JPH03104197A - Shield casing - Google Patents

Shield casing

Info

Publication number
JPH03104197A
JPH03104197A JP24113889A JP24113889A JPH03104197A JP H03104197 A JPH03104197 A JP H03104197A JP 24113889 A JP24113889 A JP 24113889A JP 24113889 A JP24113889 A JP 24113889A JP H03104197 A JPH03104197 A JP H03104197A
Authority
JP
Japan
Prior art keywords
shield case
frame member
top surface
case frame
shield casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24113889A
Other languages
Japanese (ja)
Inventor
Takahide Sasaki
尊英 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP24113889A priority Critical patent/JPH03104197A/en
Publication of JPH03104197A publication Critical patent/JPH03104197A/en
Pending legal-status Critical Current

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Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE:To reduce the number of processes by assuring mechanical mounting and soldering in the lump as in the electronic parts by providing a vacuum suction top surface part on a shield casing frame member. CONSTITUTION:A top surface 6 is provided on a shield casing frame member 2, the top surface 6 is vacuum sucked to mechanically mount the member 2 and hence solder the member 2 in the lump on a board 1 together with other electronic parts 5. With the above construction where the mechanical mounting and the soldering in the lump are assured, manhour for mounting the shield casing is sharply reduced.

Description

【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、リフロー半田付け法を用いて半田付けを行な
うシールドケースに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a shield case that is soldered using a reflow soldering method.

［従来の技術コ 従来のシールドケースは、たとえば、第４図に示すよう
な構成からなっている。[Prior Art] A conventional shield case has a structure as shown in FIG. 4, for example.

同図において、１１はプリント基板、１２は電子部品、
１３はシールドケース枠、１４は前記プリント基板１１
にあけられた穴、１５は前記シールドケース枠１３に設
けられた脚部、１６はカバーである。In the figure, 11 is a printed circuit board, 12 is an electronic component,
13 is a shield case frame, 14 is the printed circuit board 11
15 is a leg provided in the shield case frame 13, and 16 is a cover.

すなわち、プリント基板１１にあけられた穴１４にシー
ルドケース枠１３の脚部１５を作業員の手で差し込み、
その穴１４に隣接設置された露出している導体接地部と
半田付けすることで組立てられていた。That is, a worker manually inserts the legs 15 of the shield case frame 13 into the holes 14 made in the printed circuit board 11.
It was assembled by soldering to the exposed conductor grounding section installed adjacent to the hole 14.

［発明が解決しようとする課題］ しかしながら、従来の技術では、前述したように、まず
、プリント基板１１にシールドケース枠１３の脚部１５
が容易に手挿入できるような程度の穴１４をあけておき
、その近傍に接地電極を設け、電気的接続をなしており
、非常に大きなスペースを占有している。さらに、その
電気的接続の半田付けは手半田を主として行なうので、
工数が増加するという問題点があった。[Problems to be Solved by the Invention] However, in the conventional technology, as described above, first, the legs 15 of the shield case frame 13 are attached to the printed circuit board 11.
A hole 14 is drilled to the extent that it can be easily inserted manually, and a ground electrode is provided near the hole 14 for electrical connection, which occupies a very large space. Furthermore, since the electrical connections are mainly soldered by hand,
There was a problem that the number of man-hours increased.

本発明は、上記のような問題点を解決しようとするもの
である。すなわち、本発明は、半田付け等に大きなスペ
ースを必要とすることなく、機械自動マウントできるよ
うにして、工数を削減することができるシールドケース
を提供することを目的とするものである。The present invention aims to solve the above problems. That is, an object of the present invention is to provide a shield case that can be automatically mounted on a machine without requiring a large space for soldering and the like, thereby reducing the number of man-hours.

［課題を解決するための手段］ 上記目的を達成するために、本発明のシールドケースは
、プリント基板に設置されるシールドケース枠部材を備
え、かつ、前記シールドケース枠部材には、真空ノズル
によって運搬実装させるための部分的な平面からなる真
空吸着用の天面部を有するものとした。[Means for Solving the Problems] In order to achieve the above object, the shield case of the present invention includes a shield case frame member installed on a printed circuit board, and the shield case frame member is provided with a vacuum nozzle. It has a top surface for vacuum suction, which is a partially flat surface for transportation and mounting.

［作　　　用］ 本発明によれば、シールドケース枠部材に、真空吸着用
の天面部を有するので、機械自動マウントができるよう
になって、他の電子部品同様に、一括半田付けが可能と
なり、工数の削減ができる。[Function] According to the present invention, since the shield case frame member has a top surface portion for vacuum suction, it becomes possible to automatically mount the shield case, and it becomes possible to solder the shield case at once in the same way as other electronic components. Man-hours can be reduced.

［実　施　例］ 第１図および第２図は本発明の第１実施例を示している
． 同図において、１はプリント配線がなされているプリン
ト基板、２はシールドヶース枠部材、３はカバー部材、
４は該プリント基板１に設けられた導体ランド、５は電
子部品、６は該シールドケース枠部材２に設けられた真
空吸着用の天面部である。[Embodiment] Figures 1 and 2 show a first embodiment of the present invention. In the figure, 1 is a printed circuit board with printed wiring, 2 is a shield case frame member, 3 is a cover member,
4 is a conductor land provided on the printed circuit board 1, 5 is an electronic component, and 6 is a top surface portion provided on the shield case frame member 2 for vacuum suction.

さらに説明すると、プリント基板１は、その部品ランド
に、周知の方法によりクリーム半田が塗布され、機械自
動マウンタにより種々の電子部品５などが配置される。To explain further, cream solder is applied to the component lands of the printed circuit board 1 by a well-known method, and various electronic components 5 and the like are placed thereon by a mechanical automatic mounter.

その後、シールドケース枠部材２は電子部品５などと同
様に、真空ノズルを有する機械自動マウンタにより、天
面部６を真空吸着することで、導体ランド４上に置かれ
る。この状態を第２図に示している． こののち、周知のりフロー法、つまり、一括半田付け法
により、半田付けが完了する。Thereafter, the shield case frame member 2 is placed on the conductor land 4 by vacuum suctioning the top surface portion 6 using a mechanical automatic mounter having a vacuum nozzle, in the same manner as the electronic component 5 and the like. This state is shown in Figure 2. Thereafter, soldering is completed by the well-known glue flow method, that is, the batch soldering method.

このようにして、半田付けがなされた後に、カバー部材
３は、シールドケース枠部材２と嵌合して組立てされ、
シールド効果を有するケースとなる。In this way, after soldering, the cover member 3 is fitted and assembled with the shield case frame member 2,
This is a case that has a shielding effect.

第１図および第２図に示すように構成されたシールドケ
ースにおいては、一般電子部品と同時に、機械マウント
、リフローが可能であり、また天面部６の除去も容易に
できるため、インサーキットテスト、ファンクションテ
スト、目視等の検査も充分可能である。In the shield case configured as shown in FIGS. 1 and 2, it is possible to mechanically mount and reflow general electronic components at the same time, and since the top surface part 6 can be easily removed, in-circuit testing and Functional tests, visual inspections, and other inspections are also fully possible.

第３図は本発明の第２実施例を示している。FIG. 3 shows a second embodiment of the invention.

この第２実施例では、前述の第１実施例と大差はないが
、符合６゜で示される真空吸着用の天面部が、片持ち梁
になっている点で相違するだけである。This second embodiment is not much different from the first embodiment described above, except that the top surface portion for vacuum suction, indicated by the reference numeral 6°, is in the form of a cantilever.

すなわち、前記天面部６゛は片持ち梁となっているので
、除去しやすく、または折曲げ等により変形可能であり
、インサーキットテスト、ファンクションテストおよび
目視等の検査が容易である。That is, since the top surface part 6' is a cantilever beam, it can be easily removed or deformed by bending, etc., and inspections such as in-circuit tests, function tests, and visual inspections are easy.

［発明の効果］ 以上説明したように、本発明によれば、シールドケース
枠部材の天面に、真空吸着用の天面部を有するので、機
械自動マウントができるようになって、他の部品同様に
、一括半田付けが可能となり、従来のような手作業の必
要がなくなって、工数を削減することができる効果があ
る。[Effects of the Invention] As explained above, according to the present invention, since the top surface of the shield case frame member has a top surface portion for vacuum suction, automatic mechanical mounting is possible, and it can be mounted in the same manner as other parts. Another advantage is that batch soldering is possible, eliminating the need for manual work as in the past, and reducing the number of man-hours.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の第１実施例のシールドケース枠部材と
カバー枠部材を分離して示した斜視図、第２図は同じく
カバー部材を分離して示した斜視図、第３図は本発明の
第２実施例のカバー部材を分離して示した斜視図、第４
図は従来の技術の一例を示した斜視図である。 １・・・プリント基板 ２・・・シールドケース枠部材 ３・・・カバー部材　　　４・・・導体ランド５・・・
電子部品　　　　６，６゜・・・天面部他４名 第 ２ 図FIG. 1 is a perspective view showing the shield case frame member and cover frame member of the first embodiment of the present invention separated, FIG. 2 is a perspective view showing the cover member separated, and FIG. 3 is a perspective view of the main body. FIG. 4 is a perspective view showing the cover member of the second embodiment of the invention separated;
The figure is a perspective view showing an example of a conventional technique. 1... Printed circuit board 2... Shield case frame member 3... Cover member 4... Conductor land 5...
Electronic parts 6,6°...Top section and 4 other people Figure 2

Claims (1)

【特許請求の範囲】 １　プリント基板に設置されるシールドケース枠部材を
備え、かつ、前記シールドケース枠部材には、真空吸着
ノズルによって運搬実装させるための部分的な平面から
なる真空吸着用の天面部を有することを特徴とするシー
ルドケース。 ２　シールドケース枠部材に嵌め込まれて組立てられる
カバー部材を備えている請求項１記載のシールドケース
。 ３　真空吸着用の天面部は、シールドケース枠部材が半
田付けされて固着された後に、除去あるいは移動可能で
ある請求項１または２記載のシールドケース。[Scope of Claims] 1. A shield case frame member is provided which is installed on a printed circuit board, and the shield case frame member is provided with a vacuum suction top consisting of a partial plane for carrying and mounting with a vacuum suction nozzle. A shield case characterized by having a face part. 2. The shield case according to claim 1, further comprising a cover member that is assembled by being fitted into the shield case frame member. 3. The shield case according to claim 1 or 2, wherein the top surface portion for vacuum suction is removable or movable after the shield case frame member is soldered and fixed.
JP24113889A 1989-09-18 1989-09-18 Shield casing Pending JPH03104197A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24113889A JPH03104197A (en) 1989-09-18 1989-09-18 Shield casing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24113889A JPH03104197A (en) 1989-09-18 1989-09-18 Shield casing

Publications (1)

Publication Number Publication Date
JPH03104197A true JPH03104197A (en) 1991-05-01

Family

ID=17069842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24113889A Pending JPH03104197A (en) 1989-09-18 1989-09-18 Shield casing

Country Status (1)

Country Link
JP (1) JPH03104197A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998032315A1 (en) * 1997-01-14 1998-07-23 Telefonaktiebolaget Lm Ericsson (Publ) Shielding element and shielding method
JP2004179594A (en) * 2002-11-29 2004-06-24 Icom Inc Mounting structure of shielding member
WO2006035542A1 (en) * 2004-09-27 2006-04-06 Murata Manufacturing Co., Ltd. Shield case
JP2006344814A (en) * 2005-06-09 2006-12-21 Murata Mfg Co Ltd Frame of shield member and method of mounting shield member
WO2009078060A1 (en) * 2007-12-14 2009-06-25 Fujitsu Limited Shield case, electronic device using the same and portable information device
JP2010225770A (en) * 2009-03-23 2010-10-07 Kyocera Corp Board unit, electronic apparatus, shield, and method for manufacturing the board unit
WO2010134552A1 (en) * 2009-05-22 2010-11-25 千住金属工業株式会社 Solder-coated component, process for producing same, and method for mounting same
JP2011138919A (en) * 2009-12-28 2011-07-14 Nec Corp Suction frame member, shield frame member using the same, and method of manufacturing printed board

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998032315A1 (en) * 1997-01-14 1998-07-23 Telefonaktiebolaget Lm Ericsson (Publ) Shielding element and shielding method
JP2004179594A (en) * 2002-11-29 2004-06-24 Icom Inc Mounting structure of shielding member
WO2006035542A1 (en) * 2004-09-27 2006-04-06 Murata Manufacturing Co., Ltd. Shield case
US7746666B2 (en) 2004-09-27 2010-06-29 Murata Manufacturing Co., Ltd. Shield case
JP2006344814A (en) * 2005-06-09 2006-12-21 Murata Mfg Co Ltd Frame of shield member and method of mounting shield member
WO2009078060A1 (en) * 2007-12-14 2009-06-25 Fujitsu Limited Shield case, electronic device using the same and portable information device
JP4999934B2 (en) * 2007-12-14 2012-08-15 富士通株式会社 Shield case, electronic device using the same, and portable information device
JP2010225770A (en) * 2009-03-23 2010-10-07 Kyocera Corp Board unit, electronic apparatus, shield, and method for manufacturing the board unit
WO2010134552A1 (en) * 2009-05-22 2010-11-25 千住金属工業株式会社 Solder-coated component, process for producing same, and method for mounting same
JP2010272774A (en) * 2009-05-22 2010-12-02 Senju Metal Ind Co Ltd Solder coated component, and methods of manufacturing and mounting the same
JP2011138919A (en) * 2009-12-28 2011-07-14 Nec Corp Suction frame member, shield frame member using the same, and method of manufacturing printed board

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