JP5487631B2 - 化合物半導体装置及びその製造方法 - Google Patents

化合物半導体装置及びその製造方法 Download PDF

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Publication number
JP5487631B2
JP5487631B2 JP2009023953A JP2009023953A JP5487631B2 JP 5487631 B2 JP5487631 B2 JP 5487631B2 JP 2009023953 A JP2009023953 A JP 2009023953A JP 2009023953 A JP2009023953 A JP 2009023953A JP 5487631 B2 JP5487631 B2 JP 5487631B2
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buffer layer
layer
gan
semiconductor device
compound semiconductor
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Japanese (ja)
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JP2010182812A (ja
Inventor
俊英 吉川
健治 今西
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Fujitsu Ltd
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Fujitsu Ltd
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Priority to JP2009023953A priority Critical patent/JP5487631B2/ja
Priority to US12/697,391 priority patent/US8294181B2/en
Priority to CN2010101110119A priority patent/CN101794815B/zh
Priority to EP10152567.3A priority patent/EP2216806B1/fr
Publication of JP2010182812A publication Critical patent/JP2010182812A/ja
Priority to US13/591,401 priority patent/US8507329B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
    • H01L29/7783—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
    • H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
    • H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/2003—Nitride compounds

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Junction Field-Effect Transistors (AREA)
JP2009023953A 2009-02-04 2009-02-04 化合物半導体装置及びその製造方法 Active JP5487631B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009023953A JP5487631B2 (ja) 2009-02-04 2009-02-04 化合物半導体装置及びその製造方法
US12/697,391 US8294181B2 (en) 2009-02-04 2010-02-01 Compound semiconductor device and method of manufacturing the same
CN2010101110119A CN101794815B (zh) 2009-02-04 2010-02-02 化合物半导体器件及其制造方法
EP10152567.3A EP2216806B1 (fr) 2009-02-04 2010-02-03 Dispositif en semi-conducteur composé et son procédé de fabrication
US13/591,401 US8507329B2 (en) 2009-02-04 2012-08-22 Compound semiconductor device and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009023953A JP5487631B2 (ja) 2009-02-04 2009-02-04 化合物半導体装置及びその製造方法

Publications (2)

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JP2010182812A JP2010182812A (ja) 2010-08-19
JP5487631B2 true JP5487631B2 (ja) 2014-05-07

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US (2) US8294181B2 (fr)
EP (1) EP2216806B1 (fr)
JP (1) JP5487631B2 (fr)
CN (1) CN101794815B (fr)

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US9818857B2 (en) 2009-08-04 2017-11-14 Gan Systems Inc. Fault tolerant design for large area nitride semiconductor devices
US9029866B2 (en) * 2009-08-04 2015-05-12 Gan Systems Inc. Gallium nitride power devices using island topography
EP2465141B1 (fr) 2009-08-04 2021-04-07 GaN Systems Inc. Transitors hyperfréquence et de puissance à nitrure de gallium avec topologie à matrice
AU2011241423A1 (en) * 2010-04-13 2012-11-08 Gan Systems Inc. High density gallium nitride devices using island topology
JP2012054471A (ja) * 2010-09-02 2012-03-15 Fujitsu Ltd 半導体装置及びその製造方法、電源装置
JP5672926B2 (ja) * 2010-10-08 2015-02-18 富士通株式会社 化合物半導体装置及びその製造方法
KR101720589B1 (ko) * 2010-10-11 2017-03-30 삼성전자주식회사 이 모드(Ｅ-ｍｏｄｅ) 고 전자 이동도 트랜지스터 및 그 제조방법
JP5781292B2 (ja) * 2010-11-16 2015-09-16 ローム株式会社 窒化物半導体素子および窒化物半導体パッケージ
JP6018360B2 (ja) * 2010-12-02 2016-11-02 富士通株式会社 化合物半導体装置及びその製造方法
JP5707903B2 (ja) * 2010-12-02 2015-04-30 富士通株式会社 化合物半導体装置及びその製造方法
JP5810518B2 (ja) * 2010-12-03 2015-11-11 富士通株式会社 化合物半導体装置及びその製造方法
US20120153356A1 (en) * 2010-12-20 2012-06-21 Triquint Semiconductor, Inc. High electron mobility transistor with indium gallium nitride layer
JP5741042B2 (ja) * 2011-02-14 2015-07-01 富士通株式会社 化合物半導体装置及びその製造方法
JP5762049B2 (ja) * 2011-02-28 2015-08-12 ルネサスエレクトロニクス株式会社 半導体装置
JP2012182283A (ja) * 2011-03-01 2012-09-20 Sanken Electric Co Ltd 半導体装置
WO2012127567A1 (fr) * 2011-03-18 2012-09-27 富士通株式会社 Dispositif semi-conducteur composé, et procédé de fabrication associé
JP5803303B2 (ja) * 2011-06-08 2015-11-04 住友電気工業株式会社 半導体装置の製造方法
JP5914999B2 (ja) * 2011-06-08 2016-05-11 住友電気工業株式会社 半導体装置の製造方法
JP2013004750A (ja) * 2011-06-16 2013-01-07 Fujitsu Ltd 化合物半導体装置及びその製造方法
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JP6035721B2 (ja) * 2011-09-27 2016-11-30 住友電気工業株式会社 半導体装置の製造方法
JP5790461B2 (ja) * 2011-12-07 2015-10-07 富士通株式会社 化合物半導体装置及びその製造方法
JP2013149732A (ja) * 2012-01-18 2013-08-01 Mitsubishi Electric Corp へテロ接合電界効果型トランジスタおよびその製造方法
US9165766B2 (en) 2012-02-03 2015-10-20 Transphorm Inc. Buffer layer structures suited for III-nitride devices with foreign substrates
JP6054620B2 (ja) * 2012-03-29 2016-12-27 トランスフォーム・ジャパン株式会社 化合物半導体装置及びその製造方法
US10700201B2 (en) 2012-05-23 2020-06-30 Hrl Laboratories, Llc HEMT GaN device with a non-uniform lateral two dimensional electron gas profile and method of manufacturing the same
US8680536B2 (en) 2012-05-23 2014-03-25 Hrl Laboratories, Llc Non-uniform two dimensional electron gas profile in III-Nitride HEMT devices
US9379195B2 (en) 2012-05-23 2016-06-28 Hrl Laboratories, Llc HEMT GaN device with a non-uniform lateral two dimensional electron gas profile and method of manufacturing the same
US9000484B2 (en) * 2012-05-23 2015-04-07 Hrl Laboratories, Llc Non-uniform lateral profile of two-dimensional electron gas charge density in type III nitride HEMT devices using ion implantation through gray scale mask
JP2014072377A (ja) * 2012-09-28 2014-04-21 Fujitsu Ltd 化合物半導体装置及びその製造方法
JP2014146646A (ja) * 2013-01-28 2014-08-14 Fujitsu Ltd 半導体装置
US20160013327A1 (en) * 2013-03-08 2016-01-14 Hitachi, Ltd. Nitride semiconductor diode
JP6318474B2 (ja) * 2013-06-07 2018-05-09 住友電気工業株式会社 半導体装置の製造方法
JP6241915B2 (ja) * 2013-07-31 2017-12-06 住友電工デバイス・イノベーション株式会社 半導体装置の製造方法
JP2015095605A (ja) * 2013-11-13 2015-05-18 住友電気工業株式会社 半導体装置および半導体基板
US9502435B2 (en) 2015-04-27 2016-11-22 International Business Machines Corporation Hybrid high electron mobility transistor and active matrix structure
FR3043251B1 (fr) * 2015-10-30 2022-11-11 Thales Sa Transistor a effet de champ a rendement et gain optimise
CN105448976A (zh) * 2015-12-25 2016-03-30 深圳市华讯方舟微电子科技有限公司 一种增强型AlGaN/GaN高电子迁移率晶体管及其制造方法
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JP2018121001A (ja) * 2017-01-27 2018-08-02 ルネサスエレクトロニクス株式会社 半導体装置および半導体装置の製造方法
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Also Published As

Publication number Publication date
US8294181B2 (en) 2012-10-23
EP2216806A3 (fr) 2011-06-15
CN101794815B (zh) 2013-06-05
CN101794815A (zh) 2010-08-04
EP2216806A2 (fr) 2010-08-11
US20110031532A1 (en) 2011-02-10
US8507329B2 (en) 2013-08-13
US20120315743A1 (en) 2012-12-13
EP2216806B1 (fr) 2018-07-04
JP2010182812A (ja) 2010-08-19

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