JP5468800B2 - Substrate unit and electronic device - Google Patents

Description

The present invention relates around the electronic components fixed to the circuit board to the substrate unit and the electronic equipment that surrounded by the shield.

  Various electric and electronic devices such as portable information devices such as cellular phones and PDAs, and personal computers include a substrate unit in which electronic components are mounted on a circuit board. In recent years, from the viewpoint of reducing the influence of electromagnetic waves radiated from an electronic component or protecting the electronic component from noise, there is a type in which a shield is provided around the electronic component fixed to a circuit board. In many cases, the board unit automatically mounts electronic components and shields on a circuit board using a mounting machine from the viewpoint of labor saving. For example, Patent Document 1 discloses a technique in which a frame body that covers a shield cover is connected by a suction portion, the connection portion is sucked by a suction nozzle of a mounting machine, the frame is transported to a circuit board, and mounted. .

JP-A-2008-28342 [0009], [0010]

  By the way, with the downsizing of the board unit, there is a demand to arrange a portion held by the component holding unit of the mounting machine, which is provided on the shield disposed around the electronic component, at a position facing the electronic component. However, when using a mounting machine, when placing the shield on the circuit board, the suction means of the mounting machine pushes the part toward the electronic part, so that the part contacts the electronic part. There is a fear. The present invention has been made in view of the above, and in attaching the shield to the circuit board, a portion provided on the shield and held by the component holding portion of the mounting machine may come into contact with the electronic component. It aims at reducing.

In order to solve the above-described problems and achieve the object, a board unit according to the present invention is composed of a circuit board, an electronic component mounted on the circuit board, and a conductive material, and is attached to the circuit board. A frame member, and a shield member that is made of a conductive material and is attached to the opposite side of the frame member to the circuit board, and a shield member that is electrically connected to the ground of the circuit board. The frame member is provided to protrude in a direction away from the circuit board from a side wall portion arranged around the electronic component and an end portion on the opposite side of the side wall portion from the attachment side to the circuit board. together, and a held portion that is movable in the direction towards the circuit board, the held portion includes an arm portion projecting from the side wall portion, from the end of the side wall portion of the arm portion opposite A flat plate portion extending, When Kifuta member is attached to said frame member, characterized in that said plate is in contact with the lid member.

  As a preferred aspect of the present invention, in the substrate unit, when the lid member is attached to the frame member, it is desirable that the flat plate portion contacts the lid member in a state where the arm portion is elastically deformed.

In a preferred embodiment of the present invention, in the substrate unit, the held portion of which is desirably disposed in a central portion of the side wall portion.

  As a preferred aspect of the present invention, in the substrate unit, it is desirable that the flat plate portion is supported by a double-supported structure by the two arm portions.

  As a preferred aspect of the present invention, in the substrate unit, the flat plate portion is preferably supported by a single arm portion in a cantilever structure.

In a preferred embodiment of the present invention, in the substrate unit, the held portion is preferably disposed in a position facing the electronic component.

  In order to solve the above-described problems and achieve the object, an electronic apparatus according to the present invention includes the substrate unit.

  According to the present invention, when attaching the shield to the circuit board, it is possible to reduce a possibility that a portion provided on the shield and held by the component holding portion of the mounting machine contacts the electronic component.

FIG. 1 is an overall view illustrating an example of an electronic apparatus including a substrate unit according to the present embodiment. FIG. 2 is an exploded perspective view of the structure incorporated in the operation-side casing. FIG. 3 is a plan view of the substrate unit built in the operation-side casing. FIG. 4 is a perspective view showing a shield member according to the present embodiment. FIG. 5 is a plan view of the shield member according to the present embodiment. FIG. 6 is a cross-sectional view showing a state in which the shield member according to the present embodiment is attached to the circuit board and surrounds the BGA. FIG. 7 is a view showing a state when the shield member according to the present embodiment is attached to the circuit board. FIG. 8 is a perspective view showing a conventional shield member. FIG. 9 is a diagram showing a state when a conventional shield member is attached to a circuit board. FIG. 10 is a flowchart showing the procedure of the substrate unit manufacturing method according to this embodiment. FIG. 11A is an explanatory diagram of the method for manufacturing the substrate unit according to the present embodiment. FIG. 11B is an explanatory diagram of the method for manufacturing the substrate unit according to the present embodiment. 11-3 is explanatory drawing of the manufacturing method of the board | substrate unit which concerns on this embodiment. 11-4 is explanatory drawing of the manufacturing method of the board | substrate unit which concerns on this embodiment. FIG. 11-5 is an explanatory diagram of the method for manufacturing the substrate unit according to the present embodiment. FIG. 12 is a cross-sectional view showing a state in which a lid is attached to the shield member. FIG. 13 is a cross-sectional view showing a state where a lid is attached to the shield member. FIG. 14 is a plan view showing a shield member according to a first modification of the present embodiment. FIG. 15 is a plan view showing a shield member according to a second modification of the present embodiment. FIG. 16 is a cross-sectional view showing a shield member according to a second modification of the present embodiment. FIG. 17 is a plan view showing a shield member according to a third modification of the present embodiment.

  Hereinafter, the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited by the form (henceforth embodiment) for implementing the following invention. In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. In the following, a mobile phone will be described as an example of an electronic device. However, the application target of the present invention is not limited to a mobile phone. For example, PHS (Personal Handy Phone System), PDA (Personal Digital Assistant), portable The present invention can also be applied to navigation devices, notebook computers, game machines, and the like. In addition, although the electronic component mounted on the circuit board will be described using BGA as an example, the application target of the present invention is not limited to BGA.

  FIG. 1 is an overall view illustrating an example of an electronic apparatus including a substrate unit according to the present embodiment. The mobile phone 1 that is an electronic device is a foldable mobile phone in which a housing 1C is configured to be openable and closable by a display-side housing 1CA and an operation-side housing 1CB. A display 2M is provided in the display-side casing 1CA. The display 2M displays a standby image when the mobile phone 1 is waiting for reception, or displays a menu image used to assist the operation of the mobile phone 1.

  The display-side casing 1CA is provided with a speaker 6 that emits sound when the mobile phone 1 is talking. The operation-side casing 1CB is provided with a plurality of operation keys 3 for inputting a telephone number of a call partner and characters when creating a mail. Further, selection and determination of a menu displayed on the display 2M and a screen A direction and determination key 4 for easily executing scrolling and the like is provided. An antenna is provided inside the operation-side casing 1CB, and is used for transmission / reception between the mobile phone 1 and the base station. The operation key 3 and the direction / decision key 4 constitute an operation unit of the mobile phone 1. In addition, the operation-side casing 1CB is provided with a microphone 5 that receives sound when the mobile phone 1 is talking.

  The display-side housing 1CA and the operation-side housing 1CB are connected by a hinge mechanism 9. Thus, the display-side housing 1CA and the operation-side housing 1CB are configured to be rotatable about the hinge mechanism 9 in a direction away from each other and a direction approaching each other. The mobile phone 1 opens when the display-side housing 1CA and the operation-side housing 1CB are rotated away from each other, and the mobile phone 1 when the display-side housing 1CA and the operation-side housing 1CB are rotated in directions approaching each other. Closes.

  FIG. 2 is an exploded perspective view of the structure incorporated in the operation-side casing. A circuit board on which electronic components are mounted is disposed inside the display-side housing 1CA and the operation-side housing 1CB. As shown in FIG. 2, the operation side housing 1 </ b> CB includes a key sheet 10, a flexible printed circuit board 11, a reference potential pattern layer, and a mobile phone that constitute the operation keys 3, directions, and determination keys 4 described above. And a circuit board 12 including various electronic components including a radio frequency (RF) module. The key sheet 10, the flexible printed circuit board 11, and the circuit board 12 described above are stacked and disposed inside the operation-side casing 1 </ b> CB. A circuit board for the display 2M is also arranged in the display-side casing 1CA.

  FIG. 3 is a plan view of the substrate unit built in the operation-side casing. As shown in FIG. 3, the board unit 100 includes a circuit board 12, a BGA (Ball Grid Array) 30 that is an electronic component, and a shield member 20 that is a shield. A BGA 30 is mounted on the circuit board 12. A shield member 20 is disposed around the BGA 30. The shield member 20 is attached to the circuit board 12. The shield member 20 is provided to prevent the electromagnetic waves emitted from the BGA 30 from leaking and to protect the BGA 30 from electromagnetic waves such as high-frequency noise. In FIG. 3, the shield member 20 is opened. However, when the circuit board 12 is disposed in the operation-side housing 1 CB, the shield member 20 is disposed around the BGA 30 and then the opening of the shield member 20. A lid is attached to. Next, the shield member 20 will be described.

  FIG. 4 is a perspective view showing a shield member according to the present embodiment. FIG. 5 is a plan view of the shield member according to the present embodiment. FIG. 6 is a cross-sectional view showing a state in which the shield member according to the present embodiment is attached to the circuit board and surrounds the BGA. FIG. 7 is a view showing a state when the shield member according to the present embodiment is attached to the circuit board. FIG. 8 is a perspective view showing a conventional shield member. FIG. 9 is a diagram showing a state when a conventional shield member is attached to a circuit board.

  The shield member 20 is made of a conductive material (for example, a metal, such as aluminum or an alloy thereof, or copper or an alloy thereof). The shield member 20 is attached to the circuit board 12 and is electrically connected to the ground of the circuit board 12. The shield member 20 is made of a sheet metal such as aluminum or copper, and is manufactured, for example, by bending or deep drawing. As shown in FIGS. 4 and 5, the shape of the shield member 20 is a member having a rectangular shape in plan view, which is configured by combining four plate-like side portions 21A, 21B, 21C, and 21D.

The shield member 20 is configured to include a shield portion 21 and held portion 23. The shielding part 21 is configured by combining the plate surfaces of the four side parts 21A, 21B, 21C, and 21D at right angles to each other. The shielding part 21 is arranged around the BGA 30 attached to the circuit board 12 via the solder balls 31. The shielding portion 21 is formed into a cylindrical shape by combining the four side portions 21A, 21B, 21C, and 21D, and one end portion 24B is in contact with the circuit substrate 12, and for example, the circuit substrate 12 by soldering or the like. Fixed to. The other end 24T is located on the side opposite to the side attached to the circuit board 12.

  One end 24B is on the circuit board 12 mounting side (circuit board side) of the shielding part 21, and the other end 24T is on the side opposite to the circuit board 12 mounting side of the shielding part 21 (on the opposite circuit board side). Become. In addition, the shielding part 21 has an opening (circuit board side opening) 21OB and an opening (counter circuit board side opening) 21OT at both the one end 24B and the other end 24T. When the shield member 20 is disposed around the BGA 30 and attached to the circuit board 12, the BGA 30 passes through the circuit board side opening 21OB. Further, an underfill agent is applied between the BGA 30 and the circuit board 12 from the counter circuit board side opening 21OT, or the BGA 30 is inspected through the counter circuit board side opening 21OT.

The held portion 23 is provided on the side opposite to the attachment side of the shielding portion 21 to the circuit board 12, that is, on the opposite circuit board side of the shielding portion 21. Then, the held portion 23 is configured to protrude in a direction away from the circuit board 12, movable in a direction toward the circuit board 12. That is, the held portion 23, projects away from the mounting side and the opposite side of the circuit board 12 of the shield portion 21. The held portion 23 is a portion that is provided on the shield member 20 and is held by a component holding portion of a mounting machine that mounts electronic components or the like on the circuit board 12 when the shield member 20 is mounted on the circuit board 12. is there.

In the present embodiment, the held portion 23 is constituted by an arm 22A which projects from the shield portion 21, and 22B, the arm 22A, a holder 22H attached to 22B. The arm 22 </ b> A is attached to the side part 21 </ b> D of the shielding part 21, and the arm 22 </ b> B is attached to the side part 21 </ b> B of the shielding part 21. In the present embodiment, the arm 22A, the side portion 21D, the arm 22B, and the side portion 21B are integrally configured. The arm 22A and the side portion 21D may be prepared as separate members, and the arm 22B and the side portion 21B may be prepared as separate members, and both may be joined by joining means such as welding. The arm 22A projects from the side portion 21D toward the inside of the shielding portion 21 in plan view, and the arm 22B projects from the side portion 21B toward the inside of the shielding portion 21 in plan view.

The holding body 22H is disposed between the arm 22A and the arm 22B. The holding body 22H is attached to the shielding part 21 via the arms 22A and 22B. Therefore, the shielding part 21 can be moved by holding and moving the holding body 22H. The holding body 22H has a flat plate shape, and is held by the component holding means of the mounting machine when the shield member 20 is attached to the circuit board 12. As the component holding means, for example, there is a suction nozzle 50 (see FIG. 7) that uses a negative pressure to suck a holding target (the holding body 22H in this embodiment). Suction nozzle 50 is, for example, is connected to a suction pump or a vacuum pump which is a negative pressure generating means, for adsorbing holder 22H of the held portion 23. When the mounting machine moves the suction nozzle 50 to the circuit board 12 while the suction nozzle 50 sucks the holding body 22H, the shield member 20 can be moved to the circuit board 12.

In the present embodiment, the holding body 22H is supported by the shielding portion 21 in a double-supported structure with two arms 22A and 22B. As a result, the balance between the two sides of the holding body 22H is improved, so that the shield member 20 is stabilized when the shield member 20 is attracted and moved by the mounting machine. Moreover, in this embodiment, the to- be- held part 23 is arrange | positioned in the center part of the shielding part 21, ie, the longitudinal direction center part of the side parts 21B and 21D, and the longitudinal direction center part of the side parts 21A and 21C. Specifically, the sides 21B, the longitudinal dimension of the 21D is L, the holding member 22H of the held portion 23, side portion 21A, the position of each from 21C L / 2, and side portion 21B, from 21D Each is arranged at a position of W / 2. Thus, the arm 22A of the held portion 23, so even better on both sides of the balance of the holder 22H in the direction orthogonal to the 22B, when moving adsorbs shielding member 20 by the suction nozzle 50 of the mounting apparatus, Further, the shield member 20 is stabilized.

As shown in FIG. 6, the holding member 22H constituting the held portion 23 protrudes in a direction away from the circuit board 12. That is, the holding body 22H protrudes in a direction away from the attachment side of the shielding portion 21 to the circuit board 12 and the opposite side thereof (the circuit board attachment side and the counter circuit attachment side and the end portions 24B and 24T). In the present embodiment, the distance between the holding body 22H and the end 24T, that is, the distance between the holding body 22H and the opening surface of the counter-circuit board side opening 21OT shown in FIG. 4 is Δh.

The arms 22A and 22B that support the holding body 22H are made of an elastic body. In the present embodiment, the arms 22 </ b> A and 22 </ b> B are configured integrally with the shielding part 21. In the present embodiment, the shielding part 21 and the arms 22A and 22B are made of a metal material such as aluminum or an alloy thereof. Such a metal material is an elastic material having conductivity. Thus, by configuring the arm 22A, and 22B of an elastic material, the held portion 23, the holding member 22H and more specifically, the direction toward the circuit board 12, i.e., movable in the circuit board attachment side Is done.

When attaching the shield member 20 to the circuit board 12 using a mounting machine, as shown in FIG. 7, the suction nozzle 50 of the mounting machine presses toward the held portion 23 to the circuit board 12. In the conventional shield member 120 shown in FIG. 8, the end 24T, the arms 122A and 122B, and the holding body 122H are formed on the same plane. Therefore, as shown in FIG. 9, when the shield member 120 is attached to the circuit board 112, the arms 122A and 122B are bent and the holding body 122H moves toward the circuit board 112, and the BGA 130 and the holding body 122H are moved. There was a risk of contact.

In the present embodiment, the holding body 22H protrudes from the end portion 24T toward the outside of the shielding portion 21. With this configuration, when mounting the shield member 20 to the circuit board 12, the suction nozzle 50 of the mounting machine towards the holder 22H to BGA30 the held portion 23 against (the direction indicated by the arrow G in FIG. 7) Even if the arms 22 </ b> A and 22 </ b> B are bent, a gap is formed between the holding body 22 </ b> H and the BGA 30. Thereby, the possibility that the holding body 22H comes into contact with the BGA 30 can be reduced. As a result, it is possible or place BGA30 dimension is large orthogonal or to place BGA30 at a position facing the held portion 23, a circuit board 12 at a position facing the held portion 23, the shield The dimensions and the degree of freedom of arrangement of the BGA 30 arranged in the member 20 are improved, and the mounting density can be improved. Moreover, since the possibility that the holding body 22H comes into contact with the BGA 30 can be reduced, mounting defects of the BGA 30 can also be reduced.

If the size of the shield member is small, to improve the strength of the held portion by placing the held portion on the corner portion of the shield member, it is possible to reduce the deflection of the held portion. However, if the size of the shield member becomes large, the balance when lifting the shielding member by adsorbing the held portion in the mounting machine in such a construction is poor, it may be impossible to stably convey the shield member. Therefore, when the dimension of a shield member is large, it is necessary to arrange | position a to- be- held part (especially holding body) in the center part of a shield member. Placing the held portion to the central portion of the shield member, to improve the strength of the held portion is difficult, it may not be possible to sufficiently suppress the deflection of the held portion.

As in this embodiment, the retaining member 22H constituting the held portion 23 of the shield member 20, by protruding from the end portion 24T towards the outside of the shielding portion 21, when mounting the shield member 20 to the circuit board 12 Even if the held portion 23 is bent, the possibility that the holding body 22H comes into contact with the BGA 30 can be reduced. As a result, when the shield member 20 is attached to the circuit board 12, the shield member 20 can be stably conveyed.

Projecting amount Δh of the holder 22H of the held portion 23, the amount of deflection of the held portion 23 which definitive when the suction nozzle 50 of the mounting apparatus is pressed against the holder 22H on the circuit board 12 side (holder 22H amount of movement ) Y and the distance between the BGA 30 and the end 24T, that is, the distance t between the BGA 30 and the opening surface of the counter-circuit board side opening 21OT shown in FIG. That is, Y <Δh + t. Since the deflection amount Y is about 0.5 mm to 0.6 mm, it is preferable to provide the protrusion amount Δh of about 1 mm in consideration of safety. Next, a method for manufacturing the substrate unit according to the present embodiment will be described.

  FIG. 10 is a flowchart showing the procedure of the substrate unit manufacturing method according to this embodiment. 11-1 to 11-5 are explanatory diagrams of the method for manufacturing the substrate unit according to the present embodiment. In manufacturing the board unit 100 shown in FIG. 3, the electronic component (BGA 30) is placed at a predetermined position on the circuit board 12 in step ST <b> 101. The BGA 30 is automatically arranged on the circuit board 12 by a mounting machine, for example.

Next, it progresses to step ST102 and the shielding member 20 is arrange | positioned around the BGA30. As illustrated in FIG. 11A, the shield member 20 is disposed around the BGA 30 after the holding body 22 </ b> H is adsorbed by the suction nozzle 50 of the mounting machine and conveyed to the position where the BGA 30 is disposed. When the shield member 20 is disposed on the circuit board 12, is released the suction by the suction nozzle 50, the suction nozzle 50 is detached from the holder 22H of the held portion 23.

  Then, it progresses to step ST103 and the circuit board 12 is heat-processed. Solder is previously deposited on the circuit board side of the shield member 20, and a solder ball 31 is provided between the BGA 30 and the circuit board 12. For this reason, the solder on the circuit board side of the shield member 20 and the solder balls 31 are melted by the heat treatment in step ST103, and the shield member 20 and the BGA 30 are fixed to the circuit board 12. At the same time, the shield member 20 is electrically connected to the ground of the circuit board 12, and the terminal of the BGA 30 and the terminal of the circuit board 12 are electrically connected.

  Then, it progresses to step ST104 and the test | inspection of BGA30 and the shield member 20 is performed. If the result of the inspection is normal, the process proceeds to step ST105. In step ST105, as shown in FIG. 11B, for example, the syringe 51 is inserted from the counter circuit board side opening 21OT of the shield member 20, and the underfill agent 40 as a fixing agent is applied to a part around the BGA 30. Is done. Thus, the underfill agent 40 is put between the BGA 30 and the circuit board 12, that is, at the bottom side of the BGA 30. The underfill agent 40 is a sealing resin, and usually a one-component curable epoxy resin is used. The underfill agent 40 has fluidity before curing.

  When the underfill agent 40 has spread between the BGA 30 and the circuit board 12, the process proceeds to step ST106, where the underfill agent 40 is cured. When the underfill agent 40 is cured between the circuit board 12 and the BGA 30, the BGA 30 is fixed to the circuit board 12 to be in a state as shown in FIG. The underfill agent 40 improves the mounting strength of the BGA 30 and improves the connection reliability between the BGA 30 and the circuit board 12. Since the underfill agent 40 has thermosetting properties, the underfill agent 40 is cured by heating.

  When the underfill agent 40 is cured, the process proceeds to step ST10. In step ST107, the lid 25 is attached to the end 24T of the shield member 20 as shown in FIG. 11-4. As a result, the counter-circuit board side opening 21OT of the shield member 20 is closed, and the board unit 100 is completed as shown in FIG. 11-5 (step ST108). Here, the lid 25 may be attached to the shield member 20 using a mounting machine, or may be attached by an inspector. Moreover, the lid | cover 25 is an electroconductive material and is comprised with the same material as the shield member 20, for example.

FIG. 12 is a cross-sectional view showing a state in which a lid is attached to the shield member. FIG. 13 is a cross-sectional view showing a state where a lid is attached to the shield member. When the lid 25 is attached to the shield member 20, the lid 25 is put on the shield member 20 as shown in FIG. 12. Then, the holding member 22H of the held portion 23 provided on the shield member 20 is in contact with lid 25. In the state shown in FIG. 12, the lid 25 is in a state of floating from the shield member 20, so the lid 25 is further pushed into the circuit board 12 side. Then, as shown in FIG. 13, the convex portions 25T provided on the side portions of the lid 25 are fitted into the concave portions 23U provided on the side portions 21B and 21D of the shield member 20, and the lid 25 is fixed to the shield member 20. The

As described above, the arm 22A for supporting the holding member 22H of the held portion 23, with 22B is made of an elastic body, in a state in which no cover 25 is attached, the holder 22H is outside of the shield portion 21 Protrusively. For this reason, when the lid 25 is attached to the shield member 20, the holding body 22H moves toward the BGA 30, and the holding body 22H is pressed against the lid 25 by the arms 22A and 22B. In this embodiment, an integral structure from the held portion 23 and the shield portion 21, both formed of a material having conductivity, also the lid 25 is electrically conductive. Therefore, when attaching the cover 25 to the shield member 20, the holding member 22H and the arm 22A of the held portion 23, through 22B, the lid 25 and the shield member 20 are electrically connected.

Thereby, since the continuity between the shield member 20 and the lid 25 can be easily obtained, the shielding performance of the shield member 20 can be improved. In addition, since the holding body 22H is pressed against the lid 25 by the arms 22A and 22B made of an elastic body, conduction between the two can be obtained stably. In particular, the cellular telephone device 1, since it is carried by a user, but susceptible to vibration or shock, according to the structure to obtain continuity between the shield member 20 and the cover 25 through the held portion 23, stably and reliably This is preferable because conduction between the shield member 20 and the lid 25 can be obtained.

FIG. 14 is a plan view showing a shield member according to a first modification of the present embodiment. Shield member 20a according to this modification has substantially the same configuration as the shield member 20 described above, that is arranged offset to the held portion 23a from the central portion of the shield portion 21a is different. Other configurations of the shield member 20a are the same as those of the shield member 20 described above.

The to-be- held part 23a is arrange | positioned and shifted | deviated from the center part of the shielding part 21a, ie, the longitudinal direction center part of side part 21Ba, 21Da, and the longitudinal direction center part of side part 21Aa, 21Ca. Specifically, the sides 21Ba, the longitudinal dimension of the 21Da is L, the holding member 22Ha of the held portion 23a is arranged at a position of L1 from L2 and the side 21C, respectively from the side 21A. For example, the relationships of the position of the circuit board the shielding member 20a is disposed with the operating range of mounting apparatus, may not be placed to the held portion at the center of the shield portion. In such a case, as in the present modified example may be arranged by shifting the held portion 23a from the central portion of the shield portion 21a.

FIG. 15 is a plan view showing a shield member according to a second modification of the present embodiment. FIG. 16 is a cross-sectional view showing a shield member according to a second modification of the present embodiment. Shielding member 20b according to this modification has substantially the same configuration as the shield member 20 described above, a point provided in the shielding portion 21b by a single arm 22b a holder 22Hb constituting the held portion 23b is different. Other configurations of the shield member 20b are the same as those of the shield member 20 described above.

The arm 22b constituting the held portion 23b is formed integrally with the side portion 21Db from the end portion 24Tb of the side portion 21Db. A holding body 22Hb is provided on the side opposite to the end 24Tb of the arm 22b. Thus, the shielding member 20b is holder 22Hb of the held portion 23 is supported in a cantilever structure by the one arm 22b, holder 22Hb is a free end of the held portion 23. With such a structure, the holding body 22H can be reliably pressed against the lid 25 shown in FIGS. 12 and 13 by effectively utilizing the elasticity of the arm 22b formed of an elastic body. As a result, the continuity between the shield member 20b and the lid 25 can be obtained more reliably, and the shielding performance of the shield member 20b can be more reliably exhibited.

FIG. 17 is a plan view showing a shield member according to a third modification of the present embodiment. Shielding member 20c according to this modification, the holding member 22Hc two arms 22Ac constituting the held portion 23c, but the point of support by Bc almost the same configuration as the shield member 20 described above, each arm The difference is that the holding body 22H is provided so that 22Ac and Bc intersect each other. Other configurations of the shield member 20c are the same as those of the shield member 20 described above.

The arm 22Ac constituting the held portion 23c is formed integrally with the side portion 21Db from the end portion 24Tc of the side portion 21Db, and the arm 22Bc is formed from the end portion 24Tc of the side portion 21Ac where the side surface 21Dc and the plate surface are orthogonal to each other. It is formed integrally with the side portion 21Ac. The holding body 22H is supported by the arms 22Ac and 22Bc. Since the side surfaces 21Dc and the side portions 21Ac are orthogonal to each other, the arms 22Ac and the arms 22Bc are also orthogonal to each other. With such a configuration, the opening area of the second counter circuit board side opening 21OT2 can be larger than that of the first counter circuit board side opening 21OT1 of the shield member 20c. For this reason, for example, when a large opening is required in the shield member due to restrictions on the equipment to which the underfill agent 40 is applied, the structure according to the modified example 2 is advantageous. Further, the present modification has an advantage that when the dimension of the shield member 20c is reduced, it is easy to secure an opening area of a portion where the underfill agent 40 is applied.

As described above, the substrate unit and the electronic equipment according to the present invention is a structure having a target holder for holding the shield by mounting machine, the risk of the held portion and the electronic component are in contact when mounting the shield Useful for reducing.

DESCRIPTION OF SYMBOLS 1 Mobile phone 12 Circuit board 20, 20a, 20b, 20c Shield member 21, 21a, 21b Shield part 21A, 21B, 21C, 21D, 21Aa, 21Ba, 21Db, 21Ac Side part 22H, 22Ha, 22Hb, 22Hc Holder 22A, 22B, 22b, 22Ac, 22Bc arms 23, 23a, 23b, 23c held portion 24B, 24T, 24Tb, 24Tc end 25 the lid 31 solder balls 40 underfill material 50 suction nozzle 51 the syringe 100 board unit

Claims (7)

A circuit board;
Electronic components mounted on the circuit board;
A frame member made of a conductive material and attached to the circuit board; and a lid member made of a conductive material and attached to the side opposite to the attachment side of the frame member to the circuit board. A shield member electrically connected to,
Including
The frame member is provided so as to protrude in a direction away from the circuit board from a side wall portion arranged around the electronic component, and an end portion of the side wall portion opposite to the mounting side to the circuit board. A held portion movable in a direction toward the circuit board;
Wherein the held portion includes an arm portion projecting from the side wall portion, and a flat plate portion extending from the opposite end portion and the side wall portion of the arm portion,
When the lid member is attached to the frame member, the flat plate portion comes into contact with the lid member.   2. The substrate unit according to claim 1, wherein when the lid member is attached to the frame member, the flat plate portion comes into contact with the lid member in a state where the arm portion is elastically deformed. Wherein the held portion includes a substrate unit according to claim 1 or 2, characterized in that arranged at the center portion of the side wall portion.   The substrate unit according to any one of claims 1 to 3, wherein the flat plate portion is supported by the two arm portions in a double-sided structure.   4. The substrate unit according to claim 1, wherein the flat plate portion is supported in a cantilever structure by the one arm portion. 5. Wherein the held portion includes a substrate unit according to claim 1, any one of 5, characterized in that disposed in a position facing the electronic component.   An electronic apparatus comprising the substrate unit according to claim 1.

Images