JP2010272747A - Substrate unit and electronic equipment, and metal component for circuit board - Google Patents

Substrate unit and electronic equipment, and metal component for circuit board Download PDF

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JP2010272747A
JP2010272747A JP2009124399A JP2009124399A JP2010272747A JP 2010272747 A JP2010272747 A JP 2010272747A JP 2009124399 A JP2009124399 A JP 2009124399A JP 2009124399 A JP2009124399 A JP 2009124399A JP 2010272747 A JP2010272747 A JP 2010272747A
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circuit board
shield member
attached
held
hole
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Junichi Kondo
淳一 近藤
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Kyocera Corp
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Kyocera Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate unit capable of efficiently using a component mounting surface of a circuit board. <P>SOLUTION: A shield member 20 is constituted including a shield portion 21 and a metal member holder 23. The shield portion 21 is constituted by combining six side portions 21A to 21F. The holder 23 is arranged on a fitting side of the circuit board of the shield member 20. The holder 23 has a fitting portion 23F and a held portion 23H. The held portion 23H is in a flat plate shape, being a portion held by a component holding means of a mounting machine when the shield member 20 is fitted to the circuit board. The fitting portion 23F is used to fit the shield member 20 to the circuit board. The fitting portion 23F and held portion 23H constituting the holder 23 are integrally made of the same member, and the held portion 23H and fitting portion 23F are formed at the same position. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、回路基板に取り付けられた電子部品の周りに設けられる遮蔽体や回路基板を補強するための補強材を備える基板ユニット、及びこの基板ユニットを備える電子機器、並びに回路基板用金属部品に関する。   The present invention relates to a board unit including a shield provided around an electronic component attached to a circuit board and a reinforcing material for reinforcing the circuit board, an electronic device including the board unit, and a metal part for a circuit board. .

携帯電話機やＰＤＡ等の携帯情報装置やパーソナルコンピュータといった各種の電気、電子機器は、回路基板に電子部品を実装した基板ユニットを備える。近年においては、電子部品から放射される電磁波の影響を低減したり、電子部品をノイズから保護したりする観点から、回路基板に固定した電子部品の周りに金属製の遮蔽体を設けるものがある。   Various electric and electronic devices such as portable information devices such as cellular phones and PDAs, and personal computers include a substrate unit in which electronic components are mounted on a circuit board. In recent years, in order to reduce the influence of electromagnetic waves radiated from electronic components or to protect electronic components from noise, there are some which provide a metal shield around the electronic components fixed to the circuit board. .

また、回路基板を補強するため、金属製の補強部品を回路基板に取り付ける場合もある。基板ユニットは、省力化の観点から、実装機を用いて遮蔽体や補強部品等の金属部材や電子部品を自動的に回路基板上に実装されることが多い。例えば、特許文献１には、シールド蓋を被せる枠体を吸着部で連結し、この吸着部を実装機の吸着ノズルに吸着させて回路基板に枠を搬送し、実装する技術が開示されている。   Moreover, in order to reinforce a circuit board, metal reinforcement parts may be attached to a circuit board. In many cases, from the viewpoint of labor saving, a board unit often automatically mounts a metal member such as a shield or a reinforcing part or an electronic component on a circuit board using a mounting machine. For example, Patent Document 1 discloses a technique in which a frame body that covers a shield lid is connected by a suction portion, the suction portion is sucked by a suction nozzle of a mounting machine, the frame is transported to a circuit board, and mounted. .

特開２００８−２８３４２号公報［０００９］、［００１０］JP-A-2008-28342 [0009], [0010]

近年は、基板ユニットの小型化が進んできており、回路基板の電子部品を実装する面（部品実装面）をできる限り効率的に利用する必要がある。遮蔽体や補強部品等の金属部材には、実装機の部品保持部に保持される部分（被保持部、特許文献１の吸着部に相当）が設けられるが、この被保持部と対向する部分にも電子部品を実装したいという要請がある。しかし、基板ユニットが完成した後に検査をする場合、被保持部と対向する部分の電子部品は、被保持部に隠されてしまうため検査がしにくくなるという問題がある。本発明は、上記に鑑みてなされたものであって、回路基板の部品実装面を効率的に利用することを目的とする。   In recent years, miniaturization of board units has progressed, and it is necessary to utilize the surface (component mounting surface) for mounting electronic components on a circuit board as efficiently as possible. A metal member such as a shield or a reinforcing component is provided with a portion (held portion, corresponding to the suction portion of Patent Document 1) that is held by a component holding portion of the mounting machine. There is also a demand for mounting electronic components. However, when the inspection is performed after the substrate unit is completed, there is a problem in that it is difficult to perform the inspection because the electronic component of the portion facing the held portion is hidden by the held portion. The present invention has been made in view of the above, and an object thereof is to efficiently use a component mounting surface of a circuit board.

上述した課題を解決し、目的を達成するために、本発明に係る基板ユニットは、回路基板と、当該回路基板に取り付けられる金属部材と、前記回路基板の部品実装面に取り付けられる取付部、及び当該取付部と一体に形成され、かつ前記回路基板へ前記金属部材を搭載する際に保持される被保持部を有し、前記金属部材に設けられる金属部材保持体と、を含むことを特徴とする。   In order to solve the above-described problems and achieve the object, a board unit according to the present invention includes a circuit board, a metal member attached to the circuit board, an attachment portion attached to a component mounting surface of the circuit board, and A metal member holding body that is formed integrally with the mounting portion and has a held portion that is held when the metal member is mounted on the circuit board, and is provided on the metal member. To do.

本発明の好ましい態様としては、前記取付部には孔が形成され、当該孔には、前記取付部又は前記回路基板を、前記取付部又は前記回路基板の締結対象と締結する締結手段が貫通することが望ましい。   As a preferred aspect of the present invention, a hole is formed in the attachment portion, and a fastening means for fastening the attachment portion or the circuit board to a fastening object of the attachment portion or the circuit board passes through the hole. It is desirable.

本発明の好ましい態様としては、前記取付部には孔が形成され、前記金属部材を前記回路基板に取り付ける前における前記孔には、熱によって溶解するシートが貼り付けられていることが望ましい。   As a preferred aspect of the present invention, it is desirable that a hole is formed in the attachment portion, and a sheet that is melted by heat is attached to the hole before the metal member is attached to the circuit board.

本発明の好ましい態様としては、前記取付部には孔が形成され、前記金属部材を前記回路基板に取り付ける前における前記孔には、ゆるみ止め剤の膜が設けられることが望ましい。   As a preferred aspect of the present invention, it is desirable that a hole is formed in the attachment portion, and a film of a locking agent is provided in the hole before the metal member is attached to the circuit board.

本発明の好ましい態様としては、前記取付部は、前記回路基板の前記部品実装面に形成される金属導電体に接触するとともに、前記取付部と前記金属導電体とは、半田によって接合されることが望ましい。   As a preferred aspect of the present invention, the attachment portion contacts a metal conductor formed on the component mounting surface of the circuit board, and the attachment portion and the metal conductor are joined by solder. Is desirable.

上述した課題を解決し、目的を達成するために、本発明に係る電子機器は、前記基板ユニットを備えることを特徴とする。   In order to solve the above-described problems and achieve the object, an electronic apparatus according to the present invention includes the substrate unit.

上述した課題を解決し、目的を達成するために、本発明に係る回路基板用金属部品は、回路基板に取り付けられる金属部材と、前記回路基板の部品実装面に取り付けられる取付部、及び当該取付部と一体に形成され、かつ前記回路基板へ前記金属部材を搭載する際に保持される被保持部を有し、前記金属部材に設けられる金属部材保持体と、を含むことを特徴とする。   In order to solve the above-described problems and achieve the object, a metal component for a circuit board according to the present invention includes a metal member attached to the circuit board, an attachment portion attached to the component mounting surface of the circuit board, and the attachment And a holding member that is held when the metal member is mounted on the circuit board, and includes a metal member holding body provided on the metal member.

本発明は、回路基板の部品実装面を効率的に利用できる。   The present invention can efficiently use the component mounting surface of the circuit board.

図１は、本実施形態に係る基板ユニットを備える電子機器の一例を示す全体図である。FIG. 1 is an overall view illustrating an example of an electronic apparatus including a substrate unit according to the present embodiment. 図２は、操作側筐体に内蔵される基板ユニットの分解斜視図である。FIG. 2 is an exploded perspective view of the substrate unit built in the operation-side casing. 図３は、操作側筐体に内蔵される基板ユニットの平面図である。FIG. 3 is a plan view of the substrate unit built in the operation-side casing. 図４−１は、本実施形態に係るシールド部材を示す平面図である。FIG. 4A is a plan view of the shield member according to the present embodiment. 図４−２は、本実施形態に係るシールド部材を示す斜視図である。FIG. 4B is a perspective view of the shield member according to the present embodiment. 図４−３は、本実施形態に係るシールド部材の側面図である。FIG. 4-3 is a side view of the shield member according to the present embodiment. 図５−１は、図４−１の矢印Ａ方向からシールド部材を見た図である。FIG. 5A is a diagram of the shield member viewed from the direction of arrow A in FIG. 図５−２は、図４−１の矢印Ｂ方向からシールド部材を見た図である。FIG. 5-2 is a view of the shield member viewed from the direction of arrow B in FIG. 4-1. 図６−１は、本実施形態に係るシールド部材を回路基板に取り付けた例を示す側面図である。FIG. 6A is a side view illustrating an example in which the shield member according to the present embodiment is attached to the circuit board. 図６−２は、本実施形態に係るシールド部材を回路基板に取り付けた他の例を示す側面図である。FIG. 6B is a side view illustrating another example in which the shield member according to the present embodiment is attached to the circuit board. 図６−３は、本実施形態に係るシールド部材を回路基板に取り付けた他の例を示す側面図である。FIG. 6-3 is a side view showing another example in which the shield member according to the present embodiment is attached to the circuit board. 図７は、本実施形態に係るシールド部材が備える保持体にシートを貼り付けた状態を示す図である。FIG. 7 is a diagram illustrating a state where a sheet is attached to a holding body included in the shield member according to the present embodiment. 図８−１は、シールド部材に蓋を取り付けた状態を示す図である。FIG. 8-1 is a diagram illustrating a state where a lid is attached to the shield member. 図８−２は、シールド部材に取り付ける蓋の平面図である。FIG. 8-2 is a plan view of the lid attached to the shield member. 図８−３は、シールド部材に取り付ける蓋の平面図である。FIG. 8-3 is a plan view of the lid attached to the shield member. 図９は、本実施形態の第１変形例に係るシールド部材を示す平面図である。FIG. 9 is a plan view showing a shield member according to a first modification of the present embodiment. 図１０−１は、図９のＡ−Ａ断面図である。10A is a cross-sectional view taken along the line AA in FIG. 図１０−２は、図９のＢ−Ｂ断面図である。10-2 is a cross-sectional view taken along the line BB in FIG. 図１１は、本実施形態の第２変形例に係る保持体を示す図である。FIG. 11 is a view showing a holding body according to a second modification of the present embodiment. 図１２は、本実施形態の第２変形例に係る保持体を示す図である。FIG. 12 is a view showing a holding body according to a second modification of the present embodiment. 図１３は、本実施形態の第２変形例に係る保持体を示す図である。FIG. 13 is a view showing a holding body according to a second modification of the present embodiment.

以下、本発明につき図面を参照しつつ詳細に説明する。なお、下記の発明を実施するための形態（以下実施形態という）により本発明が限定されるものではない。また、下記の実施形態における構成要素には、当業者が容易に想定できるもの、実質的に同一のもの、いわゆる均等の範囲のものが含まれる。   Hereinafter, the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited by the form (henceforth embodiment) for implementing the following invention. In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range.

以下においては、携帯電話機を電子機器の一例として説明するが、本発明の適用対象は携帯電話機に限定されるものではなく、例えば、ＰＨＳ（Personal Handy phone System）、ＰＤＡ（Personal Digital Assistant）、ポータブルナビゲーション装置、ノートパソコン、ゲーム機等に対しても本発明は適用できる。また、回路基板に取り付けられる回路基板用金属部品としては、電子部品の周りに配置されるシールド部材を例とするが、本発明の適用対象はこれに限定されるものではない。例えば、回路基板を補強する金属製の補強部材に対しても本発明は適用できる。   In the following, a mobile phone will be described as an example of an electronic device. However, the application target of the present invention is not limited to a mobile phone. For example, PHS (Personal Handy Phone System), PDA (Personal Digital Assistant), portable The present invention can also be applied to navigation devices, notebook computers, game machines, and the like. Moreover, as a metal component for circuit boards attached to a circuit board, although the shield member arrange | positioned around an electronic component is made into an example, the application object of this invention is not limited to this. For example, the present invention can be applied to a metal reinforcing member that reinforces a circuit board.

図１は、本実施形態に係る基板ユニットを備える電子機器の一例を示す全体図である。電子機器である携帯電話機１は、筐体１Ｃが表示側筐体１ＣＡと操作側筐体１ＣＢとを備え、開閉可能に構成された、折り畳み式の携帯電話機である。表示側筐体１ＣＡと操作側筐体１ＣＢとは、ヒンジ機構９で連結されている。これによって、表示側筐体１ＣＡ及び操作側筐体１ＣＢは、ヒンジ機構９を中心として回動できるように構成される。なお、携帯電話機１は折り畳み式に限定されるものではない。   FIG. 1 is an overall view illustrating an example of an electronic apparatus including a substrate unit according to the present embodiment. The cellular phone 1 that is an electronic device is a foldable cellular phone in which a casing 1C includes a display-side casing 1CA and an operation-side casing 1CB and is configured to be opened and closed. The display-side housing 1CA and the operation-side housing 1CB are connected by a hinge mechanism 9. Accordingly, the display-side casing 1CA and the operation-side casing 1CB are configured to be rotatable about the hinge mechanism 9. Note that the mobile phone 1 is not limited to a folding type.

表示側筐体１ＣＡには、ディスプレイ２Ｍが設けられる。また、表示側筐体１ＣＡには、携帯電話機１の通話時に音声を発するスピーカ６が設けられる。操作側筐体１ＣＢには、通話相手の電話番号や、メール作成時等に文字を入力するための操作キー３が複数設けられ、また、ディスプレイ２Ｍに表示されるメニューの選択及び決定や画面のスクロール等を容易に実行するための方向及び決定キー４が設けられる。操作側筐体１ＣＢの内部にはアンテナが設けられており、携帯電話機１と基地局との間における送受信に用いられる。なお、操作キー３及び方向及び決定キー４は、携帯電話機１の操作部を構成する。また、操作側筐体１ＣＢには、携帯電話機１の通話時に、音声を受け取るマイク５が設けられる。   A display 2M is provided in the display-side casing 1CA. In addition, the display-side casing 1CA is provided with a speaker 6 that emits sound when the mobile phone 1 is talking. The operation-side casing 1CB is provided with a plurality of operation keys 3 for inputting a telephone number of a call partner and characters when creating a mail. Further, selection and determination of a menu displayed on the display 2M and a screen A direction and determination key 4 for easily executing scrolling and the like is provided. An antenna is provided inside the operation-side casing 1CB, and is used for transmission / reception between the mobile phone 1 and the base station. The operation key 3 and the direction / decision key 4 constitute an operation unit of the mobile phone 1. In addition, the operation-side casing 1CB is provided with a microphone 5 that receives sound when the mobile phone 1 is talking.

図２は、操作側筐体に内蔵される基板ユニットの分解斜視図である。表示側筐体１ＣＡや操作側筐体１ＣＢの内部には、電子部品が搭載された基板ユニットが配置される。図２に示すように、操作側筐体１ＣＢの内部には、上述した操作キー３及び方向及び決定キー４を構成するキーシート１０と、フレキシブル配線基板ユニット１１と、基準電位パターン層及び携帯電話機用のＲＦ（Radio Frequency）モジュールを含む各種電子部品を備える基板ユニット１２とを備える。上述したキーシート１０と、フレキシブル配線基板ユニット１１と、基板ユニット１２とは、積層されて操作側筐体１ＣＢに内に配置される。表示側筐体１ＣＡ内にも、ディスプレイ２Ｍ用の回路基板が配置される。   FIG. 2 is an exploded perspective view of the substrate unit built in the operation-side casing. A substrate unit on which electronic components are mounted is disposed inside the display-side housing 1CA and the operation-side housing 1CB. As shown in FIG. 2, inside the operation-side housing 1CB, there are a key sheet 10 that constitutes the above-described operation key 3, direction and determination key 4, a flexible wiring board unit 11, a reference potential pattern layer, and a mobile phone. And a substrate unit 12 including various electronic components including a radio frequency (RF) module. The key sheet 10, the flexible wiring board unit 11, and the board unit 12 described above are stacked and disposed inside the operation-side casing 1 </ b> CB. A circuit board for the display 2M is also arranged in the display-side casing 1CA.

図３は、操作側筐体に内蔵される基板ユニットの平面図である。図３に示すように、基板ユニット１２は、回路基板１２Ｐと、電子部品であるＢＧＡ（Ball Grid Array）３０と、回路基板用金属部品であるシールド部材２０とで構成される。回路基板１２Ｐには、ＢＧＡ３０が搭載されている。また、ＢＧＡ３０の周囲には、シールド部材２０が配置される。シールド部材２０は、回路基板１２Ｐに取り付けられる。シールド部材２０は、ＢＧＡ３０から放射される電磁波が漏れないようにするとともに、高周波ノイズ等の電磁波からＢＧＡ３０を保護するために設けられる。図３では、シールド部材２０は開放されているが、回路基板１２Ｐが操作側筐体１ＣＢ内に配置される際には、ＢＧＡ３０の周りにシールド部材２０を配置した後、シールド部材２０の開口部に蓋が取り付けられる。次に、シールド部材２０について説明する。   FIG. 3 is a plan view of the substrate unit built in the operation-side casing. As shown in FIG. 3, the board unit 12 includes a circuit board 12P, a BGA (Ball Grid Array) 30 that is an electronic component, and a shield member 20 that is a metal component for the circuit board. A BGA 30 is mounted on the circuit board 12P. A shield member 20 is disposed around the BGA 30. The shield member 20 is attached to the circuit board 12P. The shield member 20 is provided to prevent the electromagnetic waves emitted from the BGA 30 from leaking and to protect the BGA 30 from electromagnetic waves such as high-frequency noise. In FIG. 3, the shield member 20 is opened. However, when the circuit board 12 </ b> P is disposed in the operation-side casing 1 </ b> CB, the shield member 20 is disposed around the BGA 30 and then the opening of the shield member 20. A lid is attached to. Next, the shield member 20 will be described.

図４−１は、本実施形態に係るシールド部材を示す平面図である。図４−２は、本実施形態に係るシールド部材を示す斜視図である。図４−３は、本実施形態に係るシールド部材の側面図である。図５−１は、図４−１の矢印Ａ方向からシールド部材を見た図であり、図５−２は、図４−１の矢印Ｂ方向からシールド部材を見た図である。図６−１は、本実施形態に係るシールド部材を回路基板に取り付けた例を示す側面図である。図６−２、図６−３は、本実施形態に係るシールド部材を回路基板に取り付けた他の例を示す側面図である。   FIG. 4A is a plan view of the shield member according to the present embodiment. FIG. 4B is a perspective view of the shield member according to the present embodiment. FIG. 4-3 is a side view of the shield member according to the present embodiment. 5A is a diagram of the shield member viewed from the direction of arrow A in FIG. 4A, and FIG. 5B is a diagram of the shield member viewed from the direction of arrow B in FIG. 4A. FIG. 6A is a side view illustrating an example in which the shield member according to the present embodiment is attached to the circuit board. FIGS. 6-2 and 6-3 are side views showing another example in which the shield member according to the present embodiment is attached to the circuit board.

シールド部材２０は、導電性の材料（例えば金属であり、アルミニウムやその合金、銅やその合金、ステンレス鋼等）で構成される。シールド部材２０は、回路基板１２Ｐに取り付けられて、回路基板１２Ｐのグランドと電気的に接続される。本実施形態において、シールド部材２０は、ステンレス鋼、アルミニウムや銅等の金属を素材とした板状の材料で構成され、例えば、折り曲げ加工や深絞り加工によって製造される。   The shield member 20 is made of a conductive material (for example, metal, aluminum, an alloy thereof, copper, an alloy thereof, stainless steel, or the like). The shield member 20 is attached to the circuit board 12P and is electrically connected to the ground of the circuit board 12P. In the present embodiment, the shield member 20 is made of a plate-like material made of a metal such as stainless steel, aluminum, or copper, and is manufactured, for example, by bending or deep drawing.

図４−１、図４−２に示すように、シールド部材２０は、金属部材である遮蔽部２１と保持体（金属部材保持体）２３とを含んで構成される。遮蔽部２１は、４個の板状の側部２１Ａ、２１Ｂ、２１Ｃ、２１Ｄと、２個の板状の側部２１Ｅ、２１Ｆとを組み合わせて構成される。側部２１Ａ及び側部２１Ｂ、側部２１Ｂ及び側部２１Ｃ、側部２１Ｃ及び側部２１Ｄ、側部２１Ｄ及び側部２１Ｅ、側部２１Ｅ及び側部２１Ｆ、側部２１Ｆ及び側部２１Ａは、板面が互いに直角に組み合わされて構成される。６個の側部２１Ａ〜２１Ｆが組み合わされることによって遮蔽部２１は筒状の構造体となる。そして、６個の側部２１Ａ〜２１Ｆは、遮蔽部２１の内側と外側を仕切る。また、遮蔽部２１の平面視の形状は、長方形又は正方形の一つの角部が切り欠かれた形状となる。ここで、この切り欠かれた部分を、切り欠き部２１ＣＴという。   As illustrated in FIGS. 4A and 4B, the shield member 20 includes a shielding portion 21 that is a metal member and a holding body (metal member holding body) 23. The shielding part 21 is configured by combining four plate-like side parts 21A, 21B, 21C, and 21D and two plate-like side parts 21E and 21F. Side part 21A and side part 21B, side part 21B and side part 21C, side part 21C and side part 21D, side part 21D and side part 21E, side part 21E and side part 21F, side part 21F and side part 21A are plates. The surfaces are combined at right angles to each other. The shielding part 21 becomes a cylindrical structure by combining the six side parts 21A to 21F. The six side portions 21 </ b> A to 21 </ b> F partition the inside and outside of the shielding portion 21. Further, the shape of the shielding portion 21 in plan view is a shape in which one corner of a rectangle or a square is cut out. Here, the notched portion is referred to as a notch portion 21CT.

遮蔽部２１は、半田ボールを介して回路基板１２Ｐに取り付けられるＢＧＡ３０の周囲に配置される。より具体的には、遮蔽部２１を構成する６個の側部２１Ａ〜２１Ｆが、ＢＧＡ３０の周囲に配置される。上述したように、遮蔽部２１は、筒状の構造体となり、一方の端部２１ＴＢが回路基板１２Ｐと接するとともに、例えば、半田付け等によって回路基板１２Ｐに固定される。なお、他方の端部２１ＴＴは、回路基板１２Ｐへの取付側とは反対側に位置する。   The shielding part 21 is disposed around the BGA 30 attached to the circuit board 12P via solder balls. More specifically, six side portions 21 </ b> A to 21 </ b> F constituting the shielding portion 21 are arranged around the BGA 30. As described above, the shielding portion 21 has a cylindrical structure, and one end portion 21TB is in contact with the circuit board 12P and is fixed to the circuit board 12P by, for example, soldering. The other end 21TT is located on the side opposite to the side attached to the circuit board 12P.

図４−３に示すように、一方の端部２１ＴＢはシールド部材２０の回路基板１２Ｐへの取付側（回路基板側）となり、他方の端部２１ＴＴはシールド部材２０の回路基板１２Ｐへの取付側とは反対側（反回路基板側）となる。また、シールド部材２０は、一方の端部２１ＴＢ及び他方の端部２１ＴＴの両方に、それぞれ開口部（回路基板側開口部）２０ＯＢ、開口部（反回路基板側開口部）２０ＯＴを有する。シールド部材２０をＢＧＡ３０の周囲に配置して回路基板１２Ｐに取り付ける場合、回路基板側開口部２０ＯＢをＢＧＡ３０が通過する。また、反回路基板側開口部２０ＯＴからＢＧＡ３０と回路基板１２Ｐとの間にアンダーフィル剤を塗布したり、反回路基板側開口部２０ＯＴを通してＢＧＡ３０を検査したりする。   As shown in FIG. 4-3, one end 21TB is the attachment side (circuit board side) of the shield member 20 to the circuit board 12P, and the other end 21TT is the attachment side of the shield member 20 to the circuit board 12P. It is the opposite side (opposite circuit board side). Further, the shield member 20 has an opening (circuit board side opening) 20OB and an opening (counter circuit board side opening) 20OT at both the one end 21TB and the other end 21TT. When the shield member 20 is arranged around the BGA 30 and attached to the circuit board 12P, the BGA 30 passes through the circuit board side opening 20OB. Further, an underfill agent is applied between the BGA 30 and the circuit board 12P from the counter circuit board side opening 20OT, or the BGA 30 is inspected through the counter circuit board side opening 20OT.

シールド部材２０には、実装機に保持される保持体２３が設けられる。より具体的には、シールド部材２０を構成する遮蔽部２１に、保持体２３が設けられる。このような構成により、シールド部材２０が回路基板１２Ｐへ実装されるときには、実装機が保持体２３を保持して移動させることにより、シールド部材２０を移動させることができる。   The shield member 20 is provided with a holding body 23 held by the mounting machine. More specifically, the holding body 23 is provided on the shielding portion 21 constituting the shield member 20. With such a configuration, when the shield member 20 is mounted on the circuit board 12P, the shield member 20 can be moved by the mounting machine holding and moving the holding body 23.

本実施形態において、保持体２３は、遮蔽部２１の切り欠き部２１ＣＴ、すなわち、遮蔽部２１を構成する側部２１Ｅと側部２１Ｆとで一部が囲まれる部分に配置される。図４−３に示すように、本実施形態において、保持体２３は、シールド部材２０の回路基板１２Ｐへの取付側、すなわち、一方の端部２１ＴＢ側に配置される。   In the present embodiment, the holding body 23 is disposed in a notch portion 21CT of the shielding portion 21, that is, a portion partially surrounded by the side portion 21E and the side portion 21F constituting the shielding portion 21. As shown in FIG. 4C, in the present embodiment, the holding body 23 is disposed on the attachment side of the shield member 20 to the circuit board 12P, that is, on the one end 21TB side.

図５−１に示すように、保持体２３は、側部２１Ｅと一体で形成され、図５―２に示すように、側部２１Ｆとは分離している。シールド部材２０は、金属板の折り曲げ加工や深絞り加工等によって製造されるので、保持体２３をシールド部材２０の側部２１Ｅと一体に、側部２１Ｆとは分離して構成することにより、保持体２３を備えたシールド部材２０を構成しやすくなる。なお、保持体２３は、側部２１Ｆと一体に、側部２１Ｅとは分離して構成されてもよい。   As shown in FIG. 5A, the holding body 23 is formed integrally with the side portion 21E, and is separated from the side portion 21F as shown in FIG. Since the shield member 20 is manufactured by bending a metal plate, deep drawing, or the like, the holding member 23 is formed integrally with the side portion 21E of the shield member 20 and separated from the side portion 21F. It becomes easy to constitute the shield member 20 provided with the body 23. The holding body 23 may be configured integrally with the side portion 21F and separated from the side portion 21E.

保持体２３は、取付部２３Ｆと被保持部２３Ｈとを有する。被保持部２３Ｈは、平板状の形状であり、シールド部材２０が回路基板１２Ｐへ取り付けられる際には、実装機の部品保持手段に保持される部分である。部品保持手段としては、例えば、負圧を利用して保持対象（本実施形態では被保持部２３Ｈ）を吸着する吸引ノズルがある。吸引ノズルは、例えば、負圧発生手段である吸引ポンプや真空ポンプに連結されており、保持体２３の被保持部２３Ｈを吸着する。吸引ノズルが保持体２３の被保持部２３Ｈを吸着した状態で実装機が吸引ノズルを回路基板１２Ｐへ移動させると、シールド部材２０を回路基板１２Ｐへ移動させることができる。   The holding body 23 includes a mounting portion 23F and a held portion 23H. The held portion 23H has a flat plate shape, and is a portion held by the component holding means of the mounting machine when the shield member 20 is attached to the circuit board 12P. As the component holding means, for example, there is a suction nozzle that uses a negative pressure to suck a holding target (held portion 23H in the present embodiment). The suction nozzle is connected to, for example, a suction pump or a vacuum pump that is a negative pressure generating unit, and sucks the held portion 23H of the holding body 23. If the mounting machine moves the suction nozzle to the circuit board 12P in a state where the suction nozzle sucks the held portion 23H of the holding body 23, the shield member 20 can be moved to the circuit board 12P.

取付部２３Ｆは、シールド部材２０を取付対象（例えば、回路基板１２Ｐ）に取り付けるためのものである。取付部２３Ｆは、平板状の形状であって、孔２３ＦＨを有する。孔２３ＦＨは、締結手段を貫通させるものである。締結手段は、取付部２３Ｆ又は回路基板１２Ｐを、取付部２３Ｆ又は回路基板１２Ｐの締結対象に締結するためのものであり、本実施形態ではねじを用いる。なお、締結手段はねじに限定されるものではなく、例えば、リベット、ハトメ等を用いることができる。取付部２３Ｆの締結対象は、例えば、回路基板１２Ｐ、携帯電話機１を構成する表示側筐体１ＣＡや操作側筐体１ＣＢ（図１参照）である。また、回路基板１２Ｐの締結対象は、例えば、携帯電話機１を構成する表示側筐体１ＣＡや操作側筐体１ＣＢである。   The attachment portion 23F is for attaching the shield member 20 to an attachment target (for example, the circuit board 12P). The attachment portion 23F has a flat plate shape and has a hole 23FH. The hole 23FH penetrates the fastening means. The fastening means is for fastening the mounting portion 23F or the circuit board 12P to the fastening target of the mounting portion 23F or the circuit board 12P. In the present embodiment, a screw is used. The fastening means is not limited to screws, and for example, rivets, eyelets, etc. can be used. The fastening target of the mounting portion 23F is, for example, the circuit board 12P, the display-side casing 1CA and the operation-side casing 1CB (see FIG. 1) constituting the mobile phone 1. Further, the fastening target of the circuit board 12P is, for example, the display-side casing 1CA and the operation-side casing 1CB constituting the mobile phone 1.

取付部２３Ｆの締結対象が回路基板１２Ｐである場合、回路基板１２Ｐ上にシールド部材２０を配置した上で、シールド部材２０の取付部２３Ｆに形成された孔２３ＦＨにねじ５０を貫通させ、回路基板１２Ｐへねじ込む。これによって、ねじ５０によってシールド部材２０が回路基板１２Ｐに締結される。また、表示側筐体１ＣＡや操作側筐体１ＣＢが取付部２３Ｆや回路基板１２Ｐの締結対象である場合、図６−１に示すように、部品実装面１２ＰＰにシールド部材２０を取り付けた回路基板１２Ｐを、表示側筐体１ＣＡや操作側筐体１ＣＢの内部に配置する。その上で、取付部２３Ｆに形成された孔２３ＦＨにねじ５０を貫通させ、表示側筐体１ＣＡや操作側筐体１ＣＢへねじ込む。その結果、ねじ５０によって、シールド部材２０の取付部２３Ｆが回路基板１２Ｐとともに表示側筐体１ＣＡや操作側筐体１ＣＢに締結される。   When the fastening target of the mounting portion 23F is the circuit board 12P, the shield member 20 is disposed on the circuit board 12P, and then the screw 50 is passed through the hole 23FH formed in the mounting portion 23F of the shield member 20 to Screw into 12P. As a result, the shield member 20 is fastened to the circuit board 12 </ b> P by the screw 50. When the display-side housing 1CA and the operation-side housing 1CB are the fastening target of the mounting portion 23F and the circuit board 12P, as shown in FIG. 6A, the circuit board having the shield member 20 attached to the component mounting surface 12PP. 12P is arranged inside the display-side casing 1CA and the operation-side casing 1CB. Then, the screw 50 is passed through the hole 23FH formed in the attachment portion 23F, and is screwed into the display side casing 1CA and the operation side casing 1CB. As a result, the mounting portion 23F of the shield member 20 is fastened to the display-side casing 1CA and the operation-side casing 1CB together with the circuit board 12P by the screws 50.

また、図６−２に示すように、取付部２３Ｆは、回路基板１２Ｐの部品実装面１２ＰＰに形成される金属導電体（例えば、グランド１２ＰＧやグランド１２ＰＧと電気的に接続される金属製のシールド部材取付部）を介して回路基板１２Ｐの部品実装面１２ＰＰに取り付けられてもよい。この場合、取付部２３Ｆは、回路基板１２Ｐの部品実装面１２ＰＰに形成されたグランド１２ＰＧと接触するとともに、半田５２によって電気的に接続され、かつグランド１２ＰＧに固定される。   As shown in FIG. 6B, the attachment portion 23F is a metal conductor (for example, a ground shield 12PG or a metal shield electrically connected to the ground 12PG) formed on the component mounting surface 12PP of the circuit board 12P. It may be attached to the component mounting surface 12PP of the circuit board 12P via a member attachment portion. In this case, the attachment portion 23F is in contact with the ground 12PG formed on the component mounting surface 12PP of the circuit board 12P, is electrically connected by the solder 52, and is fixed to the ground 12PG.

ここで、シールド部材２０は、シールド部材２０の一方の端部２１ＴＢが、金属製のシールド部材取付部と半田によって接合される。なお、金属製のシールド部材取付部は、回路基板１２Ｐの部品実装面１２ＰＰに形成され、かつ回路基板１２Ｐのグランド１２ＰＧと電気的に接続される。図６−２に示すように、取付部２３Ｆとグランド１２ＰＧとを電気的に接続することにより、シールド部材２０とグランド１２ＰＧとの接触面積をより大きくできる。その結果、シールド部材２０とグランド１２ＰＧとの電気的な接続を強化できるので、シールド部材２０による電磁波等の遮蔽効果がより向上する。   Here, in the shield member 20, one end portion 21TB of the shield member 20 is joined to the metal shield member mounting portion by solder. The metal shield member mounting portion is formed on the component mounting surface 12PP of the circuit board 12P and is electrically connected to the ground 12PG of the circuit board 12P. As shown in FIG. 6B, the contact area between the shield member 20 and the ground 12PG can be increased by electrically connecting the mounting portion 23F and the ground 12PG. As a result, since the electrical connection between the shield member 20 and the ground 12PG can be strengthened, the shielding effect of electromagnetic waves and the like by the shield member 20 is further improved.

さらに、本実施形態では、取付部２３Ｆの孔２３ＦＨにねじ５０を貫通させ、シールド部材２０の取付部２３Ｆと回路基板１２Ｐとを締結する。その結果、シールド部材２０とグランド１２ＰＧとの電気的な接続がさらに強化される。また、ねじ５０は導電性を有するので、ねじ５０を介してシールド部材２０とグランド１２ＰＧとの電気的な接続が強化される。これらの作用により、シールド部材２０による電磁波等の遮蔽効果がさらに向上する。さらに、シールド部材２０と回路基板１２Ｐとの取付強度も上昇する。なお、取付部２３Ｆとグランド１２ＰＧとを半田によって接合しない場合でも、シールド部材２０と回路基板１２Ｐとをねじ５０によって締結することにより、シールド部材２０とグランド１２ＰＧとを電気的に接続できるので、シールド部材２０による電磁波等の遮蔽効果が得られる。   Further, in the present embodiment, the screw 50 is passed through the hole 23FH of the attachment portion 23F, and the attachment portion 23F of the shield member 20 and the circuit board 12P are fastened. As a result, the electrical connection between the shield member 20 and the ground 12PG is further strengthened. Moreover, since the screw 50 has conductivity, the electrical connection between the shield member 20 and the ground 12PG is reinforced through the screw 50. By these actions, the shielding effect of electromagnetic waves and the like by the shield member 20 is further improved. Furthermore, the attachment strength between the shield member 20 and the circuit board 12P also increases. Even when the attachment portion 23F and the ground 12PG are not joined by solder, the shield member 20 and the ground 12PG can be electrically connected by fastening the shield member 20 and the circuit board 12P with the screw 50. The shielding effect such as electromagnetic waves by the member 20 is obtained.

なお、図６−２に示す例は、回路基板１２Ｐの部品実装面１２ＰＰに形成される金属導電体を介して取付部２３Ｆを回路基板１２Ｐへ取り付けたものである。また、図６−１に示す例は、金属導電体を介さずに取付部２３Ｆを回路基板１２Ｐへ取り付けたものである。   In the example shown in FIG. 6B, the attachment portion 23F is attached to the circuit board 12P via a metal conductor formed on the component mounting surface 12PP of the circuit board 12P. In the example shown in FIG. 6A, the attachment portion 23F is attached to the circuit board 12P without using a metal conductor.

上述した例では、取付部２３Ｆに孔２３ＦＨを設けたが、孔２３ＦＨは必ずしも必要ではない。例えば、図６−３に示すように、取付部２３Ｆを、図１に示す携帯電話機１を構成する表示側筐体１ＣＡや操作側筐体１ＣＢに形成される爪５１によって押さえ込む。これによって、取付部２３Ｆを回路基板１２Ｐに取り付けてもよい。この場合、爪５１が締結手段となる。このようにした場合、孔２３ＦＨが不要になるので、後述するように、吸引ノズルで被保持部２３Ｈを吸引する際に、シール等で孔２３ＦＨを塞ぐ必要がなくなる。   In the example described above, the hole 23FH is provided in the attachment portion 23F, but the hole 23FH is not necessarily required. For example, as shown in FIG. 6-3, the attachment portion 23F is pressed by a claw 51 formed on the display-side casing 1CA and the operation-side casing 1CB constituting the mobile phone 1 shown in FIG. Thus, the attachment portion 23F may be attached to the circuit board 12P. In this case, the claw 51 is a fastening means. In this case, since the hole 23FH is not necessary, it is not necessary to close the hole 23FH with a seal or the like when sucking the held portion 23H with the suction nozzle, as will be described later.

本実施形態では、シールド部材２０の保持体２３を構成する取付部２３Ｆと被保持部２３Ｈとは、同一の部材で一体に構成される。そして、同一の部材で取付部２３Ｆの機能（回路基板１２Ｐにシールド部材２０を固定する機能）と被保持部２３Ｈの機能（実装機の部品保持手段に保持される機能）とが実現される。本実施形態では、被保持部２３Ｈと取付部２３Ｆとは同じ位置に形成される。すなわち、被保持部２３Ｈに取付部２３Ｆが形成される、あるいは取付部２３Ｆに被保持部２３Ｈが形成される。   In this embodiment, the attachment part 23F and the to-be-held part 23H which comprise the holding body 23 of the shield member 20 are comprised integrally by the same member. The function of the mounting portion 23F (the function of fixing the shield member 20 to the circuit board 12P) and the function of the held portion 23H (the function held by the component holding means of the mounting machine) are realized by the same member. In the present embodiment, the held portion 23H and the attachment portion 23F are formed at the same position. That is, the attachment portion 23F is formed on the held portion 23H, or the held portion 23H is formed on the attachment portion 23F.

本実施形態では、保持体２３を構成する被保持部２３Ｈと取付部２３Ｆとを同じ位置に形成することで共通化し、同一の部材で取付部２３Ｆの機能と被保持部２３Ｈの機能とを実現する。これによって、取付部２３Ｆと被保持部２３Ｈとをそれぞれ別個にシールド部材２０へ設ける必要はないので、その分、回路基板１２Ｐの部品実装面１２ＰＰを効率的に利用でき、例えば、電子部品の実装密度が向上する。   In the present embodiment, the held portion 23H and the mounting portion 23F constituting the holding body 23 are formed in the same position so as to be shared, and the function of the mounting portion 23F and the function of the held portion 23H are realized by the same member. To do. Accordingly, it is not necessary to separately provide the mounting portion 23F and the held portion 23H on the shield member 20, and accordingly, the component mounting surface 12PP of the circuit board 12P can be used efficiently, for example, mounting of electronic components The density is improved.

また、従来は、シールド部材の反回路基板側に保持部を設けていたため、この保持部と対向する部分には電子部品等が配置できなかった。しかし、本実施形態では、シールド部材２０の回路基板側に保持体２３を配置するので、シールド部材２０の反回路基板側に被保持部２３Ｈを形成する必要はない。これによって、シールド部材２０の回路基板側開口部２０ＯＢに配置されるものがなくなるので、シールド部材２０の内部の全領域にわたって電子部品等を配置できる。その結果、回路基板１２Ｐの部品実装面１２ＰＰを効率的に利用でき、例えば、電子部品の実装密度が向上する。   Conventionally, since the holding portion is provided on the side of the shield member opposite to the circuit board, an electronic component or the like cannot be disposed in a portion facing the holding portion. However, in this embodiment, since the holding body 23 is disposed on the circuit board side of the shield member 20, it is not necessary to form the held portion 23H on the side of the shield member 20 opposite to the circuit board. As a result, nothing is disposed in the circuit board side opening 20OB of the shield member 20, so that electronic components and the like can be disposed over the entire area inside the shield member 20. As a result, the component mounting surface 12PP of the circuit board 12P can be used efficiently, and for example, the mounting density of electronic components is improved.

図７は、本実施形態に係るシールド部材が備える保持体にシートを貼り付けた状態を示す図である。本実施形態において、保持体２３を構成する被保持部２３Ｈは、取付部２３Ｆと共通である。このため、被保持部２３Ｈには、取付部２３Ｆに設けられる孔２３ＦＨが形成されている。これにより、シールド部材２０を実装する際に吸引ノズルで被保持部２３Ｈを吸引する場合、孔２３ＦＨから吸引ノズルが空気を吸引してしまい、吸引ノズルは被保持部２３Ｈを吸引できない。   FIG. 7 is a diagram illustrating a state where a sheet is attached to a holding body included in the shield member according to the present embodiment. In the present embodiment, the held portion 23H constituting the holding body 23 is common to the attachment portion 23F. Therefore, a hole 23FH provided in the attachment portion 23F is formed in the held portion 23H. Accordingly, when the held portion 23H is sucked by the suction nozzle when the shield member 20 is mounted, the suction nozzle sucks air from the hole 23FH, and the suction nozzle cannot suck the held portion 23H.

このため、図７に示すように、シールド部材２０を回路基板１２Ｐに取り付ける前における孔２３ＦＨに、例えば、シール部材としてシート２４を貼り付けて孔２３ＦＨを塞いでおく。これによって、吸引ノズルで被保持部２３Ｈを吸引する場合、孔２３ＦＨから吸引ノズルが空気を吸引することがなくなるので、吸引ノズルは被保持部２３Ｈを吸引してこれを保持できる。   For this reason, as shown in FIG. 7, for example, a sheet 24 is attached as a seal member to the hole 23FH before the shield member 20 is attached to the circuit board 12P to close the hole 23FH. Accordingly, when the held portion 23H is sucked by the suction nozzle, the suction nozzle does not suck air from the hole 23FH, so that the suction nozzle can suck and hold the held portion 23H.

シート２４は、例えば、熱によって溶解するシートを用いることができる。上述したように、シールド部材２０は、回路基板１２Ｐの部品実装面１２ＰＰに載置された後、金属製のシールド部材取付部に半田で接合される。したがって、半田を溶融させるために熱が加えられるが、シート２４に熱によって溶解するシートを用いれば、この加熱によってシート２４は溶解するので、孔２３ＦＨを覆うシート２４が取り除かれる。この場合、シート２４を構成する材料の融点は、半田の融点よりも低くする。これによって、ねじ５０を孔２３ＦＨへ貫通させる際にシート２４を取り除く必要はないので、ねじによる締結作業が迅速に実現できる。   As the sheet 24, for example, a sheet that is melted by heat can be used. As described above, after the shield member 20 is placed on the component mounting surface 12PP of the circuit board 12P, it is joined to the metal shield member mounting portion by soldering. Accordingly, heat is applied to melt the solder. However, if a sheet that melts by heat is used as the sheet 24, the sheet 24 is melted by this heating, so that the sheet 24 covering the hole 23FH is removed. In this case, the melting point of the material constituting the sheet 24 is set lower than the melting point of the solder. Accordingly, it is not necessary to remove the sheet 24 when the screw 50 is passed through the hole 23FH, so that the fastening operation using the screw can be realized quickly.

また、シート２４の代わりに、シール部材としてゆるみ止め剤の膜を孔２３ＦＨに設けてもよい。これによって、ねじ５０を孔２３ＦＨに貫通させてねじ込むと、孔２３ＦＨに形成されたゆるみ止め剤がねじ５０に付着し、そのまま回路基板１２Ｐ等へねじ込まれる。そして、ゆるみ止め剤が硬化することにより、ねじ５０のゆるみ止めが実現できる。その結果、ねじ５０を孔２３ＦＨへ貫通させる際にゆるみ止め剤を取り除く必要はないので、ねじ５０による締結作業が迅速に実現できるとともに、ねじ５０のゆるみ止めも同時に実現できる。なお、ゆるみ止め剤の融点は、半田の融点よりも高くする。これによって、加熱によるゆるみ止め剤の溶解が抑制されるので、ねじ５０を孔２３ＦＨに貫通させる際には、確実にゆるみ止め剤を孔２３ＦＨに残しておくことができる。   Further, instead of the sheet 24, a film of a locking agent may be provided in the hole 23FH as a seal member. As a result, when the screw 50 is screwed through the hole 23FH, the locking agent formed in the hole 23FH adheres to the screw 50 and is screwed into the circuit board 12P or the like as it is. Then, the locking of the screw 50 can be realized by curing the locking agent. As a result, since it is not necessary to remove the loosening prevention agent when the screw 50 is passed through the hole 23FH, the fastening operation by the screw 50 can be realized quickly, and the loosening prevention of the screw 50 can be realized at the same time. Note that the melting point of the locking agent is higher than the melting point of the solder. Accordingly, since the dissolution of the loosening prevention agent due to heating is suppressed, when the screw 50 is passed through the hole 23FH, the loosening prevention agent can be reliably left in the hole 23FH.

次に、図３に示す基板ユニット１２を製造する手順を簡単に説明する。
（１）電子部品（ＢＧＡ３０）が回路基板１２Ｐ上の所定位置に配置される。ＢＧＡ３０は、例えば、実装機によって自動的に回路基板１２Ｐ上に配置される。
（２）ＢＧＡ３０の周りにシールド部材２０が配置される。シールド部材２０は、実装機の吸引ノズルによって保持体２３の被保持部２３Ｈが吸着されて、ＢＧＡ３０が配置されている位置まで搬送された後、ＢＧＡ３０の周りに配置される。
（３）シールド部材２０が回路基板１２Ｐ上に配置されたら、吸引ノズルによる吸引が解除されて、吸引ノズルが保持体２３の被保持部２３Ｈから取り外される。
（４）回路基板１２Ｐが加熱処理される。シールド部材２０に設けられる、金属製のシールド部材取付部には半田が予め盛られており、ＢＧＡ３０と回路基板１２Ｐとの間には半田ボールが設けられる。このため、加熱処理によって金属製のシールド部材取付部の半田及び半田ボールが溶けて、シールド部材２０及びＢＧＡ３０が回路基板１２Ｐへ固定される。金属製のシールド部材取付部は、回路基板１２Ｐのグランド１２ＰＧと電気的に接続されているので、シールド部材２０が回路基板１２Ｐのグランド１２ＰＧと電気的に接続される。また、ＢＧＡ３０の端子と回路基板１２Ｐの端子とが電気的に接続される。
（５）ＢＧＡ３０やシールド部材２０の検査が行われる。この検査は、例えば、カメラを用いた自動検査である。本実施形態では、上述したように、シールド部材２０の反回路基板側開口部２０ＯＴに被保持部２３Ｈは配置されないので、反回路基板側開口部２０ＯＴを通して回路基板１２Ｐの部品実装面１２ＰＰを検査できる。
（６）検査の結果、正常であれば、固定剤であるアンダーフィル剤をＢＧＡ３０と回路基板１２Ｐとの間に流し込む。アンダーフィル剤は封止樹脂であり、通常は一液硬化性のエポキシ樹脂が用いられる。アンダーフィル剤は、硬化する前においては流動性を有している。
（７）アンダーフィル剤がＢＧＡ３０と回路基板１２Ｐとの間へ行き渡ったら、アンダーフィル剤を硬化させる。なお、アンダーフィル剤は熱硬化性を有するので、アンダーフィル剤を加熱することにより硬化させる。アンダーフィル剤によって、ＢＧＡ３０の実装強度が向上するとともに、ＢＧＡ３０と回路基板１２Ｐとの接続信頼性が向上する。
（８）アンダーフィル剤が硬化したら、シールド部材２０の反回路基板側開口部２０ＯＴに蓋が取り付けられる。これによって、シールド部材２０の反回路基板側開口部２０ＯＴを閉じられて、基板ユニット１２が完成する。 Next, a procedure for manufacturing the substrate unit 12 shown in FIG. 3 will be briefly described.
(1) The electronic component (BGA 30) is disposed at a predetermined position on the circuit board 12P. The BGA 30 is automatically arranged on the circuit board 12P by a mounting machine, for example.
(2) The shield member 20 is disposed around the BGA 30. The shield member 20 is arranged around the BGA 30 after the held portion 23H of the holding body 23 is adsorbed by the suction nozzle of the mounting machine and conveyed to the position where the BGA 30 is arranged.
(3) When the shield member 20 is disposed on the circuit board 12P, the suction by the suction nozzle is released, and the suction nozzle is removed from the held portion 23H of the holding body 23.
(4) The circuit board 12P is heated. Solder is previously deposited on a metal shield member mounting portion provided on the shield member 20, and solder balls are provided between the BGA 30 and the circuit board 12P. For this reason, the solder and solder balls of the metal shield member mounting portion are melted by the heat treatment, and the shield member 20 and the BGA 30 are fixed to the circuit board 12P. Since the metal shield member mounting portion is electrically connected to the ground 12PG of the circuit board 12P, the shield member 20 is electrically connected to the ground 12PG of the circuit board 12P. Further, the terminal of the BGA 30 and the terminal of the circuit board 12P are electrically connected.
(5) The BGA 30 and the shield member 20 are inspected. This inspection is, for example, an automatic inspection using a camera. In the present embodiment, as described above, since the held portion 23H is not disposed in the counter circuit board side opening 20OT of the shield member 20, the component mounting surface 12PP of the circuit board 12P can be inspected through the counter circuit board side opening 20OT. .
(6) If the result of the inspection is normal, an underfill agent that is a fixing agent is poured between the BGA 30 and the circuit board 12P. The underfill agent is a sealing resin, and usually a one-component curable epoxy resin is used. The underfill agent has fluidity before being cured.
(7) When the underfill agent reaches between the BGA 30 and the circuit board 12P, the underfill agent is cured. In addition, since an underfill agent has thermosetting property, it is hardened by heating an underfill agent. The underfill agent improves the mounting strength of the BGA 30 and improves the connection reliability between the BGA 30 and the circuit board 12P.
(8) When the underfill agent is cured, the lid is attached to the counter-circuit board side opening 20OT of the shield member 20. Thereby, the counter-circuit board side opening 20OT of the shield member 20 is closed, and the board unit 12 is completed.

図８−１は、シールド部材に蓋を取り付けた状態を示す図である。図８−２、図８−３は、シールド部材に取り付ける蓋の平面図である。図８−１に示すように、シールド部材２０が回路基板１２Ｐに取り付けられた後には、シールド部材２０の反回路基板側開口部２０ＯＴに、導電性の材料（本実施形態では金属）で構成された蓋４０が取り付けられる。図８−２に示すように、蓋４０の平面視の形状をシールド部材２０の平面視の形状に合わせてもよいし、図８−３に示すように、蓋４０ａの平面視の形状をシールド部材２０の平面視の形状を包含する形状（この例では長方形）としてもよい。   FIG. 8-1 is a diagram illustrating a state where a lid is attached to the shield member. 8-2 and 8-3 are plan views of the lid attached to the shield member. As shown in FIG. 8A, after the shield member 20 is attached to the circuit board 12P, the anti-circuit board side opening 20OT of the shield member 20 is made of a conductive material (metal in the present embodiment). A lid 40 is attached. As shown in FIG. 8-2, the shape of the lid 40 in plan view may be matched with the shape of the shield member 20 in plan view. As shown in FIG. 8-3, the shape of the lid 40a in plan view may be shielded. It is good also as a shape (in this example, a rectangle) including the shape of the member 20 in plan view.

図８−３に示す蓋４０ａは、蓋４０ａをシールド部材２０に取り付けた後は、保持体２３が蓋によって隠される。このため、蓋４０ａをシールド部材２０に取り付ける前に、ねじ５０を取付部２３Ｆの孔２３ＦＨにねじ込んで、取付部２３Ｆを回路基板１２Ｐに取り付ける。一方、図８−２に示す蓋４０は、平面視の形状がシールド部材２０の平面視の形状に合わせてあるので、蓋４０をシールド部材２０に取り付けた後でも、保持体２３が蓋によって隠されない。したがって、保持体２３の取付部２３Ｆの孔２３ＦＨにねじ５０をねじ込むのは、蓋４０をシールド部材２０に取り付ける前でも後でもよい。   In the lid 40a shown in FIG. 8C, after the lid 40a is attached to the shield member 20, the holding body 23 is hidden by the lid. For this reason, before attaching the lid | cover 40a to the shield member 20, the screw 50 is screwed in the hole 23FH of the attachment part 23F, and the attachment part 23F is attached to the circuit board 12P. On the other hand, since the lid 40 shown in FIG. 8B has a shape in plan view that matches the shape of the shield member 20 in plan view, the holding body 23 is hidden by the lid even after the lid 40 is attached to the shield member 20. Not. Therefore, the screw 50 may be screwed into the hole 23FH of the attachment portion 23F of the holding body 23 before or after the lid 40 is attached to the shield member 20.

（第１変形例）
図９は、本実施形態の第１変形例に係るシールド部材を示す平面図である。図１０−１は、図９のＡ−Ａ断面図であり、図１０−２は、図９のＢ−Ｂ断面図である。シールド部材２０ａは、４個の側部２１Ａａ、２１Ｂａ、２１Ｃａ、２１Ｄａで構成される遮蔽部２１ａと、保持体２３ａとを含んで構成される。側部２１Ａａ及び側部２１Ｂａ、側部２１Ｂａ及び側部２１Ｃａ、側部２１Ｃａ及び側部２１Ｄａ、側部２１Ｄａ及び側部２１Ａａは、板面が互いに直角に組み合わされて構成される。これによって、遮蔽部２１ａは、筒状の構造体を構成するとともに、平面視が長方形又は正方形の形状となる。 (First modification)
FIG. 9 is a plan view showing a shield member according to a first modification of the present embodiment. 10A is a cross-sectional view taken along the line AA in FIG. 9, and FIG. 10B is a cross-sectional view taken along the line BB in FIG. The shield member 20a includes a shielding portion 21a including four side portions 21Aa, 21Ba, 21Ca, and 21Da, and a holding body 23a. The side portion 21Aa and the side portion 21Ba, the side portion 21Ba and the side portion 21Ca, the side portion 21Ca and the side portion 21Da, the side portion 21Da and the side portion 21Aa are configured by combining the plate surfaces at right angles. As a result, the shielding portion 21a forms a cylindrical structure and has a rectangular or square shape in plan view.

本変形例では、シールド部材２０ａに設けられる保持体２３ａは、遮蔽部２１ａの角部２１ＣＰ内側、すなわち、遮蔽部２１ａを構成する側部２１Ｄａと側部２１Ａａとが連結される部分の内側に配置される。図１０−１に示すように、保持体２３ａは、板状の金属材料で構成される側部２１Ｄａの一部を延出させ、これを折り曲げて構成される。すなわち、保持体２３ａは、側部２１Ｄａと一体で構成され、図１０−２に示すように、側部２１Ａａとは分離して構成される。   In this modification, the holding body 23a provided on the shield member 20a is disposed inside the corner portion 21CP of the shielding portion 21a, that is, inside the portion where the side portion 21Da and the side portion 21Aa constituting the shielding portion 21a are connected. Is done. As illustrated in FIG. 10A, the holding body 23a is configured by extending a part of the side portion 21Da made of a plate-like metal material and bending the side portion 21Da. That is, the holding body 23a is configured integrally with the side portion 21Da, and is configured separately from the side portion 21Aa as shown in FIG. 10-2.

保持体２３ａは、側部２１Ｄａから延出させた部分（延出部）２５をシールド部材２０ａの回路基板１２Ｐ側に向かって側部２１Ｄａの板面と平行になるように折り、さらに、側部２１Ｄａの板面と直交するように延出部２５を折ることで形成される。これによって、保持体２３ａは、シールド部材２０ａの回路基板側に配置される。保持体２３ａの構成は上述した実施形態と同様なので、説明を省略する。本変形例では、上述した実施形態と比較して、遮蔽部２１ａの平面視における形状が単純であるため、遮蔽部２１ａを容易に製造できる。   The holding body 23a folds a portion (extension portion) 25 extended from the side portion 21Da toward the circuit board 12P side of the shield member 20a so as to be parallel to the plate surface of the side portion 21Da. It is formed by folding the extending portion 25 so as to be orthogonal to the plate surface of 21 Da. Accordingly, the holding body 23a is disposed on the circuit board side of the shield member 20a. Since the structure of the holding body 23a is the same as that of the embodiment described above, the description thereof is omitted. In this modification, since the shape of the shielding part 21a in plan view is simple compared to the above-described embodiment, the shielding part 21a can be easily manufactured.

なお、本変形例では、保持体２３ａがシールド部材２０ａの内部に配置される。このため、シールド部材２０ａに蓋を取り付けた後は、保持体２３ａの取付部２３Ｆａが蓋で隠される。このため、蓋をシールド部材２０ａに取り付ける前に、ねじを取付部２３Ｆａの孔２３ＦＨａにねじ込んで、取付部２３Ｆａを回路基板１２Ｐに取り付ける。   In this modification, the holding body 23a is disposed inside the shield member 20a. For this reason, after attaching the lid to the shield member 20a, the attachment portion 23Fa of the holding body 23a is hidden by the lid. Therefore, before attaching the lid to the shield member 20a, a screw is screwed into the hole 23FHa of the attachment portion 23Fa to attach the attachment portion 23Fa to the circuit board 12P.

（第２変形例）
図１１〜図１３は、本実施形態の第２変形例に係る保持体を示す図である。本変形例は、保持体２３ｂを構成する取付部２３Ｆｂと被保持部２３Ｈｂとが同一の部材で構成される点は上述した実施形態と同様であるが、図１１、図１２に示すように、取付部２３Ｆｂと被保持部２３Ｈｂとを異なる位置に配置する点が異なる。図１１は、取付部２３Ｆｂをシールド部材２０ｂに近い部分に配置した例であり、図１２は、被保持部２３Ｈｂをシールド部材２０ｂに近い部分に配置した例である。 (Second modification)
FIGS. 11-13 is a figure which shows the holding body which concerns on the 2nd modification of this embodiment. This modification is the same as the above-described embodiment in that the mounting portion 23Fb and the held portion 23Hb constituting the holding body 23b are the same member, but as shown in FIGS. The difference is that the mounting portion 23Fb and the held portion 23Hb are arranged at different positions. FIG. 11 shows an example in which the attachment portion 23Fb is disposed near the shield member 20b, and FIG. 12 shows an example in which the held portion 23Hb is disposed near the shield member 20b.

保持体を本変形例のように構成しても、上述した実施形態と同様の作用、効果が得られる。また、取付部２３Ｆｂと被保持部２３Ｈｂとを異なる位置に配置することにより、吸引ノズルで被保持部２３Ｈｂを吸引する際には取付部２３Ｆｂに形成される孔２３ＦＨｂをシート等で塞ぐ必要はない。これによって、基板ユニットの製造コストを低減できる。   Even if the holding body is configured as in the present modification, the same operations and effects as in the above-described embodiment can be obtained. Further, by disposing the mounting portion 23Fb and the held portion 23Hb at different positions, it is not necessary to block the hole 23FHb formed in the mounting portion 23Fb with a sheet or the like when the held portion 23Hb is sucked by the suction nozzle. . Thereby, the manufacturing cost of the substrate unit can be reduced.

なお、図１２に示すように、被保持部２３Ｈｂをシールド部材２０ｂに近い部分に配置した方が、取付部２３Ｆｂとシールド部材２０ｂとの距離を小さくできる。これによって、吸引ノズルで被保持部２３Ｈｂを吸引してシールド部材２０ｂを搬送する際のバランスが向上するので好ましい。   As shown in FIG. 12, the distance between the attachment portion 23Fb and the shield member 20b can be reduced by arranging the held portion 23Hb near the shield member 20b. This is preferable because the balance when sucking the held portion 23Hb with the suction nozzle and transporting the shield member 20b is improved.

図１３に示す例は、保持体２３ｃの取付部２３Ｆｃをシールド部材２０ｃに近い部分に配置し、被保持部２３Ｈｃをシールド部材２０ｃから離れた位置に配置するとともに、被保持部２３Ｈｃの回路基板側における面が、取付部２３Ｆｃの回路基板側における面よりも反回路基板側となるようにしたものである。このようにすると、図１３に示すように、シールド部材２０ｃの近傍に、回路基板１２Ｐに取り付けられる部品２６が配置されている場合でも、被保持部２３Ｈｃはこれを回避できるので、回路基板１２Ｐの部品配置の自由度が向上する。   In the example shown in FIG. 13, the mounting portion 23Fc of the holding body 23c is arranged in a portion close to the shield member 20c, the held portion 23Hc is arranged at a position away from the shield member 20c, and the held portion 23Hc is on the circuit board side. The surface at is on the side opposite to the circuit board than the surface on the circuit board side of the attachment portion 23Fc. In this way, as shown in FIG. 13, even when the component 26 attached to the circuit board 12P is disposed in the vicinity of the shield member 20c, the held portion 23Hc can avoid this, so the circuit board 12P The degree of freedom of component placement is improved.

以上のように、本発明に係る基板ユニット及び電子機器、並びに回路基板用金属部品は、実装機により遮蔽体を保持する保持部を有する構造において、回路基板の部品実装面を効率的に利用することに有用である。   As described above, the board unit, the electronic device, and the circuit board metal component according to the present invention efficiently use the component mounting surface of the circuit board in the structure having the holding portion that holds the shield by the mounting machine. Especially useful.

１ 携帯電話機
１Ｃ 筐体
１ＣＡ 表示側筐体
１ＣＢ 操作側筐体
１２ 基板ユニット
１２Ｐ 回路基板
１２ＰＧ グランド
１２ＰＰ 部品実装面
２０、２０ａ、２０ｂ、２０ｃ シールド部材
２０ＯＢ 回路基板側開口部
２１ＣＰ 角部
２１、２１ａ 遮蔽部
２１Ａ、２１Ａａ、２１Ｂ、２１Ｂａ、２１Ｃ、２１Ｃａ、２１Ｄ、２１Ｄａ、２１Ｅ、２１Ｆ 側部
２１ＣＴ 切り欠き部
２３、２３ａ、２３ｂ、２３ｃ 保持体（金属部材保持体）
２３Ｆ、２３Ｆａ、２３Ｆｂ、２３Ｆｃ 取付部
２３ＦＨ、２３ＦＨａ、２３ＦＨｂ 孔
２３Ｈ、２３Ｈａ、２３Ｈｂ、２３Ｈｃ 被保持部
２４ シート
２５ 延出部
２６ 部品
４０、４０ａ 蓋
５０ ねじ
５１ 爪
５２ 半田 DESCRIPTION OF SYMBOLS 1 Cellular phone 1C Case 1CA Display side case 1CB Operation side case 12 Substrate unit 12P Circuit board 12PG Ground 12PP Component mounting surface 20, 20a, 20b, 20c Shield member 20OB Circuit board side opening 21CP Corner portion 21, 21a Shielding Part 21A, 21Aa, 21B, 21Ba, 21C, 21Ca, 21D, 21Da, 21E, 21F Side part 21CT Notch part 23, 23a, 23b, 23c Holding body (metal member holding body)
23F, 23Fa, 23Fb, 23Fc Mounting portion 23FH, 23FHa, 23FHb Hole 23H, 23Ha, 23Hb, 23Hc Supported portion 24 Sheet 25 Extension portion 26 Parts 40, 40a Lid 50 Screw 51 Claw 52 Solder

Claims (8)

回路基板と、
当該回路基板に取り付けられる金属部材と、
前記回路基板の部品実装面に取り付けられる取付部、及び当該取付部と一体に形成され、かつ前記回路基板へ前記金属部材を搭載する際に保持される被保持部を有し、前記金属部材に設けられる金属部材保持体と、
を含むことを特徴とする基板ユニット。 A circuit board;
A metal member attached to the circuit board;
A mounting portion attached to the component mounting surface of the circuit board; and a held portion that is formed integrally with the mounting portion and is held when the metal member is mounted on the circuit board. A metal member holder provided;
A board unit comprising: 前記金属部材保持体は、前記回路基板への取付側に配置される請求項１に記載の基板ユニット。   The board unit according to claim 1, wherein the metal member holder is disposed on an attachment side to the circuit board. 前記取付部には孔が形成され、当該孔には、前記取付部又は前記回路基板を、前記取付部又は前記回路基板の締結対象と締結する締結手段が貫通する請求項１又は２に記載の基板ユニット。   The fastening part according to claim 1 or 2, wherein a hole is formed in the attachment part, and fastening means for fastening the attachment part or the circuit board to a fastening object of the attachment part or the circuit board passes through the hole. Board unit. 前記取付部には孔が形成され、前記金属部材を前記回路基板に取り付ける前における前記孔には、熱によって溶解するシートが貼り付けられている請求項１又は２に記載の基板ユニット。   The board unit according to claim 1, wherein a hole is formed in the attachment portion, and a sheet that is melted by heat is attached to the hole before the metal member is attached to the circuit board. 前記取付部には孔が形成され、前記金属部材を前記回路基板に取り付ける前における前記孔には、ゆるみ止め剤の膜が設けられる請求項１又は２に記載の基板ユニット。   The board unit according to claim 1, wherein a hole is formed in the attachment portion, and a film of a locking agent is provided in the hole before the metal member is attached to the circuit board. 前記取付部は、前記回路基板の前記部品実装面に形成される金属導電体に接触するとともに、前記取付部と前記金属導電体とは、半田によって接合される請求項１から５のいずれか１項に記載の基板ユニット。   6. The mounting portion according to claim 1, wherein the mounting portion contacts a metal conductor formed on the component mounting surface of the circuit board, and the mounting portion and the metal conductor are joined by solder. The board unit according to item. 請求項１から６のいずれか１項に記載の基板ユニットを備えることを特徴とする電子機器。   An electronic apparatus comprising the substrate unit according to claim 1. 回路基板に取り付けられる金属部材と、
前記回路基板の部品実装面に取り付けられる取付部、及び当該取付部と一体に形成され、かつ前記回路基板へ前記金属部材を搭載する際に保持される被保持部を有し、前記金属部材に設けられる金属部材保持体と、
を含むことを特徴とする回路基板用金属部品。 A metal member attached to the circuit board;
A mounting portion attached to the component mounting surface of the circuit board; and a held portion that is formed integrally with the mounting portion and is held when the metal member is mounted on the circuit board. A metal member holder provided;
A metal part for a circuit board, comprising:
JP2009124399A 2009-05-22 2009-05-22 Substrate unit and electronic equipment, and metal component for circuit board Pending JP2010272747A (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085884A (en) * 1999-09-10 2001-03-30 Sony Computer Entertainment Inc Electromagnetic shield plate, electromagnetic shield structure and entertainment device
JP2010010524A (en) * 2008-06-30 2010-01-14 Sharp Corp Electronic device module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085884A (en) * 1999-09-10 2001-03-30 Sony Computer Entertainment Inc Electromagnetic shield plate, electromagnetic shield structure and entertainment device
JP2010010524A (en) * 2008-06-30 2010-01-14 Sharp Corp Electronic device module

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