical patent/JP2012134257A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2010283771A 2010-12-20 2010-12-20 半導体装置及び固体撮像装置 Active JP5656611B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010283771A JP5656611B2 (ja) 2010-12-20 2010-12-20 半導体装置及び固体撮像装置
US13/316,308 US8581361B2 (en) 2010-12-20 2011-12-09 Semiconductor apparatus
CN201110420964.8A CN102569253B (zh) 2010-12-20 2011-12-15 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010283771A JP5656611B2 (ja) 2010-12-20 2010-12-20 半導体装置及び固体撮像装置

Publications (3)

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JP2012134257A JP2012134257A (ja) 2012-07-12
JP2012134257A5 JP2012134257A5 (enExample) 2014-01-09
JP5656611B2 true JP5656611B2 (ja) 2015-01-21

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JP2010283771A Active JP5656611B2 (ja) 2010-12-20 2010-12-20 半導体装置及び固体撮像装置

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US (1) US8581361B2 (enExample)
JP (1) JP5656611B2 (enExample)
CN (1) CN102569253B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5746494B2 (ja) 2010-11-24 2015-07-08 ルネサスエレクトロニクス株式会社 半導体装置、液晶ディスプレイパネル及び携帯情報端末
JP2017084944A (ja) * 2015-10-27 2017-05-18 株式会社デンソー 半導体装置
JP6658047B2 (ja) 2016-02-12 2020-03-04 セイコーエプソン株式会社 画像読取装置及び半導体装置
JP2018152715A (ja) * 2017-03-13 2018-09-27 セイコーエプソン株式会社 画像読取装置及び半導体装置
US10811059B1 (en) * 2019-03-27 2020-10-20 Micron Technology, Inc. Routing for power signals including a redistribution layer
JP7362380B2 (ja) * 2019-09-12 2023-10-17 キヤノン株式会社 配線基板及び半導体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3270874B2 (ja) * 1993-09-21 2002-04-02 ソニー株式会社 リニアセンサ
JP2004214594A (ja) * 2002-11-15 2004-07-29 Sharp Corp 半導体装置およびその製造方法
JP2005243907A (ja) * 2004-02-26 2005-09-08 Renesas Technology Corp 半導体装置
KR100548582B1 (ko) * 2004-07-23 2006-02-02 주식회사 하이닉스반도체 반도체소자의 패드부
JP4714502B2 (ja) * 2005-04-26 2011-06-29 パナソニック株式会社 固体撮像装置
JP2007042718A (ja) * 2005-08-01 2007-02-15 Renesas Technology Corp 半導体装置
JP2007184311A (ja) * 2005-12-29 2007-07-19 Sony Corp 固体撮像装置およびその製造方法
JP4986114B2 (ja) * 2006-04-17 2012-07-25 ルネサスエレクトロニクス株式会社 半導体集積回路及び半導体集積回路の設計方法
JP2008078354A (ja) * 2006-09-21 2008-04-03 Renesas Technology Corp 半導体装置
JP5147234B2 (ja) * 2006-12-28 2013-02-20 パナソニック株式会社 半導体集積回路装置
JP5537016B2 (ja) * 2008-10-27 2014-07-02 株式会社東芝 半導体装置および半導体装置の製造方法
JP2010251595A (ja) * 2009-04-17 2010-11-04 Renesas Electronics Corp 半導体撮像装置

Also Published As

Publication number Publication date
US20120153367A1 (en) 2012-06-21
JP2012134257A (ja) 2012-07-12
US8581361B2 (en) 2013-11-12
CN102569253A (zh) 2012-07-11
CN102569253B (zh) 2014-10-01

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