JP5488604B2 - 回路基板の製造方法および回路基板 - Google Patents

回路基板の製造方法および回路基板 Download PDF

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Publication number
JP5488604B2
JP5488604B2 JP2011529920A JP2011529920A JP5488604B2 JP 5488604 B2 JP5488604 B2 JP 5488604B2 JP 2011529920 A JP2011529920 A JP 2011529920A JP 2011529920 A JP2011529920 A JP 2011529920A JP 5488604 B2 JP5488604 B2 JP 5488604B2
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JP
Japan
Prior art keywords
circuit pattern
plate
circuit board
insulator
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011529920A
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English (en)
Japanese (ja)
Other versions
JPWO2011027792A1 (ja
Inventor
仁 志満津
岳彦 澤田
智朗 浅井
良 山内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Industries Corp
Original Assignee
Toyota Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Industries Corp filed Critical Toyota Industries Corp
Priority to JP2011529920A priority Critical patent/JP5488604B2/ja
Publication of JPWO2011027792A1 publication Critical patent/JPWO2011027792A1/ja
Application granted granted Critical
Publication of JP5488604B2 publication Critical patent/JP5488604B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
    • H01F27/306—Fastening or mounting coils or windings on core, casing or other support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
JP2011529920A 2009-09-01 2010-09-01 回路基板の製造方法および回路基板 Expired - Fee Related JP5488604B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011529920A JP5488604B2 (ja) 2009-09-01 2010-09-01 回路基板の製造方法および回路基板

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2009201877 2009-09-01
JP2009201877 2009-09-01
JP2009215150 2009-09-17
JP2009215150 2009-09-17
JP2010053244 2010-03-10
JP2010053244 2010-03-10
JP2011529920A JP5488604B2 (ja) 2009-09-01 2010-09-01 回路基板の製造方法および回路基板
PCT/JP2010/064952 WO2011027792A1 (ja) 2009-09-01 2010-09-01 回路基板の製造方法および回路基板

Publications (2)

Publication Number Publication Date
JPWO2011027792A1 JPWO2011027792A1 (ja) 2013-02-04
JP5488604B2 true JP5488604B2 (ja) 2014-05-14

Family

ID=43649326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011529920A Expired - Fee Related JP5488604B2 (ja) 2009-09-01 2010-09-01 回路基板の製造方法および回路基板

Country Status (6)

Country Link
US (1) US8917495B2 (de)
EP (1) EP2475231B1 (de)
JP (1) JP5488604B2 (de)
KR (1) KR101409343B1 (de)
CN (1) CN102474979B (de)
WO (1) WO2011027792A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5590085B2 (ja) * 2012-09-20 2014-09-17 株式会社豊田自動織機 平面コイルの中間体および平面コイルの製造方法
US9576717B2 (en) 2012-12-19 2017-02-21 Telefonaktiebolaget L M Ericsson (Publ) Planar transformer
JP6194506B2 (ja) * 2013-01-17 2017-09-13 Fdk株式会社 薄型トランス
CN203225947U (zh) * 2013-03-28 2013-10-02 富士康(昆山)电脑接插件有限公司 印刷电路板组件
JP2017085077A (ja) * 2015-10-27 2017-05-18 Ｊｘ金属株式会社 回路基板用金属板成形品および、パワーモジュールの製造方法
JP6627674B2 (ja) * 2016-07-21 2020-01-08 株式会社豊田自動織機 部品内蔵型多層基板の製造方法
JP6593274B2 (ja) * 2016-08-03 2019-10-23 株式会社豊田自動織機 多層基板
TWI633952B (zh) * 2017-05-17 2018-09-01 Ｊｘ金屬股份有限公司 Metal plate for circuit board, metal plate molded product for circuit board, circuit board, power module, and method for manufacturing power module
WO2018211640A1 (ja) * 2017-05-17 2018-11-22 Ｊｘ金属株式会社 回路基板用金属板、回路基板用金属板成形品、回路基板およびパワーモジュールならびに、パワーモジュールの製造方法
JP7462525B2 (ja) * 2018-06-01 2024-04-05 株式会社タムラ製作所 電子部品
JP6948757B2 (ja) * 2018-06-01 2021-10-13 株式会社タムラ製作所 電子部品
CN114615790A (zh) * 2020-12-09 2022-06-10 深南电路股份有限公司 耦合器及电子设备
KR20240020474A (ko) * 2022-08-08 2024-02-15 삼성전자주식회사 옵션 회로부를 구비한 인쇄회로기판

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0321095A (ja) * 1989-06-19 1991-01-29 Furukawa Electric Co Ltd:The 大電流回路基板の製造方法
JPH0513929A (ja) * 1991-07-04 1993-01-22 Hitachi Ltd 成形基板
JP2000244075A (ja) * 1999-02-19 2000-09-08 Furukawa Electric Co Ltd:The 電子部品実装用基板及びその製造方法

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
US1794831A (en) 1929-01-19 1931-03-03 Lionel Corp Multiple conductor strip and method of making the same
US3978375A (en) * 1973-04-20 1976-08-31 Matsushita Electric Industrial Co., Ltd. Wiring unit
JPS53115067A (en) * 1977-02-21 1978-10-07 Matsushita Electric Ind Co Ltd Method of producing printed circuit board
US4482874A (en) * 1982-06-04 1984-11-13 Minnesota Mining And Manufacturing Company Method of constructing an LC network
US5223676A (en) * 1989-11-27 1993-06-29 The Furukawa Electric Co., Ltd. Composite circuit board having means to suppress heat diffusion and manufacturing method of the same
JPH05243706A (ja) * 1992-03-03 1993-09-21 Furukawa Electric Co Ltd:The 回路基板の製造方法
JP2538770B2 (ja) * 1994-12-28 1996-10-02 富山日本電気株式会社 プリント配線板の製造方法
JPH09289360A (ja) 1996-04-19 1997-11-04 Matsushita Electric Ind Co Ltd 配線板とその製造方法
DE19707709C1 (de) * 1997-02-26 1998-04-16 Siemens Ag Leiterplatte für elektrische Schaltungen und Verfahren zur Herstellung einer solchen Leiterplatte, sowie Anordnung einer Leiterplatte auf einem Stecksockel
JPH11187542A (ja) * 1997-12-18 1999-07-09 Furukawa Electric Co Ltd:The バスバー配線板の製造方法
US6008982A (en) * 1998-05-20 1999-12-28 General Motors Corporation Low profile electrical distribution center and method of making a bus subassembly therefor
JP2001006210A (ja) 1999-06-22 2001-01-12 Sony Corp 光記録媒体及びディスクカートリッジ
JP2002005059A (ja) 2000-06-20 2002-01-09 Fujitsu General Ltd スクロール圧縮機
JP2002050590A (ja) 2000-08-03 2002-02-15 Sanyo Electric Co Ltd 半導体装置の製造方法
JP2002151804A (ja) * 2000-11-07 2002-05-24 Canon Inc プリント配線基板、部品実装基板および電子機器
JP2007134393A (ja) 2005-11-08 2007-05-31 Auto Network Gijutsu Kenkyusho:Kk 回路構成体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0321095A (ja) * 1989-06-19 1991-01-29 Furukawa Electric Co Ltd:The 大電流回路基板の製造方法
JPH0513929A (ja) * 1991-07-04 1993-01-22 Hitachi Ltd 成形基板
JP2000244075A (ja) * 1999-02-19 2000-09-08 Furukawa Electric Co Ltd:The 電子部品実装用基板及びその製造方法

Also Published As

Publication number Publication date
CN102474979A (zh) 2012-05-23
CN102474979B (zh) 2015-01-07
EP2475231B1 (de) 2015-05-27
KR101409343B1 (ko) 2014-06-18
JPWO2011027792A1 (ja) 2013-02-04
KR20120035196A (ko) 2012-04-13
WO2011027792A1 (ja) 2011-03-10
US20120160553A1 (en) 2012-06-28
EP2475231A4 (de) 2013-04-10
US8917495B2 (en) 2014-12-23
EP2475231A1 (de) 2012-07-11

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