JP5439950B2 - Solder-coated component, its manufacturing method and its mounting method - Google Patents
Solder-coated component, its manufacturing method and its mounting method Download PDFInfo
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- JP5439950B2 JP5439950B2 JP2009124716A JP2009124716A JP5439950B2 JP 5439950 B2 JP5439950 B2 JP 5439950B2 JP 2009124716 A JP2009124716 A JP 2009124716A JP 2009124716 A JP2009124716 A JP 2009124716A JP 5439950 B2 JP5439950 B2 JP 5439950B2
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- 229910000679 solder Inorganic materials 0.000 title claims description 238
- 238000000034 method Methods 0.000 title claims description 102
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000000463 material Substances 0.000 claims description 123
- 238000007747 plating Methods 0.000 claims description 118
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 80
- 238000011282 treatment Methods 0.000 claims description 70
- 239000002184 metal Substances 0.000 claims description 58
- 229910052751 metal Inorganic materials 0.000 claims description 58
- 238000005476 soldering Methods 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 32
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 31
- 238000000576 coating method Methods 0.000 claims description 30
- 229910020888 Sn-Cu Inorganic materials 0.000 claims description 28
- 229910019204 Sn—Cu Inorganic materials 0.000 claims description 28
- 229910052759 nickel Inorganic materials 0.000 claims description 28
- 238000012545 processing Methods 0.000 claims description 25
- 238000004381 surface treatment Methods 0.000 claims description 24
- 239000011248 coating agent Substances 0.000 claims description 21
- 230000003014 reinforcing effect Effects 0.000 claims description 21
- 229910017944 Ag—Cu Inorganic materials 0.000 claims description 15
- 229910020836 Sn-Ag Inorganic materials 0.000 claims description 13
- 229910020988 Sn—Ag Inorganic materials 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
- 229910016331 Bi—Ag Inorganic materials 0.000 claims description 10
- 229910002482 Cu–Ni Inorganic materials 0.000 claims description 10
- 229910017932 Cu—Sb Inorganic materials 0.000 claims description 10
- 229910020830 Sn-Bi Inorganic materials 0.000 claims description 10
- 229910018728 Sn—Bi Inorganic materials 0.000 claims description 10
- 238000005304 joining Methods 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 63
- 238000009736 wetting Methods 0.000 description 24
- 238000005238 degreasing Methods 0.000 description 16
- 238000005452 bending Methods 0.000 description 15
- 239000010949 copper Substances 0.000 description 12
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 11
- 230000002265 prevention Effects 0.000 description 11
- 230000002787 reinforcement Effects 0.000 description 10
- 241000723554 Pontia occidentalis Species 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000007654 immersion Methods 0.000 description 9
- 239000002335 surface treatment layer Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 229910052797 bismuth Inorganic materials 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000008151 electrolyte solution Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- 235000009414 Elaeocarpus kirtonii Nutrition 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 235000013584 Tabebuia pallida Nutrition 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- -1 copper complex ions Chemical class 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 241000377588 Atalaya hemiglauca Species 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 241000199223 Elaeocarpus kirtonii Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910007567 Zn-Ni Inorganic materials 0.000 description 1
- 229910007614 Zn—Ni Inorganic materials 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012549 training Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
Description
本発明は、基板上に実装された電子部品を電磁的に遮蔽するシールドケースや、短小軽薄基板を補強する基板補強フレームに適用可能なはんだコート部品、その製造方法及びその実装方法に関するものである。 The present invention relates to a shield case that electromagnetically shields an electronic component mounted on a substrate, a solder coated component applicable to a substrate reinforcing frame that reinforces a short, small and thin substrate, a manufacturing method thereof, and a mounting method thereof. .
近年、携帯電話機やパーソナルコンピュータ等の情報処理装置、オーディオ・ビデオ機器や電子顕微鏡等の画像機器、各種医療機器、テレビチューナー、無線通信装置において、高速動作の要求から、数百ＭＨｚ〜数十ＧＨｚ単位の周波数の信号で動作する電子回路が組み込まれる傾向にある。このような高い周波数で動作する電子回路において、基板上に実装された電子部品同士、電子回路同士の電磁波の干渉防止、外部への電磁気の影響を遮断し、誤動作を防止するためにシールドケースが用いられる場合が多い（ＥＭＩ防止機能）。 In recent years, in information processing apparatuses such as mobile phones and personal computers, imaging equipment such as audio / video equipment and electron microscopes, various medical equipment, TV tuners, and wireless communication devices, several hundred MHz to several tens GHz due to the demand for high-speed operation. Electronic circuits that operate with signals of unit frequency tend to be incorporated. In such an electronic circuit operating at a high frequency, a shield case is provided to prevent electromagnetic interference between electronic components mounted on the board and between electronic circuits, to prevent electromagnetic interference to the outside, and to prevent malfunction. Often used (EMI prevention function).
一般に、シールドケースは、基板に実装する金属製の成形部品であり、基板に開口された挿通部を介してシールドケースから延出する爪部を基板裏面の配線パターンにはんだ付けする方法と、基板面に設けられたランドパターンにシールドケースの実装部位を面実装する方法とが知られている。面実装においても、はんだ付け処理がなされる。シールドケースは、精密モジュールを外力から保護する目的等でも使用される場合が多い。 In general, a shield case is a metal molded part that is mounted on a board, and a method of soldering a claw part extending from the shield case to a wiring pattern on the back side of the board via an insertion part opened in the board, A method of surface mounting a mounting part of a shield case on a land pattern provided on a surface is known. Soldering is also performed in surface mounting. The shield case is often used for the purpose of protecting the precision module from external force.
また、携帯電話機や、デジタルカメラ、小型オーディオ機器等には、短小軽薄の実装基板が実装され、この実装基板の樹脂封止等における反りを防止するために、基板補強フレーム類が実装される場合も多くなっている。これらのシールドケースや基板補強フレーム等の筐体部品には、耐磁性、耐防錆、耐酸化性、耐熱膨張性、加工性等から洋白材（Ｃｕ−Ｚｎ−Ｎｉ／Ｃ７５２１Ｒ，Ｃ７７０１Ｒ等）や、ステンレス材（ＳＵＳ３０４、ＳＵＳ３１６，ＳＵＳ４３０等）の金属部材（母材）が使用される場合が多い。 In addition, short, small and light mounting boards are mounted on mobile phones, digital cameras, small audio devices, etc., and board reinforcement frames are mounted to prevent warping in resin sealing of the mounting boards. Has also increased. Housing parts such as shield cases and board reinforcement frames are made of white materials (Cu-Zn-Ni / C7521R, C7701R, etc.) because of their magnetic resistance, rust resistance, oxidation resistance, thermal expansion resistance, and workability. In addition, a metal member (base material) made of stainless steel (SUS304, SUS316, SUS430, etc.) is often used.
なお、筐体部品に一般的に用いられる金属部材において、仕上げ加工性は、洋白材（Ｃ７５２１Ｒ、Ｃ７７０１Ｒ等）がやや難しく、ステンレス材（ＳＵＳ３０４、ＳＵＳ３１６，ＳＵＳ４３０等）は易しい。はんだぬれ性は、洋白材がやや易しく、ステンレス材が難しい。 In addition, in a metal member generally used for a casing component, finishing workability is slightly difficult for a white material (C7521R, C7701R, etc.), and a stainless material (SUS304, SUS316, SUS430, etc.) is easy. The solder wettability is slightly easier for white materials and difficult for stainless materials.
この種のシールドケースの実装方法に関連して、特許文献１には、シールドケース取付構造が開示されている。このシールドケース取付構造によれば、基板、シールドケース及び固定部材を備える。基板は、挿通部を有して一方の面に電子部品が実装される。シールドケースは突出部を有して電子部品を覆い電磁波を遮断する。シールドケースから突出された突出部が基板の挿通部に挿入される。これを前提にして、固定部材が、挿通部に挿通された突出部を基板の他方の面で固定するようになされる。このようにシールドケースの取付構造を採ると、シールドケース内に、はんだ屑や、はんだフラックスが入り込むのを防止できるというものである。 In relation to this type of shield case mounting method, Patent Document 1 discloses a shield case mounting structure. According to the shield case mounting structure, the substrate, the shield case, and the fixing member are provided. The board has an insertion part and an electronic component is mounted on one surface. The shield case has a protrusion and covers the electronic component to block electromagnetic waves. The protruding portion protruding from the shield case is inserted into the insertion portion of the substrate. On the premise of this, the fixing member fixes the protruding portion inserted into the insertion portion on the other surface of the substrate. By adopting the shield case mounting structure in this way, it is possible to prevent solder dust and solder flux from entering the shield case.
ところで、従来例に係るシールドケースや基板補強フレーム等の筐体部品によれば、次のような問題がある。
ｉ．特許文献１に見られるようなシールドケースによれば、板金を折り曲げて作製されているものが多く、隣接する側面の間には隙間が形成される。そして、側面から延出された爪部を、基板に設けられたランドパターンにはんだ付けすることで、シールドケースを基板に固定するようになされる。しかし、携帯電話機等の情報端末装置の小型化に伴って、シールドケースが取り付けられる実装基板も小型化してきている。この小型化によって、はんだ付け用のランドパターンの面積も小さくなる傾向にある。ランドパターンの面積が小さくなると、はんだ付け作業にかかる時間が長くなる等の作業性が悪くなる。
By the way, according to the casing parts such as the shield case and the board reinforcing frame according to the conventional example, there are the following problems.
i. According to the shield case found in Patent Document 1, many are manufactured by bending a sheet metal, and a gap is formed between adjacent side surfaces. Then, the shield case is fixed to the substrate by soldering the claw portion extending from the side surface to a land pattern provided on the substrate. However, with the miniaturization of information terminal devices such as mobile phones, the mounting substrate to which the shield case is attached has also been miniaturized. This miniaturization tends to reduce the area of the land pattern for soldering. When the area of the land pattern is reduced, workability such as a longer time for soldering work is deteriorated.
ii．特に、基板のランドパターンにシールドケースの爪部をはんだ付けして固定する方法によれば、はんだ付け面積が小さくなり、はんだが取れやすくなり、基板に対するシールドケースの接合力が強度的に弱くなる。 ii. In particular, according to the method of soldering and fixing the claw portion of the shield case to the land pattern of the board, the soldering area is reduced, the solder can be easily removed, and the bonding strength of the shield case to the board is weakened in strength. .
iii．一般的にシールドケースや、基板補強フレーム等の筐体部品のはんだ付け面は、はんだ付け処理を行う前に表面処理が施される。このときの表面処理によれば、脱脂処理や防錆処理、めっき処理等が施される。脱脂処理や防錆処理は、表面の清浄、保護効果のみであり、良好なはんだ付けが難しい。めっき処理によれば、数ミクロン単位の厚みの錫単元、あるいは、錫銀、錫銅などの二元のはんだ下地めっきが施される。この種の表面処理が施された筐体部品を基板に実装する際、はんだは基板側のみに塗布され、筐体部品側にははんだは塗布されておらず、実装時の状態で見れば全体的にはんだの量が少なく、はんだぬれ性が悪いので、表面実装時に、満足の行くフィレット形成が難しい等のはんだ付けの問題が解決されていないのが現状である。 iii. In general, the soldering surface of a casing part such as a shield case or a board reinforcing frame is subjected to a surface treatment before the soldering process. According to the surface treatment at this time, degreasing treatment, rust prevention treatment, plating treatment or the like is performed. Degreasing and rust prevention treatments are only for surface cleansing and protective effects, and good soldering is difficult. According to the plating treatment, a single unit of tin having a thickness of several microns, or binary solder base plating such as tin silver or tin copper is applied. When mounting a case component with this type of surface treatment on the substrate, the solder is applied only to the substrate side, and no solder is applied to the case component side. Since the amount of solder is small and solder wettability is poor, the problem of soldering such as difficulty in forming a satisfactory fillet during surface mounting has not been solved.
iv．また、シールドケースのはんだ付け面に溶融はんだめっきをすることが考えられるが、シールドケースに用いられる洋白やステンレスははんだ付け性が悪いため、強活性のフラックスを用いて溶融はんだめっきを行わなければならない。このような方法では、はんだ付け後に洗浄を行っても腐食性の高い残渣が残りやすく、信頼性が低下する。 iv. In addition, it is conceivable to perform hot-dip solder plating on the soldering surface of the shield case. However, the white or stainless steel used for the shield case has poor solderability, so the hot solder flux must be used for hot-dip solder plating. I must. In such a method, even if cleaning is performed after soldering, a highly corrosive residue tends to remain, and reliability is lowered.
そこで、本発明はこのような課題を解決したものであって、腐食性の高い強活性のフラックスを用いなくとも筐体部品の任意のはんだ付け領域の全範囲でフィレット部分を形成できるようにすると共に、はんだ未接合部分や、ボイド等を発生することなく、基板に確実かつ強固に接合できるようにしたはんだコート部品、その製造方法及びその実装方法を提供することを目的とする。 Accordingly, the present invention solves such a problem, and enables the fillet portion to be formed in the entire range of an arbitrary soldering region of the housing component without using a highly corrosive and highly active flux. Another object of the present invention is to provide a solder-coated component that can be securely and firmly bonded to a substrate without generating a solder unbonded portion, void, or the like, a manufacturing method thereof, and a mounting method thereof.
上述の課題を解決するために、はんだコート部品は、母材上に所定の膜厚のニッケル皮膜及び錫合金めっき皮膜を順次設けられ、かつ、当該錫合金めっき皮膜上に鉛フリーの溶融はんだがコート処理されて表面処理が施された金属部材からなるはんだコート部品であって、前記表面処理された金属部材は、はんだ付けされる接合部分を含む蓋部材、シールドケース及び基板補強用フレームの少なくともいずれか１つの形状に加工されて成り、少なくとも、前記接合部分がはんだ付け面となされ、前記はんだ付け面に表面処理によって所定の膜厚のニッケル皮膜、錫合金めっき皮膜及び溶融はんだ皮膜が順次形成されていることを特徴とするものである。
In order to solve the above-mentioned problems, a solder coated component is provided with a nickel film and a tin alloy plating film of a predetermined thickness on a base material in order, and lead-free molten solder is formed on the tin alloy plating film. a solder coating component made of a metal member coated treated with surface-treated, the surface-treated metal member, the lid member including a joint portion to be soldered, the shield case and at least a substrate reinforcing frame Processed into any one of the shapes, at least the joint portion becomes a soldering surface, and a nickel film, a tin alloy plating film, and a molten solder film having a predetermined thickness are sequentially formed on the soldering surface by surface treatment. it is is characterized in Rukoto.
本発明に係るはんだコート部品によれば、例えば、表面処理された金属部材がはんだ付けされる接合部分を含む蓋部材、シールドケース及び基板補強用フレームの少なくともいずれか一方の部品形状に加工され、その後、金属部材の一部位又は全ての部位に所定の膜厚のニッケル皮膜及び錫合金めっき皮膜を順次形成して下地処理し、下地処理後の金属部材上の一部位又は全ての部位に溶融はんだがコート処理されてなる表面処理が施され、少なくとも、当該接合部分がはんだ付け面となされ、はんだ付け面に表面処理によって所定の膜厚のニッケル皮膜、錫合金めっき皮膜及び溶融はんだ皮膜が形成されている。鉛フリーの溶融はんだには、Ｓｎ−Ａｇ系、Ｓｎ−Ｃｕ系、Ｓｎ−Ａｇ−Ｃｕ系、Ｓｎ−Ｂｉ系、Ｓｎ−Ａｇ−Ｃｕ−Ｂｉ系、Ｓｎ−Ｂｉ−Ａｇ（Ｃｕ）系、Ｓｎ−Ａｇ−Ｃｕ−Ｎｉ系、又は、Ｓｎ−Ａｇ−Ｃｕ−Ｓｂ系等の鉛フリーはんだが使用される。
According to the solder coat component according to the present invention, for example, it is processed into a component shape of at least one of a lid member, a shield case, and a board reinforcing frame including a joint portion to which a surface-treated metal member is soldered , After that, a nickel film and a tin alloy plating film with a predetermined film thickness are sequentially formed on one part or all parts of the metal member, and the ground treatment is performed, and molten solder is applied to a part or all of the parts on the metal member after the ground treatment. A surface treatment is applied, and at least the joint portion is a soldering surface, and a nickel film, a tin alloy plating film and a molten solder film having a predetermined film thickness are formed on the soldering surface by the surface treatment. It is. Lead-free molten solder includes Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Bi, Sn-Ag-Cu-Bi, Sn-Bi-Ag (Cu), Sn Lead-free solder such as -Ag-Cu-Ni or Sn-Ag-Cu-Sb is used.
従って、面実装用のはんだコート部品のはんだ付け部分のはんだぬれ性が、従来例のめっき処理方法や、防錆処理、脱脂処理等によるはんだ付け処理に比べて、より一段と向上（良好となる）できるようになる。 Accordingly, the solder wettability of the soldered part of the surface-mounted solder-coated component is further improved (becomes better) than the conventional plating method, soldering treatment by rust prevention treatment, degreasing treatment, etc. become able to.
本発明に係るはんだコート部品の製造方法は、はんだコート部品用の母材となる金属部材に所定の膜厚のニッケル皮膜及び錫合金めっき皮膜を順次形成して下地処理する工程及び下地処理された前記錫合金めっき皮膜上に鉛フリーの溶融はんだをコート処理する工程とからなる表面処理工程と、前記表面処理工程の前又は後に前記金属部材を加工して、はんだ付けされる接合部分を含む蓋部材、シールドケース及び基板補強用フレームの少なくともいずれか１つの形状に形成する工程とを有し、少なくとも、前記接合部分がはんだ付け面となされ、前記はんだ付け面に前記表面処理工程によって所定の膜厚のニッケル皮膜、錫合金めっき皮膜及び溶融はんだ皮膜が順次形成されているものである。
The method for manufacturing a solder coated component according to the present invention includes a step of sequentially forming a nickel film and a tin alloy plating film having a predetermined film thickness on a metal member which is a base material for the solder coated component, and a substrate treatment. A lid including a surface treatment step comprising a step of coating a lead-free molten solder on the tin alloy plating film, and a joint portion to be soldered by processing the metal member before or after the surface treatment step Forming at least one of a member, a shield case, and a board reinforcing frame, at least the joining portion is a soldering surface, and a predetermined film is formed on the soldering surface by the surface treatment step. the thickness of the nickel coating, a tin alloy plated film and the molten solder film is shall have been successively formed.
本発明に係るはんだコート部品の製造方法によれば、従来例のめっき処理方法や、防錆処理、脱脂処理等によるはんだ付け処理に比べて、面実装用のはんだコート部品のはんだ付け部分のはんだぬれ性をより一段と向上できるようになる。 According to the method for manufacturing a solder coated part according to the present invention, the solder of the soldered part of the solder coated part for surface mounting is compared with the plating method of the conventional example and the soldering process by rust prevention process, degreasing process, etc. The wettability can be further improved.
本発明に係るはんだコート部品の第１の実装方法は、一方で、はんだコート部品用の母材となる金属部材を加工して、はんだ付けされる接合部分を含む蓋部材、シールドケース及び基板補強用フレームの少なくともいずれか１つの形状に形成する工程と、少なくとも、前記接合部分がはんだ付け面となされ、前記はんだ付け面にニッケル皮膜及び錫合金めっき皮膜を順次形成して下地処理する工程及び下地処理された前記金属部材に溶融はんだをコート処理する工程からなる表面処理工程と、他方で、前記金属部材が接合される所定の部位にはんだ材料を形成する工程と、前記はんだ材料が形成された前記所定の部位に、前記表面処理された前記金属部材の前記接合部分を位置合わせして熱処理を施し、前記所定の部位に前記金属部材を接合する工程とを有することを特徴とするものである。
The first mounting method of the solder coat component according to the present invention, on the other hand, is a lid member, a shield case, and a substrate reinforcement including a joint portion to be soldered by processing a metal member as a base material for the solder coat component Forming at least one shape of the frame for use, and at least a step of performing a ground treatment by sequentially forming a nickel film and a tin alloy plating film on the soldering surface, wherein the joint portion is a soldering surface A surface treatment step comprising a step of coating the treated metal member with molten solder; on the other hand, a step of forming a solder material at a predetermined site where the metal member is joined ; and the solder material is formed. wherein a predetermined portion, the aligning surface treated the joint portion of the metal member is subjected to a heat treatment, before Symbol joining the metal member at the predetermined site It is characterized in that it has a that step.
また、本発明に係るはんだコート部品の第２の実装方法は、一方で、はんだコート部品用の母材となる金属部材に所定の膜厚のニッケル皮膜及び錫合金めっき皮膜を順次形成して下地処理する工程及び下地処理された前記金属部材に溶融はんだをコート処理する工程とからなる表面処理工程と、表面処理された前記金属部材を加工して、はんだ付けされる接合部分を含む蓋部材、シールドケース及び基板補強用フレームの少なくともいずれか１つの形状に形成する工程と、他方で、前記金属部材が接合される所定の部位にはんだ材料を形成する工程と、前記はんだ材料が形成された前記基板の所定の部位に、前記表面処理された前記金属部材の前記接合部分を位置合わせして熱処理を施し、前記所定の部位に前記金属部材を接合する工程とを有することを特徴とするものである。
In the second mounting method of the solder coated component according to the present invention, on the other hand, a nickel film and a tin alloy plating film having a predetermined film thickness are sequentially formed on a metal member which is a base material for the solder coated component. A surface treatment step comprising a step of processing and a step of coating a molten solder on the metal member that has been ground-treated, and a lid member that includes a joint portion to be soldered by processing the surface-treated metal member; forming at least one of the shape of the shield case and the substrate reinforcing frame, on the other hand, forming a solder material on a predetermined portion of said metal member is bonded, the said solder material is formed a predetermined portion of the substrate, and a step of the aligning the surface-treated the joint portion of the metal member is subjected to a heat treatment, joining the metallic member before Symbol predetermined site The to Rukoto those characterized.
本発明に係るはんだコート部品の第１及び第２の実装方法によれば、従来例のめっき処理方法や、防錆処理、脱脂処理等によるはんだ付け処理に比べて、面実装用のはんだコート部品のはんだ付け部分のはんだぬれ性をより一段と向上できるようになった。 According to the first and second mounting methods for solder-coated components according to the present invention, solder-coated components for surface mounting compared to the conventional plating method and the soldering processing by rust prevention processing, degreasing processing, etc. It has become possible to further improve the solder wettability of the soldered portion of the solder.
本発明に係るはんだコート部品、その製造方法及びその実装方法によれば、従来例のめっき処理方法や、防錆処理、脱脂処理等によるはんだ付け処理に比べて、面実装用のはんだコート部品のはんだ付け部分のはんだぬれ性をより一段と向上できるようになった。この結果、従来の金属部材では得られない筐体部品の任意のはんだ付け領域の全範囲ではんだ付け部分を形成できるようになった。 According to the solder coated component, the manufacturing method and the mounting method thereof according to the present invention, the solder coated component for surface mounting is compared with the plating method of the conventional example and the soldering treatment by rust prevention treatment, degreasing treatment, etc. The solder wettability of the soldered part can be further improved. As a result, a soldered portion can be formed in the entire range of an arbitrary soldering region of a casing component that cannot be obtained by a conventional metal member.
しかも、はんだ未接合部分や、ボイド等を発生することなく、シールドケースや基板補強フレーム等のはんだコート部品をプリント配線基板等に確実かつ強固に接合し実装できる良好なフィレットを形成できるようになった。これにより、耐曲げ性及び耐絞り性に優れたシールド部品等の電子部品を提供できるようになった。 In addition, it is possible to form a good fillet that can securely and firmly join and mount solder coated parts such as shield cases and board reinforcement frames to printed wiring boards, etc. without generating solder unjoined parts or voids. It was. As a result, it is possible to provide electronic parts such as shield parts having excellent bending resistance and drawing resistance.
本発明者らは、本発明のシールドケースではめっき処理の金属部材に錫皮膜処理等のみを施した場合に比べて、所定の膜厚のニッケル皮膜及び錫合金めっき皮膜を順次形成して下地処理した場合の方が、当該錫合金めっき皮膜上に、数十倍の膜厚の溶融はんだを被着できる点に着目して本発明に至った。以下、図面を参照しながら、本発明に係る実施例としてのはんだコート部品、その製造方法及びその実装方法について説明する。 In the shield case of the present invention, the nickel coating and the tin alloy plating film having a predetermined film thickness are sequentially formed as compared with the case where only the tin film treatment or the like is applied to the metal member for plating treatment. In this case, the inventors reached the present invention by paying attention to the point that a molten solder having a film thickness of several tens of times can be deposited on the tin alloy plating film. Hereinafter, a solder coated component, a manufacturing method thereof, and a mounting method thereof will be described with reference to the drawings.
＜第１の実施形態＞
図１に示す第１の実施形態としてのシールドケース１００は、はんだコート部品の一例を構成し、プリント配線基板１０の上に実装された電子部品（図示せず）を電磁的に遮蔽するものである。ここに、はんだコート部品とは、シールドケース等の金属部品に、所定の膜厚のニッケル皮膜及び錫合金めっき皮膜を順次設けられ、かつ、当該錫合金めっき皮膜上に鉛フリーの溶融はんだ皮膜がコート処理されてなる表面処理が施されたものをいう。本発明において、母材とは、シールドケースなどの形成材料のことをいい、母材は洋白、ステンレスに加えて鉄、コバール等などの金属部材の素材によって構成される。
<First Embodiment>
A shield case 100 as the first embodiment shown in FIG. 1 constitutes an example of a solder coated component, and electromagnetically shields an electronic component (not shown) mounted on the printed wiring board 10. is there. Here, the solder coated part is a metal part such as a shield case, in which a nickel film and a tin alloy plating film with a predetermined film thickness are sequentially provided, and a lead-free molten solder film is formed on the tin alloy plating film. A surface-treated product that has been coated. In the present invention, the base material refers to a forming material such as a shield case, and the base material is composed of a material of a metal member such as iron or Kovar in addition to white or stainless steel.
また、所定のニッケル皮膜とは、めっき厚０．３〜２．０μmの膜厚のニッケル皮膜をいい、より好ましくは、０．５〜１．０μmの膜厚である。また、所定の錫合金皮膜とは、めっき厚０．７〜７．０μmの膜厚の錫合金皮膜をいい、より好ましくは、１．０〜３．０μm膜厚である。シールドケース１００は枠部材１１及び蓋部材１２から構成される。枠部材１１は幅がＷ１で、長さがＬ１で、高さがＨ１を有した額縁状を成している。枠部材１１は幅Ｗ１が３８ｍｍ程度で、長さＬ１が６０ｍｍ程度で、高さＨ１が２ｍｍ程度を有している。枠部材１１はプリント配線基板１０にはんだ付け処理される。プリント配線基板１０には、銅箔をパターニングしたランドパターン１０ａが設けられ、このランドパターン１０ａに枠部材１１がリフロー処理によって溶融はんだ付け処理される。枠部材１１の枠内は開口部１３となされている。枠部材１１から蓋部材１２を外したとき、開口部１３内の電子部品を点検できるようになっている。この例で、絞り加工時に開口部１３の周囲にハット状（鍔状）の絞り端部１１ａが設けられている。絞り端部１１ａは、枠部材１１の補強、蓋部材１２の固定強化及び、リフロー処理時の溶融はんだのぬれ性を良くするために設けられている。 The predetermined nickel film refers to a nickel film having a plating thickness of 0.3 to 2.0 μm, and more preferably 0.5 to 1.0 μm. Further, the predetermined tin alloy film refers to a tin alloy film having a plating thickness of 0.7 to 7.0 μm, more preferably 1.0 to 3.0 μm. The shield case 100 includes a frame member 11 and a lid member 12. The frame member 11 has a frame shape having a width W1, a length L1, and a height H1. The frame member 11 has a width W1 of about 38 mm, a length L1 of about 60 mm, and a height H1 of about 2 mm. The frame member 11 is soldered to the printed wiring board 10. The printed wiring board 10 is provided with a land pattern 10a obtained by patterning a copper foil, and the frame member 11 is melted and soldered to the land pattern 10a by a reflow process. An opening 13 is formed in the frame of the frame member 11. When the lid member 12 is removed from the frame member 11, the electronic components in the opening 13 can be inspected. In this example, a hat-shaped (saddle-shaped) drawn end portion 11a is provided around the opening 13 during drawing. The throttle end portion 11a is provided to reinforce the frame member 11, strengthen the lid member 12, and improve the wettability of the molten solder during the reflow process.
蓋部材１２は、矩形のカバー形状を成しており、プリント配線基板１０にはんだ付けされた枠部材１１を覆う（カバー）ように開蓋自在に取り付けられる。蓋部材１２は、ブリキ部材（錫めっき鋼板）、洋白材（Ｃ７５２１Ｒ、Ｃ７７０１Ｒ等）やステンレス材（ＳＵＳ３０４，ＳＵＳ３１６，ＳＵＳ４３０等）等から構成される。蓋部材１２は、これらの板状部材を切り抜き及び折り曲げて蓋部材１２が形成される。 The lid member 12 has a rectangular cover shape, and is attached to be openable so as to cover (cover) the frame member 11 soldered to the printed wiring board 10. The lid member 12 is composed of a tin member (tin-plated steel plate), a white material (C7521R, C7701R, etc.), a stainless material (SUS304, SUS316, SUS430, etc.). The lid member 12 is formed by cutting and bending these plate-like members.
シールドケース１００の枠部材１１は、図２に示すように金属部材の一例を構成する洋白材１から構成される。洋白材１は所定の厚みｄを有している。この洋白材１には、下層から順に所定の膜厚のニッケル（Ｎｉ）めっき層２（皮膜）及び錫−銅（Ｓｎ−Ｃｕ）めっき層３（皮膜）が順次設けられ、かつ、当該Ｓｎ−Ｃｕめっき層３上には溶融はんだがコーティング（コート処理）されている。以下、溶融はんだをコーティングした層をはんだコート層４という。 As shown in FIG. 2, the frame member 11 of the shield case 100 is composed of a white material 1 that constitutes an example of a metal member. The western white material 1 has a predetermined thickness d. The white wood 1 is provided with a nickel (Ni) plating layer 2 (film) and a tin-copper (Sn-Cu) plating layer 3 (film) having a predetermined thickness in order from the lower layer, and the Sn. The molten solder is coated (coated) on the Cu plating layer 3. Hereinafter, the layer coated with molten solder is referred to as a solder coat layer 4.
以下で、ニッケル（Ｎｉ）めっき層２（皮膜）、錫−銅（Ｓｎ−Ｃｕ）めっき層３（皮膜）、及び、はんだコート層４からなる処理層を表面処理層５という。上述の溶融はんだをコーティングしたコート層４を形成する際のコート処理とは、金属部材を溶融はんだ内に浸漬して全体的にはんだを被着したり、局所的にはんだ付けを行う方法を用いて金属部材の必要箇所にのみはんだを被着させる表面処理のことをいう。 Hereinafter, a treatment layer composed of a nickel (Ni) plating layer 2 (film), a tin-copper (Sn—Cu) plating layer 3 (film), and a solder coat layer 4 is referred to as a surface treatment layer 5. The coating process when forming the coating layer 4 coated with the above-described molten solder is a method in which a metal member is immersed in the molten solder so that the entire solder is deposited or soldered locally. This is a surface treatment in which solder is deposited only on the necessary parts of the metal member.
はんだコート層４の厚みは、リフロー処理時の溶融はんだのぬれ性を良くするために１０μｍ〜３０μｍ程度が確保される。溶融はんだには、例えば、Ｓｎ−Ａｇ−Ｃｕ系の鉛フリーはんだが使用される。溶融はんだには、Ｓｎ−Ａｇ−Ｃｕ系の他に、Ｓｎ−Ａｇ系、Ｓｎ−Ｃｕ系、Ｓｎ−Ｂｉ系、Ｓｎ−Ａｇ−Ｃｕ−Ｂｉ系、Ｓｎ−Ｂｉ−Ａｇ（Ｃｕ）系、Ｓｎ−Ａｇ−Ｃｕ−Ｎｉ系、又は、Ｓｎ−Ａｇ−Ｃｕ−Ｓｂ系の合金はんだ（エコソルダー（登録商標）Ｍ７０５）が使用される。Ｍ７０５の溶融はんだの組成は、Ｓｎ−３．０Ａｇ−０．５Ｃｕである。この他、エコソルダー（登録商標）Ｍ２０が使用される。Ｍ２０の溶融はんだの組成は、Ｓｎ−０．７５Ｃｕである。 The solder coat layer 4 has a thickness of about 10 μm to 30 μm in order to improve the wettability of the molten solder during the reflow process. For the molten solder, for example, Sn—Ag—Cu-based lead-free solder is used. In addition to Sn-Ag-Cu series, molten solder includes Sn-Ag series, Sn-Cu series, Sn-Bi series, Sn-Ag-Cu-Bi series, Sn-Bi-Ag (Cu) series, Sn -Ag-Cu-Ni-based or Sn-Ag-Cu-Sb-based alloy solder (Eco Solder (registered trademark) M705) is used. The composition of the molten solder of M705 is Sn-3.0Ag-0.5Cu. In addition, Eco Solder (registered trademark) M20 is used. The composition of the molten solder of M20 is Sn-0.75Cu.
すなわち、図２で示すように、本願発明の表面処理層５は、ニッケル（Ｎｉ）めっき層２（皮膜）及び錫−銅（Ｓｎ−Ｃｕ）めっき層３（皮膜）が順次設けられ、かつ、当該Ｓｎ−Ｃｕめっき層３上には溶融はんだがコーティング（コート処理）されてなるはんだコート層４から構成されている。 That is, as shown in FIG. 2, the surface treatment layer 5 of the present invention is provided with a nickel (Ni) plating layer 2 (film) and a tin-copper (Sn-Cu) plating layer 3 (film) in sequence, and The Sn—Cu plating layer 3 is composed of a solder coat layer 4 formed by coating (coating) molten solder.
続いて、図３〜図５を参照して、本発明に係るシールドケース１００の製造方法について、その枠部材１１の形成例を説明する。この例では、シールドケース１００を製品化するに際して、表面処理する前に、シールドケース用の金属部材の一例を構成する洋白材１をシールド部品形状に加工する場合を前提とする。 Then, with reference to FIGS. 3-5, the formation example of the frame member 11 is demonstrated about the manufacturing method of the shield case 100 which concerns on this invention. In this example, when the shield case 100 is commercialized, it is assumed that the white material 1 constituting an example of the metal member for the shield case is processed into a shield part shape before the surface treatment.
シールドケース１００は、洋白材１を加工して面実装用の枠部材１１を形成する場合を例に挙げる。その際に、溶融はんだコート処理可能な洋白材１を絞り加工して、枠部材１１に面実装するための絞り端部位を形成する場合を例に採る。コート処理は、当該シールドケースの実装時のはんだ付け処理に使用されるエコソルダーＭ７０５（登録商標）を片面１５μｍでシールドケースの両面にはんだをコーティングして処理する場合を例に採る。 The shield case 100 is exemplified by a case where the white member 1 is processed to form the frame member 11 for surface mounting. In this case, a case where the western white material 1 that can be subjected to the molten solder coating is drawn to form a drawn end portion for surface mounting on the frame member 11 is taken as an example. As an example of the coating process, Eco Solder M705 (registered trademark) used for the soldering process when the shield case is mounted is coated with solder on both sides of the shield case with 15 μm on one side.
例えば、図１に示したような枠部材１１を得るために、図３Ａに示す幅Ｗ１’×長さＬ１’の大きさで、図３Ｂに示す厚みがｄ１の洋白材１（Ｃ７５２１Ｒ、Ｃ７７０１等）を準備する。図３Ｂは、洋白材１のＸ１−Ｘ１矢視断面図である。枠部材１１には洋白材１の他にステンレス材（ＳＵＳ３０４，ＳＵＳ３１６，ＳＵＳ４３０等）等を使用してもよい。洋白材１の厚みｄ１は、例えば、０．１ｍｍ、０．１５ｍｍ、０．２ｍｍ、０．２５ｍｍ、０．３ｍｍ等である。洋白材１の幅Ｗ１’は、絞り加工して高さＨ１を得るために、枠部材１１の仕上げ寸法の幅Ｗ１よりもやや大きく（５％〜１０％程度）、また、長さＬ１’も枠部材１１の仕上げ寸法の長さＬ１よりもやや長目（５％〜１０％程度）のものを準備する。 For example, in order to obtain the frame member 11 as shown in FIG. 1, the white material 1 (C7521R, C7701) having a size of width W1 ′ × length L1 ′ shown in FIG. 3A and thickness d1 shown in FIG. 3B. Etc.). FIG. 3B is a cross-sectional view of the western white material 1 taken along the X1-X1 arrow. For the frame member 11, stainless steel (SUS304, SUS316, SUS430, etc.) or the like may be used in addition to the white material 1. The thickness d1 of the white material 1 is, for example, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, or the like. The width W1 ′ of the white material 1 is slightly larger (about 5% to 10%) than the width W1 of the finished dimension of the frame member 11 in order to obtain the height H1 by drawing, and the length L1 ′. Also, the frame member 11 having a slightly longer length (about 5% to 10%) than the finished dimension length L1 is prepared.
図中の破線は、図示しない絞り加工機の凸部先端押圧部を当てる部分（投影部分）である。図示せずも、枠部材１１の一部形状が面実装用のはんだ付け面となるように、絞り加工機には絞り端部１１ａを形成するための端部押え機構が装備される。この例では、図１に示したように洋白材１の外周部をＬ状に絞り曲げ開口部１３の周囲にハット状（鍔状）の絞り端部１１ａを設けた場合を例に採る。 A broken line in the figure is a portion (projected portion) to which a convex portion tip pressing portion of a drawing machine (not shown) is applied. Although not shown, the drawing machine is equipped with an end pressing mechanism for forming the drawn end 11a so that a part of the frame member 11 becomes a soldering surface for surface mounting. In this example, as shown in FIG. 1, a case where a hat-shaped (butterfly-shaped) narrow end 11 a is provided around the aperture bend opening 13 in an L shape around the outer periphery of the white material 1 is taken as an example.
図３Ａ及びＢに示した大きさの洋白材１が準備できたら、図示しない絞り加工機に洋白材１をセットし、その凸部先端押圧部を当該洋白材１に押し当てて絞り加工処理を実行する。この絞り加工処理により、図４Ａに示すハット状の洋白材１を得ることができる。ハット状の洋白材１によれば、凸状部位１ａを成している。その外周囲は、鍔状の絞り端部１１ａとなされる。これにより、図１に示したような枠部材１１の開口部１３が未だ開口されていないハット状の中間部材１１’が得られる。 When the white material 1 having the size shown in FIGS. 3A and 3B is prepared, the white material 1 is set on a drawing machine (not shown), and the convex tip end pressing portion is pressed against the white material 1 and drawn. Perform processing. By this drawing processing, the hat-shaped white material 1 shown in FIG. 4A can be obtained. According to the hat-shaped western white material 1, the convex part 1a is comprised. The outer periphery is a bowl-shaped throttle end 11a. Thereby, a hat-shaped intermediate member 11 ′ in which the opening 13 of the frame member 11 as shown in FIG. 1 is not yet opened is obtained.
図４Ａ及びＢに示したハット状の中間部材１１’が準備できたら、中間部材１１’の凸状部位１ａに開口部１３を形成する。開口部１３は、例えば、プレス加工機に中間部材１１’をセットし、プレス加工部材で打ち抜くことにより形成する。これにより、図５Ａに示す開口部１３を有した生地の枠部材１１を得ることができる。図５Ｂに枠部材１１のＸ１’−Ｘ１’矢視断面図を示している。この枠部材１１を得る加工工程は、ロール状に巻かれた洋白材１のフープ材から、順送型プレス機により連続して形成するなど、適宜選択可能である。 When the hat-shaped intermediate member 11 ′ shown in FIGS. 4A and 4B is prepared, the opening 13 is formed in the convex portion 1 a of the intermediate member 11 ′. The opening 13 is formed, for example, by setting the intermediate member 11 ′ on a press machine and punching with the press member. Thereby, the fabric frame member 11 having the opening 13 shown in FIG. 5A can be obtained. FIG. 5B shows a cross-sectional view of the frame member 11 taken along the arrow X1'-X1 '. The processing step for obtaining the frame member 11 can be selected as appropriate, for example, by continuously forming from a hoop material of the white material 1 wound in a roll shape with a progressive press.
図５Ａ及びＢに示した生地の枠部材１１が準備できたら、所定の膜厚のニッケル（Ｎｉ）及び錫銅（Ｓｎ―Ｃｕ）を枠部材１１に順次形成して下地処理する。まず、枠部材１１の脱脂処理を実行する。この脱脂処理によれば、ＮａＯＨ（水酸化ナトリウム）又はＮａＣＮ（シアン化ナトリウム）を用いて枠部材１１の前処理が行われる。次に前処理後の枠部材１１に対してシアン化浸漬脱脂及び／又はシアン化電解脱脂工程が施される。 When the fabric frame member 11 shown in FIGS. 5A and 5B is prepared, nickel (Ni) and tin-copper (Sn—Cu) having a predetermined thickness are sequentially formed on the frame member 11 and subjected to a ground treatment. First, the degreasing process of the frame member 11 is performed. According to this degreasing process, pre-processing of the frame member 11 is performed using NaOH (sodium hydroxide) or NaCN (sodium cyanide). Next, the cyanide immersion degreasing and / or cyanide electrolytic degreasing step is performed on the pre-treated frame member 11.
上述の脱脂処理が終了したら、枠部材１１の下地処理を更に続ける。この例では、脱脂処理後の枠部材１１にＮｉめっきを施す。図示しない電気めっき装置に当該枠部材１１をセットして、下地処理を実行する。電気めっき装置はめっき浴内に電解液が満たされている。枠部材１１はカソード電極に接続し、Ｎｉ等のターゲット材料はアノード電極に接続して直流電流を通電する。この例では、洋白材１上の第１層目に電気めっきによりＮｉめっきを施す。 When the above-described degreasing process is completed, the foundation process of the frame member 11 is further continued. In this example, Ni plating is applied to the frame member 11 after the degreasing treatment. The frame member 11 is set in an electroplating apparatus (not shown), and the base processing is executed. In the electroplating apparatus, an electrolytic solution is filled in a plating bath. The frame member 11 is connected to the cathode electrode, and the target material such as Ni is connected to the anode electrode to pass a direct current. In this example, Ni plating is applied to the first layer on the western white material 1 by electroplating.
めっき浴はスルフォン酸浴を構成する。電解液はＮｉめっき液によって構成する。Ｎｉめっき液には、スルファミン酸ニッケル（Ｎｉ（ＮＨ2ＳＯ3）2・４Ｈ2Ｏ）又は塩化ニッケル（ＮｉＣｌ2・６Ｈ2Ｏ）を使用する。この電気めっき処理により、図２に示したように洋白材１の上層にＮｉめっき層２を設けることができる。洋白材１の上層にＮｉめっき層２を下地処理することでウイスカの発生を防止できるようになる。 The plating bath constitutes a sulfonic acid bath. The electrolytic solution is composed of a Ni plating solution. As the Ni plating solution, nickel sulfamate (Ni (NH2SO3) 2 · 4H2O) or nickel chloride (NiCl2 · 6H2O) is used. By this electroplating process, the Ni plating layer 2 can be provided on the upper layer of the white material 1 as shown in FIG. The generation of whiskers can be prevented by applying the Ni plating layer 2 to the upper layer of the white material 1.
この例では、下地処理の仕上げとして、Ｎｉめっき層２の上層に電気めっきによりＳｎ−Ｃｕめっき処理を施す。この前処理として、酸浸漬浴に枠部材１１を短時間浸漬してＮｉめっき層２の金属表面を光沢処理する。酸浸漬浴にはＨ2ＳＯ4（硫酸）を使用する。Ｓｎめっき処理を施す場合、めっき浴５１には有機酸浴を使用する。Ｓｎめっき液には、メタンスルフォン酸（ＣＨ3ＳＯ3Ｈ）又はメタルスルファミン酸錫（ＣＨ3ＳＯ3）2Ｓｎ）を使用する。 In this example, as the finishing of the base treatment, Sn—Cu plating treatment is performed on the upper layer of the Ni plating layer 2 by electroplating. As this pretreatment, the frame member 11 is immersed in an acid immersion bath for a short time, and the metal surface of the Ni plating layer 2 is subjected to a gloss treatment. H2SO4 (sulfuric acid) is used for the acid immersion bath. When performing the Sn plating treatment, an organic acid bath is used as the plating bath 51. As the Sn plating solution, methanesulfonic acid (CH3SO3H) or tin metalsulfamate (CH3SO3) 2Sn) is used.
Ｃｕめっき処理を施す場合、めっき浴には銅イオン又は銅錯イオンを含む電解質浴を使用する。Ｃｕめっき液には、銅イオン又は銅錯イオンを含む電解液を使用する。カソード電極には金属銅を使用する。この電気めっき処理により、図２に示したようにＮｉめっき層２の上層にＳｎ−Ｃｕめっき層３を設けることができる。なお、枠部材１１の酸化防止処理にはリン酸を使用する。 When performing the Cu plating treatment, an electrolyte bath containing copper ions or copper complex ions is used as the plating bath. As the Cu plating solution, an electrolytic solution containing copper ions or copper complex ions is used. Metal copper is used for the cathode electrode. By this electroplating process, the Sn—Cu plating layer 3 can be provided on the Ni plating layer 2 as shown in FIG. Note that phosphoric acid is used for the antioxidant treatment of the frame member 11.
メッキする方法としては、上述のように金属部材を浸漬して全体的にメッキする方法や、金属部材の必要箇所にスタンプメッキの方法により部分的にメッキしたり、適宜手段を選択することができる。 As a method of plating, a method of immersing a metal member as described above and plating it entirely, a part of a metal member that is necessary to be plated by a stamp plating method, or a means can be selected as appropriate. .
次に、下地処理を完了した枠部材１１の必要箇所に、はんだコート処理を施す。この例のはんだコート処理では、エコソルダーＭ７０５を使用した。エコソルダーＭ７０５は、鉛フリーの溶融はんだである。鉛フリーの溶融はんだには、Ｓｎ−Ａｇ系、Ｓｎ−Ｃｕ系、Ｓｎ−Ａｇ−Ｃｕ系、Ｓｎ−Ｂｉ系、Ｓｎ−Ａｇ−Ｃｕ−Ｂｉ系、Ｓｎ−Ｂｉ−Ａｇ（Ｃｕ）系、Ｓｎ−Ａｇ−Ｃｕ−Ｎｉ系、又は、Ｓｎ−Ａｇ−Ｃｕ−Ｓｂ系等の鉛フリーはんだを使用する。 Next, a solder coating process is performed on a necessary portion of the frame member 11 for which the base process has been completed. In the solder coating process of this example, Eco Solder M705 was used. Eco solder M705 is a lead-free molten solder. Lead-free molten solder includes Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Bi, Sn-Ag-Cu-Bi, Sn-Bi-Ag (Cu), Sn Use lead-free solder such as -Ag-Cu-Ni or Sn-Ag-Cu-Sb.
鉛フリーの溶融はんだのコート厚は、洋白材１等の金属部材の片面当たり１５μｍ程度で、このコート処理を片面又は／及び両面に施すようにした。コート厚の制御は、例えば、金属部材へ浸漬する溶融はんだに超音波を当てることによって制御を行う公知の技術を用いて調整するようにした。このコート処理により、図２に示したようにＳｎ−Ｃｕめっき層３の上層にはんだコート層４を設けることができる。これにより、図２に示すように、ニッケルめっき層２、錫合金めっき層３、及び、溶融はんだをコート処理したはんだコート層４からなる表面処理層５が形成されたたシールドケース用の枠部材１１が完成する。 The coating thickness of the lead-free molten solder was about 15 μm per one side of the metal member such as the white material 1 and this coating treatment was performed on one side or / and both sides. The control of the coat thickness is adjusted by using a known technique for controlling by applying ultrasonic waves to the molten solder immersed in the metal member, for example. By this coating treatment, the solder coat layer 4 can be provided on the Sn-Cu plating layer 3 as shown in FIG. Thus, as shown in FIG. 2, a frame member for a shield case in which a surface treatment layer 5 comprising a nickel plating layer 2, a tin alloy plating layer 3, and a solder coating layer 4 coated with molten solder is formed. 11 is completed.
表面処理後のシールドケース用の枠部材１１は、エンボステープに詰め込まれ、リールに巻かれて部品供給経路に搬送される。又は、汎用乃至は専用のトレイに載せて梱包され、部品供給経路に搬送される。なお、ニッケル皮膜及び錫合金めっき皮膜の下地処理、及び、溶融はんだによるコート処理からなる表面処理は、スタンプメッキ方法や局所はんだ付け方法などの公知の適宜手段を選択することによって、シールド部品の全体乃至は必要箇所に施される。 The shield case frame member 11 after the surface treatment is packed in an embossed tape, wound on a reel, and conveyed to a component supply path. Alternatively, it is packed on a general-purpose or dedicated tray and conveyed to the component supply path. In addition, the surface treatment consisting of a nickel film and a tin alloy plating film undercoating, and a coating process using molten solder is performed by selecting a known appropriate means such as a stamp plating method or a local soldering method, so that the entire shield part Or it is given where needed.
続いて、図６Ａ〜図６Ｃを参照して、本発明に係るシールドケース１００の実装方法について、その枠部材１１のプリント配線基板１０への実装例を説明する。この例では、図３〜図５の形成工程により得られた、表面処理後の面実装用の枠部材１１をプリント配線基板１０（実装基板）の所定の部位に、はんだ材料を使用して接合する場合を例に挙げる。 Next, with reference to FIGS. 6A to 6C, an example of mounting the frame member 11 on the printed wiring board 10 will be described with respect to the mounting method of the shield case 100 according to the present invention. In this example, the surface mounting frame member 11 obtained by the formation process of FIGS. 3 to 5 is bonded to a predetermined portion of the printed wiring board 10 (mounting board) using a solder material. An example is given below.
まず、図６Ａにおいて、プリント配線基板１０の所定の部位にはんだ材料１６’（素材）を形成する。はんだ材料１６’には、ソルダペーストを使用する。プリント配線基板１０には、銅箔をパターニングしたランドパターン１０ａ（接地パターン）を有したものを使用する。ランドパターン１０ａは、少なくとも、枠部材１１の実装面と対峙する部分に銅箔をパターニングしたものを用いる。プリント配線基板１０のランドパターン１０ａに、はんだ材料１６’が形成できたら、ランドパターン１０ａと枠部材１１とを位置合わせする。 First, in FIG. 6A, a solder material 16 ′ (material) is formed at a predetermined portion of the printed wiring board 10. A solder paste is used as the solder material 16 '. A printed wiring board 10 having a land pattern 10a (ground pattern) obtained by patterning a copper foil is used. As the land pattern 10a, a pattern obtained by patterning a copper foil at least on a portion facing the mounting surface of the frame member 11 is used. When the solder material 16 ′ is formed on the land pattern 10 a of the printed wiring board 10, the land pattern 10 a and the frame member 11 are aligned.
そして、図６Ａにおいて、はんだ材料１６’が形成されたランドパターン１０ａの所定の部位に、図６Ｂに示す枠部材１１をマウントする。枠部材１１のマウントは、部品搭載機による方法でも、手作業による載置の方法であってもどちらでもよい。 6A, the frame member 11 shown in FIG. 6B is mounted on a predetermined portion of the land pattern 10a on which the solder material 16 'is formed. The mounting of the frame member 11 may be either a method using a component mounting machine or a manual mounting method.
次に、はんだ材料１６’を介してランドパターン１０ａ上にマウントされた枠部材１１を含むプリント配線基板１０を、図示しないリフロー炉に導入してリフロー処理を施す。このリフロー処理によって、プリント配線基板１０と枠部材１１とが接合する。このとき、リフロー炉を所定の温度プロファイルに従って加熱制御する。 Next, the printed wiring board 10 including the frame member 11 mounted on the land pattern 10a via the solder material 16 'is introduced into a reflow furnace (not shown) and subjected to a reflow process. The printed wiring board 10 and the frame member 11 are joined by this reflow process. At this time, the reflow furnace is heated and controlled according to a predetermined temperature profile.
例えば、目標設定温度を２５０℃に設定して、リフロー炉のコンベアのスピードを１．２５ｍ／秒程度に設定する。プリント配線基板１０の加熱雰囲気は、大気雰囲気中、好ましくは窒素ガス等の不活性ガスからなる雰囲気中である。このように、枠部材１１をマウントしたプリント配線基板１０の熱処理を実行すると、ランドパターン１０ａ上のはんだ材料１６’が溶融して枠部材１１の絞り端部１１ａをぬれ性良く這い上がる。この溶融はんだの這い上がりによってフィレット部分１６が形成される。これにより、図６Ｃに示すように枠部材１１とプリント配線基板１０とを良好にはんだ付け処理できるようになった。 For example, the target set temperature is set to 250 ° C., and the conveyor speed of the reflow furnace is set to about 1.25 m / sec. The heating atmosphere of the printed wiring board 10 is an air atmosphere, preferably an atmosphere made of an inert gas such as nitrogen gas. As described above, when the heat treatment is performed on the printed wiring board 10 on which the frame member 11 is mounted, the solder material 16 'on the land pattern 10a is melted, and the drawn end portion 11a of the frame member 11 is scooped up with good wettability. The fillet portion 16 is formed by the rising of the molten solder. As a result, as shown in FIG. 6C, the frame member 11 and the printed wiring board 10 can be satisfactorily soldered.
また、上述の実施例においては、枠部材１１には周囲にハット状（鍔状）の絞り端部１１ａが設けられているので、図６（ｃ）に示すように形成されるフィレットは、枠部材１１の外側と内側でほぼ均等とはなっていない。すなわち、内側の方が厚くフィレットが形成されている。 In the above-described embodiment, the frame member 11 is provided with a hat-shaped (saddle-shaped) throttle end portion 11a around the frame member 11, so that the fillet formed as shown in FIG. The outside and inside of the member 11 are not substantially equal. That is, the inner side is thicker and the fillet is formed.
枠部材１１の外側と内側にほぼ均等にフィレットを形成したい場合には、図示しないが図６（ａ）で示される絞り端部１１aをさらに折り返して、断面形状でＵ字状となるように端部を形成すると、枠部材１１の補強にもなるうえに、Ｕ字状の底部が左右対称形となるので、プリント配線基板１０に枠部材１１を実装した後に形成されるフィレットは枠部材１１の外側と内側でほぼ均等に形成される。 When it is desired to form fillets almost uniformly on the outer side and the inner side of the frame member 11, the diaphragm end portion 11a shown in FIG. 6 (a) is further folded back to form a U-shaped cross section. When the portion is formed, the frame member 11 is reinforced and the U-shaped bottom portion is symmetrical, so that the fillet formed after the frame member 11 is mounted on the printed wiring board 10 It is formed almost uniformly on the outside and inside.
この結果、図６（ｃ）で示される実装状態に比べて、プリント配線基板１０と枠部材１１の機械的な接合強度が増し、品質上の信頼性も高くなる。 As a result, compared to the mounting state shown in FIG. 6C, the mechanical joint strength between the printed wiring board 10 and the frame member 11 is increased, and the reliability in quality is increased.
このように第１の実施形態としてのシールドケース１００及びその製造方法によれば、洋白材１から、その一部が面実装用のはんだ付け面となされた枠部材１１を加工した後に、枠部材１１の一部位に、所定の膜厚のＮｉめっき層２及びＳｎ−Ｃｕめっき層３を順次形成して下地処理し、下地処理後の当該Ｓｎ−Ｃｕめっき層３上の全ての部位に鉛フリーの溶融はんだをコート処理してはんだコート層４を形成し、全体として三層からなる表面処理層５が形成されている。溶融はんだには、Ｓｎ−Ａｇ系、Ｓｎ−Ｃｕ系、Ｓｎ−Ａｇ−Ｃｕ系、Ｓｎ−Ｂｉ系、Ｓｎ−Ａｇ−Ｃｕ−Ｂｉ系、Ｓｎ−Ｂｉ−Ａｇ（Ｃｕ）系、Ｓｎ−Ａｇ−Ｃｕ−Ｎｉ系、又は、Ｓｎ−Ａｇ−Ｃｕ−Ｓｂ系等の鉛フリーはんだが使用される。 As described above, according to the shield case 100 and the manufacturing method thereof as the first embodiment, after processing the frame member 11, part of which is a soldering surface for surface mounting, from the white material 1, the frame A Ni plating layer 2 and a Sn—Cu plating layer 3 having a predetermined film thickness are sequentially formed on one part of the member 11 and subjected to a base treatment, and lead is applied to all parts on the Sn—Cu plating layer 3 after the base treatment. A solder coating layer 4 is formed by coating free molten solder, and a surface treatment layer 5 consisting of three layers as a whole is formed. For the molten solder, Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Bi, Sn-Ag-Cu-Bi, Sn-Bi-Ag (Cu), Sn-Ag- A lead-free solder such as Cu-Ni or Sn-Ag-Cu-Sb is used.
従って、面実装用のシールドケース１００のはんだ付け部分（以下フィレット部分１６という）のはんだぬれ性を従来例のめっき処理方法や、防錆処理、脱脂処理等によるはんだ付け処理に比べて、より一段と向上できるようになった。これにより、耐曲げ性及び耐絞り性に優れた枠部材１１等の電子部品を提供できるようになった。しかも、はんだ未接合部分や、ボイド等を発生することなく、枠部材１１等の電子部品をプリント配線基板等に確実かつ強固に接合し実装できる良好なフィレットを形成できるようになった。 Accordingly, the solderability of the soldered portion (hereinafter referred to as the fillet portion 16) of the shield case 100 for surface mounting is further improved compared to the conventional plating method, soldering treatment such as rust prevention treatment and degreasing treatment. It can be improved. Thereby, electronic components, such as the frame member 11 excellent in bending resistance and drawing resistance, can be provided. In addition, it is possible to form a good fillet that can securely and firmly join and mount the electronic component such as the frame member 11 to the printed wiring board or the like without generating a solder unjoined portion or void.
また、ソルダペーストだけでは、はんだ量不足による実装不良が発生する可能性のある箇所には、チップ型電子部品と類似の矩形サイズ（＃１００５、＃１６０８、＃０６０３等の寸法形状）に加工された固形はんだ（以下、チップソルダーという）を使用するようにしても良い。 Also, solder paste alone is processed into a rectangular size (dimensional shape such as # 1005, # 1608, # 0603, etc.) similar to a chip-type electronic component at a place where a mounting failure due to insufficient solder amount may occur. Solid solder (hereinafter referred to as chip solder) may be used.
チップソルダーは、上述したエコソルダーＭ７０５など、鉛フリーのはんだであり、チップ型電子部品と類似の矩形サイズに加工されているので、既存の設備、例えば、チップマウンター等の部品搭載機において、任意の場所に必要量のはんだを供給できるものである。チップソルダーを使用すると、部品の微小化等により、はんだ材料１６’の供給量が少量化しても、その一定量の供給に対処できるようになる。 The chip solder is a lead-free solder such as the above-mentioned Eco Solder M705, and is processed into a rectangular size similar to the chip-type electronic component. Therefore, in the existing equipment, for example, a component mounting machine such as a chip mounter, any The required amount of solder can be supplied to the location. When the chip solder is used, even if the supply amount of the solder material 16 ′ is reduced due to the miniaturization of parts or the like, it becomes possible to cope with the supply of the constant amount.
ここでチップソルダーの使用手順については、まず、実装しようとするプリント配線基板１０上のはんだ量不足による実装不良が発生する可能性があるため、頻発箇所を特定する。次に、特定した実装不良頻発箇所の被実装ワーク寸法形状、並びにランド面積形状や必要供給量に応じたサイズのチップソルダーを選択する。そして、チップマウンターに搭載パラメータをプログラミングする。 Here, with regard to the procedure for using the chip solder, first, since there is a possibility that a mounting failure due to an insufficient amount of solder on the printed wiring board 10 to be mounted may occur, a frequent location is specified. Next, a chip solder having a size corresponding to the dimension of the work to be mounted at the location where frequent mounting defects are identified, the land area shape, and the required supply amount is selected. Then, the mounting parameters are programmed into the chip mounter.
その後、チップマウンターにチップソルダーマガジンをセットする。このとき、上述のチップソルダーを実装したままリフロー処理を実行する。なお、チップソルダーを用いた場合も、チップマウンターを用いてチップ部品を実装する手順と大きな差異がないことから、専用設備が不要なことはもとより、作業者への特別な訓練も一切不要である。 After that, set the chip solder magazine on the chip mounter. At this time, the reflow process is executed with the above chip solder mounted. Note that even when using a chip solder, there is no significant difference from the procedure for mounting chip components using a chip mounter, so there is no need for special equipment and no special training for workers. .
また、部品搭載機とチップソルダーとのコラボレーションにより平坦度が得にくい大型筐体部品の限られたランドパターン１０ａへの表面実装にも対処できるようになった。このチップソルダーを適宜箇所に使用することにおいては、他の実施形態においても同様である。 In addition, the collaboration between the component mounting machine and the chip solder has made it possible to cope with the surface mounting of the large case component on which the flatness is difficult to obtain on the limited land pattern 10a. The use of this chip solder in appropriate places is the same in other embodiments.
はんだコート部品とは、シールドケース等の金属部品に、所定の膜厚のニッケル皮膜及び錫合金めっき皮膜を順次設けられ、かつ、当該錫合金めっき皮膜上にコート処理された鉛フリーの溶融はんだ皮膜からなる表面処理が施されたものをいう。 A solder-coated part is a lead-free molten solder film in which a nickel film and a tin alloy plating film with a predetermined film thickness are sequentially provided on a metal part such as a shield case, and the tin alloy plating film is coated. The surface treatment which consists of is said.
なお、ニッケル皮膜及び錫合金めっき皮膜を順次形成して下地処理がなされた後に、当該錫合金めっき皮膜上にコート処理された鉛フリーの溶融はんだ皮膜からなる表面処理が施されたシールド部品を得るに際して、上述の本発明に係るはんだコート部品の実装方法においては、はんだコート部品用の金属部材を加工して面実装用のシールド部品を形成する工程を先に行い、形成されたシールド部材にニッケル皮膜及び錫合金めっき皮膜を順次形成して下地処理した後に金属部材に溶融はんだをコート処理して表面処理するようにしたが、先ず、はんだコート部品用の母材となる金属部材に所定の膜厚のニッケル皮膜及び錫合金めっき皮膜を順次形成して下地処理した後に、金属部材に溶融はんだをコート処理して表面処理するようにし、このように表面処理された金属部材を加工して面実装用のシールド部品を形成するようにして良い。他の実施形態においても同様である。 In addition, after the nickel film and the tin alloy plating film are sequentially formed and the base treatment is performed, a shield component having a surface treatment made of a lead-free molten solder film coated on the tin alloy plating film is obtained. On the other hand, in the solder coated component mounting method according to the present invention described above, the step of processing the metal member for the solder coated component to form the shield component for surface mounting is performed first, and the formed shield member is made of nickel. The film and the tin alloy plating film are sequentially formed and the base treatment is performed, and then the surface of the metal member is coated with the molten solder. First, a predetermined film is formed on the metal member as a base material for the solder coated component. After a thick nickel film and a tin alloy plating film are sequentially formed and ground, the metal member is coated with molten solder and surface-treated. By processing the surface-treated metal member may be adapted to form a shielding component for surface mounting as. The same applies to other embodiments.
＜第２の実施形態＞
続いて、図７を参照して、第２の実施形態としてのシールドケース２００について説明する。図７に示すシールドケース２００は、はんだコート部品の一例を構成し、第１の実施形態と同様にして、プリント配線基板１０の上に実装された電子部品（図示せず）を電磁的に遮蔽するものである。シールドケース２００は、蓋部材１２及び躯体補強された枠部材２１から構成される。枠部材２１は第１の実施形態と同様にして、幅Ｗ２が３８ｍｍ程度で、長さＬ２が６０ｍｍ程度で、高さＨ２が２ｍｍ程度を有している。枠部材２１はプリント配線基板１０にはんだ付け処理される。プリント配線基板１０には、第１の実施形態で説明したものが使用される。
<Second Embodiment>
Then, with reference to FIG. 7, the shield case 200 as 2nd Embodiment is demonstrated. A shield case 200 shown in FIG. 7 constitutes an example of a solder-coated component, and electromagnetically shields an electronic component (not shown) mounted on the printed wiring board 10 in the same manner as in the first embodiment. To do. The shield case 200 is composed of a lid member 12 and a frame member 21 reinforced with a casing. Similar to the first embodiment, the frame member 21 has a width W2 of about 38 mm, a length L2 of about 60 mm, and a height H2 of about 2 mm. The frame member 21 is soldered to the printed wiring board 10. As the printed wiring board 10, the one described in the first embodiment is used.
シールドケース２００では、枠部材２１の内側が躯体補強されている。この例で、枠部材２１は、十文字に交差する梁部位２１ａ，２１ｂを有している。梁部位２１ａは、梁部位２１ｂの幅よりも広く設定されている。この設定は、梁部位２１ａで枠部材２１の長手方向の歪みを防止するためである。この十文字の梁部位２１ａ，２１ｂによって第１の実施形態で説明した開口部１３が４分割され、枠部材２１の内側には開口部１３ａ〜１３ｄが設けられる。枠部材２１から蓋部材１２を外したとき、４分割された開口部１３ａ〜１３ｄ内の電子部品を点検できるようになっている。 In the shield case 200, the inside of the frame member 21 is reinforced with a frame. In this example, the frame member 21 has beam portions 21a and 21b intersecting with a cross. The beam part 21a is set wider than the width of the beam part 21b. This setting is for preventing distortion in the longitudinal direction of the frame member 21 at the beam portion 21a. The opening 13 described in the first embodiment is divided into four by the cross-shaped beam portions 21 a and 21 b, and openings 13 a to 13 d are provided inside the frame member 21. When the lid member 12 is removed from the frame member 21, the electronic components in the four divided openings 13a to 13d can be inspected.
この例では、４つの開口部１３ａ〜１３ｄの外周囲の下方は、洋白材１の切断端面がそのままランドパターン１０ａに当接されるような形状を成している。もちろん、第１の実施形態と同様にして、洋白材１の切断端面を内側又は外側に折り曲げて曲げ端部を設けてもよい。上述の切断端面をランドパターン１０ａに当接したときに、枠部材２１の内側及び外側に、リフロー処理時の溶融はんだのぬれ性を良くするために、図２に示したような所定の膜厚のＮｉめっき層２及びＳｎ−Ｃｕめっき層３を順次形成して下地処理し、その下地処理後の当該Ｓｎ−Ｃｕめっき層３上に仕上げ層として鉛フリーの溶融はんだをコート処理されてなるはんだコート層４から構成された表面処理層５が形成されている。 In this example, the lower part of the outer periphery of the four openings 13a to 13d has such a shape that the cut end surface of the white material 1 is brought into contact with the land pattern 10a as it is. Of course, similarly to the first embodiment, the cut end surface of the white material 1 may be bent inward or outward to provide a bent end. In order to improve the wettability of the molten solder during the reflow process on the inner side and the outer side of the frame member 21 when the above-mentioned cut end face is brought into contact with the land pattern 10a, a predetermined film thickness as shown in FIG. The Ni plating layer 2 and the Sn—Cu plating layer 3 are sequentially formed and subjected to a foundation treatment, and the solder is coated with a lead-free molten solder as a finishing layer on the Sn—Cu plating layer 3 after the foundation treatment. A surface treatment layer 5 composed of the coat layer 4 is formed.
はんだコート層４の厚みは、第１の実施形態と同様にして、リフロー処理時の溶融はんだのぬれ性を良くするために１８μｍ〜３０μｍ程度が確保される。溶融はんだには、第１の実施形態と同様にして、例えば、Ｓｎ−Ａｇ−Ｃｕ系の鉛フリーはんだが使用される。溶融はんだには、Ｓｎ−Ａｇ−Ｃｕ系の他に、Ｓｎ−Ａｇ系、Ｓｎ−Ｃｕ系、Ｓｎ−Ｂｉ系、Ｓｎ−Ａｇ−Ｃｕ−Ｂｉ系、Ｓｎ−Ｂｉ−Ａｇ（Ｃｕ）系、Ｓｎ−Ａｇ−Ｃｕ−Ｎｉ系、又は、Ｓｎ−Ａｇ−Ｃｕ−Ｓｂ系等の鉛フリーはんだが使用される。なお、蓋部材１２については、第１の実施形態で説明しているので、その説明を省略する。 The solder coat layer 4 has a thickness of about 18 μm to 30 μm in order to improve the wettability of the molten solder during the reflow process, as in the first embodiment. As the molten solder, for example, Sn—Ag—Cu-based lead-free solder is used in the same manner as in the first embodiment. In addition to Sn-Ag-Cu series, molten solder includes Sn-Ag series, Sn-Cu series, Sn-Bi series, Sn-Ag-Cu-Bi series, Sn-Bi-Ag (Cu) series, Sn Lead-free solder such as -Ag-Cu-Ni or Sn-Ag-Cu-Sb is used. Since the lid member 12 has been described in the first embodiment, the description thereof is omitted.
続いて、図８〜図１０を参照して、本発明に係るシールドケース２００の製造方法について、その枠部材２１の形成例について説明する。この例では、洋白材１を十文字構造のシールド部品形状に加工する場合を前提とする。 Then, with reference to FIGS. 8-10, the formation example of the frame member 21 is demonstrated about the manufacturing method of the shield case 200 which concerns on this invention. In this example, it is assumed that the western white material 1 is processed into a shield part shape having a cross structure.
例えば、図７に示したような仕上げ寸法、幅×長さ×高さ＝Ｗ２×Ｌ２×Ｈ２の枠部材２１を得るために、図８Ａに示した幅Ｗ２’（Ｗ２’＞Ｗ２）×長さＬ２’（Ｌ２’＞Ｌ２）の大きさで、図８Ｂに示す厚みがｄ１の洋白材１（Ｃ７５２１Ｒ、Ｃ７７０１Ｒ等）を準備する。図８Ｂは、洋白材１のＸ２−Ｘ２矢視断面図である。この例では、折り曲げ加工により枠部材２１を形成するので、洋白材１の四隅の所定の位置に、４つの開孔部１ｂ，１ｂ，１ｂ，１ｂを開口する。これらの開孔部１ｂ等は折り曲げ時の応力吸収孔として利用される。 For example, in order to obtain a frame member 21 having a finish size, width × length × height = W2 × L2 × H2, as shown in FIG. 7, the width W2 ′ (W2 ′> W2) × length shown in FIG. 8A A white material 1 (C7521R, C7701R, etc.) having a size of L2 ′ (L2 ′> L2) and a thickness d1 shown in FIG. 8B is prepared. FIG. 8B is a cross-sectional view of the western white material 1 taken along the line X2-X2. In this example, since the frame member 21 is formed by bending, four opening portions 1b, 1b, 1b, 1b are opened at predetermined positions at the four corners of the white material 1. These opening portions 1b and the like are used as stress absorbing holes at the time of bending.
四隅に開孔部１ｂ等を有した洋白材１が準備できたら、図９に示すように、四隅の開孔部１ｂ，１ｂ，１ｂ，１ｂを基準にして、洋白材１の角部位から矩形状片を切断具を使用して切り欠く（切り落とす）。ここで、洋白材１の角部位から矩形状片が落とされた部位を切り欠き部２２ａ，２２ｂ，２２ｃ，２２ｄという。これにより、切り欠き部２２ａ，２２ｂ，２２ｃ，２２ｄした中間部材２１’が得られる。 When the white material 1 having the opening portions 1b and the like at the four corners is prepared, as shown in FIG. 9, the corner portions of the white material 1 with reference to the opening portions 1b, 1b, 1b, and 1b at the four corners. Cut out (cut off) the rectangular piece using a cutting tool. Here, the portions where the rectangular pieces are dropped from the corner portions of the white material 1 are referred to as notches 22a, 22b, 22c, and 22d. As a result, the intermediate member 21 'having the cutout portions 22a, 22b, 22c, and 22d is obtained.
その後、図示しない折り曲げ加工機に洋白材１をセットし、その本体押圧部及び端部折り曲げ機構を当該洋白材１に押し当てて折り曲げ加工処理を実行する。このとき、切り欠き部２２ａ，２２ｂ，２２ｃ，２２ｄに残留した開孔部１ｂ，１ｂ，１ｂ，１ｂのＣ状部位が折り曲げ時の応力を吸収するようになる。この折り曲げ加工処理により、図７に示したような枠部材２１の開口部１３ａ〜１３ｄが未だ開口されていないキャップ状の中間部材２１ａ’が得られる。第２の実施形態に係るキャップ状の洋白材１によれば、その外周囲の下方は、洋白材１の切断端面がそのままランドパターン１０ａに当接されるような形状を成している。 Thereafter, the white material 1 is set on a folding machine (not shown), and the body pressing portion and the end bending mechanism are pressed against the white material 1 to execute the bending process. At this time, the C-shaped portions of the opening portions 1b, 1b, 1b, and 1b remaining in the notches 22a, 22b, 22c, and 22d absorb the stress at the time of bending. By this bending process, a cap-shaped intermediate member 21a 'in which the openings 13a to 13d of the frame member 21 as shown in FIG. 7 are not yet opened is obtained. According to the cap-shaped white material 1 according to the second embodiment, the lower part of the outer periphery has a shape such that the cut end surface of the white material 1 is in direct contact with the land pattern 10a. .
このようなキャップ状の中間部材２１ａ’が準備できたら、この中間部材２１ａ’の凸状部位に、十文字に交差する梁部位２１ａ，２１ｂを形成して開口部１３ａ〜１３ｄを開口する。梁部位２１ａ，２１ｂは、図示しない例えば、プレス加工機に中間部材をセットし、プレス加工部材で中間部材の凸状部位を、十文字状に打ち抜くことにより形成する。これにより、図１０Ａに示す十文字に交差する梁部位２１ａ，２１ｂを有した生地の枠部材２１を得ることができる。図１０Ｂは、中間部材２１ａ’のＸ３−Ｘ３矢視断面図である。 When such a cap-shaped intermediate member 21a 'is prepared, beam portions 21a and 21b crossing the cross are formed on the convex portion of the intermediate member 21a' to open the openings 13a to 13d. The beam portions 21a and 21b are formed by, for example, setting an intermediate member on a press machine (not shown) and punching out the convex portion of the intermediate member into a cross shape with the press member. Thereby, the fabric frame member 21 having the beam portions 21a and 21b intersecting with the cross character shown in FIG. 10A can be obtained. FIG. 10B is a cross-sectional view of the intermediate member 21a ′ taken along the line X3-X3.
図１０Ａ，Ｂに示した生地の枠部材２１が準備できたら、所定の膜厚のＮｉめっき層２及びＳｎ−Ａｇめっき層３を順次形成して下地処理する。この際の下地処理については、第１の実施形態と同様であるので、その説明を省略する。次に、下地処理を完了した枠部材２１の必要箇所に、第１の実施形態と同様に仕上げ層として、はんだコート処理を施す。はんだコート処理及び、その部品供給過程については、第１の実施形態と同様であるので、その説明を省略する。 When the fabric frame member 21 shown in FIGS. 10A and 10B is prepared, the Ni plating layer 2 and the Sn—Ag plating layer 3 having a predetermined film thickness are sequentially formed and subjected to the base treatment. Since the ground processing at this time is the same as that in the first embodiment, the description thereof is omitted. Next, a solder coat process is performed as a finishing layer on the necessary portion of the frame member 21 that has undergone the base process, as in the first embodiment. Since the solder coating process and its component supply process are the same as those in the first embodiment, the description thereof is omitted.
続いて、図１１Ａ〜図１１Ｃを参照して、シールドケース２００の実装方法について、その枠部材２１のプリント配線基板１０への実装例を説明する。この例では、図８〜図１０に示した形成工程により得られた、はんだコート処理後の面実装用の枠部材２１をプリント配線基板１０（実装基板）の所定の部位に、はんだ材料を使用して接合する場合を例に挙げる。 Next, with reference to FIGS. 11A to 11C, an example of mounting the frame member 21 on the printed wiring board 10 will be described with respect to the mounting method of the shield case 200. In this example, a solder material is used for a predetermined part of the printed wiring board 10 (mounting board) for the surface mounting frame member 21 obtained by the forming process shown in FIGS. Then, the case of joining is given as an example.
まず、図１１Ａにおいて、プリント配線基板１０の所定の部位にはんだ材料２６’（素材）を形成する。プリント配線基板１０及びはんだ材料２６’については、第１の実施形態で説明した通りであるので、その説明を省略する。プリント配線基板１０のランドパターン１０ａに、はんだ材料２６’が形成できたら、ランドパターン１０ａと枠部材２１とを位置合わせする。そして、図１１Ａにおいて、はんだ材料２６’が形成されたランドパターン１０ａの所定の部位に、図１１Ｂに示す枠部材２１をマウントする。枠部材２１のマウントは、部品搭載機による方法でも、手作業による載置の方法であってもどちらでもよい。 First, in FIG. 11A, a solder material 26 ′ (material) is formed at a predetermined portion of the printed wiring board 10. Since the printed wiring board 10 and the solder material 26 ′ are as described in the first embodiment, description thereof is omitted. When the solder material 26 'can be formed on the land pattern 10a of the printed wiring board 10, the land pattern 10a and the frame member 21 are aligned. In FIG. 11A, the frame member 21 shown in FIG. 11B is mounted on a predetermined portion of the land pattern 10a on which the solder material 26 'is formed. The mounting of the frame member 21 may be either a method using a component mounting machine or a manual placement method.
次に、はんだ材料２６’を介してランドパターン１０ａ上にマウントされた枠部材２１を含むプリント配線基板１０を、図示しないリフロー炉に導入してリフロー処理を施す。このリフロー処理によって、プリント配線基板１０と枠部材２１とが接合する。このとき、第１の実施形態と同様にして、リフロー炉を温度プロファイルに従って加熱制御する。 Next, the printed wiring board 10 including the frame member 21 mounted on the land pattern 10a via the solder material 26 'is introduced into a reflow furnace (not shown) and subjected to a reflow process. The printed wiring board 10 and the frame member 21 are joined by this reflow process. At this time, similarly to the first embodiment, the reflow furnace is heated and controlled according to the temperature profile.
このように温度プロファイルに従って、枠部材２１をマウントしたプリント配線基板１０の熱処理を実行すると、ランドパターン１０ａ上のはんだ材料２６’が溶融して枠部材２１の下方の内側及び外側をぬれ性良く這い上がる。この溶融はんだの這い上がりによってフィレット部分２６が形成される。これにより、図１１Ｃに示すように枠部材２１とプリント配線基板１０とを良好に、はんだ付け処理できるようになった。 As described above, when the heat treatment is performed on the printed wiring board 10 on which the frame member 21 is mounted according to the temperature profile, the solder material 26 ′ on the land pattern 10 a melts and scoops the inside and outside below the frame member 21 with good wettability. Go up. The fillet portion 26 is formed by the rising of the molten solder. As a result, as shown in FIG. 11C, the frame member 21 and the printed wiring board 10 can be soldered satisfactorily.
このように第２の実施形態としてのシールドケース２００及びその製造方法によれば、洋白材１から、その一部が面実装用のはんだ付け面となされた、枠内十文字構造付きの枠部材２１を加工した後に、所定の膜厚のＮｉめっき層２及びＳｎ−Ａｇめっき層３を順次形成して下地処理し、その下地処理した後に、仕上げ層として鉛フリーの溶融はんだをコート処理している。溶融はんだには、Ｓｎ−Ａｇ系、Ｓｎ−Ｃｕ系、Ｓｎ−Ａｇ−Ｃｕ系、Ｓｎ−Ｂｉ系、Ｓｎ−Ａｇ−Ｃｕ−Ｂｉ系、Ｓｎ−Ｂｉ−Ａｇ（Ｃｕ）系、Ｓｎ−Ａｇ−Ｃｕ−Ｎｉ系、Ｓｎ−Ａｇ−Ｃｕ−Ｓｂ系等の鉛フリーはんだが使用される。 As described above, according to the shield case 200 as the second embodiment and the manufacturing method thereof, a frame member with a cross structure in the frame, in which a part of the white material 1 is a soldering surface for surface mounting. After processing 21, the Ni plating layer 2 and the Sn-Ag plating layer 3 having a predetermined thickness are sequentially formed and subjected to a ground treatment, and after the ground treatment, a lead-free molten solder is coated as a finishing layer. Yes. For the molten solder, Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Bi, Sn-Ag-Cu-Bi, Sn-Bi-Ag (Cu), Sn-Ag- Lead-free solders such as Cu-Ni and Sn-Ag-Cu-Sb are used.
従って、面実装用のシールドケース２００のフィレット部分２６のはんだぬれ性を従来例のめっき処理方法や、防錆処理、脱脂処理等によるはんだ付け処理に比べて、より一段と向上できるようになった。これにより、耐曲げ性及び耐絞り性に優れた枠部材２１等の電子部品を提供できるようになった。しかも、はんだ未接合部分や、ボイド等を発生することなく、枠部材２１等の電子部品をプリント配線基板１０に確実かつ強固に接合し実装できる良好なフィレットを形成できるようになった。 Therefore, the solder wettability of the fillet portion 26 of the shield case 200 for surface mounting can be further improved as compared with the conventional plating method, soldering treatment such as rust prevention treatment and degreasing treatment. Thereby, electronic components, such as the frame member 21 excellent in bending resistance and drawing resistance, can be provided. In addition, it is possible to form a good fillet that can securely and firmly join and mount the electronic components such as the frame member 21 to the printed wiring board 10 without generating solder unjoined portions or voids.
＜第３の実施形態＞
続いて、図１２を参照して、第３の実施形態としてのチューナーケース３００について説明する。図１２に示すチューナーケース３００は、はんだコート部品の一例を構成し、チューナー回路基板３０の上に実装されたチューナー部品（図示せず）を電磁的に遮蔽するものである。
<Third Embodiment>
Next, a tuner case 300 as the third embodiment will be described with reference to FIG. A tuner case 300 shown in FIG. 12 constitutes an example of a solder coat component, and electromagnetically shields a tuner component (not shown) mounted on the tuner circuit board 30.
チューナーケース３００は、枠部材３１及び蓋部材３２から構成される。枠部材３１は幅Ｗ３が１８ｍｍ程度で、長さＬ３が２２ｍｍ程度で、高さＨ３が２ｍｍ程度を有している。枠部材３１はチューナー回路基板３０に、はんだ付け処理される。チューナー回路基板３０にはランドパターン３０ａが設けられ、第１の実施形態で説明したプリント配線基板１０にチューナー回路が組み込まれたものが使用される。枠部材３１及び蓋部材３２は洋白材１やＳＵＳ３０４、ＳＵＳ３１６、ＳＵＳ４３０等から作製されたものが使用される。枠部材３１は、ランドパターン３０ａにはんだ付け処理される。 The tuner case 300 includes a frame member 31 and a lid member 32. The frame member 31 has a width W3 of about 18 mm, a length L3 of about 22 mm, and a height H3 of about 2 mm. The frame member 31 is soldered to the tuner circuit board 30. A land pattern 30a is provided on the tuner circuit board 30, and the printed circuit board 10 described in the first embodiment is incorporated with a tuner circuit. As the frame member 31 and the lid member 32, those made from the white material 1, SUS304, SUS316, SUS430 or the like are used. The frame member 31 is soldered to the land pattern 30a.
この例で、枠部材３１の内側は平面補強されている。この平面補強では、枠部材３１の内側の開口部３３の端面（木場面）方向に凹凸状部位を設けている。凹凸状部位を設けたのは、枠部材３１の長手方向や短手方向でねじれや反りを生じないようにするためである。この例でも、枠部材３１から蓋部材３２を外したとき、内側が平面補強された開口部３３内のチューナー部品を点検できるようになっている。 In this example, the inner side of the frame member 31 is plane reinforced. In this plane reinforcement, an uneven portion is provided in the direction of the end face (tree scene) of the opening 33 inside the frame member 31. The reason why the uneven portion is provided is to prevent the frame member 31 from being twisted or warped in the longitudinal direction or the short direction. Also in this example, when the lid member 32 is removed from the frame member 31, it is possible to inspect the tuner parts in the opening portion 33 whose inside is flat-reinforced.
この例では、開口部３３の外周囲は、第１の実施形態のようなハット状の絞り端部１１ａとは異なり、第２の実施形態で説明したような洋白材１の切断端面がそのままランドパターン３０ａに当接されるような形状を成している。もちろん、その外周囲を第１の実施形態のような絞り端部１１ａとしてもよい。蓋部材３２については、第１の実施形態で説明した他に、接地用のリード３２ａが設けられている。リード３２ａは板バネ性を有しており、当該チューナーケース３００を実装したチューナー回路基板３０を携帯電話機等の筐体に組み入れたときに、筐体に設けられた被接点部位に接触され、電気的に導通され、アースするようになされる。 In this example, the outer periphery of the opening 33 is different from the hat-shaped throttle end 11a as in the first embodiment, and the cut end surface of the white material 1 as described in the second embodiment is intact. It has a shape that comes into contact with the land pattern 30a. Of course, the outer periphery thereof may be the throttle end portion 11a as in the first embodiment. In addition to the cover member 32 described in the first embodiment, a grounding lead 32a is provided. The lead 32a has a leaf spring property, and when the tuner circuit board 30 on which the tuner case 300 is mounted is incorporated in a casing such as a mobile phone, the lead 32a is brought into contact with a contacted portion provided in the casing, Conductive and grounded.
チューナーケース３００の枠部材３１も、図２に示したような所定の膜厚のＮｉめっき層２及びＳｎ−Ｃｕめっき層３が順次設けられ、かつ、当該Ｓｎ−Ｃｕめっき層３上には溶融はんだがコーティング処理されたはんだコート層４からなる表面処理層５が形成された洋白材１から構成される。
はんだコート層４の厚みは、第１及び第２の実施形態と同様にして、リフロー処理時の溶融はんだのぬれ性を良くするために１８μｍ〜３０μｍ程度が確保される。溶融はんだには、例えば、Ｓｎ−Ａｇ−Ｃｕ系の鉛フリーはんだが使用される。
The frame member 31 of the tuner case 300 is also provided with a Ni plating layer 2 and a Sn—Cu plating layer 3 having a predetermined film thickness as shown in FIG. 2 and is melted on the Sn—Cu plating layer 3. It is comprised from the white material 1 in which the surface treatment layer 5 which consists of the solder coat layer 4 by which the solder was coated is formed.
As in the first and second embodiments, the solder coat layer 4 has a thickness of about 18 μm to 30 μm in order to improve the wettability of the molten solder during the reflow process. For the molten solder, for example, Sn—Ag—Cu-based lead-free solder is used.
溶融はんだには、Ｓｎ−Ａｇ−Ｃｕ系の他に、Ｓｎ−Ａｇ系、Ｓｎ−Ｃｕ系、Ｓｎ−Ｂｉ系、Ｓｎ−Ａｇ−Ｃｕ−Ｂｉ系、Ｓｎ−Ｂｉ−Ａｇ（Ｃｕ）系、Ｓｎ−Ａｇ−Ｃｕ−Ｎｉ系、又は、Ｓｎ−Ａｇ−Ｃｕ−Ｓｂ系等の鉛フリーはんだが使用される。 In addition to Sn-Ag-Cu series, molten solder includes Sn-Ag series, Sn-Cu series, Sn-Bi series, Sn-Ag-Cu-Bi series, Sn-Bi-Ag (Cu) series, Sn Lead-free solder such as -Ag-Cu-Ni or Sn-Ag-Cu-Sb is used.
なお、チューナーケース３００の実装方法については、第２の実施形態を参照されたい。図中のフィレット部分３６は、枠部材３１をマウントしたチューナー回路基板３０の熱処理を実行して、ランドパターン３０ａ上のはんだ材料が溶融して枠部材３１の切断端面の内側及び外側をぬれ性良く這い上がったもので、この溶融はんだの這い上がりによって生じたものである。
For the method of mounting the tuner case 300, refer to the second embodiment. Fillet component 36 in the figure, by performing the heat treatment of the tuner circuit board 30 has been mounted by the frame member 31, wetting the inner and outer cut end faces of the frame member 31 solder material on the land pattern 30a is melted property It was a well-cracked up and was caused by the scooping up of this molten solder.
このように第３の実施形態としてのチューナーケース３００によれば、洋白材１から、その一部が面実装用のはんだ付け面となされた、枠内平面補強付きの枠部材３１を加工した後に、Ｎｉめっき層２及びＳｎ−Ａｇめっき層３の下地処理をし、その下地処理した後に、鉛フリーの溶融はんだをコート処理しているので、面実装用のチューナーケース３００のフィレット部分３６のはんだぬれ性を従来例のめっき処理方法や、防錆処理、脱脂処理等によるはんだ付け処理に比べて、より一段と向上できるようになった。 As described above, according to the tuner case 300 as the third embodiment, the frame member 31 with in-frame plane reinforcement, in which a part of the white material 1 is a soldering surface for surface mounting, is processed. Later, the Ni plating layer 2 and the Sn—Ag plating layer 3 are subjected to the ground treatment, and after the ground treatment, the lead-free molten solder is coated, so that the fillet portion 36 of the tuner case 300 for surface mounting is formed. The solder wettability can be further improved compared to the conventional plating method, soldering treatment such as rust prevention treatment and degreasing treatment.
これにより、耐曲げ性及び耐絞り性に優れた枠部材３１等の電子部品を提供できるようになった。しかも、はんだ未接合部分や、ボイド等を発生することなく、枠部材３１等のチューナー部品をチューナー回路基板３０に確実かつ強固に接合し実装できる良好なフィレットを形成できるようになった。 Thereby, electronic components, such as the frame member 31 excellent in bending resistance and squeeze resistance, can be provided. In addition, it is possible to form a good fillet that can securely and firmly join the tuner components such as the frame member 31 to the tuner circuit board 30 without generating any solder unjoined portions or voids.
＜第４の実施形態＞
続いて、図１３を参照して、第４の実施形態としての基板補強フレーム４００について説明する。図１３に示す基板補強フレーム４００は、はんだコート部品の一例を構成し、軽薄回路基板４０の上に実装された電子部品（図示せず）を電磁的に遮蔽すると共に、当該軽薄回路基板４０そのものの反りや、ねじれを防止するものである。
<Fourth Embodiment>
Next, a substrate reinforcing frame 400 as a fourth embodiment will be described with reference to FIG. A substrate reinforcing frame 400 shown in FIG. 13 constitutes an example of a solder-coated component, electromagnetically shields an electronic component (not shown) mounted on the light and thin circuit substrate 40, and the light and thin circuit substrate 40 itself. This prevents warping and twisting.
基板補強フレーム４００は、一部に斜め部位を有する五角形状の枠部材４１及び図示しない蓋部材から構成される。枠部材４１は幅Ｗ４が４０ｍｍ程度で、長さＬ４が８０ｍｍ程度で、高さＨ４が２ｍｍ程度を有している。枠部材４１は軽薄回路基板４０に、はんだ付け処理される。軽薄回路基板４０は軟柔性を有しており、軽薄回路基板４０にはランドパターン４０ａが設けられる。枠部材４１及び蓋部材は洋白材１、ステンレス材、鉄、及び、コバール等から作製されたものが使用される。枠部材４１は、ランドパターン４０ａにはんだ付け処理される。 The substrate reinforcing frame 400 is composed of a pentagonal frame member 41 having an oblique portion in part and a lid member (not shown). The frame member 41 has a width W4 of about 40 mm, a length L4 of about 80 mm, and a height H4 of about 2 mm. The frame member 41 is soldered to the light and thin circuit board 40. The light and thin circuit board 40 has flexibility, and the light and thin circuit board 40 is provided with a land pattern 40a. As the frame member 41 and the lid member, those made from the white material 1, stainless steel, iron, Kovar, etc. are used. The frame member 41 is soldered to the land pattern 40a.
この例で、枠部材４１の内側は第３の実施形態と同様にして平面補強されている。この平面補強では、枠部材４１の内側の２つの開口部４３ａ，４３ｂの端面（木場面）方向に斜め状部位（筋交いに相当）を設けている。斜め状部位を設けたのは、枠部材４１の長手方向や短手方向でねじれや反りを生じないようにするためである。この例でも、枠部材４１から蓋部材を外したとき、内側が平面補強された開口部４３ａ，４３ｂ内の電子部品を点検できるようになっている。 In this example, the inner side of the frame member 41 is plane reinforced in the same manner as in the third embodiment. In this plane reinforcement, diagonal portions (corresponding to braces) are provided in the direction of the end faces (tree scenes) of the two openings 43a and 43b inside the frame member 41. The reason why the oblique portion is provided is to prevent twisting and warping in the longitudinal direction and the short direction of the frame member 41. Also in this example, when the lid member is removed from the frame member 41, the electronic components in the openings 43a and 43b whose inner surfaces are reinforced can be inspected.
この例でも、開口部４３ａ，４３ｂを挟む外周囲には、第１の実施形態のような絞り端部１１ａとは異なり、第２の実施形態で説明したような枠部材３１の切断端面がランドパターン４０ａに当接するように設けられている。もちろん、その外周囲を第１の実施形態のような絞り端部１１ａとしてもよい。 Also in this example, the cut end face of the frame member 31 as described in the second embodiment is different from the diaphragm end portion 11a as in the first embodiment on the outer periphery sandwiching the openings 43a and 43b. It is provided so as to contact the pattern 40a. Of course, the outer periphery thereof may be the throttle end portion 11a as in the first embodiment.
基板補強フレーム４００の枠部材４１も、図２に示したような所定の膜厚のＮｉめっき層２及びＳｎ−Ｃｕめっき層３が順次設けられ、かつ、当該Ｓｎ−Ｃｕめっき層３上には溶融はんだがコーティング処理されたはんだコート層４からなる表面処理層５が形成された洋白材１から構成される。はんだコート層４の厚みは、第１の実施形態と同様にして、リフロー処理時の溶融はんだのぬれ性を良くするために１８μｍ〜３０μｍ程度が確保される。溶融はんだには、例えば、Ｓｎ−Ａｇ−Ｃｕ系の鉛フリーはんだが使用される。 The frame member 41 of the substrate reinforcing frame 400 is also provided with the Ni plating layer 2 and the Sn—Cu plating layer 3 having a predetermined thickness as shown in FIG. 2 in order, and on the Sn—Cu plating layer 3. It is comprised from the white material 1 in which the surface treatment layer 5 which consists of the solder coat layer 4 by which the molten solder was coated is formed. The solder coat layer 4 has a thickness of about 18 μm to 30 μm in order to improve the wettability of the molten solder during the reflow process, as in the first embodiment. For the molten solder, for example, Sn—Ag—Cu-based lead-free solder is used.
溶融はんだには、Ｓｎ−Ａｇ−Ｃｕ系の他に、Ｓｎ−Ａｇ系、Ｓｎ−Ｃｕ系、Ｓｎ−Ｂｉ系、Ｓｎ−Ａｇ−Ｃｕ−Ｂｉ系、Ｓｎ−Ｂｉ−Ａｇ（Ｃｕ）系、Ｓｎ−Ａｇ−Ｃｕ−Ｎｉ系、又は、Ｓｎ−Ａｇ−Ｃｕ−Ｓｂ系等の鉛フリーはんだが使用される。 In addition to Sn-Ag-Cu series, molten solder includes Sn-Ag series, Sn-Cu series, Sn-Bi series, Sn-Ag-Cu-Bi series, Sn-Bi-Ag (Cu) series, Sn Lead-free solder such as -Ag-Cu-Ni or Sn-Ag-Cu-Sb is used.
なお、基板補強フレーム４００の実装方法については、第２の実施形態を参照されたい。図中のフィレット部分４６は、枠部材４１で補強した軽薄回路基板４０の熱処理を実行して、ランドパターン４０ａ上のはんだ材料が溶融して枠部材４１の下方の内側及び外側をぬれ性良く這い上がったもので、この溶融はんだの這い上がりによって生じたものである。 For the mounting method of the board reinforcing frame 400, refer to the second embodiment. The fillet portion 46 in the drawing performs heat treatment of the light and thin circuit board 40 reinforced by the frame member 41, and the solder material on the land pattern 40a is melted to scoop the inner and outer sides below the frame member 41 with good wettability. This is caused by the creeping of the molten solder.
このように第４の実施形態としての基板補強フレーム４００によれば、洋白材１から、その一部が面実装用のはんだ付け面となされた、枠内平面斜め補強付きの枠部材４１を加工した後に、鉛フリーの溶融はんだをコート処理しているので、面実装用の基板補強フレーム４００のフィレット部分４６のはんだぬれ性を従来例のめっき処理方法や、防錆処理、脱脂処理等によるはんだ付け処理に比べて、より一段と向上できるようになった。 Thus, according to the board reinforcing frame 400 as the fourth embodiment, the frame member 41 with the in-frame plane diagonal reinforcement, in which a part of the white material 1 is a soldering surface for surface mounting. Since the lead-free molten solder is coated after the processing, the solder wettability of the fillet portion 46 of the substrate reinforcing frame 400 for surface mounting is determined by the conventional plating method, rust prevention treatment, degreasing treatment, etc. Compared to the soldering process, it can be further improved.
これにより、耐曲げ性及び耐絞り性に優れた枠部材４１等の基板補強フレーム４００を提供できるようになった。しかも、はんだ未接合部分や、ボイド等を発生することなく、枠部材４１等の基板補強フレーム４００を軽薄回路基板４０に確実かつ強固に接合し実装できる良好なフィレットを形成できるようになった。 As a result, it is possible to provide the substrate reinforcing frame 400 such as the frame member 41 having excellent bending resistance and drawing resistance. In addition, it is possible to form a good fillet that can securely and firmly bond and mount the board reinforcing frame 400 such as the frame member 41 to the light and thin circuit board 40 without generating any solder unbonded portion or void.
＜評価例＞
続いて、第１〜第４の実施形態で説明した枠部材１１，２１，３１，４１に係るＪＩＳＺ３１９８−４に基づくはんだぬれ上がり性（メニスコ）試験について説明する。
<Evaluation example>
Subsequently, a solder wettability (menisco) test based on JISZ3198-4 according to the frame members 11, 21, 31, and 41 described in the first to fourth embodiments will be described.
図１４に示すはんだぬれ上がり性の試験例によれば、メニスコグラフ測定装置を使用し、枠部材１１，２１，３１，４１に係る金属部材としての洋白材１（Ｃ７５２１Ｒ；Ｃ７７０１Ｒ等でもよい）を用い、下地処理として、第１層目にＮｉめっき処理を施し、第２層目にＳｎ−Ｃｕめっきを施し、第３層（仕上げ層）目にはんだコート処理（以下Ｍ７０５処理という）を行った場合と、洋白材１をＳｎめっき処理のみを施した場合とについて、測定経過時間毎に溶融はんだによるぬれ力［ｍＮ］を測定した（ウエッティングバランス法及び接触角法によるぬれ性試験方法）。フラックスにはＥＳＲ２５０を用い、溶融はんだとしてエコソルダー（Ｍ７０５）を使用して洋白材１をはんだ溶融めっきする例である。 According to the test example of solder wettability shown in FIG. 14, a white material 1 (C7521R; C7701R or the like may be used) as a metal member related to the frame members 11, 21, 31, 41 is used using a meniscograph measuring device. The first layer was subjected to Ni plating treatment, the second layer was subjected to Sn-Cu plating, and the third layer (finishing layer) was subjected to solder coating treatment (hereinafter referred to as M705 treatment). The wet power [mN] by the molten solder was measured at every measurement elapsed time for the case and the case where the white material 1 was subjected only to the Sn plating treatment (wetting test method by the wetting balance method and the contact angle method). . In this example, ESR250 is used as the flux, and the solder material 1 is solder-plated using Ecosolder (M705) as the molten solder.
浸漬条件は、メニスコグラフ測定装置の測定レンジが２０［ｍＮ］、浸漬速度が２０ｍｍ／秒、浸漬深さは２［ｍｍ］、浸漬保持時間は１０[秒］である。リフロー処理時の温度は２４０℃である。この測定に基づいてメニスコグラフを作成して、当該洋白材１をはんだコート処理した場合と洋白材１をＳｎめっき処理した場合とについてはんだぬれ上がり性を評価した。 The immersion conditions are a measurement range of a meniscograph measuring apparatus of 20 [mN], an immersion speed of 20 mm / second, an immersion depth of 2 [mm], and an immersion holding time of 10 [second]. The temperature during the reflow process is 240 ° C. A meniscograph was prepared based on this measurement, and the solder wettability was evaluated for the case where the white material 1 was subjected to solder coating treatment and the case where the white material 1 was subjected to Sn plating treatment.
図１４に示す縦軸は溶融はんだによる作用力（ぬれ力）［ｍＮ］であり、横軸は測定経過を示す時間［秒］である。図１４に示すメニスコグラフによれば、図中の実線が洋白材１のＭ７０５処理特性である。破線が洋白材１のＳｎめっき処理特性である。メニスコグラフは、Ｍ７０５処理した洋白材１やＳｎめっき処理をした洋白材１を加熱開始から、浸漬完了→ぬれ開始→ゼロクロス→ぬれ上がり→引き上げ開始→引き上げ完了に至るまでを時間を追って、溶融はんだによる作用力（ぬれ力）［ｍＮ］を測定した。 The vertical axis | shaft shown in FIG. 14 is the action force (wetting force) [mN] by a molten solder, and a horizontal axis is time [second] which shows measurement progress. According to the meniscograph shown in FIG. 14, the solid line in the figure is the M705 treatment characteristic of the western white material 1. A broken line is the Sn plating processing characteristic of the white material 1. Meniscograph melts the white material 1 treated with M705 and the white material 1 treated with Sn plating from the start of heating to the completion of dipping → wetting start → zero cross → wetting up → start of lifting → up to completion of lifting. The acting force (wetting force) [mN] by the solder was measured.
図１４に示すメニスコグラフにおいて、Ｔ１１は、Ｍ７０５処理の洋白材１の加熱開始時刻ｔ０からゼロクロス時刻ｔ１１に至るゼロクロス時間である。ゼロクロス時間Ｔ１１には、溶融はんだの浸漬時間、その不ぬれ時間及びそのぬれ時間が含まれる。ぬれ時間は、Ｍ７０５処理の溶融はんだのぬれ速度を意味する。ぬれ時間が短時間なほどぬれ速度が速いことを示す。図中、黒丸印ｐ１はＭ７０５処理の洋白材１のゼロクロス点である。Ｍ１は、Ｍ７０５処理の洋白材１の最大作用力（＝Ｆｍａｘ）である。なお、作用力（ぬれ力）が大きいほど、ぬれ性が高いことを示している。 In the meniscograph shown in FIG. 14, T11 is a zero crossing time from the heating start time t0 to the zero crossing time t11 of the white material 1 subjected to M705 treatment. The zero crossing time T11 includes the immersion time of the molten solder, its non-wetting time, and its wetting time. The wetting time means the wetting speed of the molten solder treated with M705. The shorter the wetting time, the faster the wetting speed. In the figure, a black circle mark p1 is a zero cross point of the white material 1 treated with M705. M1 is the maximum acting force (= Fmax) of the white material 1 treated with M705. In addition, it shows that wettability is so high that action force (wetting force) is large.
また、図１４に示すメニスコグラフにおいて、Ｔ２１は、Ｓｎめっき処理の洋白材１の加熱開始時刻ｔ０からゼロクロス時刻ｔ２１に至るゼロクロス時間である。ゼロクロス時間Ｔ２１には、溶融はんだの浸漬時間、その不ぬれ時間及びそのぬれ時間が含まれる。ぬれ時間は、Ｓｎめっき処理の溶融はんだのぬれ速度を意味する。Ｓｎめっき処理のぬれ時間は、Ｍ７０５処理に比べて長くなっている。Ｍ７０５処理時よりもＳｎめっき処理のぬれ上がり速度が遅いことを示している。図中、黒丸印ｑ１はＳｎめっき処理の洋白材１のゼロクロス点であり、Ｍ２は、Ｓｎめっき処理の洋白材１の最大作用力（＝Ｆｍａｘ）である。 In the meniscograph shown in FIG. 14, T21 is a zero cross time from the heating start time t0 to the zero cross time t21 of the white material 1 of the Sn plating process. The zero crossing time T21 includes the immersion time of the molten solder, the non-wetting time thereof, and the wetting time thereof. The wetting time means the wetting speed of the molten solder in the Sn plating process. The wetting time of the Sn plating process is longer than that of the M705 process. It shows that the wetting speed of the Sn plating process is slower than that during the M705 process. In the figure, the black circle q1 is the zero crossing point of the white material 1 subjected to Sn plating, and M2 is the maximum acting force (= Fmax) of the white material 1 subjected to Sn plating.
続いて、図１５を参照して、洋白材１に係るＭ７０５処理及びＳｎめっき処理における評価結果を説明する。図１５に示す表図の縦方向には、洋白材１からなる枠部材に係る実施例及び比較例の処理内容を記述し、横方向にはゼロクロス時間、図６（ｃ）で示される枠部材１１の長手方向の辺の一方を前方とし、長手方向の辺の他方を後方として、前方及び後方のはんだ付けされた実装状態を写真撮影し、要部拡大した写真図である。部品浮き部分を各々記述している。 Then, with reference to FIG. 15, the evaluation result in the M705 process and Sn plating process which concern on the white material 1 is demonstrated. The vertical direction of the table shown in FIG. 15 describes the processing contents of the example and the comparative example relating to the frame member made of the white material 1, the horizontal direction shows the zero cross time, and the frame shown in FIG. It is the photograph which expanded the principal part by taking a photograph of the soldered mounting state of the front and rear, with one of the longitudinal sides of the member 11 as the front and the other of the longitudinal sides as the rear. Each part floating part is described.
本発明に係る枠部材１１の基材として採用した洋白材１のＭ７０５処理によれば、図１４に示したぬれ上がり性試験に基づく、図１５の実施例に係る写真図に示すように、当該洋白材１にそりを生じることなく、枠部材１１の前方及び後方ともに良好な接合が確認できた。 According to the M705 treatment of the white material 1 adopted as the base material of the frame member 11 according to the present invention, as shown in the photographic diagram according to the embodiment of FIG. 15 based on the wettability test shown in FIG. It was confirmed that the front and rear of the frame member 11 were satisfactorily joined without causing warpage in the white material 1.
Ｍ７０５処理によれば、溶融はんだのぬれ性が良く、実装時に従来品では得られない任意のはんだ付け箇所で良好なフィレットを形成できるようになった。これにより、図６Ｃで二点鎖線に示した部位にフィレット部分１６を形成できるようになった。また、同様に図１１Ｃに示したフィレット部分２６、図１２に示したフィレット部分３６、及び、図１３に示したフィレット部分４６等を形成できるようになった。 According to the M705 treatment, the wettability of the molten solder is good, and a good fillet can be formed at an arbitrary soldering point that cannot be obtained with a conventional product at the time of mounting. As a result, the fillet portion 16 can be formed at the portion indicated by the two-dot chain line in FIG. 6C. Similarly, the fillet portion 26 shown in FIG. 11C, the fillet portion 36 shown in FIG. 12, the fillet portion 46 shown in FIG. 13, and the like can be formed.
因みに、Ｍ７０５コート処理の溶融はんだのゼロクロス時間Ｔ１１は、１．３４［秒］であり、ぬれ上がり時間は、１．５０［秒］である。最大作用力Ｍ１（＝Ｆｍａｘ）は、７．０６［ｍＮ］であり、測定開始時刻ｔ＝０からＦｍａｘに至る所要時間は、１０．８５［秒］であった。 Incidentally, the zero crossing time T11 of the molten solder subjected to the M705 coating process is 1.34 [seconds], and the wetting time is 1.50 [seconds]. The maximum acting force M1 (= Fmax) was 7.06 [mN], and the required time from the measurement start time t = 0 to Fmax was 10.85 [seconds].
これに対して、図１５に示す比較例に係るＳｎめっき処理では、その写真図に示すように、当該枠部材１１の前方は接合しているが、その後方がプリント配線基板１０から浮き上がってしまい、満足の行くフィレットが形成できなかった。浮き上がった部分は後方の写真図で帯状に黒くなっている部分である。因みにＳｎめっき処理の溶融はんだのゼロクロス時間Ｔ２１は、２．４５［秒］である。ぬれ上がり時間は、１．８３［秒］であり、最大作用力Ｍ２（＝Ｆｍａｘ）は、４．３９［ｍＮ］であり、測定開始時刻ｔ＝０からＦｍａｘに至る所要時間は、１０．８６［秒］であった。この表図からも明確なようにＳｎめっき処理を施した枠部材に比べてＭ７０５処理を施した枠部材１１で、はんだコート部品を製造した場合の方が、リフロー処理時、はんだぬれ性の良い接合が得られることが実証できた。 On the other hand, in the Sn plating process according to the comparative example shown in FIG. 15, as shown in the photograph, the front of the frame member 11 is joined, but the rear of the frame member 11 is lifted from the printed wiring board 10. A satisfactory fillet could not be formed. The raised part is the part that is black in a strip shape in the rear photo. Incidentally, the zero crossing time T21 of the molten solder in the Sn plating process is 2.45 [seconds]. The wetting time is 1.83 [seconds], the maximum acting force M2 (= Fmax) is 4.39 [mN], and the time required from the measurement start time t = 0 to Fmax is 10.86. [Seconds]. As clearly shown in this table, the solder member is manufactured with the M705-treated frame member 11 in comparison with the Sn-plated frame member, and the solder wettability is better during the reflow process. It was proved that bonding was obtained.
なお、枠部材１１，２１，３１，４１に係る金属部材としてステンレス材ＳＵＳ３０４を用い、下地処理も洋白材１と同様に施し、フラックスにはＥＳＲ２５０を用いた場合であって、溶融はんだとしてエコソルダー（Ｍ７０５）を使用してＳＵＳ３０４からなる枠部材をはんだＭ７０５処理を行った場合と、ＳＵＳ３０４からなる枠部材をＳｎめっき処理のみを施した場合についても、ＪＩＳＺ３１９８−４に基づくはんだぬれ上がり性（メニスコ）試験を行った。 In addition, the stainless steel SUS304 is used as the metal member related to the frame members 11, 21, 31, and 41, the ground treatment is performed in the same manner as the white material 1, and ESR250 is used as the flux. The solder wettability based on JISZ3198-4 (when solder M705 is applied to the frame member made of SUS304 using the solder (M705) and when only the Sn plating treatment is applied to the frame member made of SUS304) Menisco) test was conducted.
図示しないが、ＳＵＳ３０４からなる枠部材にそりを生じることなく、洋白材１と同様にＳＵＳ３０４からなる枠部材の前方及び後方ともに良好な接合が確認できた。 Although not shown in the drawing, it was confirmed that both the front and the rear of the frame member made of SUS304 were satisfactorily the same as the white material 1 without causing warpage in the frame member made of SUS304.
Ｍ７０５処理によれば、溶融はんだのぬれ性が良く、実装時に従来品では得られない任意のはんだ付け箇所で良好なフィレットを形成できるようになった。因みにＭ７０５コート処理の溶融はんだのゼロクロス時間Ｔ１１は、７．１６［秒］であり、ぬれ上がり時間は、１．７９［秒］である。 According to the M705 treatment, the wettability of the molten solder is good, and a good fillet can be formed at an arbitrary soldering point that cannot be obtained with a conventional product at the time of mounting. Incidentally, the zero crossing time T11 of the molten solder subjected to the M705 coating process is 7.16 [seconds], and the wetting time is 1.79 [seconds].
これに対して、Ｓｎめっき処理では、洋白材からなる枠部材と同様に、ＳＵＳ３０４からなる枠部材の前方は接合しているが、その後方がプリント配線基板１０から浮き上がってしまい、満足の行くフィレットが形成できなかった。因みにＳｎめっき処理の溶融はんだのゼロクロス時間Ｔ２１は、１０．００［秒］である。ぬれ上がり時間は、０．００［秒］である。この表図からも明確なようにＳｎめっき処理を施したＳＵＳ３０４に比べてＭ７０５処理を施したＳＵＳ３０４で、はんだコート部品を製造した場合の方が、リフロー処理時、はんだぬれ性の良い接合が得られることが実証できた。 On the other hand, in the Sn plating process, like the frame member made of white material, the front of the frame member made of SUS304 is joined, but the rear of the frame member is lifted from the printed wiring board 10 and is satisfactory. A fillet could not be formed. Incidentally, the zero crossing time T21 of the molten solder of the Sn plating process is 10.00 [seconds]. The wetting time is 0.00 [seconds]. As is clear from this table, when solder coated parts are manufactured with SUS304 with M705 treatment compared to SUS304 with Sn plating treatment, bonding with better solder wettability is obtained during reflow treatment. We were able to prove that
なお、Ｓｎめっき処理や、Ｍ７０５処理等を施すことなく、溶融はんだのみを洋白材１やＳＵＳ３０４等に浸漬処理しようと試みたが、溶融はんだがはじかれるのみで、被着しなかった（のらなかった）。 Although an attempt was made to immerse only the molten solder in the western white material 1 or SUS304 without performing the Sn plating treatment or the M705 treatment, the molten solder was only repelled and was not deposited. Did not.)
本発明は、基板上に実装された電子部品を電磁的に遮蔽するシールドケースや、短小軽薄基板を補強する基板補強フレームに適用して極めて好適である。 The present invention is extremely suitable when applied to a shield case that electromagnetically shields an electronic component mounted on a substrate and a substrate reinforcing frame that reinforces a short, small, and light substrate.
１ 洋白材（金属部材）
２ Ｎｉめっき層
３ Ｓｎ−Ｃｕめっき層
４ Ｓｎ−Ａｇ−Ｃｕコート層
１０ プリント配線基板
１０ａ，３０ａ，４０ａ ランドパターン
１１，２１，３１，４１ 枠部材
１２ 蓋部材
１６，２６ フィレット部分
２０，３０ チューナー回路基板
４０ 軽薄回路基板
１００，２００ シールドケース（はんだコート部品）
３００ チューナーケース（はんだコート部品）
４００ 基板補強フレーム（はんだコート部品）
1 White wood (metal member)
2 Ni plating layer 3 Sn-Cu plating layer 4 Sn-Ag-Cu coating layer 10 Printed wiring board 10a, 30a, 40a Land pattern 11, 21, 31, 41 Frame member 12 Lid member 16, 26 Fillet portion 20, 30 Tuner Circuit board 40 Light and thin circuit board 100,200 Shield case (solder coated parts)
300 Tuner case (solder coated parts)
400 Substrate reinforcement frame (solder coated parts)
Claims (6)
前記表面処理された金属部材は、はんだ付けされる接合部分を含む蓋部材、シールドケース及び基板補強用フレームの少なくともいずれか１つの形状に加工されて成り、
少なくとも、前記接合部分がはんだ付け面となされ、前記はんだ付け面に表面処理によって所定の膜厚のニッケル皮膜、錫合金めっき皮膜及び溶融はんだ皮膜が順次形成されていることを特徴とするはんだコート部品。 This is a solder coated part made of a metal member in which a nickel film and a tin alloy plating film are sequentially provided on a base material, and a surface treatment is performed by coating lead-free molten solder on the tin alloy plating film. And
The surface-treated metal member is processed into at least one of a lid member including a joint portion to be soldered, a shield case, and a board reinforcing frame,
At least the joint portion is a soldering surface, and a nickel coating, a tin alloy plating film, and a molten solder coating having a predetermined thickness are sequentially formed on the soldering surface by a surface treatment. .
Ｓｎ−Ａｇ系、Ｓｎ−Ｃｕ系、Ｓｎ−Ａｇ−Ｃｕ系、Ｓｎ−Ｂｉ系、Ｓｎ−Ａｇ−Ｃｕ−Ｂｉ系、Ｓｎ−Ｂｉ−Ａｇ（Ｃｕ）系、Ｓｎ−Ａｇ−Ｃｕ−Ｎｉ系、又は、Ｓｎ−Ａｇ−Ｃｕ−Ｓｂ系等の合金はんだが使用されることを特徴とする請求項１に記載のはんだコート部品。 In the lead-free molten solder,
Sn-Ag system, Sn-Cu system, Sn-Ag-Cu system, Sn-Bi system, Sn-Ag-Cu-Bi system, Sn-Bi-Ag (Cu) system, Sn-Ag-Cu-Ni system, Alternatively, a solder-coated component according to claim 1, wherein an alloy solder such as Sn-Ag-Cu-Sb is used.
前記表面処理工程の前又は後に前記金属部材を加工して、はんだ付けされる接合部分を含む蓋部材、シールドケース及び基板補強用フレームの少なくともいずれか１つの形状に形成する工程とを有し、
少なくとも、前記接合部分がはんだ付け面となされ、前記はんだ付け面に前記表面処理工程によって所定の膜厚のニッケル皮膜、錫合金めっき皮膜及び溶融はんだ皮膜が順次形成されていることを特徴とするはんだコート部品の製造方法。 A step of sequentially forming a nickel film and a tin alloy plating film with a predetermined film thickness on a metal member as a base material for a solder-coated component, and then applying a lead-free molten solder to the metal member subjected to the substrate treatment A surface treatment process comprising the steps of:
Processing the metal member before or after the surface treatment step, and forming the shape into at least one of a lid member including a joint portion to be soldered, a shield case, and a board reinforcing frame,
At least the joining portion is a soldering surface, and a nickel film, a tin alloy plating film, and a molten solder film having a predetermined film thickness are sequentially formed on the soldering surface by the surface treatment process. Manufacturing method of coated parts.
Ｓｎ−Ａｇ系、Ｓｎ−Ｃｕ系、Ｓｎ−Ａｇ−Ｃｕ系、Ｓｎ−Ｂｉ系、Ｓｎ−Ａｇ−Ｃｕ−Ｂｉ系、Ｓｎ−Ｂｉ−Ａｇ（Ｃｕ）系、Ｓｎ−Ａｇ−Ｃｕ−Ｎｉ系、又は、Ｓｎ−Ａｇ−Ｃｕ−Ｓｂ系等の鉛フリーはんだが使用されることを特徴とする請求項３に記載のはんだコート部品の製造方法。 In the lead-free molten solder,
Sn-Ag system, Sn-Cu system, Sn-Ag-Cu system, Sn-Bi system, Sn-Ag-Cu-Bi system, Sn-Bi-Ag (Cu) system, Sn-Ag-Cu-Ni system, Alternatively, a lead-free solder such as Sn-Ag-Cu-Sb is used. The method for manufacturing a solder-coated component according to claim 3 .
少なくとも、前記接合部分がはんだ付け面となされ、前記はんだ付け面にニッケル皮膜及び錫合金めっき皮膜を順次形成して下地処理する工程及び、下地処理された前記金属部材に溶融はんだをコート処理する工程からなる表面処理工程と、
他方で、前記金属部材が接合される所定の部位にはんだ材料を形成する工程と、
前記はんだ材料が形成された前記所定の部位に、前記表面処理された前記金属部材の前記接合部分を位置合わせして熱処理を施し、前記所定の部位に前記金属部材を接合する工程とを有することを特徴とするはんだコート部品の実装方法。 On the other hand, processing a metal member as a base material for a solder coat component, and forming the shape into at least one of a lid member including a joining portion to be soldered, a shield case, and a board reinforcing frame ;
At least, the step wherein the joined portion is performed with soldering surface, which coating process the molten solder in step and, the metal member which is primed to surface treatment by sequentially forming a nickel coating and tin alloy plating film on the soldering surface A surface treatment process comprising:
On the other hand, forming a solder material at a predetermined site where the metal member is joined ;
To the predetermined site where the solder material is formed, and a step of the aligning the surface-treated the joint portion of the metal member is subjected to a heat treatment, joining the metallic member before Symbol predetermined site A method for mounting a solder-coated component.
表面処理された前記金属部材を加工して、はんだ付けされる接合部分を含む蓋部材、シールドケース及び基板補強用フレームの少なくともいずれか１つの形状に形成する工程と、
他方で、前記金属部材が接合される所定の部位にはんだ材料を形成する工程と、前記はんだ材料が形成された前記基板の所定の部位に、前記表面処理された前記金属部材の前記接合部分を位置合わせして熱処理を施し、前記所定の部位に前記金属部材を接合する工程とを有することを特徴とするはんだコート部品の実装方法。 On the other hand, a surface comprising a step of sequentially forming a nickel film and a tin alloy plating film on a metal member as a base material for a solder-coated component, and a step of coating a molten solder on the metal member subjected to the ground treatment Processing steps;
Processing the surface-treated metal member to form a shape of at least one of a lid member, a shield case, and a board reinforcing frame including a joint portion to be soldered ;
On the other hand, forming a material which solder predetermined portion of said metal member is bonded to a predetermined portion of the substrate on which the solder material has been formed, the bonding portion of the surface-treated said metal member aligned and subjected to a heat treatment, before Symbol mounting method of solder coating components, characterized that you have a and joining the metallic member at the predetermined site.
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| CN201080022520.2A CN102440091B (en) | 2009-05-22 | 2010-05-19 | Solder-coated component, process for producing same, and method for mounting same |
| KR1020167023297A KR102134500B1 (en) | 2009-05-22 | 2010-05-19 | Solder-coated component, process for producing same, and method for mounting same |
| PCT/JP2010/058466 WO2010134552A1 (en) | 2009-05-22 | 2010-05-19 | Solder-coated component, process for producing same, and method for mounting same |
| TW099116264A TWI524964B (en) | 2009-05-22 | 2010-05-21 | A solder coating member, a method for manufacturing the same, and a method of installing the same |
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| US9391029B2 (en) | 2014-06-12 | 2016-07-12 | Kabushiki Kaisha Toshiba | Electronic device |
| DE102014110459A1 (en) * | 2014-07-24 | 2016-01-28 | Mahle International Gmbh | Heat exchanger |
| KR102311677B1 (en) | 2014-08-13 | 2021-10-12 | 삼성전자주식회사 | Semiconductor device and method of manufacturing the same |
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| CN109079270A (en) * | 2018-10-26 | 2018-12-25 | 南通舟舰钣金有限公司 | A kind of soldering method |
| JP6871524B1 (en) * | 2020-03-23 | 2021-05-12 | 千住金属工業株式会社 | Laminated bonding materials, semiconductor packages and power modules |
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