JP5444136B2 - 配線基板 - Google Patents

配線基板 Download PDF

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Publication number
JP5444136B2
JP5444136B2 JP2010139664A JP2010139664A JP5444136B2 JP 5444136 B2 JP5444136 B2 JP 5444136B2 JP 2010139664 A JP2010139664 A JP 2010139664A JP 2010139664 A JP2010139664 A JP 2010139664A JP 5444136 B2 JP5444136 B2 JP 5444136B2
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JP
Japan
Prior art keywords
insulating layer
wiring
layer
insulating
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010139664A
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English (en)
Japanese (ja)
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JP2012004440A (ja
JP2012004440A5 (https=
Inventor
人資 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2010139664A priority Critical patent/JP5444136B2/ja
Publication of JP2012004440A publication Critical patent/JP2012004440A/ja
Publication of JP2012004440A5 publication Critical patent/JP2012004440A5/ja
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2010139664A 2010-06-18 2010-06-18 配線基板 Active JP5444136B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010139664A JP5444136B2 (ja) 2010-06-18 2010-06-18 配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010139664A JP5444136B2 (ja) 2010-06-18 2010-06-18 配線基板

Publications (3)

Publication Number Publication Date
JP2012004440A JP2012004440A (ja) 2012-01-05
JP2012004440A5 JP2012004440A5 (https=) 2013-06-27
JP5444136B2 true JP5444136B2 (ja) 2014-03-19

Family

ID=45536067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010139664A Active JP5444136B2 (ja) 2010-06-18 2010-06-18 配線基板

Country Status (1)

Country Link
JP (1) JP5444136B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229526A (ja) * 2012-04-26 2013-11-07 Ngk Spark Plug Co Ltd 多層配線基板及びその製造方法
KR101659678B1 (ko) 2012-05-24 2016-09-26 후지필름 가부시키가이샤 편광판 및 액정 표시 장치
JP5990421B2 (ja) * 2012-07-20 2016-09-14 新光電気工業株式会社 配線基板及びその製造方法、半導体パッケージ
JP5952153B2 (ja) * 2012-09-28 2016-07-13 京セラ株式会社 積層配線基板およびそれを用いた実装構造体
US10424547B2 (en) * 2017-08-30 2019-09-24 Advanced Semiconductor Engineering Inc. Semiconductor device package and a method of manufacturing the same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04322451A (ja) * 1991-04-23 1992-11-12 Hitachi Ltd 半導体装置
JP2000244127A (ja) * 1998-12-24 2000-09-08 Ngk Spark Plug Co Ltd 配線基板および配線基板の製造方法
JP2000286362A (ja) * 1999-03-30 2000-10-13 Mitsubishi Gas Chem Co Inc 極薄ｂｇａタイプ半導体プラスチックパッケージ用プリント配線板
JP2000294677A (ja) * 1999-04-05 2000-10-20 Fujitsu Ltd 高密度薄膜配線基板及びその製造方法
JP2001284809A (ja) * 2000-04-03 2001-10-12 Ibiden Co Ltd 多層回路基板および、その製造方法
JP3760101B2 (ja) * 2001-02-13 2006-03-29 富士通株式会社 多層プリント配線板およびその製造方法
JP2002290022A (ja) * 2001-03-27 2002-10-04 Kyocera Corp 配線基板およびその製造方法ならびに電子装置
JP4070193B2 (ja) * 2002-10-01 2008-04-02 京セラ株式会社 配線基板および電子部品実装構造体
JP4072176B2 (ja) * 2005-08-29 2008-04-09 新光電気工業株式会社 多層配線基板の製造方法
JP4806279B2 (ja) * 2006-03-17 2011-11-02 三菱樹脂株式会社 ガラスクロス含有絶縁基材
JP4929784B2 (ja) * 2006-03-27 2012-05-09 富士通株式会社 多層配線基板、半導体装置およびソルダレジスト
JP2008028302A (ja) * 2006-07-25 2008-02-07 Sumitomo Bakelite Co Ltd 多層回路基板及び該多層回路基板を用いた半導体装置
JP2008041932A (ja) * 2006-08-07 2008-02-21 Toray Ind Inc 配線基板の製造方法
JP5092547B2 (ja) * 2007-05-30 2012-12-05 凸版印刷株式会社 印刷配線板の製造方法
JP5096855B2 (ja) * 2007-09-27 2012-12-12 新光電気工業株式会社 配線基板の製造方法及び配線基板
JP2009224461A (ja) * 2008-03-14 2009-10-01 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
JP5295596B2 (ja) * 2008-03-19 2013-09-18 新光電気工業株式会社 多層配線基板およびその製造方法
JP5302635B2 (ja) * 2008-11-13 2013-10-02 パナソニック株式会社 多層配線基板

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JP2012004440A (ja) 2012-01-05

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