JP2008182490A - Ground structure of function unit in electronic equipment, method for assembling electronic equipment and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately and surely position a flexible printed wiring board and a gasket during assembling. <P>SOLUTION: After an auxiliary frame 44 is attached to a main frame 45 with a main circuit board 34 attached thereto, a gasket 46 is inserted from an opening 44p of the auxiliary frame 44 to be attached to an upper surface of a ceiling board 42a of a shield body 42. Next, a camera circuit module 33 with the flexible printed wiring board 35 connected thereto is attached to the auxiliary frame 44 while the position of the gasket 46 exposing itself from the opening 44p is checked. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a functional unit grounding structure in an electronic device, an electronic device assembling method, and an electronic device, for example, an electronic camera unit grounding structure in an electronic device such as a cellular phone, an electronic device assembling method, and an electronic device. About.

  2. Description of the Related Art In recent years, mobile phones as portable electronic devices have become common not only with original call functions and data communication functions but also with electronic camera units. The sender attaches the surrounding landscape, his / her own face, etc. as image data and transmits the image data to the receiver side, and the receiver can check the state of the other party on the display.

By the way, even if an electronic camera unit is mounted, a mobile phone is required to have at least the same size as before, and the demand for downsizing, thinning, and weight reduction remains unchanged, and downsizing of the mounted electronic camera unit itself is required. Therefore, there is a demand for reduction in thickness and weight.
For this reason, for example, signal wiring is laid out on the mold resin in an MCM (multi-chip module), or a flexible printed wiring board is used for connection to a main circuit board on which a control unit, a wireless communication unit, etc. are mounted. In general, a DSP (digital signal processor) is used as a part of a camera circuit module constituting an electronic camera unit.

However, in this camera circuit module, signal wiring is arranged with high density, is not protected by shields, and signal wiring for transmitting high-speed data signals and clock signals has high impedance. There is a problem that harmonics of the data signal and the clock signal are radiated from the wiring and propagated to the main circuit board side, and for example, the reception sensitivity of the circuit of the wireless communication unit is suppressed.
In particular, when the antenna is arranged near the camera circuit module, this adverse effect is remarkable.

  In addition, for example, a transmission wave from the wireless communication unit of the main circuit board enters the camera circuit module, for example, adversely affects the analog signal output from the imaging device (image sensor) as noise and disturbs the image signal. was there. This phenomenon is prominent particularly when packet transmission or burst transmission such as PDC is performed.

  For this reason, for example, when a metal member is used as a housing, the housing and the grounding can be used so that a stable ground potential can be reliably obtained on the ground wiring of the camera circuit module. The wiring is electrically connected using a lead wire (strap wire) (for example, refer to Patent Document 1).

However, in order to solder the lead wire to the camera circuit module and the housing, a considerable gap is required between the camera circuit module and the housing, the thickness of the housing is increased, the size is reduced, There is a problem in that the thickness and weight are hindered.
Even when a resin member is used as the housing, for example, a predetermined portion of the flexible printed wiring board that connects the camera circuit module and the main circuit board is connected to the main circuit via an elastic and conductive gasket. A technique has been proposed in which the ground potential of the camera circuit module and the main circuit board is electrically connected to the ground wiring of the board and the ground potential is stabilized by electrical connection.

Here, a conductive portion having a relatively large area connected to the ground wiring of the flexible printed wiring board through a through hole is formed at the predetermined portion of the flexible printed wiring board, and the conductive portion and the main circuit board are provided. With a gasket interposed between the grounded conductive portion and the gasket being compressed and deformed, the conductive portion of the flexible printed wiring board is connected to the grounded conductive portion, and the camera circuit module and the main circuit board are connected. The ground wiring is electrically connected.
JP-A-1-307373

The problem to be solved is that, in the above-described conventional technique, it is difficult to accurately perform positioning particularly when the conductive portion of the flexible printed wiring board is brought into contact with the gasket.
That is, after placing the gasket in the conductive area of the main circuit board, when placing the camera circuit module to which the flexible printed wiring board is connected, the gasket cannot be seen. Cannot be accurately aligned.

  For this reason, in particular, the contact portion between the conductive portion of the flexible printed wiring board and the gasket is displaced from each other, and the contact between the conductive portion formed on the flexible printed wiring board and the gasket becomes incomplete, and the main circuit board The connection between the grounded conductive part and the conductive part of the flexible printed wiring board through the gasket is incomplete, and the ground wiring of the main circuit board and the ground wiring of the flexible printed wiring board (and the ground wiring of the camera circuit module) ) Is not reliably connected and grounding is not reliably performed.

  The present invention has been made in view of the above-described circumstances, and at the time of assembly, for example, it is possible to accurately and reliably align a functional unit such as a camera circuit module and a grounding conductive member such as a gasket. It is an object to provide a grounding structure of a functional unit in an electronic device, an electronic device assembly method, and an electronic device.

  In order to solve the above-mentioned problems, the invention described in claim 1 is characterized in that a functional unit driven by an electronic circuit and having a function for achieving a predetermined object is mounted on the internal holding base in a state where the functional unit is grounded. The functional unit is placed in an electronic device casing and is installed in an electronic device casing, and the functional unit is positioned and installed in an opening provided in the internal holding base. It is characterized by being functionally grounded via a member.

  The invention according to claim 2 has a function main body and a wiring board connected to the function main body for inputting / outputting signals to / from the outside, and has a function for achieving a predetermined purpose. The functional unit provided is functionally grounded, is placed on an internal holding base, and is housed in an electronic device casing. The functional unit is mounted on an electronic device. It is characterized in that it is functionally grounded via a grounding conductive member positioned and installed in an opening provided in the internal holding base.

  The invention according to claim 3 relates to a grounding structure of the functional unit in the electronic device according to claim 1 or 2, wherein the functional unit is connected to the high-frequency circuit and / or the high-speed circuit via the grounding conductive member. It is characterized in that it is connected to a shield for electromagnetic shielding and is functionally grounded.

  According to a fourth aspect of the present invention, there is provided the functional unit grounding structure in the electronic device according to the third aspect, wherein a pressing rib is formed on the inner surface of the electronic device casing and is mounted on the internal holding base. The functional unit, the shield, and the grounding conductive member interposed between the functional unit and the shield are housed in the electronic device casing. The portion facing the contact portion with the grounding conductive member is pressed by the rib, and at the contact portion, the functional unit and the grounding conductive member press each other, and the shield The grounding conductive member is in close contact with the functional unit and the shielding body when the shielding body and the grounding conductive member press each other at a contact portion with the grounding conductive member. As a feature That.

  According to a fifth aspect of the present invention, there is provided a functional unit grounding structure in the electronic device according to the second aspect, wherein the functional main body portion is connected to the high-frequency circuit or / or via the wiring board and the grounding conductive member. The functional unit is connected to a shield for electromagnetically shielding the high-speed circuit and is functionally grounded, and a pressing rib is formed on the inner surface of the electronic device casing and is placed on the internal holding base. And the grounding conductive member of the wiring board in a state in which the shield and the grounding conductive member interposed between the wiring board and the shield are housed in the electronic device casing. The part opposite to the contact part is pressed by the rib, the wiring board and the grounding conductive member press each other at the contact part, and the grounding conductive member of the shield At the contact point with the shield and the ground By the conductive member presses each other, the grounding conductive member is characterized by being in close contact to the wiring board and the shield.

  According to a sixth aspect of the present invention, there is provided a functional unit grounding structure in the electronic device according to any one of the first to fifth aspects, wherein the functional unit is overlaid on the grounding conductive member. The grounding conductive member is positioned and installed in the opening so that a part of the grounding conductive member protrudes from the functional unit and is visible.

  According to a seventh aspect of the present invention, an electronic apparatus includes the grounding structure of the functional unit in the electronic apparatus according to any one of the first to sixth aspects.

  According to the eighth aspect of the present invention, there is provided an electronic apparatus in which a functional unit driven by an electronic circuit and having a function for achieving a predetermined object is placed on an internal holding base in a state of functional grounding. In connection with an assembling method of an electronic device housed in a housing, a grounding conductive member is positioned and installed in an opening provided in the internal holding base, and the functional unit is functionally grounded via the grounding conductive member. It is characterized by having a process of performing.

  The invention according to claim 9 has a function main body and a wiring board connected to the function main body for inputting / outputting signals to / from the outside, and has a function for achieving a predetermined purpose. The functional unit provided is placed on the internal holding base in a functionally grounded state, and relates to a method for assembling the electronic equipment housed in the electronic equipment casing, and is grounded to the opening provided in the internal holding base. The conductive member is positioned and installed, and the functional unit is functionally grounded via the grounding conductive member.

  According to a tenth aspect of the present invention, there is provided the electronic device assembling method according to the eighth or ninth aspect, wherein the functional unit is mounted on the internal holding base after the grounding conductive member is positioned and installed in the opening. It is characterized by placing.

  According to an eleventh aspect of the invention, there is provided the electronic device assembling method according to the eighth or ninth aspect, wherein the grounding conductive member is positioned and installed in the opening of the internal holding base on which the functional unit is placed. It is characterized by that.

  According to the configuration of the present invention, the functional unit is functionally grounded via the grounding conductive member positioned and installed in the opening provided in the internal holding base. The functional unit can be brought into contact with the grounding conductive member while visually confirming the exposed grounding conductive member and confirming its position, so that the alignment between the functional unit and the grounding conductive member can be accurately and reliably performed. It can be carried out.

  The functional unit is functionally grounded via a grounding conductive member positioned and installed in an opening provided in the internal holding base, so that the grounding conductive member exposed from the opening of the internal holding base is assembled during assembly. The functional unit can be brought into contact with the grounding conductive member while visually recognizing and confirming its position, and the purpose of accurately and reliably aligning the functional unit and the grounding conductive member has been realized.

  FIG. 1 is an exploded perspective view showing an exploded configuration of a main part of a mobile phone according to a first embodiment of the present invention, FIG. 2 is an open front view showing the configuration of the mobile phone, and FIG. FIG. 4 is a block diagram showing the configuration of the mobile phone, FIG. 5 is a cross-sectional view for explaining the configuration of the grounding structure of the mobile phone, and FIG. FIG. 7 is a plan view showing a configuration of an auxiliary frame to which the electronic camera unit of the cellular phone is attached, and FIG. 7 is a configuration in a portion where a gasket of a flexible printed wiring board connected to the camera circuit module of the electronic camera unit is arranged. FIG. 8 is a bottom view showing the configuration of the flexible printed wiring board, and FIG. 9 is a cross-sectional view showing the configuration of the gasket used in the grounding structure.

  The mobile phone 1 of this example has a photographing function by a built-in electronic camera in addition to the original call function and data communication function, and as shown in FIGS. 2 and 3, a foldable casing 2 The upper unit 3 and the lower unit 4 are coupled to each other by a hinge portion 5 so as to be foldable.

The upper housing 6 (lower housing 7) constituting the housing 2 is made of a synthetic resin molded product such as ABS resin, for example, and as shown in FIGS. 2 and 3, the front case 8 constituting the inner surface side, respectively. (9) and a rear case 11 (12) constituting the outer surface side, and the assembled front case 8 (9) and rear case 11 (12) are fitted by a rib, Various components are assembled or assembled in a state where they are housed or attached by fastening with a fixing tool such as a male screw.
Further, as shown in FIG. 5, a rib 11 a that presses a gasket arrangement site on the upper surface of the flexible printed wiring board 35 is formed at a predetermined site on the back surface of the rear case 11. A photographing window 11b is formed at a portion of the rear case 11 corresponding to the camera lens 31.

  As shown in FIGS. 2 to 4, the mobile phone 1 includes a control unit 14 that controls each component of the mobile phone body, and a storage unit that stores processing programs executed by the control unit 14, various data, and the like. 15, for example, an electronic camera unit 16 that captures surrounding scenery, a person, and the like, an antenna 17 that transmits and receives radio waves, a wireless communication unit 18 that is used to perform a call and data communication according to a predetermined protocol, The voice receiving unit 19 that outputs voice, the voice output unit 21 that outputs a ring tone when receiving an incoming call, and the liquid crystal display device disposed on the inner side (inner side) when folded, for example, a function setting screen, A main display unit 22 for displaying a receiving screen and the like, an auxiliary display unit 23 made of a liquid crystal display device disposed on the outer side (outer side) at the time of folding, and having an LED, for example, when receiving a call or during a call A light emitting unit 24 that emits light, an operation unit 25 that includes a number of various operation keys for performing operations such as inputting numbers and characters, a transmitter unit 26 that includes a microphone that inputs a transmitted voice, and an incoming call by vibration, for example. Is provided with a vibration unit 27 and a power supply unit 28 having a battery pack.

  The control unit 14 includes a CPU. For example, a display control program for displaying image data obtained by the electronic camera unit 16 on the main display unit 22, a browser as a program for browsing a home page, an electronic Various processing programs stored in the storage unit 15 such as a mailer as a program for creating and sending / receiving mails are executed, and each component is controlled using various registers and flags secured in the storage unit 15.

  The storage unit 15 includes a semiconductor memory such as a ROM and a RAM. The storage unit 15 is photographed by various processing programs such as the display control program executed by the control unit 14, received information, and the electronic camera unit 16. Various information such as image data is stored, and various registers and flags used when the control unit 14 executes the program are secured.

  As shown in FIGS. 1 and 4, the electronic camera unit 16 receives light coming from a subject, for example, a lens barrel 32 containing a camera lens 31 made of a standard lens, and a predetermined image signal. It has a camera circuit module 33 incorporating a DSP and the like, and a flexible printed wiring board 35 for connecting the camera circuit module 33 and the main circuit board 34.

  As shown in FIG. 4, the camera circuit module 33 includes an imaging device 36 including a CMOS imaging device that photoelectrically converts an image formed via the camera lens 31 and outputs an image signal as an electrical signal, and an imaging device. An A / D conversion unit 37 that performs A / D conversion on the image signal sent from 36, and an image processing unit 38 that performs image processing such as gamma conversion and color space conversion on the digitized signal.

  As shown in FIGS. 1 and 5, the electronic camera unit 16 is mounted on the main circuit board 34 and connected to a corresponding CPU 41 constituting the control unit 14 by a flexible printed wiring board 35. The CPU 41 is covered with a tray-like shield body 42 that is maintained at substantially the same potential as a predetermined portion on the ground wiring of the main circuit board 34 set as the ground reference point, and the upper and sides are covered. Shielded.

The flexible printed wiring board 35 has one end connected to the camera circuit module 33 and the other end connected to a connector 43 mounted on the main circuit board 34, and is connected to the CPU 41 via the connector 43. Has been.
The camera circuit module 33 is attached to the auxiliary frame 44, and the main frame 45 to which the main circuit board 34 is attached and the auxiliary frame 44 to which the camera circuit module 33 is attached are combined to form the upper casing 6 Attached to the front case 8.

In this example, as shown in FIGS. 1, 5, and 7, the ground wiring of the flexible printed wiring board 35 has the gasket 46 so that a stable ground potential can be obtained on the ground wiring of the camera circuit module 33. And is connected to the shield body 42 for functional grounding.
That is, in the ground structure 47 of this example, the ground wiring of the flexible printed wiring board 35 connected to the camera circuit module 33 has conductivity and elasticity to the shield body 42 connected to the ground wiring of the main circuit board 34. The flexible printed wiring is connected through the gasket 46, and the gasket 46 is inserted into the opening 44p formed in the auxiliary frame 44 to which the electronic camera unit 16 is attached and is deformed by receiving a compressive load. It is schematically configured by being interposed between the plate 35 and the shield body 42.

As shown in FIG. 6, the auxiliary frame 44 includes an electronic camera mounting portion 44a for mounting the camera circuit module 33 and the like, and a liquid crystal panel mounting portion 44b for mounting the liquid crystal panel of the auxiliary display portion 23 and the like. Yes.
The electronic camera mounting portion 44a is formed with a rectangular opening 44p through which the gasket 46 is inserted and attached to the upper surface of the ceiling plate 42a of the shield body 42. As a result, the entire upper surface of the gasket 46 is exposed when the flexible printed wiring board 35 is not overlaid on the gasket 46. The dimension of the opening 44p is set slightly larger than the cross-sectional dimension of the gasket 46.
Further, the displacement of the gasket 46 is restricted by the inner wall surface of the opening 44p. For example, even if the double-sided adhesive tape 53 attached to the lower surface of the gasket 46 is peeled off, the gasket 46 may fall off the opening 44p. Is prevented.

  The electronic camera mounting portion 44a of the auxiliary frame 44 is formed with claw portions 44q, 44q, 44q for mounting the camera circuit module 33 in a state of being positioned on the auxiliary frame 44, and each claw portion 44q is a camera circuit module. The camera circuit module 33 is attached to the auxiliary frame 44 in a state where the flexible printed wiring board 35 is attached by engaging with a predetermined portion of the upper surface of the circuit board constituting the 33.

  Further, claw portions 44r and 44r for assembling the auxiliary frame 44 in a state of being positioned on the main circuit board 34 are formed on the peripheral edge portion of the liquid crystal panel mounting portion 44b of the auxiliary frame 44, and each claw portion 44r is connected to the main circuit. By engaging with a predetermined portion of the lower surface of the substrate 34, the auxiliary frame 44 is assembled while being positioned on the main circuit substrate 34 with the main circuit substrate 34 sandwiched between the main frame 45.

  Thus, when the gasket 46 is inserted from the opening 44p in a state where the auxiliary frame 44 not attached with the camera circuit module 33 is assembled to the main circuit board 34, the gasket 46 is placed on the upper surface of the ceiling plate 42a of the shield body 42. When the camera circuit module 33 is attached to the auxiliary frame 44, the conductive portion 35j on the lower surface side of the flexible printed wiring board 35 is positioned and brought into contact with the upper surface of the gasket 46, and the flexible printed circuit board is mounted. Even when the wiring board 35 is overlaid on the gasket 46, a part of the gasket 46 is exposed so as to be visible.

Further, when the mobile phone 1 is assembled by fitting the front case 8 and the rear case 11 of the upper housing 6 to each other or by fastening them using a fixing tool such as a male screw or a female screw, the rear surface of the rear case 11 is assembled. The upper surface of the flexible printed wiring board 35 is press-contacted by the rib 11a formed on the gasket 11 so that the gasket 46 inserted between the flexible printed wiring board 35 and the shield body 42 is deformed by receiving a compressive load. Thus, the repulsive force presses itself against the flexible printed wiring board 35 and the shield body 42, and the flexible printed wiring board 35 and the shield body 42 are surely electrically connected.
Here, the rib 11a is set to be approximately the same size as the cross-sectional dimension of the gasket 46, and is formed at a location corresponding to the location of the opening 44a.

As shown in FIGS. 7 and 8, the flexible printed wiring board 35 includes a signal wiring for connecting, for example, a signal wiring of a circuit constituting the camera circuit module 33 and a signal wiring of the main circuit board 34, and a camera circuit. Wiring layers 35a and 35b including a ground wiring for connecting the circuit of the module 33 and a ground wiring for the main circuit board 34; an insulating layer 35c for insulating the wiring layers 35a and 35b; Insulating layers 35d and 35e formed on the upper layer side of the wiring layer 35a and on the lower layer side of the wiring layer 35b, respectively, and the wiring layers 35a and 35b and the insulating layer are in the contact region with the gasket 46 and in the vicinity thereof. In addition to 35c, 35d, and 35e, conductive layers 35f and 3 formed by using, for example, silver paste on the upper layer side of the insulating layer 35d and the lower layer side of the insulating layer 35e, respectively. g and, the upper side of the conductive layer 35f (uppermost layer), the lower-side protective layer formed respectively on the (bottom layer) of conductive layer 35 g 35h, which is and a 35i.
The insulating layer 35c is formed with through holes for connecting the power supply wires constituting the wiring layers 35a and 35b and the ground wires. In addition, predetermined portions of the insulating layers 35d and 35e are removed and filled with a conductive material, and the ground wiring and the conductive layers 35f and 35g constituting the wiring layers 35a and 35b are connected to each other.
In the contact area, a conductive portion 35j is formed by removing the protective layer 35i and filled with a conductive material, and the ground wiring constituting the wiring layers 35a and 35b is connected to the shield body 42 via the gasket 46. Electrically connected.

As shown in FIG. 9, the gasket 46 has a substantially rectangular parallelepiped sponge portion 51 made of urethane foam and the like, and a conductive cloth portion 52 that covers the sponge portion 51. It is stuck on the ceiling part 42a.
The gasket 46 is affixed to the upper surface of the ceiling plate 42a of the shield body 42, is interposed between the conductive portion 35j of the flexible printed wiring board 35 and the shield body 42, and the front case 8 and the rear of the upper housing 6 are disposed. A rib 11a formed on the back surface of the rear case 11 when the mobile phone 1 is assembled by fitting the case 11 with each other or tightening with a fixing tool such as a male screw or a female screw. The flexible printed wiring board 35 is inserted between the flexible printed wiring board 35 and the upper surface of the ceiling plate 42a of the shield body 42 in a state of being deformed by receiving a compressive load. 35 and the shield body 42, and a function for reliably connecting the flexible printed wiring board 35 and the shield body 42. It has.

The wireless communication unit 18 includes, for example, an RF circuit, a modulation / demodulation circuit, a baseband processing circuit, and the like. The wireless communication unit 18 modulates voice and data and transmits the radio wave via the antenna 17 and transmits the radio wave via the antenna 17. Are received and demodulated into voice and data, and used for telephone conversation and data communication according to a predetermined protocol.
In this example, the wireless communication unit 18 is also used to perform data communication as a wireless communication unit constituting a wireless LAN (Local Area Network) device.

The operation unit 25 selects a shooting mode that enables shooting with the electronic camera unit 16 and also uses a shooting mode key that also functions as a shutter button, a mail mode selection key for creating and sending / receiving e-mails, and voice communication. Call mode selection key used for the browser, browser mode selection key for starting the browser to browse the home page, clear key for displaying the standby screen from the shooting mode, etc. and shifting to the standby mode for waiting for operations and incoming calls A power key, a numeric keypad for inputting numbers, etc., a cursor key for moving the cursor on the display screen displayed on the main display unit 22 in the vertical and horizontal directions, and the like are arranged.
The main display unit 22 includes a liquid crystal panel on which a standby screen, a function setting screen, and the like are displayed, a backlight device that provides illumination light to the liquid crystal panel, and a drive circuit that drives the liquid crystal panel. And is connected to the main circuit board 34.

Next, with reference to FIG. 1 and FIG. 5, an assembling method of the cellular phone 1 of this example will be described.
First, as shown in FIGS. 1 and 5, the auxiliary frame 44 not attached with the camera circuit module 33 is attached to the main frame 45 to which the main circuit board 34 is attached.
That is, by engaging the claws 44 r and 44 r formed on the auxiliary frame 44 with a predetermined portion on the lower surface of the main circuit board 34, the auxiliary frame 44 sandwiches the main circuit board 34 with the main frame 45. Thus, the main circuit board 34 is assembled while being positioned. Here, the opening 44 p of the auxiliary frame 44 is positioned and arranged on the upper surface of the ceiling plate 42 a of the shield body 42.

Next, the gasket 46 is inserted from the opening 44p of the auxiliary frame 44, and attached to the upper surface of the ceiling plate 42a of the shield body 42 using the double-sided adhesive tape 53.
Next, the camera circuit module 33 to which the flexible printed wiring board 35 is connected is attached to the auxiliary frame 44 while confirming the position of the gasket 46 exposed from the opening 44a.
That is, by engaging the claw portions 44q, 44q, 44q formed on the auxiliary frame 44 with a predetermined portion on the upper surface of the circuit board constituting the camera circuit module 33, the camera circuit module 33 is connected to the flexible printed wiring board 35. Is attached to the auxiliary frame 44.

Thereby, the upper surface of the gasket 46 is positioned and brought into contact with the conductive portion 35j on the upper surface side of the flexible printed wiring board 35. In addition, it is confirmed that a part of the gasket 46 is exposed so as to be visible to the outside of the flexible printed wiring board 35 and is securely in contact with the conductive portion 35j of the flexible printed wiring board 35.
Therefore, the camera circuit module 33 is attached to the auxiliary frame 44 while being positioned, and the gasket 46 is surely brought into contact with the conductive portion 35j of the flexible printed wiring board 35 while visually checking the gasket 46. It is confirmed.

Next, the other end of the flexible printed wiring board 35 is connected to the connector 43.
Next, the front case 8 and the rear case 11 constituting the outer surface side are combined and assembled by fitting in the rib 11a.
As a result, the rib 11 a formed on the back surface of the rear case 11 presses the portion facing the conductive portion 35 j on the upper surface of the flexible printed wiring board 35, and the gasket 46 is elastically deformed. Thus, the ground wiring 35a of the flexible printed wiring board 35 and the shield body 42 are stably electrically connected.

Thus, according to the configuration of this example, the claw portions 44r and 44r for attaching the auxiliary frame 44 to the main circuit board 34 in a state of being positioned on the peripheral portion of the liquid crystal panel attachment portion 44b of the auxiliary frame 44 are provided. The claw portions 44r are formed and engaged with predetermined portions of the lower surface of the main circuit board 34, whereby the auxiliary frame 44 is positioned on the main circuit board 34 with the main circuit board 34 sandwiched between the main frame 45. Can be assembled.
Accordingly, when the gasket 46 is inserted from the opening 44p with the auxiliary frame 44 not attached to the camera circuit module 33 attached to the main circuit board 34, the gasket 46 is placed on the upper surface of the ceiling plate 42a of the shield body 42. Positioned and arranged.

The electronic camera mounting portion 44a of the auxiliary frame 44 is formed with claw portions 44q, 44q, 44q for mounting the camera circuit module 33 in a state of being positioned on the auxiliary frame 44, and each claw portion 44q is a camera circuit module. The camera circuit module 33 can be attached to the auxiliary frame 44 in a state where the flexible printed wiring board 35 is attached by engaging with a predetermined portion of the upper surface of the circuit board constituting the 33.
Thus, when the camera circuit module 33 is attached to the auxiliary frame 44, the conductive portion 35 j on the upper surface side of the flexible printed wiring board 35 is positioned and brought into contact with the upper surface of the gasket 46.

In addition to these, when the camera circuit module 33 to which the flexible printed wiring board 35 is attached is attached to the auxiliary frame 44, the conductive portion 35 h on the lower surface of the flexible printed wiring board 35 is visible while viewing the gasket 46 exposed from the opening 44 p. After confirming that the upper surface of the gasket 46 is in contact, the camera circuit module 33 can be mounted with more accurate and reliable alignment.
Further, even after the flexible printed wiring board 35 is placed on the gasket 46, a part of the gasket 46 is exposed so as to be visible outside the flexible printed wiring board 35 and is securely in contact with the flexible printed wiring board 35. Therefore, it is possible to accurately and reliably position the flexible printed wiring board 35 with respect to the gasket 46. In addition, forgetting to attach the gasket 46 can be prevented, and the defect rate can be improved.
Further, by restricting the displacement of the gasket 46 on the inner wall surface of the opening 44p, for example, even if the double-sided adhesive tape 53 attached to the lower surface of the gasket 46 is peeled off, the gasket 46 may fall off the opening 44p. Can be prevented. Therefore, for example, it is possible to avoid the occurrence of a short circuit or the like of the chip components by dropping the gasket 46 on the main circuit board 34.

  Thus, the contact portion between the ceiling portion 42a of the shield body 42 and the gasket 46 and the contact portion between the conductive portion 35j of the flexible printed wiring board 35 and the gasket 46 are both accurately aligned, so that the flexible printed wiring board 35 is aligned. The conductive portion 35j formed on the lower surface of the substrate and the gasket 46 are securely contacted, and the shield 42 provided on the main circuit board 34 and the conductive portion 35j of the flexible printed wiring board 35 are connected via the gasket 46. Thus, the ground wiring of the main circuit board 34 and the ground wiring of the flexible printed wiring board 35 (and the ground wiring of the camera circuit module 33) can be securely connected, and the grounding can be reliably strengthened.

  Further, when the mobile phone 1 is assembled by fitting the front case 8 and the rear case 11 of the upper housing 6 to each other or by fastening them using a fixing tool such as a male screw or a female screw, the rear surface of the rear case 11 is assembled. The flexible printed wiring board 35 is press-contacted by the rib 11a formed on the gasket 11, and a gasket 46 inserted between the flexible printed wiring board 35 and the shield body 42 is sandwiched between the shield body 42 and the flexible printed wiring board 35. Since it is deformed by receiving a compressive load, it is pressed against the flexible printed wiring board 35 and the shield body 42 by a repulsive force, and the electrical connection between the flexible printed wiring board 35 and the shield body 42 is ensured. This contributes to the downsizing, thinning, and weight reduction of the housing without interfering with downsizing. It can be enhanced.

Therefore, the ground potential of the camera circuit module 33 can be obtained reliably and stably, and noise radiation from the camera circuit module can be suppressed.
For example, since unnecessary radiation from signal wiring such as a data signal and a clock signal is reduced, suppression of reception sensitivity of the wireless communication unit is prevented, and a stable wireless function can be maintained. In addition, it is possible to reduce the influence of wireless noise on the camera image.

  Further, since the shield body 42 used for electromagnetic shielding of the CPU 41 is used as the grounding conductive portion, there is no need to increase the number of components and to secure a new space. Without increasing the size, and does not hinder downsizing and thinning.

This example is greatly different from the first embodiment described above. In the first embodiment, the auxiliary frame not attached with the camera circuit module is attached to the main circuit board, whereas the auxiliary frame attached with the camera circuit module is attached. The frame is configured to be attached to the main circuit board.
Since the other configuration is substantially the same as that of the first embodiment described above, the description thereof will be simplified.

In order to assemble a mobile phone in this example, first, the camera circuit module 33 is attached to the auxiliary frame 44. Next, the auxiliary frame 44 is assembled to the main circuit board 34.
Next, in a state where the flexible printed wiring board 35 is attached to the camera circuit module 33 and slightly bent, a gasket 46 is inserted through the opening 44p, and a double-sided adhesive tape is applied to the upper surface of the ceiling board 42a of the shield body 42. Paste using 53.
Next, the flexible printed wiring board 35 is returned and brought into contact with the gasket 46. Here, the gasket 46 exposed to the outside of the flexible printed wiring board 35 is visually confirmed, and it is confirmed that the flexible printed wiring board 35 is securely contacted.
Thereafter, assembling is performed in the same manner as in the first embodiment.

  According to the configuration of this example, substantially the same effect as that of the first embodiment described above can be obtained.

The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and there are design changes and the like without departing from the gist of the present invention. Are also included in the present invention.
For example, in the above-described embodiment, the case where a shield body for shielding a component (e.g., CPU) is used as the ground conductive portion has been described. However, a shield body may be newly disposed, A gasket may be directly connected to the ground wiring on the main circuit board.

Moreover, although the case where it applied to a mobile phone as electronic equipment was described, not only a mobile phone but a simple portable telephone (PHS) terminal or a portable information terminal (PDA) having a wireless communication function may be used, for example. The same effect as in the case of a mobile phone can be obtained.
Further, it may be a notebook personal computer or the like having a wireless communication function and incorporating a camera. In the case of a mobile phone, the mobile phone is not limited to a foldable mobile phone, and may be a straight type mobile phone.
Further, the present invention can be applied to a case where a TCP (Tape Carrier Package) is used as a flexible printed circuit instead of an FPC (Flexible Printed Circuit).

  In addition to the electronic camera unit, it can be applied to functionally ground other functional units such as a main display unit and an auxiliary display unit.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view showing an exploded configuration of a main part of a mobile phone according to a first embodiment of the present invention. It is a front view of the open state which shows the structure of the mobile phone. It is a rear view of the open state which shows the structure of the mobile phone. It is a block diagram which shows the structure of the mobile phone. It is sectional drawing for demonstrating the structure of the grounding structure of the mobile phone. It is a top view which shows the structure of the auxiliary | assistant frame to which the electronic camera unit of the mobile phone is attached. It is sectional drawing which shows typically the structure in the site | part by which the gasket of the flexible printed wiring board connected to the camera circuit module of the electronic camera unit is arrange | positioned. It is a bottom view which shows the structure of the flexible printed wiring board. It is sectional drawing which shows the structure of the gasket used in the grounding structure.

Explanation of symbols

1 Mobile phone (electronic equipment)
2 Housing 6 Upper housing (electronic equipment housing)
7 Lower housing 11 Rear case 11a Rib 16 Electronic camera unit (functional unit)
33 Camera circuit module (functional main unit)
34 Main circuit board (circuit board)
35 Flexible printed wiring boards (wiring boards)
35h Conductive part 41 CPU (electronic component)
42 Shield body (shield body)
44 Auxiliary frame (internal holding base)
44p opening (opening)
45 Main frame 46 Gasket (conductive member for grounding)
47 Grounding structure (grounding structure for electronic equipment function unit)

Claims (11)

An electronic device, which is driven by an electronic circuit and has a function for achieving a predetermined purpose, is placed on an internal holding base in a state of functional grounding, and is housed in an electronic device casing. It is a grounding structure of the installed functional unit,
A functional unit grounding structure in an electronic device, wherein the functional unit is functionally grounded via a grounding conductive member positioned and installed in an opening provided in the internal holding base. A functional unit having a function main body and a wiring board connected to the function main body for inputting / outputting signals to / from the outside and having a function for achieving a predetermined purpose is functionally grounded. In the state, the grounding structure of the functional unit mounted on the electronic device, placed on the internal holding base and housed in the electronic device casing,
A functional unit grounding structure in an electronic device, wherein the functional unit is functionally grounded via a grounding conductive member positioned and installed in an opening provided in the internal holding base.   The functional unit is connected to a shield for electromagnetically shielding a high-frequency circuit and / or a high-speed circuit via the grounding conductive member, and is functionally grounded. A functional unit grounding structure in the electronic device described. On the inner surface of the electronic device casing, a pressing rib is formed,
The functional unit mounted on the internal holding base, the shield, and the grounding conductive member interposed between the functional unit and the shield are housed in the electronic device casing. In state,
The portion of the functional unit that faces the contact portion with the grounding conductive member is pressed by the rib, and at the contact portion, the functional unit and the grounding conductive member press each other, and When the shielding body and the grounding conductive member press each other at a contact portion of the shielding body with the grounding conductive member, the grounding conductive member is in close contact with the functional unit and the shielding body. The grounding structure of the functional unit in the electronic device according to claim 3, wherein the functional unit is grounded. The functional main body is connected to a shield for electromagnetically shielding a high-frequency circuit or / and a high-speed circuit via the wiring board and the grounding conductive member, and is functionally grounded.
On the inner surface of the electronic device casing, a pressing rib is formed,
The functional unit placed on the internal holding base, the shield, and the grounding conductive member interposed between the wiring board and the shield are housed in the electronic device casing. In state,
The portion of the wiring board facing the contact portion with the grounding conductive member is pressed by the rib, and at the contact portion, the wiring board and the grounding conductive member press each other, and When the shielding body and the grounding conductive member press each other at a contact portion of the shielding body with the grounding conductive member, the grounding conductive member is in close contact with the wiring board and the shielding body. The grounding structure of the functional unit in the electronic device according to claim 2, wherein the grounding structure is a functional unit.   In a state where the functional unit is overlaid on the grounding conductive member, the grounding conductive member may be visible from the functional unit so that a part of the grounding conductive member protrudes from the functional unit. The grounding structure of the functional unit in the electronic device according to claim 1, wherein the grounding structure is disposed on the electronic device.   An electronic device comprising a grounding structure for a functional unit in the electronic device according to claim 1. Assembly of an electronic device that is driven by an electronic circuit and is mounted on an internal holding base in a state in which a functional unit having a function for achieving a predetermined purpose is functionally grounded and housed in an electronic device casing A method,
An assembly of an electronic device comprising: a step of positioning and installing a grounding conductive member in an opening provided in the internal holding base and functionally grounding the functional unit via the grounding conductive member Method. A functional unit having a function main body and a wiring board connected to the function main body for inputting / outputting signals to / from the outside and having a function for achieving a predetermined purpose is functionally grounded. In the state, the electronic device is mounted on the internal holding base and accommodated in the electronic device casing.
An assembly of an electronic device comprising: a step of positioning and installing a grounding conductive member in an opening provided in the internal holding base and functionally grounding the functional unit via the grounding conductive member Method.   10. The electronic device assembling method according to claim 8, wherein the functional unit is placed on the internal holding base after the grounding conductive member is positioned and installed in the opening.   10. The electronic device assembling method according to claim 8, wherein the grounding conductive member is positioned and installed in the opening of the internal holding base on which the functional unit is placed.

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