KR101532826B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR101532826B1
KR101532826B1 KR1020130013259A KR20130013259A KR101532826B1 KR 101532826 B1 KR101532826 B1 KR 101532826B1 KR 1020130013259 A KR1020130013259 A KR 1020130013259A KR 20130013259 A KR20130013259 A KR 20130013259A KR 101532826 B1 KR101532826 B1 KR 101532826B1
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KR
South Korea
Prior art keywords
substrate
unit
exposure
block
transport mechanism
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KR1020130013259A
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English (en)
Korean (ko)
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KR20130092466A (ko
Inventor
스구루 에노키다
마사히로 나카하라다
세이지 나카시마
아키라 미야타
마사토 나카조
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도쿄엘렉트론가부시키가이샤
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Publication of KR20130092466A publication Critical patent/KR20130092466A/ko
Application granted granted Critical
Publication of KR101532826B1 publication Critical patent/KR101532826B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020130013259A 2012-02-09 2013-02-06 기판 처리 장치 Active KR101532826B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-025743 2012-02-09
JP2012025743A JP5588469B2 (ja) 2012-02-09 2012-02-09 基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020140118783A Division KR101602570B1 (ko) 2012-02-09 2014-09-05 기판 처리 장치

Publications (2)

Publication Number Publication Date
KR20130092466A KR20130092466A (ko) 2013-08-20
KR101532826B1 true KR101532826B1 (ko) 2015-06-30

Family

ID=49174080

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020130013259A Active KR101532826B1 (ko) 2012-02-09 2013-02-06 기판 처리 장치
KR1020140118783A Active KR101602570B1 (ko) 2012-02-09 2014-09-05 기판 처리 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020140118783A Active KR101602570B1 (ko) 2012-02-09 2014-09-05 기판 처리 장치

Country Status (2)

Country Link
JP (1) JP5588469B2 (enrdf_load_stackoverflow)
KR (2) KR101532826B1 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6182065B2 (ja) * 2013-12-27 2017-08-16 東京エレクトロン株式会社 基板処理装置
JP6867827B2 (ja) 2017-02-28 2021-05-12 キヤノン株式会社 リソグラフィ装置および物品製造方法
JP6955922B2 (ja) * 2017-07-14 2021-10-27 株式会社ディスコ インラインシステム
WO2019159736A1 (ja) * 2018-02-16 2019-08-22 東京エレクトロン株式会社 基板処理装置
JP7363591B2 (ja) * 2020-03-05 2023-10-18 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002175976A (ja) * 2000-12-08 2002-06-21 Tokyo Electron Ltd 塗布、現像装置及びパターン形成方法
KR100892756B1 (ko) * 2007-12-27 2009-04-15 세메스 주식회사 기판 처리 장치 및 이를 이용한 기판 이송 방법
KR20120005938A (ko) * 2010-07-09 2012-01-17 도쿄엘렉트론가부시키가이샤 도포, 현상 장치, 도포, 현상 방법 및 기억 매체

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002175976A (ja) * 2000-12-08 2002-06-21 Tokyo Electron Ltd 塗布、現像装置及びパターン形成方法
KR100892756B1 (ko) * 2007-12-27 2009-04-15 세메스 주식회사 기판 처리 장치 및 이를 이용한 기판 이송 방법
KR20120005938A (ko) * 2010-07-09 2012-01-17 도쿄엘렉트론가부시키가이샤 도포, 현상 장치, 도포, 현상 방법 및 기억 매체

Also Published As

Publication number Publication date
KR20140118966A (ko) 2014-10-08
KR20130092466A (ko) 2013-08-20
JP5588469B2 (ja) 2014-09-10
JP2013162111A (ja) 2013-08-19
KR101602570B1 (ko) 2016-03-10

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