JP2010225770A - Board unit, electronic apparatus, shield, and method for manufacturing the board unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce a risk that in attaching a shield to a circuit board, a portion which is provided in the shield, and is held by a component holding part of a packaging apparatus comes into contact with an electronic component. <P>SOLUTION: A shield member 20 is attached to a circuit board 12, and is disposed around a BGA 30 mounted on the circuit board 12. The shield member 20 has a shield part 21 and a holding part 23. The holding part 23 is composed of arms 22A and 22B provided in side parts 21D and 21B constituting the shield part 21, and a supporter 22H supported by the arms 22A and 22B. The supporter 22H is disposed on the opposite side to the circuit board 12 of the shield part 21, and protrudes from the shield part 21 toward a direction apart from the BGA 30. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate unit that surrounds an electronic component fixed to a circuit board with a shield, an electronic device, a shield disposed around the electronic component, and a substrate unit that surrounds the electronic component with a shield. It relates to the manufacturing method.

  Various electric and electronic devices such as portable information devices such as cellular phones and PDAs, and personal computers include a substrate unit in which electronic components are mounted on a circuit board. In recent years, from the viewpoint of reducing the influence of electromagnetic waves radiated from an electronic component or protecting the electronic component from noise, there is a type in which a shield is provided around the electronic component fixed to a circuit board. In many cases, the board unit automatically mounts electronic components and shields on a circuit board using a mounting machine from the viewpoint of labor saving. For example, Patent Document 1 discloses a technique in which a frame body that covers a shield cover is connected by a suction portion, the connection portion is sucked by a suction nozzle of a mounting machine, the frame is transported to a circuit board, and mounted. .

JP-A-2008-28342 [0009], [0010]

  By the way, with the downsizing of the board unit, there is a demand to arrange a portion held by the component holding unit of the mounting machine, which is provided on the shield disposed around the electronic component, at a position facing the electronic component. However, when using a mounting machine, when placing the shield on the circuit board, the suction means of the mounting machine pushes the part toward the electronic part, so that the part contacts the electronic part. There is a fear. The present invention has been made in view of the above, and in attaching the shield to the circuit board, a portion provided on the shield and held by the component holding portion of the mounting machine may come into contact with the electronic component. It aims at reducing.

  In order to solve the above-described problems and achieve the object, a board unit according to the present invention is attached to a circuit board, an electronic component mounted on the circuit board, the circuit board, and the electronic component. Provided on the opposite side of the shielding portion disposed around and the attachment side of the shielding portion to the circuit board, protrudes in a direction away from the circuit board, and is movable in a direction toward the circuit board And a holding part.

  As a preferred aspect of the present invention, in the substrate unit, it is desirable that the holding portion is disposed at a central portion of the shielding portion.

  As a preferred aspect of the present invention, it is desirable that the board unit includes a lid attached to an opposite side of the shielding part to the circuit board, and the holding part comes into contact with the lid.

  As a preferred aspect of the present invention, in the substrate unit, it is desirable that the holding portion includes an arm protruding from the shielding portion and a holding body attached to the arm.

  As a preferred aspect of the present invention, in the substrate unit, it is desirable that the holding body is supported by a two-sided structure by the two arms.

  As a preferred aspect of the present invention, in the substrate unit, the holding body is preferably supported by a single arm with a cantilever structure.

  As a preferred aspect of the present invention, in the substrate unit, the arm is preferably made of an elastic body.

  As a preferred aspect of the present invention, in the board unit, it is desirable that the holding portion is disposed at a position facing the electronic component.

  In order to solve the above-described problems and achieve the object, an electronic apparatus according to the present invention includes the substrate unit.

  In order to solve the above-described problems and achieve the object, a shielding body according to the present invention is attached to a circuit board, and a shielding part arranged around an electronic component mounted on the circuit board, and the shielding And a holding portion that is provided on the opposite side of the mounting side to the circuit board and protrudes from the shielding portion in a direction away from the mounting side and the opposite side.

  In order to solve the above-described problems and achieve the object, a method for manufacturing a board unit according to the present invention includes a procedure for mounting an electronic component on a circuit board, and a circuit board disposed around the electronic component and mounted on the circuit board. The holding part of the shielding body having a shielding part to be attached and a holding part that is provided on the opposite side of the shielding part from the attachment side to the circuit board and protrudes away from the attachment side. And holding the shielding body around the electronic component, and removing the component holding means from the holding portion.

  According to the present invention, when attaching the shield to the circuit board, it is possible to reduce a possibility that a portion provided on the shield and held by the component holding portion of the mounting machine contacts the electronic component.

FIG. 1 is an overall view illustrating an example of an electronic apparatus including a substrate unit according to the present embodiment. FIG. 2 is an exploded perspective view of the structure incorporated in the operation-side casing. FIG. 3 is a plan view of the substrate unit built in the operation-side casing. FIG. 4 is a perspective view showing a shield member according to the present embodiment. FIG. 5 is a plan view of the shield member according to the present embodiment. FIG. 6 is a cross-sectional view showing a state in which the shield member according to the present embodiment is attached to the circuit board and surrounds the BGA. FIG. 7 is a view showing a state when the shield member according to the present embodiment is attached to the circuit board. FIG. 8 is a perspective view showing a conventional shield member. FIG. 9 is a diagram showing a state when a conventional shield member is attached to a circuit board. FIG. 10 is a flowchart showing the procedure of the substrate unit manufacturing method according to this embodiment. FIG. 11A is an explanatory diagram of the method for manufacturing the substrate unit according to the present embodiment. FIG. 11B is an explanatory diagram of the method for manufacturing the substrate unit according to the present embodiment. 11-3 is explanatory drawing of the manufacturing method of the board | substrate unit which concerns on this embodiment. 11-4 is explanatory drawing of the manufacturing method of the board | substrate unit which concerns on this embodiment. FIG. 11-5 is an explanatory diagram of the method for manufacturing the substrate unit according to the present embodiment. FIG. 12 is a cross-sectional view showing a state in which a lid is attached to the shield member. FIG. 13 is a cross-sectional view showing a state where a lid is attached to the shield member. FIG. 14 is a plan view showing a shield member according to a first modification of the present embodiment. FIG. 15 is a plan view showing a shield member according to a second modification of the present embodiment. FIG. 16 is a cross-sectional view showing a shield member according to a second modification of the present embodiment. FIG. 17 is a plan view showing a shield member according to a third modification of the present embodiment.

  Hereinafter, the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited by the form (henceforth embodiment) for implementing the following invention. In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. In the following, a mobile phone will be described as an example of an electronic device. However, the application target of the present invention is not limited to a mobile phone. For example, PHS (Personal Handy Phone System), PDA (Personal Digital Assistant), portable The present invention can also be applied to navigation devices, notebook computers, game machines, and the like. In addition, although the electronic component mounted on the circuit board will be described using BGA as an example, the application target of the present invention is not limited to BGA.

  FIG. 1 is an overall view illustrating an example of an electronic apparatus including a substrate unit according to the present embodiment. The mobile phone 1 that is an electronic device is a foldable mobile phone in which a housing 1C is configured to be openable and closable by a display-side housing 1CA and an operation-side housing 1CB. A display 2M is provided in the display-side casing 1CA. The display 2M displays a standby image when the mobile phone 1 is waiting for reception, or displays a menu image used to assist the operation of the mobile phone 1.

  The display-side casing 1CA is provided with a speaker 6 that emits sound when the mobile phone 1 is talking. The operation-side casing 1CB is provided with a plurality of operation keys 3 for inputting a telephone number of a call partner and characters when creating a mail. Further, selection and determination of a menu displayed on the display 2M and a screen A direction and determination key 4 for easily executing scrolling and the like is provided. An antenna is provided inside the operation-side casing 1CB, and is used for transmission / reception between the mobile phone 1 and the base station. The operation key 3 and the direction / decision key 4 constitute an operation unit of the mobile phone 1. In addition, the operation-side casing 1CB is provided with a microphone 5 that receives sound when the mobile phone 1 is talking.

  The display-side housing 1CA and the operation-side housing 1CB are connected by a hinge mechanism 9. Thus, the display-side housing 1CA and the operation-side housing 1CB are configured to be rotatable about the hinge mechanism 9 in a direction away from each other and a direction approaching each other. The mobile phone 1 opens when the display-side housing 1CA and the operation-side housing 1CB are rotated away from each other, and the mobile phone 1 when the display-side housing 1CA and the operation-side housing 1CB are rotated in directions approaching each other. Closes.

  FIG. 2 is an exploded perspective view of the structure incorporated in the operation-side casing. A circuit board on which electronic components are mounted is disposed inside the display-side housing 1CA and the operation-side housing 1CB. As shown in FIG. 2, the operation side housing 1 </ b> CB includes a key sheet 10, a flexible printed circuit board 11, a reference potential pattern layer, and a mobile phone that constitute the operation keys 3, directions, and determination keys 4 described above. And a circuit board 12 including various electronic components including a radio frequency (RF) module. The key sheet 10, the flexible printed circuit board 11, and the circuit board 12 described above are stacked and disposed inside the operation-side casing 1 </ b> CB. A circuit board for the display 2M is also arranged in the display-side casing 1CA.

  FIG. 3 is a plan view of the substrate unit built in the operation-side casing. As shown in FIG. 3, the board unit 100 includes a circuit board 12, a BGA (Ball Grid Array) 30 that is an electronic component, and a shield member 20 that is a shield. A BGA 30 is mounted on the circuit board 12. A shield member 20 is disposed around the BGA 30. The shield member 20 is attached to the circuit board 12. The shield member 20 is provided to prevent the electromagnetic waves emitted from the BGA 30 from leaking and to protect the BGA 30 from electromagnetic waves such as high-frequency noise. In FIG. 3, the shield member 20 is opened. However, when the circuit board 12 is disposed in the operation-side housing 1 CB, the shield member 20 is disposed around the BGA 30 and then the opening of the shield member 20. A lid is attached to. Next, the shield member 20 will be described.

  FIG. 4 is a perspective view showing a shield member according to the present embodiment. FIG. 5 is a plan view of the shield member according to the present embodiment. FIG. 6 is a cross-sectional view showing a state in which the shield member according to the present embodiment is attached to the circuit board and surrounds the BGA. FIG. 7 is a view showing a state when the shield member according to the present embodiment is attached to the circuit board. FIG. 8 is a perspective view showing a conventional shield member. FIG. 9 is a diagram showing a state when a conventional shield member is attached to a circuit board.

  The shield member 20 is made of a conductive material (for example, a metal, such as aluminum or an alloy thereof, or copper or an alloy thereof). The shield member 20 is attached to the circuit board 12 and is electrically connected to the ground of the circuit board 12. The shield member 20 is made of a sheet metal such as aluminum or copper, and is manufactured, for example, by bending or deep drawing. As shown in FIGS. 4 and 5, the shape of the shield member 20 is a member having a rectangular shape in plan view, which is configured by combining four plate-like side portions 21A, 21B, 21C, and 21D.

  The shield member 20 includes a shielding part 21 and a holding part 23. The shielding part 21 is configured by combining the plate surfaces of the four side parts 21A, 21B, 21C, and 21D at right angles to each other. The shielding part 21 is arranged around the BGA 30 attached to the circuit board 12 via the solder balls 31. The shielding portion 21 is formed into a cylindrical shape by combining the four side portions 21A, 21B, 21C, and 21D, and one end portion 24B is in contact with the circuit substrate 12, and for example, the circuit substrate 12 by soldering or the like. Fixed to. The other end 24T is located on the side opposite to the side attached to the circuit board 12.

  One end 24B is on the circuit board 12 mounting side (circuit board side) of the shielding part 21, and the other end 24T is on the side opposite to the circuit board 12 mounting side of the shielding part 21 (on the opposite circuit board side). Become. In addition, the shielding part 21 has an opening (circuit board side opening) 21OB and an opening (counter circuit board side opening) 21OT at both the one end 24B and the other end 24T. When the shield member 20 is disposed around the BGA 30 and attached to the circuit board 12, the BGA 30 passes through the circuit board side opening 21OB. Further, an underfill agent is applied between the BGA 30 and the circuit board 12 from the counter circuit board side opening 21OT, or the BGA 30 is inspected through the counter circuit board side opening 21OT.

  The holding part 23 is provided on the side opposite to the side where the shielding part 21 is attached to the circuit board 12, that is, on the side opposite to the circuit part of the shielding part 21. The holding portion 23 is configured to protrude in a direction away from the circuit board 12 and to be movable in a direction toward the circuit board 12. That is, the holding part 23 protrudes in a direction away from the attachment side of the shielding part 21 to the circuit board 12 and the opposite side. The holding portion 23 is a portion that is provided on the shield member 20 and is held by a component holding portion of a mounting machine that mounts electronic components or the like on the circuit board 12 when the shield member 20 is mounted on the circuit board 12. .

  In the present embodiment, the holding unit 23 includes arms 22A and 22B protruding from the shielding unit 21 and a holding body 22H attached to the arms 22A and 22B. The arm 22 </ b> A is attached to the side part 21 </ b> D of the shielding part 21, and the arm 22 </ b> B is attached to the side part 21 </ b> B of the shielding part 21. In the present embodiment, the arm 22A, the side portion 21D, the arm 22B, and the side portion 21B are integrally configured. The arm 22A and the side portion 21D may be prepared as separate members, and the arm 22B and the side portion 21B may be prepared as separate members, and both may be joined by joining means such as welding. The arm 22A projects from the side portion 21D toward the inside of the shielding portion 21 in plan view, and the arm 22B projects from the side portion 21B toward the inside of the shielding portion 21 in plan view.

  The holding body 22H is disposed between the arm 22A and the arm 22B. The holding body 22H is attached to the shielding part 21 via the arms 22A and 22B. Therefore, the shielding part 21 can be moved by holding and moving the holding body 22H. The holding body 22H has a flat plate shape, and is held by the component holding means of the mounting machine when the shield member 20 is attached to the circuit board 12. As the component holding means, for example, there is a suction nozzle 50 (see FIG. 7) that uses a negative pressure to suck a holding target (the holding body 22H in this embodiment). The suction nozzle 50 is connected to, for example, a suction pump or a vacuum pump that is a negative pressure generating unit, and sucks the holding body 22H of the holding unit 23. When the mounting machine moves the suction nozzle 50 to the circuit board 12 while the suction nozzle 50 sucks the holding body 22H, the shield member 20 can be moved to the circuit board 12.

  In the present embodiment, the holding body 22H is supported by the shielding portion 21 in a double-supported structure with two arms 22A and 22B. As a result, the balance between the two sides of the holding body 22H is improved, so that the shield member 20 is stabilized when the shield member 20 is attracted and moved by the mounting machine. Moreover, in this embodiment, the holding | maintenance part 23 is arrange | positioned in the center part of the shielding part 21, ie, the longitudinal direction center part of the side parts 21B and 21D, and the longitudinal direction center part of the side parts 21A and 21C. Specifically, when the longitudinal dimension of the side portions 21B and 21D is L, the holding body 22H of the holding portion 23 is positioned at L / 2 from the side portions 21A and 21C, and from the side portions 21B and 21D, respectively. It arrange | positions in the position of W / 2. This improves the balance of both sides of the holding body 22H even in the direction orthogonal to the arms 22A and 22B of the holding portion 23. Therefore, when the shield member 20 is attracted and moved by the suction nozzle 50 of the mounting machine, The shield member 20 is stabilized.

  As shown in FIG. 6, the holding body 22 </ b> H constituting the holding portion 23 protrudes in a direction away from the circuit board 12. That is, the holding body 22H protrudes in a direction away from the attachment side of the shielding portion 21 to the circuit board 12 and the opposite side thereof (the circuit board attachment side and the counter circuit attachment side and the end portions 24B and 24T). In the present embodiment, the distance between the holding body 22H and the end 24T, that is, the distance between the holding body 22H and the opening surface of the counter-circuit board side opening 21OT shown in FIG. 4 is Δh.

  The arms 22A and 22B that support the holding body 22H are made of an elastic body. In the present embodiment, the arms 22 </ b> A and 22 </ b> B are configured integrally with the shielding part 21. In the present embodiment, the shielding part 21 and the arms 22A and 22B are made of a metal material such as aluminum or an alloy thereof. Such a metal material is an elastic material having conductivity. As described above, by configuring the arms 22A and 22B with an elastic body, the holding portion 23, more specifically, the holding body 22H is configured to be movable toward the circuit board 12, that is, toward the circuit board mounting side. The

  When the shield member 20 is attached to the circuit board 12 using the mounting machine, the suction nozzle 50 of the mounting machine presses the holding portion 23 toward the circuit board 12 as shown in FIG. In the conventional shield member 120 shown in FIG. 8, the end 24T, the arms 122A and 122B, and the holding body 122H are formed on the same plane. Therefore, as shown in FIG. 9, when the shield member 120 is attached to the circuit board 112, the arms 122A and 122B are bent and the holding body 122H moves toward the circuit board 112, and the BGA 130 and the holding body 122H are moved. There was a risk of contact.

  In the present embodiment, the holding body 22H protrudes from the end portion 24T toward the outside of the shielding portion 21. With this configuration, when the shield member 20 is attached to the circuit board 12, the suction nozzle 50 of the mounting machine presses the holding body 22H toward the BGA 30 (in the direction indicated by the arrow G in FIG. 7) to form the holding portion 23. Even if the arms 22A and 22B to be bent are bent, a gap is formed between the holding body 22H and the BGA 30. Thereby, the possibility that the holding body 22H comes into contact with the BGA 30 can be reduced. As a result, the BGA 30 can be arranged at a position facing the holding part 23, or the BGA 30 having a large dimension in the direction orthogonal to the circuit board 12 can be arranged at a position facing the holding part 23. The dimensions and the degree of freedom of arrangement of the BGA 30 arranged inside can be improved, and the mounting density can be improved. Moreover, since the possibility that the holding body 22H comes into contact with the BGA 30 can be reduced, mounting defects of the BGA 30 can also be reduced.

  When the dimension of the shield member is small, it is possible to improve the strength of the holding portion by reducing the bending of the holding portion by arranging the holding portion at the corner of the shield member. However, when the size of the shield member is increased, in such a structure, there is a possibility that the balance when the holding unit is attracted by the mounting machine and the shield member is lifted is poor and the shield member cannot be stably conveyed. Therefore, when the dimension of a shield member is large, it is necessary to arrange | position a holding | maintenance part (especially holding body) in the center part of a shield member. If the holding portion is disposed in the central portion of the shield member, it is difficult to improve the strength of the holding portion, and the bending of the holding portion may not be sufficiently suppressed.

  When attaching the shield member 20 to the circuit board 12 by projecting the holding body 22H constituting the holding portion 23 of the shield member 20 from the end portion 24T toward the outside of the shielding portion 21 as in the present embodiment. Even if the holding part 23 bends, the possibility that the holding body 22H contacts the BGA 30 can be reduced. As a result, when the shield member 20 is attached to the circuit board 12, the shield member 20 can be stably conveyed.

  The amount of protrusion Δh of the holding body 22H of the holding portion 23 is the amount of deflection of the holding portion 23 (the amount of movement of the holding body 22H) Y when the suction nozzle 50 of the mounting machine presses the holding body 22H toward the circuit board 12 side. And the distance between the BGA 30 and the end 24T, that is, the distance t between the BGA 30 and the opening surface of the counter circuit board side opening 21OT shown in FIG. That is, Y <Δh + t. Since the deflection amount Y is about 0.5 mm to 0.6 mm, it is preferable to provide the protrusion amount Δh of about 1 mm in consideration of safety. Next, a method for manufacturing the substrate unit according to the present embodiment will be described.

  FIG. 10 is a flowchart showing the procedure of the substrate unit manufacturing method according to this embodiment. 11-1 to 11-5 are explanatory diagrams of the method for manufacturing the substrate unit according to the present embodiment. In manufacturing the board unit 100 shown in FIG. 3, the electronic component (BGA 30) is placed at a predetermined position on the circuit board 12 in step ST <b> 101. The BGA 30 is automatically arranged on the circuit board 12 by a mounting machine, for example.

  Next, it progresses to step ST102 and the shielding member 20 is arrange | positioned around the BGA30. As illustrated in FIG. 11A, the shield member 20 is disposed around the BGA 30 after the holding body 22 </ b> H is adsorbed by the suction nozzle 50 of the mounting machine and conveyed to the position where the BGA 30 is disposed. When the shield member 20 is disposed on the circuit board 12, the suction by the suction nozzle 50 is released, and the suction nozzle 50 is removed from the holding body 22 </ b> H of the holding unit 23.

  Then, it progresses to step ST103 and the circuit board 12 is heat-processed. Solder is previously deposited on the circuit board side of the shield member 20, and a solder ball 31 is provided between the BGA 30 and the circuit board 12. For this reason, the solder on the circuit board side of the shield member 20 and the solder balls 31 are melted by the heat treatment in step ST103, and the shield member 20 and the BGA 30 are fixed to the circuit board 12. At the same time, the shield member 20 is electrically connected to the ground of the circuit board 12, and the terminal of the BGA 30 and the terminal of the circuit board 12 are electrically connected.

  Then, it progresses to step ST104 and the test | inspection of BGA30 and the shield member 20 is performed. If the result of the inspection is normal, the process proceeds to step ST105. In step ST105, as shown in FIG. 11B, for example, the syringe 51 is inserted from the counter circuit board side opening 21OT of the shield member 20, and the underfill agent 40 as a fixing agent is applied to a part around the BGA 30. Is done. Thus, the underfill agent 40 is put between the BGA 30 and the circuit board 12, that is, at the bottom side of the BGA 30. The underfill agent 40 is a sealing resin, and usually a one-component curable epoxy resin is used. The underfill agent 40 has fluidity before curing.

  When the underfill agent 40 has spread between the BGA 30 and the circuit board 12, the process proceeds to step ST106, where the underfill agent 40 is cured. When the underfill agent 40 is cured between the circuit board 12 and the BGA 30, the BGA 30 is fixed to the circuit board 12 to be in a state as shown in FIG. The underfill agent 40 improves the mounting strength of the BGA 30 and improves the connection reliability between the BGA 30 and the circuit board 12. Since the underfill agent 40 has thermosetting properties, the underfill agent 40 is cured by heating.

  When the underfill agent 40 is cured, the process proceeds to step ST10. In step ST107, the lid 25 is attached to the end 24T of the shield member 20 as shown in FIG. 11-4. As a result, the counter-circuit board side opening 21OT of the shield member 20 is closed, and the board unit 100 is completed as shown in FIG. 11-5 (step ST108). Here, the lid 25 may be attached to the shield member 20 using a mounting machine, or may be attached by an inspector. Moreover, the lid | cover 25 is an electroconductive material and is comprised with the same material as the shield member 20, for example.

  FIG. 12 is a cross-sectional view showing a state in which a lid is attached to the shield member. FIG. 13 is a cross-sectional view showing a state where a lid is attached to the shield member. When the lid 25 is attached to the shield member 20, the lid 25 is put on the shield member 20 as shown in FIG. 12. Then, the holding body 22 </ b> H of the holding portion 23 provided on the shield member 20 comes into contact with the lid 25. In the state shown in FIG. 12, the lid 25 is in a state of floating from the shield member 20, so the lid 25 is further pushed into the circuit board 12 side. Then, as shown in FIG. 13, the convex portions 25T provided on the side portions of the lid 25 are fitted into the concave portions 23U provided on the side portions 21B and 21D of the shield member 20, and the lid 25 is fixed to the shield member 20. The

  As described above, the arms 22A and 22B that support the holding body 22H of the holding portion 23 are formed of an elastic body, and the holding body 22H faces the outside of the shielding portion 21 when the lid 25 is not attached. Protruding. For this reason, when the lid 25 is attached to the shield member 20, the holding body 22H moves toward the BGA 30, and the holding body 22H is pressed against the lid 25 by the arms 22A and 22B. In the present embodiment, the holding portion 23 and the shielding portion 21 have an integral structure, both are made of a conductive material, and the lid 25 is conductive. Therefore, when the lid 25 is attached to the shield member 20, the lid 25 and the shield member 20 are electrically connected via the holding body 22H of the holding portion 23 and the arms 22A and 22B.

  Thereby, since the continuity between the shield member 20 and the lid 25 can be easily obtained, the shielding performance of the shield member 20 can be improved. In addition, since the holding body 22H is pressed against the lid 25 by the arms 22A and 22B made of an elastic body, conduction between the two can be obtained stably. In particular, since the mobile phone 1 is carried by the user, the mobile phone 1 is susceptible to vibrations and shocks. However, according to the structure in which the shield member 20 and the lid 25 are electrically connected via the holding portion 23, the mobile phone 1 is stably and reliably shielded. Since conduction between the member 20 and the lid 25 is obtained, it is preferable.

  FIG. 14 is a plan view showing a shield member according to a first modification of the present embodiment. The shield member 20a according to the present modification has substantially the same configuration as the shield member 20 described above, except that the holding portion 23a is shifted from the central portion of the shield portion 21a. Other configurations of the shield member 20a are the same as those of the shield member 20 described above.

  The holding part 23a is arranged to be shifted from the central part of the shielding part 21a, that is, the central part in the longitudinal direction of the side parts 21Ba and 21Da and the central part in the longitudinal direction of the side parts 21Aa and 21Ca. Specifically, when the length in the longitudinal direction of the side portions 21Ba and 21Da is L, the holding bodies 22Ha of the holding portion 23a are arranged at positions L2 from the side portion 21A and L1 from the side portions 21C, respectively. For example, the holding unit may not be arranged at the center of the shielding unit due to the relationship between the position of the circuit board on which the shield member 20a is arranged and the operating range of the mounting machine. In such a case, as in the present modification, the holding portion 23a may be shifted from the central portion of the shielding portion 21a.

  FIG. 15 is a plan view showing a shield member according to a second modification of the present embodiment. FIG. 16 is a cross-sectional view showing a shield member according to a second modification of the present embodiment. The shield member 20b according to this modification has substantially the same configuration as the shield member 20 described above, except that a holding body 22Hb constituting the holding portion 23b is provided on the shielding portion 21b by a single arm 22b. Other configurations of the shield member 20b are the same as those of the shield member 20 described above.

  The arm 22b constituting the holding portion 23b is formed integrally with the side portion 21Db from the end portion 24Tb of the side portion 21Db. A holding body 22Hb is provided on the side opposite to the end 24Tb of the arm 22b. Thus, in the shield member 20b, the holding body 22Hb of the holding portion 23 is supported in a cantilever structure by the one arm 22b, and the holding body 22Hb becomes a free end of the holding portion 23. With such a structure, the holding body 22H can be reliably pressed against the lid 25 shown in FIGS. 12 and 13 by effectively utilizing the elasticity of the arm 22b formed of an elastic body. As a result, the continuity between the shield member 20b and the lid 25 can be obtained more reliably, and the shielding performance of the shield member 20b can be more reliably exhibited.

  FIG. 17 is a plan view showing a shield member according to a third modification of the present embodiment. The shield member 20c according to this modification is substantially the same as the shield member 20 described above in that the holding body 22Hc constituting the holding portion 23c is supported by the two arms 22Ac and Bc. , Bc is different in that it is provided on the holding body 22H so as to cross each other. Other configurations of the shield member 20c are the same as those of the shield member 20 described above.

  The arm 22Ac constituting the holding portion 23c is integrally formed with the side portion 21Db from the end portion 24Tc of the side portion 21Db, and the arm 22Bc is formed from the end portion 24Tc of the side portion 21Ac where the side surface 21Dc and the plate surface are orthogonal to each other. It is formed integrally with the portion 21Ac. The holding body 22H is supported by the arms 22Ac and 22Bc. Since the side surfaces 21Dc and the side portions 21Ac are orthogonal to each other, the arms 22Ac and the arms 22Bc are also orthogonal to each other. With such a configuration, the opening area of the second counter circuit board side opening 21OT2 can be larger than that of the first counter circuit board side opening 21OT1 of the shield member 20c. For this reason, for example, when a large opening is required in the shield member due to restrictions on the equipment to which the underfill agent 40 is applied, the structure according to the modified example 2 is advantageous. Further, the present modification has an advantage that when the dimension of the shield member 20c is reduced, it is easy to secure an opening area of a portion where the underfill agent 40 is applied.

  As described above, the substrate unit, the electronic device, the shielding body, and the manufacturing method of the substrate unit according to the present invention include a holding unit that holds the shielding body by the mounting machine, and the holding unit when the shielding body is attached. This is useful for reducing the risk of contact with electronic components.

DESCRIPTION OF SYMBOLS 1 Mobile phone 12 Circuit board 20, 20a, 20b, 20c Shield member 21, 21a, 21b Shield part 21A, 21B, 21C, 21D, 21Aa, 21Ba, 21Db, 21Ac Side part 22H, 22Ha, 22Hb, 22Hc Holder 22A, 22B, 22b, 22Ac, 22Bc Arm 23, 23a, 23b, 23c Holding portion 24B, 24T, 24Tb, 24Tc End portion 25 Lid 31 Solder ball 40 Underfill agent 50 Suction nozzle 51 Syringe 100 Substrate unit

Claims (11)

A circuit board;
Electronic components mounted on the circuit board;
A shielding portion attached to the circuit board and disposed around the electronic component;
A holding part that is provided on the opposite side of the shielding part to the circuit board and protrudes in a direction away from the circuit board and is movable in the direction toward the circuit board;
A board unit comprising:   The circuit board according to claim 1, wherein the holding portion is disposed at a central portion of the shielding portion.   The board unit according to claim 1, further comprising a lid attached to an opposite side of the shielding part to the circuit board, wherein the holding part is in contact with the lid.   The substrate unit according to any one of claims 1 to 3, wherein the holding unit includes an arm projecting from the shielding unit and a holding body attached to the arm.   The substrate unit according to claim 4, wherein the holding body is supported by a two-sided structure by the two arms.   The substrate unit according to claim 4, wherein the holding body is supported in a cantilever structure by one arm.   The board unit according to claim 4, wherein the arm is made of an elastic body.   The substrate unit according to claim 1, wherein the holding unit is disposed at a position facing the electronic component.   An electronic apparatus comprising the substrate unit according to claim 1. A shielding part that is attached to the circuit board and arranged around the electronic component mounted on the circuit board;
A holding portion that is provided on the opposite side of the shielding portion to the circuit board and protrudes from the shielding portion in a direction away from the attachment side and the opposite side;
A shield characterized by comprising. A procedure for mounting electronic components on a circuit board;
A shield disposed around the electronic component and attached to the circuit board, and a holding provided on the side opposite to the side of the shield to be attached to the circuit board and projecting away from the attachment side A procedure for holding the holding portion of the shield having a portion by a component holding means;
Placing the shield around the electronic component;
Removing the component holding means from the holding portion;
A method for manufacturing a substrate unit, comprising:

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