JP5556176B2 - 粒子およびインクおよびそれらを用いるフィルム - Google Patents

粒子およびインクおよびそれらを用いるフィルム Download PDF

Info

Publication number
JP5556176B2
JP5556176B2 JP2009523067A JP2009523067A JP5556176B2 JP 5556176 B2 JP5556176 B2 JP 5556176B2 JP 2009523067 A JP2009523067 A JP 2009523067A JP 2009523067 A JP2009523067 A JP 2009523067A JP 5556176 B2 JP5556176 B2 JP 5556176B2
Authority
JP
Japan
Prior art keywords
particles
silver
capped
silver particles
iii
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009523067A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009545657A (ja
JP2009545657A5 (cg-RX-API-DMAC10.html
Inventor
パラシャール，サチン
サルカール，シウリー
カセレフ，オスカー
ルイス，ブライアン・ジィー
マルジ，マイケル・ティー
シン，バーワ
デサイ，ニティン
リベラトーレ，マイケル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alpha Assembly Solutions Inc
Original Assignee
Alpha Metals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Metals Inc filed Critical Alpha Metals Inc
Publication of JP2009545657A publication Critical patent/JP2009545657A/ja
Publication of JP2009545657A5 publication Critical patent/JP2009545657A5/ja
Application granted granted Critical
Publication of JP5556176B2 publication Critical patent/JP5556176B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0545—Dispersions or suspensions of nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C09D7/67—Particle size smaller than 100 nm
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K99/00—Subject matter not provided for in other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
    • C01P2002/84—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by UV- or VIS- data
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Powder Metallurgy (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
JP2009523067A 2006-08-03 2007-08-03 粒子およびインクおよびそれらを用いるフィルム Active JP5556176B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/462,089 2006-08-03
US11/462,089 US7968008B2 (en) 2006-08-03 2006-08-03 Particles and inks and films using them
PCT/US2007/075174 WO2008017062A1 (en) 2006-08-03 2007-08-03 Particles and inks and films using them

Publications (3)

Publication Number Publication Date
JP2009545657A JP2009545657A (ja) 2009-12-24
JP2009545657A5 JP2009545657A5 (cg-RX-API-DMAC10.html) 2010-09-16
JP5556176B2 true JP5556176B2 (ja) 2014-07-23

Family

ID=38728951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009523067A Active JP5556176B2 (ja) 2006-08-03 2007-08-03 粒子およびインクおよびそれらを用いるフィルム

Country Status (6)

Country Link
US (2) US7968008B2 (cg-RX-API-DMAC10.html)
EP (2) EP2066470B1 (cg-RX-API-DMAC10.html)
JP (1) JP5556176B2 (cg-RX-API-DMAC10.html)
KR (1) KR101431570B1 (cg-RX-API-DMAC10.html)
CA (1) CA2659028C (cg-RX-API-DMAC10.html)
WO (1) WO2008017062A1 (cg-RX-API-DMAC10.html)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7968008B2 (en) * 2006-08-03 2011-06-28 Fry's Metals, Inc. Particles and inks and films using them
WO2008036752A2 (en) * 2006-09-22 2008-03-27 Fry's Metals, Inc. Solvent systems for metals and inks
US9615463B2 (en) * 2006-09-22 2017-04-04 Oscar Khaselev Method for producing a high-aspect ratio conductive pattern on a substrate
TWI477332B (zh) * 2007-02-27 2015-03-21 三菱綜合材料股份有限公司 金屬奈米粒子分散液及其製造方法及金屬奈米粒子之合成方法
EP1998602B1 (en) 2007-03-29 2014-03-05 Alpha Metals, Inc. Method of manufacturing electrical contacts
US8312623B2 (en) 2007-03-29 2012-11-20 Fry's Metals, Inc. Methods for producing electrical conductors
US20100133465A1 (en) * 2007-05-30 2010-06-03 Won Jong Kwon Dispersant containing metal complex for carbon nanotube
US8555491B2 (en) 2007-07-19 2013-10-15 Alpha Metals, Inc. Methods of attaching a die to a substrate
US8304062B2 (en) * 2007-07-20 2012-11-06 Fry's Metals, Inc. Electrical conductors and methods of making and using them
US8852316B2 (en) * 2008-04-28 2014-10-07 Tata Chemicals Limited Process for the preparation of silver nano particles
EP2157067B1 (de) * 2008-07-30 2012-09-12 Ivoclar Vivadent AG Mit einer farbgebenden Komponente beschichtete Primärpartikel
US9095898B2 (en) * 2008-09-15 2015-08-04 Lockheed Martin Corporation Stabilized metal nanoparticles and methods for production thereof
EP2334728B1 (en) 2008-09-26 2018-03-21 Alpha Assembly Solutions Inc. Lead-free conductive compositions and methods of using them
KR101038784B1 (ko) * 2009-02-03 2011-06-03 삼성전기주식회사 금속 배선의 형성방법 및 이를 이용하여 형성된 금속 배선
KR101105348B1 (ko) * 2009-05-13 2012-01-16 주식회사 유월드테크 잉크젯 프린터용 전도성 잉크 조성물 및 그 제조 방법
US8277894B2 (en) * 2009-07-16 2012-10-02 Rohm And Haas Electronic Materials Llc Selenium ink and methods of making and using same
JP2011042758A (ja) * 2009-08-24 2011-03-03 Yokohama Rubber Co Ltd:The インクジェットプリンタ用インク、導電性配線の形成方法および導電性配線
US8894760B2 (en) * 2009-11-20 2014-11-25 Rohm And Haas Electronic Materials Llc Group 3a ink and methods of making and using same
US8765025B2 (en) * 2010-06-09 2014-07-01 Xerox Corporation Silver nanoparticle composition comprising solvents with specific hansen solubility parameters
US8871370B2 (en) * 2010-09-24 2014-10-28 Jian Zhang Water based biological and photochemical batteries
SG10201509037SA (en) 2010-11-03 2015-12-30 Fry Metals Inc Sintering materials and attachment methods using same
KR101287938B1 (ko) * 2011-01-17 2013-07-22 한국화학연구원 나노 결정 실리콘의 제조방법
KR101273694B1 (ko) * 2011-02-25 2013-06-12 삼성전기주식회사 구리 나노 페이스트 및 그 형성 방법, 그리고 상기 구리 나노 페이스트를 이용한 전극 형성 방법
US9272334B2 (en) * 2011-04-12 2016-03-01 GM Global Technology Operations LLC Synthesis of platinum-alloy nanoparticles and supported catalysts including the same
WO2013147535A1 (en) * 2012-03-30 2013-10-03 Korea Research Institute Of Chemical Technology Synthetic method of suppressing metal nano-particle from having oxidized film and method of manufacturing conductive metal thin film via solution-processed
KR101418276B1 (ko) * 2012-03-30 2014-07-15 한국화학연구원 표면 산화막 형성이 제어된 금속 나노 입자 합성 방법 및 용액 공정을 통한 금속 전도성 박막의 제조방법
US9872916B2 (en) 2012-04-06 2018-01-23 University of North Texas Office of Economic Development and Technology Transfer Facile method for making non-toxic biomedical compositions comprising hybrid metal-polymer microparticles
US9034075B2 (en) 2012-04-30 2015-05-19 Dow Global Technologies Llc Methods of manufacturing high aspect ratio silver nanowires
CN104736483A (zh) * 2012-10-29 2015-06-24 阿尔法金属公司 烧结粉末
KR101346240B1 (ko) * 2013-03-15 2014-01-02 한국화학연구원 나노 결정 실리콘의 제조방법
US10150918B2 (en) * 2013-04-15 2018-12-11 Kent State University Patterned liquid crystal alignment using ink-jet printed nanoparticles and use thereof to produce patterned, electro-optically addressable devices; ink-jet printable compositions
WO2014209235A1 (en) * 2013-06-26 2014-12-31 Agency For Science, Technology And Research Metal-containing particles, processes for their preparation, and uses thereof
CA2918939C (en) 2013-07-24 2021-10-26 National Research Council Of Canada Process for depositing metal on a substrate
TW201611198A (zh) * 2014-04-11 2016-03-16 阿爾發金屬公司 低壓燒結粉末
JP2017526159A (ja) * 2014-05-20 2017-09-07 アルファ・アセンブリー・ソリューションズ・インコーポレイテッドＡｌｐｈａ Ａｓｓｅｍｂｌｙ Ｓｏｌｕｔｉｏｎｓ Ｉｎｃ． 太陽電池及び半導体製造用の噴射可能なインク
KR102424487B1 (ko) * 2014-06-12 2022-07-25 알파 어?뻠磁? 솔루션 인크. 재료들의 소결 및 그를 이용하는 부착 방법들
CN106660116A (zh) * 2014-06-23 2017-05-10 阿尔法金属公司 多层金属纳米和微米颗粒
DE102015013238A1 (de) 2014-10-28 2016-04-28 Dow Global Technologies Llc Verfahren mit niedriger Sauerstoffkonzentration zur Herstellung von Silber-Nanodrähten
DE102015013220A1 (de) 2014-10-28 2016-04-28 Dow Global Technologies Llc Verfahren zur Herstellung von Silber-Nanodrähten
DE102015013219A1 (de) 2014-10-28 2016-04-28 Dow Global Technologies Llc Verfahren zur Herstellung von Silber-Nanodrähten
DE102015013239A1 (de) 2014-10-28 2016-04-28 Dow Global Technologies Llc Hydrothermalverfahren zur Herstellung von Silber-Nanodrähten
KR102052326B1 (ko) * 2014-12-17 2019-12-05 알파 어셈블리 솔루션스 인크. 다이 및 클립 부착 방법
US10081020B2 (en) 2015-06-12 2018-09-25 Dow Global Technologies Llc Hydrothermal method for manufacturing filtered silver nanowires
US10376898B2 (en) 2015-06-12 2019-08-13 Dow Global Technologies Llc Method for manufacturing high aspect ratio silver nanowires
JP2017171974A (ja) * 2016-03-23 2017-09-28 株式会社豊田中央研究所 ポリマー被覆鉄ニッケル合金微粒子、その製造方法、及びそれを用いた印刷用組成物及び磁性体膜
US10982107B2 (en) * 2018-07-24 2021-04-20 Xerox Corporation Metal nanoparticle ink composition
US20240102186A1 (en) * 2022-09-22 2024-03-28 Xerox Corporation Carbon supported carboxyl functionalized silver nanoparticles for gas diffusion electrodes

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5413617A (en) 1993-09-13 1995-05-09 National Science Council Process for the preparation of silver powder with a controlled surface area by reduction reaction
JPH0920903A (ja) * 1995-06-30 1997-01-21 Tanaka Kikinzoku Internatl Kk 単分散球状金粒子粉末の製造方法
US5882722A (en) * 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
US5922403A (en) * 1996-03-12 1999-07-13 Tecle; Berhan Method for isolating ultrafine and fine particles
US6103868A (en) * 1996-12-27 2000-08-15 The Regents Of The University Of California Organically-functionalized monodisperse nanocrystals of metals
US6780765B2 (en) * 1998-08-14 2004-08-24 Avery N. Goldstein Integrated circuit trenched features and method of producing same
US6660058B1 (en) 2000-08-22 2003-12-09 Nanopros, Inc. Preparation of silver and silver alloyed nanoparticles in surfactant solutions
US7351468B2 (en) * 2000-10-26 2008-04-01 E. I. Du Pont De Nemours And Company Interlayers for laminated safety glass with superior de-airing and laminating properties and process for making the same
JP4183924B2 (ja) * 2001-03-30 2008-11-19 日揮触媒化成株式会社 金属微粒子および該微粒子の製造方法、該微粒子を含む透明導電性被膜形成用塗布液、透明導電性被膜付基材、表示装置
JP2002317215A (ja) * 2001-04-19 2002-10-31 Mitsuboshi Belting Ltd 金属微粒子の製造方法
US6645444B2 (en) * 2001-06-29 2003-11-11 Nanospin Solutions Metal nanocrystals and synthesis thereof
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
JP2003253310A (ja) * 2001-12-28 2003-09-10 Mitsuboshi Belting Ltd 金属微粒子の製造方法
JP3796476B2 (ja) 2002-10-25 2006-07-12 バンドー化学株式会社 導電性インク
JP4248857B2 (ja) * 2002-11-29 2009-04-02 三ツ星ベルト株式会社 銀微粒子の製造方法
JP2005060816A (ja) * 2002-11-29 2005-03-10 Mitsuboshi Belting Ltd 合金微粒子の製造方法及び合金薄膜の製造方法
EP1434281A3 (en) 2002-12-26 2007-10-24 Konica Minolta Holdings, Inc. Manufacturing method of thin-film transistor, thin-film transistor sheet, and electric circuit
JP2005060824A (ja) * 2003-07-28 2005-03-10 Mitsuboshi Belting Ltd 合金微粒子の製造方法及び合金薄膜の製造方法
JP4447273B2 (ja) * 2003-09-19 2010-04-07 三井金属鉱業株式会社 銀インク及びその銀インクの製造方法
US7160525B1 (en) * 2003-10-14 2007-01-09 The Board Of Trustees Of The University Of Arkansas Monodisperse noble metal nanocrystals
US20050129843A1 (en) * 2003-12-11 2005-06-16 Xerox Corporation Nanoparticle deposition process
ATE492888T1 (de) * 2004-03-10 2011-01-15 Asahi Glass Co Ltd Metallhaltiger feinpartikel, flüssigdispersion eines metallhaltigen feinpartikels und leitfähiges metallhaltiges material
JP4246104B2 (ja) * 2004-04-26 2009-04-02 田中貴金属工業株式会社 金属コロイド溶液の製造方法及び該金属コロイド溶液の製造方法により得られた金属コロイド溶液を用いた回路形成方法
US7270694B2 (en) * 2004-10-05 2007-09-18 Xerox Corporation Stabilized silver nanoparticles and their use
WO2006072959A1 (en) 2005-01-10 2006-07-13 Yissum Research Development Company Of The Hebrew University Of Jerusalem Aqueous-based dispersions of metal nanoparticles
US7345370B2 (en) 2005-01-12 2008-03-18 International Business Machines Corporation Wiring patterns formed by selective metal plating
US20060163744A1 (en) 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
ATE485171T1 (de) * 2005-01-14 2010-11-15 Cabot Corp Sicherheitseinrichtungen sowie verwendung und herstellungsverfahren davon
JP4635262B2 (ja) * 2005-03-31 2011-02-23 独立行政法人産業技術総合研究所 金属ナノ粒子の製造方法及び金属ナノ粒子
JP2006328532A (ja) * 2005-05-10 2006-12-07 Samsung Electro-Mechanics Co Ltd 金属ナノ粒子、これを製造する方法及び導電性インク
KR100690360B1 (ko) 2005-05-23 2007-03-09 삼성전기주식회사 도전성 잉크, 그 제조방법 및 도전성 기판
JP4908002B2 (ja) * 2005-05-31 2012-04-04 三ツ星ベルト株式会社 貴金属微粒子の製造方法および貴金属薄膜の製造方法
KR100711967B1 (ko) 2005-08-08 2007-05-02 삼성전기주식회사 금속 나노 입자의 제조방법 및 도전성 잉크
US7291292B2 (en) * 2005-08-26 2007-11-06 E.I. Du Pont De Nemours And Company Preparation of silver particles using thermomorphic polymers
JP4822783B2 (ja) * 2005-09-22 2011-11-24 株式会社日本触媒 金属ナノ粒子の製法および当該製法により得られた粒子のコロイド
JP2007175619A (ja) * 2005-12-28 2007-07-12 Mitsuboshi Belting Ltd 金属薄膜の製造方法
CN100384572C (zh) 2005-12-29 2008-04-30 黄德欢 一种无机物载纳米银溶胶的制备方法
JP5063003B2 (ja) * 2006-01-25 2012-10-31 株式会社日本触媒 銅ナノ粒子の製造方法、銅ナノ粒子、導電性組成物および電子デバイス
JP4995492B2 (ja) * 2006-06-02 2012-08-08 株式会社日本触媒 銅ナノ粒子の製造方法、銅ナノ粒子、銅ナノ粒子分散体および電子デバイス
US7968008B2 (en) * 2006-08-03 2011-06-28 Fry's Metals, Inc. Particles and inks and films using them
WO2008036752A2 (en) 2006-09-22 2008-03-27 Fry's Metals, Inc. Solvent systems for metals and inks
US9615463B2 (en) 2006-09-22 2017-04-04 Oscar Khaselev Method for producing a high-aspect ratio conductive pattern on a substrate
EP2081729A4 (en) 2006-10-17 2010-12-22 Fry Metals Inc Materials for use with interconnects of electrical devices and related methods

Also Published As

Publication number Publication date
EP2066470A1 (en) 2009-06-10
EP2066470B1 (en) 2013-10-09
WO2008017062A1 (en) 2008-02-07
KR101431570B1 (ko) 2014-08-19
EP2380688B1 (en) 2014-06-04
JP2009545657A (ja) 2009-12-24
US20110318478A1 (en) 2011-12-29
US7968008B2 (en) 2011-06-28
US9217088B2 (en) 2015-12-22
CA2659028C (en) 2015-10-20
EP2380688A1 (en) 2011-10-26
HK1163598A1 (en) 2012-09-14
KR20090069162A (ko) 2009-06-29
CA2659028A1 (en) 2008-02-07
US20080032047A1 (en) 2008-02-07

Similar Documents

Publication Publication Date Title
JP2009545657A (ja) 粒子およびインクおよびそれらを用いるフィルム
JP5219296B2 (ja) 金属およびインクのための溶剤系
US7850933B2 (en) Nanoparticles, methods of making, and applications using same
US10462908B2 (en) Conductive patterns and methods of using them
JP6327612B2 (ja) 導体パターンを製造する方法
CN104024351A (zh) 导电金属和方法
KR20100092392A (ko) 유기 아민 안정화 은 나노입자 및 그의 제조 방법
KR20100083391A (ko) 인쇄회로기판용 도전성 잉크 조성물의 제조 방법 및 인쇄회로기판의 제조방법
JP5151229B2 (ja) 太陽電池の電極形成用組成物及び該電極の形成方法並びに該形成方法により得られた電極を用いた太陽電池の製造方法
Popovetskiy Metal-Based Inks for Printed Electronics. Comparison of the Main Approaches to Production
HK1163598B (en) Particles and inks and films using them
HK1145901A (zh) 導電圖形和使用方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100729

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100729

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120515

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120814

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120821

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120914

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120924

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20121012

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20121019

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121115

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130827

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131226

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20131226

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140206

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20140212

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140507

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140520

R150 Certificate of patent or registration of utility model

Ref document number: 5556176

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250