JP5439950B2 - はんだコート部品、その製造方法及びその実装方法 - Google Patents

はんだコート部品、その製造方法及びその実装方法 Download PDF

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Publication number
JP5439950B2
JP5439950B2 JP2009124716A JP2009124716A JP5439950B2 JP 5439950 B2 JP5439950 B2 JP 5439950B2 JP 2009124716 A JP2009124716 A JP 2009124716A JP 2009124716 A JP2009124716 A JP 2009124716A JP 5439950 B2 JP5439950 B2 JP 5439950B2
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JP
Japan
Prior art keywords
solder
frame member
metal member
treatment
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009124716A
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English (en)
Japanese (ja)
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JP2010272774A (ja
JP2010272774A5 (https=
Inventor
勇 佐藤
光司 渡辺
道雄 鈴木
剛憲 東
睦 出口
雅哉 伊東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2009124716A priority Critical patent/JP5439950B2/ja
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Priority to CN201080022520.2A priority patent/CN102440091B/zh
Priority to KR1020117027704A priority patent/KR101970831B1/ko
Priority to PCT/JP2010/058466 priority patent/WO2010134552A1/ja
Priority to KR1020167023297A priority patent/KR102134500B1/ko
Priority to TW099116264A priority patent/TWI524964B/zh
Publication of JP2010272774A publication Critical patent/JP2010272774A/ja
Publication of JP2010272774A5 publication Critical patent/JP2010272774A5/ja
Application granted granted Critical
Publication of JP5439950B2 publication Critical patent/JP5439950B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0233—Sheets or foils
    • B23K35/0238—Sheets or foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
JP2009124716A 2009-05-22 2009-05-22 はんだコート部品、その製造方法及びその実装方法 Active JP5439950B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2009124716A JP5439950B2 (ja) 2009-05-22 2009-05-22 はんだコート部品、その製造方法及びその実装方法
KR1020117027704A KR101970831B1 (ko) 2009-05-22 2010-05-19 땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법
PCT/JP2010/058466 WO2010134552A1 (ja) 2009-05-22 2010-05-19 はんだコート部品、その製造方法及びその実装方法
KR1020167023297A KR102134500B1 (ko) 2009-05-22 2010-05-19 땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법
CN201080022520.2A CN102440091B (zh) 2009-05-22 2010-05-19 焊料涂布元件及其制造方法、安装方法
TW099116264A TWI524964B (zh) 2009-05-22 2010-05-21 A solder coating member, a method for manufacturing the same, and a method of mounting the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009124716A JP5439950B2 (ja) 2009-05-22 2009-05-22 はんだコート部品、その製造方法及びその実装方法

Publications (3)

Publication Number Publication Date
JP2010272774A JP2010272774A (ja) 2010-12-02
JP2010272774A5 JP2010272774A5 (https=) 2012-04-19
JP5439950B2 true JP5439950B2 (ja) 2014-03-12

Family

ID=43126229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009124716A Active JP5439950B2 (ja) 2009-05-22 2009-05-22 はんだコート部品、その製造方法及びその実装方法

Country Status (5)

Country Link
JP (1) JP5439950B2 (https=)
KR (2) KR101970831B1 (https=)
CN (1) CN102440091B (https=)
TW (1) TWI524964B (https=)
WO (1) WO2010134552A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101029221B1 (ko) * 2011-01-14 2011-04-14 에프엔티주식회사 부분 도금층이 마련된 전자파 차단용 쉴드캔 고정클립
US9391029B2 (en) 2014-06-12 2016-07-12 Kabushiki Kaisha Toshiba Electronic device
DE102014110459A1 (de) * 2014-07-24 2016-01-28 Mahle International Gmbh Wärmeübertrager
KR102311677B1 (ko) 2014-08-13 2021-10-12 삼성전자주식회사 반도체소자 및 그 제조방법
CN108029222B (zh) * 2015-09-18 2020-08-28 东丽株式会社 电子设备壳体
KR102717102B1 (ko) 2016-09-06 2024-10-16 삼성디스플레이 주식회사 디스플레이 장치
CN109079270A (zh) * 2018-10-26 2018-12-25 南通舟舰钣金有限公司 一种锡焊方法
JP6871524B1 (ja) * 2020-03-23 2021-05-12 千住金属工業株式会社 積層接合材料、半導体パッケージおよびパワーモジュール
US11744019B2 (en) * 2020-11-18 2023-08-29 Murata Manufacturing Co., Ltd. Component mounted on circuit board
EP4325568B1 (en) * 2021-04-28 2025-10-22 Senju Metal Industry Co., Ltd. Layered bonding material, semiconductor package, and power module
CN113205957B (zh) * 2021-05-26 2023-01-10 厦门匠锐科技有限公司 一种骨架线圈的生产线
CN115642773A (zh) 2021-07-19 2023-01-24 台达电子企业管理（上海）有限公司 电路模块和固态变压器系统
CN115643738B (zh) * 2021-07-19 2026-04-24 台达电子企业管理（上海）有限公司 功率模块和固态变压器系统
CN117161499A (zh) * 2023-09-05 2023-12-05 西安微电子技术研究所 一种j形引脚陶瓷封装器件的搪锡方法
JP7632924B1 (ja) * 2024-02-16 2025-02-19 Ｎｅｃプラットフォームズ株式会社 シールド部品、電子機器、及び、シールド部品の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01289298A (ja) * 1988-05-17 1989-11-21 Alps Electric Co Ltd シールドケースの製造方法
JPH03104197A (ja) * 1989-09-18 1991-05-01 Canon Inc シールドケース
JPH0563100U (ja) * 1992-01-30 1993-08-20 京セラ株式会社 シールドケース付電子部品
JPH07147495A (ja) * 1993-11-26 1995-06-06 Nec Corp プリント基板表面実装用シールドケース
US5911356A (en) * 1996-08-19 1999-06-15 Sony Corporation Method for attaching lead parts and shield case to printed circuit board, and method for attaching chip parts, lead parts and shield case to printed circuit board
JPH10117062A (ja) * 1996-08-19 1998-05-06 Sony Corp リード部品及び高周波信号が漏洩するのを防ぐシールドケースのプリント基板への取付け方法並びに取付け装置、チップ部品、リード部品及び高周波信号が漏洩するのを防ぐシールドケースのプリント基板への取付け方法並びに取付け装置
JP2001007588A (ja) * 1999-06-21 2001-01-12 Alps Electric Co Ltd 電子回路ユニット
JP2001155955A (ja) * 1999-11-30 2001-06-08 Taiyo Kagaku Kogyo Kk 外部端子電極具備電子部品及びその搭載電子用品
JP2001217588A (ja) * 2000-01-31 2001-08-10 Sharp Corp シールドケース及びそれを用いたｒｆ通信ユニット
JP3657874B2 (ja) * 2000-10-30 2005-06-08 株式会社ルネサステクノロジ 半導体装置および電子機器
JP4685274B2 (ja) * 2001-05-31 2011-05-18 京セラキンセキ株式会社 電子部品容器
JP4222015B2 (ja) * 2002-12-04 2009-02-12 株式会社村田製作所 電子部品の製造方法
WO2004070836A1 (ja) * 2003-02-06 2004-08-19 Neomax Co., Ltd. 気密封止用キャップおよびその製造方法
CN100508714C (zh) * 2004-09-27 2009-07-01 株式会社村田制作所 屏蔽罩
JP2006196664A (ja) 2005-01-13 2006-07-27 Fuji Photo Film Co Ltd 基板へのシールドケース取付構造及び携帯電話

Also Published As

Publication number Publication date
CN102440091A (zh) 2012-05-02
JP2010272774A (ja) 2010-12-02
KR20160105913A (ko) 2016-09-07
CN102440091B (zh) 2014-09-03
KR20120023002A (ko) 2012-03-12
TWI524964B (zh) 2016-03-11
KR102134500B1 (ko) 2020-07-15
TW201102208A (en) 2011-01-16
KR101970831B1 (ko) 2019-08-27
WO2010134552A1 (ja) 2010-11-25

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