JP2006344814A - Frame of shield member and method of mounting shield member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily miniaturize and thin a shield member. <P>SOLUTION: A frame 2 has an upside opening having a marginal frame wall 3 surrounding a region to be shielded, and forms a shield member with a shield cover combined with the frame 2 in the form of closing the upside opening. A vacuum pad 6 to be vacuumed to a frame carrying vacuum nozzle is disposed in the upside opening of the frame 2 such that it is supported and fixed to the marginal frame wall 3 with a beam 7. The vacuum pad 6 is disposed above the upper end of the marginal frame wall 3. In a step of mounting the shield member on the region to be shielded, the end of the beam 7 at the marginal frame wall 3 is cut off the frame wall 3 to cut the vacuum pad 6 and the beam 7 from the marginal frame wall 3, after carrying the frame 2 to the region to be shielded, utilizing the vacuum nozzle. Then the shield cover is combined with the frame 2 in the form of closing the upside opening from which the pad 6 and the beam 7 have been removed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a frame of a shield member that covers and shields a shield target region of a circuit board, and a method for attaching the shield member.

  FIG. 11A shows a schematic perspective view of an example of the shield member attached to the circuit board, and FIG. 11B schematically shows the shield member of FIG. (For example, refer to Patent Document 1). The shield member 30 includes a frame body 31 and a shield cover 32. The frame body 31 includes an edge frame wall portion 34 having a shape of an upper surface opening standing on an edge portion of the shield target region Z of the circuit board 33 and surrounding the shield target region Z, and an upper surface opening portion of the edge frame wall portion 34. And a beam portion 36 for supporting and fixing the suction pad portion 35 to the edge frame wall portion 34 by connecting the suction pad portion 35 to the edge frame wall portion 34 in the form of a cantilever beam. (36a, 36b). The shield cover 32 is combined with the frame body 31 so as to cover the frame body 31 so as to block the upper surface opening of the frame body 31.

  In the step of attaching the shield member 30 as shown in this example to the circuit board 33, first, the frame 31, the shield cover 32, and the circuit board 33 as shown in FIG. To do. Then, for example, the suction nozzle for conveying the frame body is sucked to the nozzle suction surface of the suction pad portion 35 of the frame body 31 stored in the component storage section, and the frame body 31 is taken out from the component storage section and sucked by the suction nozzle. In this state, the frame body 31 is conveyed to the shield target area Z of the circuit board 33 and the frame body 31 is arranged in the shield target area Z. Thereafter, the shield cover 32 is put on the frame body 31 so as to close the upper surface opening of the frame body 31 and combined. In this way, the shield member 30 including the frame body 31 and the shield cover 32 can be attached to the shield target region Z of the circuit board 33.

JP 2004-179594 A Japanese Patent Laid-Open No. 11-317587

  In the configuration of the frame 31 of the shield member 30 shown in FIG. 11B, as shown in the schematic cross-sectional view of FIG. It is disposed at a position lower than the upper end position of the frame wall portion 34. Therefore, the height (thickness) of the frame 31 is set so that the suction pad portion 35 and the beam portion 36 do not come into contact with the component 38 when the frame 31 is arranged in the shield target region Z of the circuit board 33. ), For example, the height of the tall component 38 disposed in the frame body 31 takes into account the lowering of the suction pad portion 35 and the beam portion 36 relative to the upper end position of the edge frame wall portion 34 of the frame body 31. It becomes a height. For this reason, in the shield member 30 using the frame 31 having the configuration of FIG. 12A, there is a problem that it is difficult to make the shield member 30 thinner.

  Further, in order to reduce the thickness of the shield member 30, as shown in FIG. 12B, the suction pad portion 35 and the beam portion 36 are prevented from coming into contact with the component 38 as shown in FIG. When the component layout of the circuit board 33 is performed so that the component 38 is disposed at a position avoiding the arrangement position, the shield target region Z is enlarged, and the shield member 30 is enlarged accordingly. There is a fear.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a shield member frame body and a shield member attachment method that can promote downsizing and thinning of the shield member. It is in.

In order to achieve the above object, the present invention has the following configuration as means for solving the above problems. That is, the frame of the shield member of the present invention is a frame having a form of an upper surface opening having an edge frame wall portion standing on the edge portion of the shield target region of the circuit board and surrounding the shield target region, The frame body is configured to form a shield member in a shield target area of the circuit board together with a shield cover combined with the frame body in a mode of closing the upper surface opening.
At the upper surface opening of the frame body, a suction pad portion having a nozzle suction surface that is sucked by a suction nozzle for conveying the frame body is formed by a beam portion that is formed to extend from a plurality of positions of the edge frame wall portion. It is arranged in a state of being supported and fixed to
The suction pad portion is disposed at a position higher than the upper end position of the edge frame wall portion.

The shield member mounting method of the present invention includes a frame body having a form of an upper surface opening having an edge frame wall portion standing on an edge portion of a shield target region of a circuit board and surrounding the shield target region, and the frame. A shield member having a shield cover combined with the frame body so as to block the upper surface opening of the body is attached to the shield target region of the circuit board, and the frame body has an upper edge position of the edge frame wall portion at the upper surface opening portion. The suction pad portion having the nozzle suction surface is disposed at a position higher than that in a state where the suction pad portion is connected to a plurality of locations on the edge frame wall portion by the beam portion,
The frame body is transported to the shield target area of the circuit board with the nozzle suction surface of the suction pad portion of the frame body being sucked by the suction nozzle for transporting the frame body, and the frame body is arranged in the shield target area of the circuit board.
After that, the end of the beam part on the edge frame wall part side is cut off from the edge frame wall part and the beam part and the suction pad part are cut off from the edge frame wall part,
Thereafter, the shield cover is combined with the frame body so as to close the upper surface opening of the frame body from which the beam portion and the suction pad portion are removed.

  According to the present invention, the frame constituting the shield member is provided with the suction pad portion supported and fixed to the edge frame wall portion by the beam portion at the upper surface opening. The arrangement position is set to be higher than the upper end position of the edge frame wall. For this reason, even if the height of the edge frame wall portion of the frame body is set as low as, for example, the height of the tallest component disposed in the shield target area of the circuit board, It is possible to avoid a situation in which the suction pad portion hits a tall component in the shield target area of the circuit board when arranged in the shield target area.

  In addition, by adopting the method for attaching the shield member in the present invention, the shield member can be thinned even if the suction pad portion is disposed at a position above the upper end position of the edge frame wall portion. That is, the suction pad portion of the frame body is for sucking the suction body to the suction nozzle to transport the frame body to the shield target area of the circuit board, and the upper surface opening of the frame body is closed by the shield cover. Therefore, in the attachment process of the shield member, after the frame body of the present invention is disposed in the shield target region of the circuit board using the suction nozzle, the suction pad portion and the beam disposed in the upper surface opening of the frame body Even if the part is removed from the frame, there is almost no hindrance to the shielding ability of the shielding member. For this reason, after being arranged in the shield target area of the circuit board, the suction pad portion and the beam portion of the frame body are cut off from the frame body, so that the height of the suction pad portion and the beam portion of the frame body is increased to the height of the shield member. The thickness of the shield member can be reduced even if the suction pad portion of the frame body is arranged at a position higher than the upper end position of the edge frame wall portion.

  Further, as described above, in the present invention, since the suction pad portion is arranged at a position above the upper end position of the edge frame wall portion, the height of the edge frame wall portion is set to the circuit board. Even if the height of the tallest component in the shield target area is as low as possible, when the frame is placed in the shield target area of the circuit board, the suction pad portion will hit the part in the shield target area. Can be avoided. For this reason, it is not necessary to lay out the components in the shield target area of the circuit board in consideration of the arrangement position of the suction pad portion, and the degree of freedom of component layout can be increased, and the mounting density of the components in the shield target area is increased. Can be easily done. Thereby, a shield object area | region can be narrowed and size reduction of a shield member can be achieved in connection with this.

  Furthermore, the beam part can be easily separated from the edge frame wall part by providing the beam part of the frame with a structure in which a part for cutting the beam part is formed. Further, in the step of arranging the shield member in the shield target area of the circuit board, for example, from the arrangement of the frame part in the shield target area of the circuit board to the suction pad part from the beam part cutting part of the beam part. The beam part is divided at the middle part of the beam, and then the part from the parting position of the beam part to the part for cutting the beam part is rocked with the part for cutting the beam part as a fulcrum, and the beam is cut at the position where the part for cutting the beam part is formed. The part is cut from the edge frame wall. By thus cutting the beam portion from the edge frame wall portion, it is possible to suppress the occurrence of burrs at the cutting position of the beam portion. If an outward burr is generated at the beam cutting position, the burr protrudes outward, which may cause a problem that the burr interferes and it is difficult to combine the shield cover with the frame. Therefore, there arises a problem that the shield cover is lifted and the height of the shield member is increased. On the other hand, since the occurrence of burrs can be suppressed as described above, the above-described problems caused by burrs can be avoided.

  Furthermore, even if a burr has occurred at the cutting position of the beam portion by providing the structure where the beam cutting portion of the beam portion is provided at a position lower than the upper end position of the edge frame wall portion, It is possible to more reliably prevent the burrs from protruding upward (outside) from the upper end position of the edge frame wall portion, and it is possible to more reliably avoid the occurrence of problems due to burrs.

  Embodiments according to the present invention will be described below with reference to the drawings.

  1A is a schematic plan view showing a shield member frame according to the first embodiment, and FIG. 1B shows the shield member frame shown in FIG. FIG. 1 (c) shows a schematic side view when viewed from the vertical direction of a), and FIG. 1 (c) shows the shield member frame of FIG. 1 (a) when viewed from the horizontal direction of FIG. 1 (a). A schematic side view of is shown.

  The frame 2 of the shield member 1 according to the first embodiment is erected on the edge of the shield target region Z of the circuit board 33 in the same manner as the frame 31 shown in FIGS. 11 (a) and 11 (b). Thus, it has a form of an upper surface opening having an edge frame wall portion 3 surrounding the shield target region Z. The frame 2 constitutes a shield member 1 together with a shield cover 4 as shown in the model diagram of FIG. Note that the frame body 2 and the shield cover 4 may each be configured by a metal plate, or may be configured such that a conductor is provided on the surface of an insulator such as a resin.

  In the first embodiment, the edge frame wall portion 3 of the frame body 2 is formed with a flange portion 5 protruding at an upper end portion thereof in an inner region surrounded by the edge frame wall portion 3. Further, a suction pad portion 6 and a beam portion 7 (7a, 7b) are disposed in the upper surface opening of the frame body 2. The beam portion 7 (7a, 7b) is formed to extend from the flange portion 5 of the edge frame wall portion 3 toward the suction pad portion 6, and is supported and fixed to the edge frame wall portion 3 in the form of a double-supported beam. ing. Further, the suction pad portion 6 has a nozzle suction surface 10 to be sucked by the suction nozzle 8 as shown in the schematic side view of FIG. For example, the suction surface 8 of the suction pad portion 6 is attracted to the suction nozzle 8, the frame body 2 is taken out from the component storage portion in which the frame body 2 is stored, and the suction pad portion 6 is attracted to the suction nozzle 8. The frame 2 can be transported to the shield target area Z of the circuit board while remaining in the state. As described above, when the frame 2 is transported by adsorbing the nozzle suction surface 10 of the suction pad portion 6 to the suction nozzle 8, the frame 2 is in a state of being suspended from the suction nozzle 8. In the first embodiment, in order to stabilize the frame body 2 during the transportation of the frame body 2, the suction pad portion 6 is positioned at substantially the center position of the upper surface opening of the frame body 2 (that is, the frame body 2. (Position of the center of gravity or a position close to the center of gravity).

  In the first embodiment, the portions other than the end portions of the suction pad portion 6 and the beam portions 7 (7a, 7b) on the edge frame wall portion side are positions above the upper end position of the edge frame wall portion 3. Is arranged.

  Further, in the first embodiment, the beam portions 7a and 7b are respectively provided at the end portions on the edge frame wall portion 3 side with the beam portion cutting portions 12 (where the rigidity of the beam portion 7 is locally weakened) ( 12a, 12b) are formed. In the example shown in FIG. 1, the beam portion cutting portion 12 (12a, 12b) is formed by locally narrowing the end portion on the edge frame wall portion 3 side of the beam portion 7 (7a, 7b). The rigidity is weakened.

  The frame 2 of the shield member according to the first embodiment is configured as described above. Next, an example of a process for attaching the shield member 1 including the frame body 2 and the shield cover 4 to the circuit board will be described. For example, first, a frame 2 having a specific configuration in the first embodiment, a shield cover 4, and a circuit board having a shield target region on which a circuit is formed by mounting components are prepared. Then, the nozzle suction surface 10 of the suction pad portion 6 of the frame body 2 is sucked by the suction nozzle 8 for transporting the frame body, the frame body 2 is lifted, and the frame body 2 is transported to the shield target area of the circuit board. To do. In addition, in order to arrange the frame body 2 in the shield target area of the circuit board with high positional accuracy, for example, a recess or a through hole is formed in the edge portion of the shield target area of the circuit board. Further, for example, a claw portion that protrudes downward from the lower end portion of the edge frame wall portion 3 of the frame body 2 and fits into the concave portion or the through hole is formed. When the frame body 2 is transported to the shield target area of the circuit board, the claw portion of the frame body 2 is fitted into the concave portion or the through hole of the edge part of the shield target area of the circuit board, thereby It can be positioned and fixed to the shield target area of the circuit board.

  After the frame body 2 is disposed in the shield target area of the circuit board, for example, on one side of the beam portions 7a and 7b, a portion in the middle from the beam portion cutting portion 12 to the suction pad portion 6 ( For example, the beam portion 7 is divided by a cutting tool such as a nipper at a portion as shown by a dotted line L in FIG.

  Thereafter, for example, as shown in the schematic cross-sectional view of FIG. 4A, the beam 7 is gripped by the hand or the gripping tool 13, and the suction pad portion 6 is removed from the beam 7 at the split position. Then, the part up to the beam part cutting part 12 is rocked with the beam part cutting part 12 as a fulcrum as shown in FIG. Then, as shown in FIG. 4 (c), the portion that has been swung in such a manner is cut out from the edge frame wall 3 at the position where the beam cut-out portion 12 is formed.

  Thereafter, as in the above, the remaining beam portion 7 is also gripped on the split position side of the beam portion 7 and rocked with the beam portion cutting portion 12 as a fulcrum as shown in FIG. Cut from the edge frame wall 3 as shown in FIG.

  In this manner, the shield cover 4 is combined with the frame body 2 so as to block the upper surface opening of the frame body 2 from which the suction pad portion 6 and the beam portion 7 are removed. Thereafter, for example, the frame body 2 and the shield cover 4 are bonded and fixed to the circuit board with a conductive bonding material such as solder.

  In this way, the shield member 1 including the frame body 2 and the shield cover 4 can be attached to the shield target area of the circuit board.

In the first embodiment, since the suction pad portion 6 of the frame body 2 is disposed above the upper end position of the edge frame wall portion 3, the shield member 1 can be reduced in thickness and size. That is, for example, as in the frame body 20 shown in the schematic cross-sectional view of FIG. 5B, the placement positions of the suction pad portion 6 and the beam portion 7 are the same as the upper end portion of the edge frame wall portion 3. If it is the position, the frame 20 is arranged so that the suction pad portion 6 and the beam portion 7 of the frame 20 do not contact the component 18 in the shield target region when the frame 20 is arranged in the shield target region of the circuit board 17. The height H ₂₀ of the body 20 is a height that takes into account the height of the gap that can ensure insulation from the suction pad portion 6 and the beam portion 7 to the height of the tall component in the shield target area. Become. 5 as (a), the a 'height H' of the frame height H ₂₀ in height shield member the thickness of the sum of the shield cover 4 1 20.

  On the other hand, even if the height of the components 18 in the shield target area of the circuit board 17 is the same by adopting the frame body 2 shown in the first embodiment and configuring the shield member 1. As shown in FIG. 5A, the height H of the shield member 1 can be made lower than the height H ′ of the shield member 1 ′ that employs the frame body 20.

This is because, in the frame body 2 shown in the first embodiment, portions other than the suction pad portion 6 and the end portion of the beam portion 7 on the edge frame wall portion 3 side are the edge frame wall portion 3. The frame 2 is shielded from the circuit board 17 even if the height of the edge frame wall 3 is approximately the same as the height of the component 18 in the shield target area. When arranged in the target region, the suction pad portion 6 and the beam portion 7 can be prevented from contacting the component 18 as shown in FIG. Moreover, although the suction pad part 6 and the beam part 7 are arrange | positioned in the position above the upper end position of the edge frame wall part 3, in this 1st Embodiment, after arrange | positioning the frame 2 in a shield object area | region. Since the suction pad portion 6 and the beam portion 7 are removed and the shield cover 4 is combined with the frame 2, the height of the shield member 1 is equal to the height H ₃ of the edge frame wall 3 of the frame 2. The height H is obtained by adding the thickness of 4. Since the height H ₃ of the edge frame wall portion 3 of the frame body 2 does not need to consider the height of the gap for ensuring insulation between the suction pad portion 6 and the beam portion 7 and the component 18, The height 20 of the edge frame wall 3 of the frame ₂₀ can be made lower. For this reason, the height H of the shield member 1 can be made lower than the height H ′ of the shield member 1 ′. That is, the shield member 1 can be thinned by adopting the characteristic structure of the frame 2 and the shield member attaching step in the first embodiment.

  Further, when the heights of the parts 18 in the shield target region are the same, if the shield members 1 and 1 ′ are made to have the same height, as shown in FIG. When the frame 20 is arranged in the shield target area of the circuit board 17, the part 18 is arranged in the shield target area while avoiding the portion that becomes the arrangement area of the suction pad portion 6 and the beam portion 7. Can be considered. By restricting the layout of the component 18 in this way, the shield target area is enlarged, and the shield member 1 ′ is enlarged accordingly. On the other hand, when the frame 2 shown in the first embodiment is employed, the components 18 in the shield target region can be obtained without worrying about the arrangement positions of the suction pad portion 6 and the beam portion 7. Layout is possible, and the degree of freedom in designing the component layout is high. For this reason, the arrangement | positioning density of components can be raised, a shield object area | region can be narrowed, and size reduction of the shield member 1 can be achieved.

  In the first embodiment, the beam cutting member 12 provided at the end of the beam 7 on the side of the edge frame wall 3 is configured such that the beam 7 is locally disposed as shown in FIG. However, if the beam cutting part 12 can be locally weakened, the beam cutting portion 12 can be reduced to the shape shown in FIG. It is not limited. For example, the beam cutting part 12 may have a form as shown in FIG. 6 or a form as shown in FIG. In other words, in the example of FIG. 6, the beam cutting part 12 is provided with a hole penetrating in the front and back direction at the end of the beam 7 on the edge frame wall 3 side to locally weaken the rigidity of the beam 7. It is made up of forms. Further, in the example of FIG. 7A, as shown in the sectional view of the aa portion (FIG. 7B), the beam cutting part 12 is located on the edge frame wall 3 side of the beam 7. Grooves (for example, V-grooves) are provided on both the front and back sides of the end portion to locally weaken the rigidity of the beam portion 7. Furthermore, the beam portion cutting portion 12 is provided with a groove (for example, a V-groove) on one side of the front surface and the back surface of the end portion of the beam portion 7 on the edge frame wall portion 3 side, and the rigidity of the beam portion 7 is locally increased. It is good also as a form weakened. Furthermore, the beam portion cutting portion 12 may have a form in which a plurality of through holes are provided to locally weaken the rigidity of the beam portion 7.

  The second embodiment will be described below. In the description of the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and duplicate descriptions of common portions are omitted.

  FIG. 8A shows a frame 2 of the shield member of the second embodiment in a schematic plan view, and FIG. 8B shows the frame 2 of FIG. FIG. 8C is a schematic cross-sectional view taken along line bb in FIG. 8B. In the second embodiment, the beam portion 7 (7a, 7b) is connected to the position of the edge frame wall portion 3 whose end portion on the edge frame wall portion 3 side is lower than the upper end position of the edge frame wall portion 3. ing. Further, the beam portion cutting portion 12 (12a, 12b) of the beam portion 7 (7a, 7b) is provided at a position lower than the upper end position of the edge frame wall portion 3.

  As shown in FIG. 8C, the beam cutting part 12 (12a, 12b) has grooves (for example, V-grooves) formed on both the front and back sides of the beam 7 so that the beam 7 is locally thinned. The beam portion 7 may have a locally weakened rigidity, or a groove is formed on one side of the front and back surfaces of the beam portion 7 so that the beam portion 7 is locally thinned. 7 may be locally weakened. Further, the beam cutting part 12 (12a, 12b) may have a configuration in which one or more through holes are provided in the beam 7 and the rigidity of the beam 7 is locally weakened as in FIG. As in FIG. 1, the beam portion 7 may be locally narrowed so that the rigidity of the beam portion 7 is locally weakened.

  In the second embodiment, a beam partial cutting site 14 is provided in a midway from the cutting site 12 to the suction pad unit 6 on one side of the beam portions 7a and 7b. The beam part cutting part 14 is for easily dividing the beam part 7 with a cutting tool such as a nipper, for example. In the example of FIG. A use site 14 is configured.

  Other configurations of the frame 2 in the second embodiment are the same as those in the first embodiment. The frame body 2 shown in the second embodiment example is arranged in the shield target area of the circuit board and shielded together with the shield cover 4 in the same process as the attachment process example of the shield member 1 shown in the first embodiment example. The member 1 can be configured to shield the shield target area.

  In the second embodiment, the beam portion cutting portion 12 of the beam portion 7 is provided at a position lower than the upper end position of the edge frame wall portion 3, so that in the attachment process of the shield member 1, the beam portion 7. After the frame 2 is cut from the edge frame wall 3 at the position where the beam portion cutting portion 12 is formed, the frame 2 has a form as shown in the plan view of FIG. 9A, and the side surface of FIG. As shown in the drawing, the cutting position 16 of the beam portion 7 in the edge frame wall 3 is lower than the upper end position of the edge frame wall 3. For this reason, even if burrs occur in the cut portion of the beam portion 7, it is possible to prevent the burrs from protruding above the upper end position of the edge frame wall portion 3. For this reason, the problem that the frame body 2 and the shield cover 4 cannot be combined well by the burr protruding upward, and the problem that the shield cover 4 is lifted can be avoided.

  In addition, this invention is not limited to the form of each 1st or 2nd embodiment, Various embodiments can be taken. For example, in each of the first and second embodiments, the suction pad portion 6 is connected to the edge frame wall portion 3 by the two beam portions 7, but for example, as shown in the model diagram of FIG. The suction pad portion 6 may be connected to the edge frame wall portion 3 by three or more beam portions 7 extending in different directions.

  Further, in each of the first and second embodiments, all the beam portions 7 are provided with the beam portion cutting portions 12 having the same form. For example, one beam portion 7 is shown in FIG. 6 is provided, and another beam part 7 is provided with a beam part cutting part 12 having the form shown in FIG. 6, so that the beam part cutting parts 12 of all the beam parts 7 are provided. May not be the same form.

  Further, in each of the first and second embodiments, the beam portion cutting portion 12 is provided at the end portion of each beam portion 7 on the edge frame wall portion 3 side. For example, the edge frame of the beam portion 7 is provided. When the end on the wall 3 side is cut using a cutting tool, the beam cutting portion 12 need not be provided. However, in this case, since burrs are likely to occur in the portion cut by the cutting tool, as shown in the second embodiment, the end of the beam portion 7 on the edge frame wall portion 3 side is the edge frame wall. It is set as the structure connected to the position lower than the upper end position of the part 3, and the edge part position by the side of the edge frame wall part 3 of the beam part 7 lower than the upper end position of the edge frame wall part 3 is cut | disconnected with a cutting tool. Is desirable.

  Furthermore, in each of the first and second exemplary embodiments, in the step of attaching the shield member to the circuit board, at a part in the middle from the beam part cutting part 12 of the at least one beam part 7 to the suction pad part 6. After the beam portion 7 is divided, the adsorption pad portion 6 and the beam portion 7 are separated from each other through a plurality of cutting processes such that the beam portion 7 is separated from the edge frame wall portion 3 at the position where the beam portion cutting portion 12 is formed. For example, the edge portion of each beam portion 7 on the edge frame wall portion 3 side is cut by using a cutting tool such as a nipper, for example, so that the suction pad portion 6 and the beam portion 7 are edged. In the case of separating from the frame wall portion 3, the beam portion 7 and the suction pad portion 6 are connected to the edge frame wall by cutting the end portion on the edge frame wall portion 3 side of the beam portion 7 without using steps. Since it can be cut out from the part 3, in such a case, multiple From the beginning without passing through the cutting process by cutting the end of the edge frame wall portion 3 side of the beam portion 7 may be cut from the edge frame wall 3.

  Furthermore, in the second embodiment, the beam portion cutting portion 14 is provided in one beam portion 7. However, for example, when the beam portion 7 is made of a material that can be easily cut by a cutting tool. The beam portion cutting part 14 may not be provided in the beam part 7. Further, in the configuration of the first embodiment, the beam portion 7 is not provided with the beam portion cutting portion 14, but in addition to the configuration of the first embodiment, at least one beam portion 7 has a beam portion. The cutting part 14 may be provided.

  Furthermore, in each of the first and second embodiments, the suction pad portion 6 has a circular shape. However, if the suction pad portion 6 has a nozzle suction surface that can be sucked by the suction nozzle 8, the shape is as follows. It is not particularly limited and may be set as appropriate.

It is a figure for demonstrating the frame of the shield member of the example of 1st Embodiment. It is a model figure showing an example of a form of a shield cover which combines with the frame of Drawing 1 and constitutes a shield member with the frame. It is a figure for demonstrating a suction pad part. It is a figure for demonstrating an example of the attachment process of a shield member. It is a figure for demonstrating the effect obtained from the structure of the frame of the shield member of 1st Embodiment. It is a figure for demonstrating another example of the form for the part for beam part cutting. It is a figure for demonstrating another example of a form of the part for beam part cutting. It is a figure for demonstrating the frame of the shield member of the example of 2nd Embodiment. It is a model figure showing the example of a form after removing a suction pad part and a beam part from the frame shown in FIG. It is a model figure for demonstrating other example embodiments. It is a figure for demonstrating one example of the shield member which shields the shield object area | region of a circuit board. It is a figure for demonstrating the problem of the shield member shown by FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Shield member 2 Frame 3 Edge frame wall part 4 Shield cover 6 Suction pad part 7 Beam part 12 Beam part cutting part

Claims (5)

A frame body having a form of an upper surface opening having an edge frame wall portion standing on an edge portion of a shield target area of a circuit board and surrounding the shield target area, and the frame body is configured to block the upper surface opening. It is configured to form a shield member in the shield target area of the circuit board together with the shield cover combined with the frame body,
At the upper surface opening of the frame body, a suction pad portion having a nozzle suction surface that is sucked by a suction nozzle for conveying the frame body is formed by a beam portion that is formed to extend from a plurality of positions of the edge frame wall portion. It is arranged in a state of being supported and fixed to
The shield member frame, wherein the suction pad portion is disposed above the upper end position of the edge frame wall portion.   The beam part that connects the suction pad part to the edge frame wall part is formed with a beam cutting part that locally weakens the rigidity of the beam part at the end on the edge frame wall side. The frame of the shield member according to claim 1, wherein   The edge of the beam on the edge frame wall side is connected to the position of the edge frame wall lower than the upper end position of the edge frame wall. 3. The shield member frame according to claim 2, wherein the portion for use is provided at a position lower than the upper end position of the edge frame wall. A frame body having a form of an upper surface opening having an edge frame wall portion standing on an edge portion of the shield target area of the circuit board and surrounding the shield target area, and in a manner of closing the upper surface opening of the frame body. A shield member having a shield cover to be combined is attached to a shield target region of a circuit board, and the frame body has a nozzle suction surface at a position above the upper end position of the edge frame wall portion in the upper surface opening. The suction pad part is arranged in a state where it is connected to a plurality of positions on the edge frame wall part by the beam part,
The frame body is transported to the shield target area of the circuit board with the nozzle suction surface of the suction pad portion of the frame body being sucked by the suction nozzle for transporting the frame body, and the frame body is arranged in the shield target area of the circuit board.
After that, the end of the beam part on the edge frame wall part side is cut off from the edge frame wall part and the beam part and the suction pad part are cut off from the edge frame wall part,
Thereafter, the shield member is combined with the frame body in such a manner as to close the upper surface opening of the frame body from which the beam portion and the suction pad portion have been removed. The suction pad portion of the frame body is connected to the edge frame wall portion by a plurality of beam portions formed to extend in different directions, and each beam portion is respectively connected to the end portion on the edge frame wall portion side, Form a beam cutting part that locally weakens the rigidity of the beam,
After transporting and arranging the frame body to the shield target area of the circuit board, the beam part is divided at a part in the middle from the beam part cutting part of the at least one beam part to the suction pad part,
After that, the part from the beam cutting position to the beam cutting part is rocked with the beam cutting part as a fulcrum, and the beam part is cut from the edge frame wall part at the position where the beam cutting part is formed. The method for attaching a shield member according to claim 4.

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