JP5588469B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP5588469B2
JP5588469B2 JP2012025743A JP2012025743A JP5588469B2 JP 5588469 B2 JP5588469 B2 JP 5588469B2 JP 2012025743 A JP2012025743 A JP 2012025743A JP 2012025743 A JP2012025743 A JP 2012025743A JP 5588469 B2 JP5588469 B2 JP 5588469B2
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JP
Japan
Prior art keywords
substrate
unit
exposure
block
transport mechanism
Prior art date
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Active
Application number
JP2012025743A
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English (en)
Japanese (ja)
Other versions
JP2013162111A5 (enrdf_load_stackoverflow
JP2013162111A (ja
Inventor
卓 榎木田
雅弘 中原田
清次 中島
宮田　　亮
将人 中城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2012025743A priority Critical patent/JP5588469B2/ja
Priority to KR1020130013259A priority patent/KR101532826B1/ko
Publication of JP2013162111A publication Critical patent/JP2013162111A/ja
Publication of JP2013162111A5 publication Critical patent/JP2013162111A5/ja
Priority to KR1020140118783A priority patent/KR101602570B1/ko
Application granted granted Critical
Publication of JP5588469B2 publication Critical patent/JP5588469B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2012025743A 2012-02-09 2012-02-09 基板処理装置 Active JP5588469B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012025743A JP5588469B2 (ja) 2012-02-09 2012-02-09 基板処理装置
KR1020130013259A KR101532826B1 (ko) 2012-02-09 2013-02-06 기판 처리 장치
KR1020140118783A KR101602570B1 (ko) 2012-02-09 2014-09-05 기판 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012025743A JP5588469B2 (ja) 2012-02-09 2012-02-09 基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014151419A Division JP5830140B2 (ja) 2014-07-25 2014-07-25 基板処理装置

Publications (3)

Publication Number Publication Date
JP2013162111A JP2013162111A (ja) 2013-08-19
JP2013162111A5 JP2013162111A5 (enrdf_load_stackoverflow) 2014-02-27
JP5588469B2 true JP5588469B2 (ja) 2014-09-10

Family

ID=49174080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012025743A Active JP5588469B2 (ja) 2012-02-09 2012-02-09 基板処理装置

Country Status (2)

Country Link
JP (1) JP5588469B2 (enrdf_load_stackoverflow)
KR (2) KR101532826B1 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6182065B2 (ja) * 2013-12-27 2017-08-16 東京エレクトロン株式会社 基板処理装置
JP6867827B2 (ja) 2017-02-28 2021-05-12 キヤノン株式会社 リソグラフィ装置および物品製造方法
JP6955922B2 (ja) * 2017-07-14 2021-10-27 株式会社ディスコ インラインシステム
WO2019159736A1 (ja) * 2018-02-16 2019-08-22 東京エレクトロン株式会社 基板処理装置
JP7363591B2 (ja) * 2020-03-05 2023-10-18 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3943828B2 (ja) * 2000-12-08 2007-07-11 東京エレクトロン株式会社 塗布、現像装置及びパターン形成方法
KR100892756B1 (ko) * 2007-12-27 2009-04-15 세메스 주식회사 기판 처리 장치 및 이를 이용한 기판 이송 방법
JP5338757B2 (ja) * 2010-07-09 2013-11-13 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体

Also Published As

Publication number Publication date
KR20140118966A (ko) 2014-10-08
KR20130092466A (ko) 2013-08-20
KR101532826B1 (ko) 2015-06-30
JP2013162111A (ja) 2013-08-19
KR101602570B1 (ko) 2016-03-10

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