JP2019041041A - 配線基板、半導体装置、配線基板の製造方法及び半導体装置の製造方法 - Google Patents
配線基板、半導体装置、配線基板の製造方法及び半導体装置の製造方法 Download PDFInfo
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- JP2019041041A JP2019041041A JP2017163269A JP2017163269A JP2019041041A JP 2019041041 A JP2019041041 A JP 2019041041A JP 2017163269 A JP2017163269 A JP 2017163269A JP 2017163269 A JP2017163269 A JP 2017163269A JP 2019041041 A JP2019041041 A JP 2019041041A
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Classifications
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Abstract
Description
なお、添付図面は、便宜上、特徴を分かりやすくするために特徴となる部分を拡大して示している場合があり、各構成要素の寸法比率などが実際と同じであるとは限らない。また、断面図では、各部材の断面構造を分かりやすくするために、一部の部材のハッチングを梨地模様に代えて示し、一部の部材のハッチングを省略している。
配線構造21は、配線構造23よりも配線密度の低い配線層が形成された低密度配線層である。この配線構造21は、1層の絶縁層30と、配線層31と、絶縁層30を厚さ方向に貫通するビア配線32とを有している。
図1(a)に示すように、配線構造23は、絶縁層30の上面30Aに積層された配線構造である。配線構造23は、配線構造21よりも配線密度の高い配線層が形成された高密度配線層である。
配線基板20は、配線構造21の一方の側にソルダーレジスト層22が形成され、他方の側に高密度配線層である配線構造23とソルダーレジスト層24とが形成された構造、つまり配線構造21を中心として上下非対称の構造を有している。但し、配線基板20では、剛性の高いガラスクロス30Gを、配線構造21内において、絶縁層30の厚さ方向の中心C1よりも配線構造23側に片寄らせて設けるようにした。さらに、配線基板20では、ガラスクロス30Gを、絶縁層30の下面30Bから配線層45の上面までの厚さT3における厚さ方向の中心に位置するように設けた。すなわち、配線基板20では、ガラスクロス30Gの下面から絶縁層30の下面30Bまでの厚さと、ガラスクロス30Gの上面から配線層45の上面までの厚さとが等しくなるように、各部材の厚さが設定されている。これにより、剛性の高いガラスクロス30Gの位置を、配線基板20の厚さ方向の中心に近づけることができる。このため、配線基板20を上下方向(厚さ方向)に見たときに、ガラスクロス30Gを中心として上下対称の構造に近づけることができる。この結果、配線基板20を反りに強い構造とすることができるため、配線基板20に反りが発生することを好適に抑制できる。
次に、図4(a)に示す工程では、支持基板100の上面に、配線層31の上面31T全面及び側面31S全面と金属膜101の側面全面とを被覆する絶縁層30を形成する。この絶縁層30は、例えば、金属膜101に樹脂フィルムをラミネートした後に、樹脂フィルムを押圧しながら130〜200℃程度の温度で熱処理して硬化させることにより形成することができる。ここで、樹脂フィルムとしては、補強材であるガラスクロス30Gにエポキシ樹脂等の熱硬化性樹脂を含浸させた樹脂フィルムを用いることができる。図4(a)に示すように、本工程により形成された絶縁層30では、ガラスクロス30Gの上面が樹脂層34によって被覆され、ガラスクロス30Gの下面が樹脂層34と同じ厚さの樹脂層35によって被覆されている。このため、この場合の絶縁層30では、ガラスクロス30Gが絶縁層30の厚さ方向の中心付近に配設されている。なお、本工程では、ガラスクロス30Gの中心から樹脂層34の上面までの厚さを例えば20〜25μm程度とすることができ、ガラスクロス30Gの中心から樹脂層35の下面までの厚さを例えば20〜25μm程度とすることができる。
続いて、図4(b)に示す工程では、配線層31の上面31Tの一部が露出されるように絶縁層30の所定箇所に貫通孔30Yを形成する。この貫通孔30Yは、例えば、CO2レーザやUV−YAGレーザ等によるレーザ加工法によって形成することができる。
なお、本例のCMP法では、例えば、絶縁層30の上面30Aに形成された導電層105(図4(c)参照)を研磨する際には、導電層105(金属)の研磨量が、絶縁層30(樹脂)の研磨量に比べて大きくなるようにスラリーの材質や研磨パッドの硬度等が調整されている。また、本例のCMP法では、例えば、絶縁層30の上面30Aが露出された後に、スラリーの材質や研磨パッドの硬度等が変更される。具体的には、絶縁層30の上面30Aが露出された後には、絶縁層30(樹脂)の研磨量が、導電層105(金属)の研磨量に比べて大きくなるようにスラリーの材質や研磨パッドの硬度等が調整される。
(反りのシミュレーション)
図1(a)に示した配線基板20(実施例)と、図15に示した従来の配線基板200とについて、反りのシミュレーションを実行した。
実施例の配線基板20では、ソルダーレジスト層22の下面から上面までの厚さを22μm、配線層31の厚さを15μm、絶縁層30の下面30Bから上面30Aまでの厚さを30μmに固定した。また、配線基板20では、絶縁層40の下面から上面までの厚さを5μm、各絶縁層42,44の下面から上面までの厚さを7μm、各配線層41,43の厚さを2μm、配線層45の厚さを10μm、ソルダーレジスト層24の下面から上面までの厚さを22μmに固定した。すなわち、配線基板20全体の厚さ(つまり、ソルダーレジスト層22の下面から配線層45の上面までの厚さ)を81μmに設定した。また、配線構造23に占める配線層41,43,45の体積割合V2を70%に固定した。そして、このような配線基板20において、配線構造21に占める配線層31及びビア配線32の体積割合V1を、0%、10%、20%、30%、40%、50%、60%、70%、80%、90%、100%に変えた場合の反りのシミュレーションを実行した。
反りのシミュレーション結果を図10に示した。図10において、破線で示した反り量(具体的には、1.13mm)は、比較例の配線基板200における反り量である。図10に示すように、実施例の配線基板20では、体積割合V1が高くなるに連れて反り量が低減されることが確認された。具体的には、体積割合V1を70〜100%の範囲に設定することにより、比較例よりも、配線基板20の反り量を低減できることが確認された。すなわち、体積割合V2(ここでは、70%)に対する体積割合V1の比V1/V2を1.0〜1.4程度の範囲に設定することにより、比較例よりも、配線基板20の反り量を低減できることが確認された。さらに言えば、体積割合V1,V2の比V1/V2を1.0〜1.4程度の範囲に設定することにより、配線基板20より厚く設定された比較例の配線基板200よりも、配線基板20の反り量を低減できることが確認された。
以上のことから、配線基板20の反り量を効果的に抑制するためには、体積割合V2に対する体積割合V1の比V1/V2を、1.0〜1.4の範囲に設定することが好ましく、1.0〜1.14の範囲に設定することがより好ましい。
(1)配線基板20は、配線構造21の一方の側にソルダーレジスト層22が形成され、他方の側に高密度配線層である配線構造23とソルダーレジスト層24とが形成された構造、つまり配線構造21を中心として上下非対称の構造を有している。但し、配線基板20では、剛性の高いガラスクロス30Gを、配線構造21内において、絶縁層30の厚さ方向の中心C1よりも配線構造23側に片寄らせて設けるようにした。これにより、剛性の高いガラスクロス30Gの位置を、配線基板20の厚さ方向の中心に近づけることができる。このため、配線基板20を上下方向(厚さ方向)に見たときに、ガラスクロス30Gを中心として上下対称の構造に近づけることができる。この結果、配線基板20を反りに強い構造とすることができるため、配線基板20に反りが発生することを好適に抑制できる。
なお、上記実施形態は、これを適宜変更した以下の態様にて実施することもできる。
・上記実施形態では、ビア配線32の上端面32Aに、ビア配線46の下端面を直接接続するようにしたが、配線構造23の構造はこれに限定されない。
例えば図12(a)に示すように、配線層31の下面31Lを、絶縁層30の下面30Bよりも配線構造23側(ここでは、上側)に凹むように形成してもよい。本変形例の配線層31は、その下面31L全面が絶縁層30の下面30Bよりも配線構造23側に位置するように形成されている。この場合には、凹部30Xの内側面のうち下面30B側の一部が配線層31から露出されている。図12(b)に示すように、本変形例のソルダーレジスト層22は、配線パターン31Aの下面31Lの一部を被覆するとともに、配線パターン31Aから露出された凹部30Xの内側面を被覆するように形成されている。また、本変形例のソルダーレジスト層22は、導体パターン31Bの下面31L全面を被覆するとともに、導体パターン31Bから露出された凹部30Xの内側面を被覆するように形成されている。
・上記実施形態の配線構造23における配線層41,43,45及び絶縁層40,42,44の層数や配線の取り回しなどは様々に変形・変更することが可能である。
・上記実施形態では、ガラスクロス30Gを、絶縁層30の上面30Aから露出されないように絶縁層30内に配設したが、これに限定されない。
・上記実施形態では、配線基板20の最外層となる保護絶縁層の一例としてソルダーレジスト層22,24を例示したが、各種の感光性を有する絶縁性樹脂から保護絶縁層を形成することができる。
・上記実施形態では、半導体チップ60の裏面を露出するように封止樹脂70を形成した。これに限らず、半導体チップ60の裏面を被覆するように封止樹脂70を形成してもよい。
・上記実施形態では、配線基板20に半導体チップ60を実装し、その半導体チップ60を封止する封止樹脂70を形成した後に、支持基板100を除去したが、支持基板100を除去するタイミングはこれに限定されない。すなわち、支持基板100を除去した後の構造体のみで剛性を十分に確保することができれば、支持基板100を除去するタイミングは特に限定されない。例えば、絶縁層30の上面30Aに配線構造23を形成した直後に支持基板100を除去するようにしてもよい。
・上記実施形態並びに各変形例は適宜組み合わせてもよい。
20,20A 配線基板
21 配線構造(第1配線構造)
22 ソルダーレジスト層(保護絶縁層)
23 配線構造(第2配線構造)
24 ソルダーレジスト層
30 絶縁層(第1絶縁層)
30G ガラスクロス(補強材)
31 配線層(第1配線層)
32 ビア配線
34 樹脂層(第1樹脂層)
35 樹脂層(第2樹脂層)
40,42,44 絶縁層
41,43,45,48 配線層
60 半導体チップ(電子部品)
70 封止樹脂
100 支持基板
101 金属膜
105 導電層
Claims (8)
- 熱硬化性樹脂に対して補強材を入れた絶縁性樹脂からなる第1絶縁層と、
前記第1絶縁層の下面に形成された凹部と、
前記凹部に充填された第1配線層と、
前記第1絶縁層の上面から露出された上端面を有し、前記第1絶縁層を厚さ方向に貫通して前記第1配線層と接続されたビア配線と、を有する第1配線構造と、
前記第1絶縁層の下面に形成された保護絶縁層と、
感光性樹脂を主成分とする絶縁性樹脂からなる絶縁層と配線層とを有し、前記第1絶縁層の上面に積層された第2配線構造と、を有し、
前記第1絶縁層の上面と前記ビア配線の上端面とが研磨面であり、
前記第1配線層の下面は、前記第1絶縁層の下面と面一になるように、又は前記第1絶縁層の下面よりも前記第2配線構造側に凹むように形成されており、
前記第2配線構造の配線密度は、前記第1配線構造の配線密度よりも高く、
前記補強材は、前記第1絶縁層の厚さ方向の中心よりも前記第2配線構造側に偏在するとともに、前記第1絶縁層の下面から前記第2配線構造の最上層の配線層の上面までの厚さにおける厚さ方向の中心に位置するように設けられていることを特徴とする配線基板。 - 前記第1配線構造に占める前記第1配線層及び前記ビア配線の体積割合は、前記第2配線構造に占める、前記第2配線構造内の全ての配線層の体積割合以上の値に設定されていることを特徴とする請求項1に記載の配線基板。
- 前記第1絶縁層は、前記補強材と、前記補強材の上面を被覆する第1樹脂層と、前記補強材の下面を被覆する第2樹脂層とからなり、
前記第1樹脂層は、前記第2樹脂層よりも薄いことを特徴とする請求項1又は2に記載の配線基板。 - 前記補強材の表面全面は前記第1樹脂層及び前記第2樹脂層によって被覆されていることを特徴とする請求項3に記載の配線基板。
- 前記第1配線層は、配線パターンと、前記配線パターンの形成されていない領域に形成されたダミーパターンとを有することを特徴とする請求項1〜4のいずれか一項に記載の配線基板。
- 熱硬化性樹脂に対して補強材を入れた絶縁性樹脂からなる第1絶縁層と、
前記第1絶縁層の下面に形成された凹部と、
前記凹部に充填された第1配線層と、
前記第1絶縁層の上面から露出された上端面を有し、前記第1絶縁層を厚さ方向に貫通して前記第1配線層と接続されたビア配線と、を有する第1配線構造と、
前記第1絶縁層の下面に形成された保護絶縁層と、
感光性樹脂を主成分とする絶縁性樹脂からなる絶縁層と配線層とを有し、前記第1絶縁層の上面に積層された第2配線構造と、
前記第2配線構造の最上層の配線層に接続された電子部品と、
前記第2配線構造の最上層の絶縁層の上面に形成され、前記電子部品を封止する封止樹脂と、を有し、
前記第1絶縁層の上面と前記ビア配線の上端面とが研磨面であり、
前記第1配線層の下面は、前記第1絶縁層の下面と面一になるように、又は前記第1絶縁層の下面よりも前記第2配線構造側に凹むように形成されており、
前記第2配線構造の配線密度は、前記第1配線構造の配線密度よりも高く、
前記補強材は、前記第1絶縁層の厚さ方向の中心よりも前記第2配線構造側に偏在するとともに、前記第1絶縁層の下面から前記第2配線構造の最上層の配線層の上面までの厚さにおける厚さ方向の中心に位置するように設けられていることを特徴とする半導体装置。 - 支持基板上に第1配線層を形成する工程と、
前記支持基板上に、熱硬化性樹脂に対して補強材を入れた絶縁性樹脂からなる第1絶縁層を、前記第1配線層の側面全面及び上面全面を被覆するように形成する工程と、
前記第1絶縁層を厚さ方向に貫通して前記第1配線層の上面の一部を露出する貫通孔を形成する工程と、
前記貫通孔を充填するとともに、前記第1絶縁層の上面を被覆する導電層を形成する工程と、
前記第1絶縁層の上面から突出した前記導電層と前記第1絶縁層の上面の一部とを研磨し、前記第1絶縁層の上面に露出する上端面を有するビア配線を前記貫通孔内に形成する工程と、
前記第1絶縁層の上面に、感光性樹脂を主成分とする絶縁性樹脂からなる絶縁層と配線層とを有する第2配線構造を積層する工程と、
前記支持基板を除去し、前記第1絶縁層の下面及び前記第1配線層の下面を露出させる工程と、
前記第1絶縁層の下面に保護絶縁層を形成する工程と、
を有し、
前記第2配線構造の配線密度は、前記第1配線層の配線密度よりも高く、
前記第1絶縁層の下面及び前記第1配線層の下面を露出させる工程では、前記第1配線層の下面が、前記第1絶縁層の下面と面一になるように、又は前記第1絶縁層の下面よりも前記第2配線構造側に凹むように形成され、
前記第1絶縁層の上面の一部を研磨する工程では、前記補強材が前記第1絶縁層の厚さ方向の中心よりも前記第1絶縁層の上面側に偏在されるように前記第1絶縁層の上面が研磨され、
前記補強材は、前記第1絶縁層の下面から前記第2配線構造の最上層の配線層の上面までの厚さにおける厚さ方向の中心に位置するように設けられることを特徴とする配線基板の製造方法。 - 支持基板上に第1配線層を形成する工程と、
前記支持基板上に、熱硬化性樹脂に対して補強材を入れた絶縁性樹脂からなる第1絶縁層を、前記第1配線層の側面全面及び上面全面を被覆するように形成する工程と、
前記第1絶縁層を厚さ方向に貫通して前記第1配線層の上面の一部を露出する貫通孔を形成する工程と、
前記貫通孔を充填するとともに、前記第1絶縁層の上面を被覆する導電層を形成する工程と、
前記第1絶縁層の上面から突出した前記導電層と前記第1絶縁層の上面の一部とを研磨し、前記第1絶縁層の上面に露出する上端面を有するビア配線を前記貫通孔内に形成する工程と、
前記第1絶縁層の上面に、感光性樹脂を主成分とする絶縁性樹脂からなる絶縁層と配線層とを有する第2配線構造を積層する工程と、
前記第2配線構造の最上層の配線層に電子部品を接続する工程と、
前記第2配線構造の最上層の絶縁層の上面に、前記電子部品を封止する封止樹脂を形成する工程と、
前記支持基板を除去し、前記第1絶縁層の下面及び前記第1配線層の下面を露出させる工程と、
前記第1絶縁層の下面に保護絶縁層を形成する工程と、
を有し、
前記第2配線構造の配線密度は、前記第1配線層の配線密度よりも高く、
前記第1絶縁層の下面及び前記第1配線層の下面を露出させる工程では、前記第1配線層の下面が、前記第1絶縁層の下面と面一になるように、又は前記第1絶縁層の下面よりも前記第2配線構造側に凹むように形成され、
前記第1絶縁層の上面の一部を研磨する工程では、前記補強材が前記第1絶縁層の厚さ方向の中心よりも前記第1絶縁層の上面側に偏在されるように前記第1絶縁層の上面が研磨され、
前記補強材は、前記第1絶縁層の下面から前記第2配線構造の最上層の配線層の上面までの厚さにおける厚さ方向の中心に位置するように設けられることを特徴とする半導体装置の製造方法。
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