JP4793988B2 - Electronic equipment and shield case - Google Patents

Description

  The present invention relates to an electronic device including a shield case for blocking electromagnetic wave noise and the like, and a shield case for blocking electromagnetic wave noise and the like.

  Conventionally, there has been an electronic device including a shield case for blocking electromagnetic wave noise or the like (see, for example, Patent Document 1). FIG. 8 is a perspective view showing the circuit board 4 inside the electronic device according to Patent Document 1 and the shield case 2 attached to the circuit board 4. As shown in the figure, the shield case 2 is made of metal and includes a frame member 6 and a lid member 8.

  The frame member 6 of the shield case 2 is fixed to the component mounting surface 4a, which is one surface of the circuit board 4, by soldering. The frame member 6 surrounds a predetermined region on the component mounting surface 4a, and has a wall portion 10 having a height in a direction perpendicular to the component mounting surface 4a, and the frame member 6 from the entire periphery of the upper edge of the wall portion 10. And an overhanging portion 12 projecting like an eave at a substantially right angle with respect to the inner side.

  The frame member 6 is mounted on the circuit board 4 by a mounter (not shown) in the same manner as other electronic components mounted on the circuit board 4 in the manufacturing process before being soldered on the circuit board 4. The For this reason, the frame member 6 is provided with a bridge portion 14 that connects two portions of the overhanging portion 12 that are spaced apart from each other, and a suction nozzle of the mounter (in FIG. A substantially disc-shaped attracted portion 16 for holding the frame member 6 is formed by abutting and adsorbing the tip end portion (see reference numeral 37).

  The attracted portion 16 is a frame member so that the frame member 6 can maintain a horizontal posture even when the attracting nozzle of the mounter attracts the attracted portion 16 and lifts the frame member 6. 6 is formed at a position where the center of gravity of the frame member 6 is projected on a virtual plane (not shown) including the entire upper surface of the overhanging portion 12.

  Further, the lid member 8 of the shield case 2 is fitted with the frame member 6 so as to accommodate the frame member 6 therein. As a result, the shield case 2 can be closed without removing the entire shield case 2 from the circuit board 4 when the electronic components mounted on the inside of the shield case 2 need to be replaced due to problems or the like. Only the member 8 can be removed and the electronic component can be exchanged.

  Further, since the shield case 2 can confirm the inside of the frame member 6 even after the frame member 6 is soldered onto the circuit board 4, the solder of all electronic components to the circuit board 4 can be confirmed. Even after the attaching operation is completed, the electronic component mounted inside the frame member 6 can be inspected by the image recognition device.

Further, conventionally, in addition to the electronic device according to Patent Document 1, a shield case is provided, and this shield case has a bridge portion similar to the bridge portion 14 of the shield case 2 according to Patent Document 1. There are electronic devices (see, for example, Patent Documents 2 and 3).
JP 2005-159144 A JP 2004-179594 A JP 2005-347392 A

  However, in the shield case 2 of the electronic device according to Patent Document 1, when the electronic component in the frame member 6 is inspected for mounting state confirmation by the image recognition device, the range below the bridge portion 14 is as follows. Since it cannot be inspected because it is blocked by the bridge portion 14 (becomes a blind spot), an electronic component cannot be mounted in the lower range of the bridge portion 14.

  Therefore, in order to reduce the range of blind spots that cannot be inspected, a method of reducing the width dimension of the bridge portion 14 in the direction perpendicular to the length direction is conceivable. Since it is necessary to connect the portion 16 and the overhanging portion 12 with a certain level of strength or more, the bridge portion 14 needs to have a width dimension sufficient to ensure such strength.

  For this reason, since the bridge part 14 must be formed so as to have a certain width or more, this eventually causes a problem that the mounting density of the electronic components in the shield case 2 cannot be improved. was there.

  Also, the electronic devices according to Patent Documents 2 and 3 have the same problems as the electronic device according to Patent Document 1.

  Therefore, in view of the above problems, the present invention provides an electronic device capable of improving the mounting density of electronic components in the shield case on the circuit board, and the electronic components in the inner range on the mounted circuit board. It is an object of the present invention to provide a shield case capable of improving the mounting density.

In order to solve the above problems, the present invention
An electronic device comprising a circuit board on which electronic components are mounted, and a shield case attached to the circuit board,
The shield case includes a frame member that is attached to the circuit board so as to surround the electronic component, and a lid that is attached to the frame member so as to cover the frame member.
The frame member includes a wall portion disposed substantially perpendicular to a surface on which the electronic component is mounted on the circuit board, and a bridge portion disposed across an opening formed by the wall portion. And
The bridge portion is substantially parallel to the plane portion with respect to the opening surface of the wall portion, from the bridge end portion along the extending direction of the said planar portion, the circuit board side end the circuit board A vertical portion protruding toward the circuit board substantially perpendicularly to the opening surface of the wall portion so as to be separated from
The frame member, Ru der those wherein the planar portion includes a center of gravity of the frame member is formed in the opening surface of the wall portion.

  Moreover, the electronic device according to the present invention is characterized in that the flat portion has a wide portion in which a region in the vicinity of the center of gravity is formed wider than other regions.

  Moreover, the electronic device according to the present invention is characterized in that the wide portion is an adsorbed portion adsorbed by an adsorbing device.

  Moreover, the electronic device according to the present invention is characterized in that the vertical portion is formed so as to be disposed between the plurality of electronic components mounted on the circuit board.

An electronic device according to the present invention
The electronic component includes an integrated circuit component and a chip component,
The planar portion is formed so that at least the wide portion is disposed on the integrated circuit component.

An electronic device according to the present invention
The frame member has an engaging portion that is integrally formed with the wall portion and protrudes outward,
The lid body is formed with a side plate portion that overlaps the wall portion when attached to the wall portion,
The side plate portion is formed with an engaged hole that engages with the engaging portion and fixes the lid.
An electronic device according to the present invention
In the frame member, at least the bridge portion is formed of one sheet metal,
The vertical part is formed by being bent from the flat part.

In order to solve the above-mentioned problem, the shield case according to the present invention is
A shield case attached to a circuit board on which electronic components are mounted,
The shield case includes a frame member in which a wall portion forming one opening portion and a bridge portion arranged across the opening portion are formed by a single sheet metal, and the frame member including the one opening portion. A lid attached to the frame member so as to cover
The bridge part includes a plane part substantially parallel to the opening part, and at least a part of the bridge part substantially perpendicularly to the opening surface of the wall part from an end part along the extending direction of the bridge part in the plane part. A length protruding in the circuit board side and a length in a direction perpendicular to a surface on which the electronic component is mounted on the circuit board is shorter than the wall portion ;
The frame member is characterized in that the flat portion is formed including the center of gravity of the frame member on the opening surface of the wall portion .

  According to the electronic apparatus and the shield case of the present invention, the mounting density of electronic components within the inner range can be improved on the circuit board on which the shield case is mounted.

The best mode for carrying out an electronic device and a shield case according to the present invention will be specifically described below with reference to the drawings.
FIG. 1 to FIG. 7 are diagrams that are referred to for explaining an electronic device 20 according to an embodiment of the present invention and a shield case 22 provided in the electronic device 20.

  The electronic device 20 according to the present embodiment includes a shield case 22 and a circuit board 24 as shown in FIG. In addition to the shield case 22, a plurality of electronic components and the like are mounted on the circuit board 24, but are not shown in FIG. 1 to prevent complication of the drawing.

  The shield case 22 is made of metal and includes a frame member 26 and a lid member 28 (corresponding to a lid). The frame member 26 of the shield case 22 is fixed to the component mounting surface 24a, which is one surface of the circuit board 24, by soldering, and a wiring pattern of a reference potential line (not shown) formed on the component mounting surface 24a. Electrical continuity.

  The frame member 26 includes a wall portion 30 that surrounds a predetermined region on the component mounting surface 24a and has a height in a direction perpendicular to the component mounting surface 24a. The wall 30 is formed on the outer periphery of a planar shape (not shown) when the frame member 26 is viewed from a direction perpendicular to the component mounting surface 24a of the circuit board 24. Although divided | segmented for every edge | side, it is set as the wall part 30 generically referring to these divided | segmented.

  The wall portion 30 is provided with a plurality of engaging portions 31 that are integrally formed and protrude outwardly in a substantially hemispherical shape. In addition, the frame member 26 includes an overhanging portion 32 that protrudes from the upper edge of substantially the entire circumference of the wall portion 30 in an eave shape at a substantially right angle to the inner side of the frame member 26.

  The lid member 28 of the shield case 22 has a flat top plate portion 50 corresponding to the outer peripheral shape of the frame member 26, and a height on the frame member 26 side at substantially the entire periphery of the edge of the top plate portion 50. It has the side plate part 52 formed so that it may have. The side plate portion 52 is formed with an engaged hole 54 corresponding to each of the engaging portions 31 of the frame member 26.

  The lid member 28 is configured such that an electronic component (not shown), a frame member 26, and the like are soldered on the circuit board 24, and after various inspections and coating processes are completed, the frame member 26 is accommodated inside. It fits with the member 26 and is electrically connected to each other.

  Further, as shown in FIG. 2, the engaging portion 31 of the wall portion 30 in the frame member 26 is formed to have a flat cut and raised portion 31 a that faces the circuit board 24, and thus the lid member 28 is a frame member. After being engaged with the H. 26, the engaged hole 54 is hooked on the flat cut-and-raised part 31a of the engaging part 31 so that it cannot be easily detached.

  On the other hand, the side of the engaging portion 31 opposite to the flat cut-and-raised portion 31a, that is, the position where the side plate 52 first contacts when the cover member 28 is attached is formed in a spherical shape. It is also possible to ride on the joint part 31.

  Further, as shown in FIG. 1, the frame member 26 has a bridge portion 34 that is disposed across the opening and that the wall portion 30 forms in the inner area thereof. That is, the frame member 26 is provided with a bridge portion 34 that connects two portions of the protruding portion 32 that are separated from each other.

  The bridge portion 34 includes planar portions 40 and 43 that are substantially parallel to a virtual plane (not shown) including the upper edge of the entire circumference of the wall portion 30 (corresponding to the opening surface), and the upper edge of the entire circumference of the wall portion 30. It includes vertical portions 38, 42, and 44 that are substantially perpendicular to a virtual plane that is not shown.

  The plane portion 40 of the bridge portion 34 is a center of gravity point of the frame member 26 in a virtual plane (not shown) including the upper edge of the entire circumference of the wall portion 30 (corresponding to the opening surface), that is, on such a virtual plane (not shown). On the other hand, the center of gravity of the frame member 26 itself is formed so as to include a point projected in parallel with the height direction of the wall 30.

  Further, in the flat surface portion 40 of the bridge portion 34, the region in the vicinity of the center of gravity is formed wider so as to swell in an arcuate shape than the other regions, and constitutes the wide portion 36. It has become.

  When the frame member 26 is transferred onto the circuit board 24 during the manufacturing process of the electronic device 20, a mounter (not shown) corresponds to the tip of the suction nozzle 37 as shown in FIG. The part is brought into contact with and adsorbed to the wide part 36 of the frame member 26 to hold the frame member 26. When the wide portion 36 is used for being sucked by the suction nozzle 37 as in the frame member 26 according to the present embodiment, the wide portion 36 is particularly referred to as a portion to be sucked.

  Further, after the lid member 28 shown in FIG. 1 is attached to the frame member 26, the bridge portion 34 receives the external force from the top plate portion 50 of the lid member 28, and its center portion is bent toward the frame member 26 side. In such a case, the top plate portion 50 is supported in a direction to push back such bending, and the amount of bending of the top plate portion 50 is reduced.

  FIG. 4 is a diagram illustrating a developed state before the frame member 26 of the shield case 22 is formed into a three-dimensional shape. The frame member 26 before being formed into a three-dimensional shape is a sheet metal, and is a wall portion formed in the shape of a flap (down wing) of an airplane from the outer periphery of an overhang portion 32 indicated by a virtual broken line in FIG. Each of 30 is formed to extend outward.

  In the frame member 26, each of the wall portions 30 formed in such a flap shape is bent in the back side direction perpendicular to the paper surface in FIG. 4, and as shown in FIG. The wall part 30 which is perpendicular to the above is constituted.

  Further, as shown in FIG. 4, the bridge portion 34 of the frame member 26 is formed in a continuous substantially rectangular wave shape, except for the wide portion 36 in the initial state before being formed into a three-dimensional shape. As shown in FIG. 3, each rectangular wave peak portion (reference numerals 38, 42, and 44 in FIG. 4) projecting to one side is bent in the back direction perpendicular to the paper surface in FIG. , Extending in a direction substantially perpendicular to a virtual plane (not shown) including the upper edge of the entire circumference of the wall portion 30 (corresponding to an opening surface), that is, in a direction parallel to the direction from the upper end side to the lower end side of the wall portion 30. Vertical portions 38, 42 and 44 are formed.

  Each of the portion between the vertical portion 38 and the vertical portion 42 including the wide portion 36 and the portion between the vertical portion 42 and the vertical portion 44 includes an upper edge of the entire circumference of the wall 30 (not shown). The plane portions 40 and 43 that are substantially parallel to the virtual plane (corresponding to the opening surface) are configured.

  Next, FIG. 5 is a plan view of the frame member 26 showing a state of being mounted on the circuit board 24. As shown in the drawing, various sizes of electronic components including integrated circuit components 46 and 48 are mounted in the inner region of the frame member 26 on the circuit board 24. The integrated circuit components 46 and 48 are provided with a plurality of lead wires (not shown) on the outer periphery thereof and soldered to electronic components on the circuit board 24 and pads (not shown) connected to the circuit wiring. .

  Here, in FIG. 5, the electronic components mounted on the circuit board 24 are not denoted by reference numerals except for the integrated circuit components 46 and 48, but are illustrated in the inner region of the frame member 26. Each square of various sizes is an integrated circuit component (a large component such as a CPU or memory having a large number of pins) or a chip component (resistors with a few pins) mounted on the circuit board 24. And single-function components such as transistors).

  The frame member 26 is set so that the planar portion 40 of the bridge portion 34 is positioned immediately above the integrated circuit component 46 and does not protrude outside the planar region of the integrated circuit component 46. Further, the flat surface portion 43 of the bridge portion 34 is positioned immediately above the integrated circuit component 48 and is set so as not to protrude outside the flat area of the integrated circuit component 48.

  Each of the vertical portions 38, 42, 44 of the bridge portion 34 has a height on the side of the integrated circuit components 46, 48, but the vertical portions 38, 42, 44 and the integrated circuit components 46, 48 are A sufficient space is provided in the height direction, that is, a direction perpendicular to the component mounting surface 24a of the circuit board 24 (a direction perpendicular to the paper surface in FIG. 5).

  Each of the vertical portions 38, 42, 44 of the bridge portion 34 is an integrated circuit component when viewed from a direction perpendicular to the component mounting surface 24a of the circuit board 24 (a direction perpendicular to the paper surface in FIG. 5). The electronic components other than 46 and 48 are arranged not to pass above. That is, the vertical portions 38, 42, 44 are disposed so as to pass above between electronic components such as chip components except that a part thereof passes above the integrated circuit components 46, 48. On the other hand, some electronic components such as chip components mounted on the circuit board 24 have their mounting positions adjusted so as to avoid being directly below the vertical portions 38, 42, 44.

  FIG. 6 is a cross-sectional view taken along line BB in FIG. 5 and shows a state when the lower range of the vertical portion 38 of the bridge portion 34 is inspected by the image recognition apparatus 100. . As shown in the figure, the range on the circuit board 24 that is hidden by the vertical portion 38 of the bridge portion 34 is only a portion (dimension d in the figure) hidden by the thickness of the plate of the vertical portion 38.

  Thereby, as shown in FIG. 5, the shield case 22 has the flat portion 40 and the bridge portion 34 of the frame member 26, although the bridge portion 34 has a width in the flat portion 40. Provided on the outer periphery of the electronic component mounted on the circuit board 24 and the integrated circuit component 46 except for the portion hidden by the thickness of the plate of the vertical portion 38 in the range between the protruding portion 32 on the vertical portion 38 side. The lead wire (not shown) can be inspected by the image recognition apparatus 100, such as whether the soldering to the pad is correctly performed.

  Further, as described above, the plane portions 40 and 43 are in the same manner as the inspection by the image recognition apparatus 100 can be performed in the range between the plane portion 40 and the overhanging portion 32 on the vertical portion 38 side. Despite having a width, the vertical portion 42 is also in the range between the flat portion 40 and the flat portion 43 and between the flat portion 43 and the overhanging portion 32 on the vertical portion 44 side. , 44 except for the portion hidden by the thickness of the plate, the electronic components mounted on the circuit board 24 and the lead wires (not shown) provided on the outer periphery of the integrated circuit components 46, 48 are determined by the image recognition apparatus 100. Inspection can be performed.

  According to the electronic apparatus 20 and the shield case 22 according to the present embodiment as described above, the bridge portion is formed in spite of the fact that the flat portions 40 and 43 in the bridge portion 34 of the frame member 26 have a width. 34 without lowering the strength of 34, between the flat portion 40 and the protruding portion 32 on the vertical portion 38 side, between the flat portion 40 and the flat portion 43, and between the flat portion 43 and the vertical portion 44 side. Since the inspection by the image recognition apparatus 100 can be performed in the range between 32 and 32, electronic components and the like can be mounted in such a range. For this reason, the mounting density of the electronic components can be improved within the inner range of the shield case 22.

  Further, the electronic device 20 and the shield case 22 according to the present embodiment have the following problems that the shield case 2 (see FIG. 8) and the like according to the conventional Patent Document 1 potentially have. Has also been solved.

  That is, in the conventional shield case 2 (see FIG. 8) according to Patent Document 1, a defect is found in the lower part of the bridge portion 14 and an electronic component mounted in the vicinity of such a range. When it is necessary to replace an electronic component, the bridge portion 14 becomes an obstacle during the replacement operation, and a soldering iron is brought into contact with the circuit board 4 or an electronic component to be replaced is removed. There was a problem that I could not.

  Further, in the shield case 2 according to Patent Document 1, when such an electronic component replacement operation is performed, for example, even if an attempt is made to cut the bridge portion 14 with the nipper 102 as shown in FIG. Since the handle portion or the like of the nipper 102 comes into contact with the frame member 6, the circuit board 4 or the like when inserting the bridge portion 14 below the bridge portion 14, the bridge portion 14 cannot be properly sandwiched. For this reason, the frame member 6 of the shield case 2 according to Patent Document 1 has a problem that the bridge portion 14 cannot be cut after all.

  On the other hand, in the electronic device 20 and the shield case 22 according to the present embodiment, as shown in FIG. 1, the vertical portions 38, 42, 44 of the bridge portion 34 in the frame member 26 of the shield case 22 are walls. Since it is formed to extend in a direction substantially perpendicular to a virtual plane (not shown) including the upper edge of the entire circumference of the portion 30, that is, in a direction parallel to the direction from the upper end side to the lower end side of the wall portion 30, Each of the vertical portions 38, 42, and 44 can be sandwiched with a tool such as a nipper.

  For example, as shown in FIG. 7, when the vertical portion 38 of the bridge portion 34 is to be cut by the nipper 102, the nipper 102 is approached from above, and the vertical portion 38 is appropriately sandwiched and cut. Can be done.

  As a result, the shield case 22 can be cut at the bridge portions 34 (see FIGS. 1 and 5) of the frame member 26 at the vertical portions 38, 42 and 44. Since it can be removed, the bridge portion 34 does not get in the way when the electronic component mounted in the inner range of the shield case 22 is exchanged. Therefore, the electronic component can be easily exchanged. it can.

  In addition, in the frame member 26 of the shield case 22 according to the present embodiment, as shown in FIG. 1, the bridge portion 34 connects two portions of the overhang portion 32 that are separated from each other. Instead of the bridge portion 34, the wide portion 36 or the vertical portion is extended from one place of the overhang portion 32 to an arbitrary position within the inner range surrounded by the overhang portion 32. You may come to provide the bridge part in which the vertical part applicable to 40,42,44 is provided.

  Further, as shown in FIG. 4, the bridge portion 34 in the frame member 26 of the shield case 22 according to the present embodiment has a portion other than the wide portion 36 in the initial state before being formed into a three-dimensional shape. Although it was formed in a continuous substantially rectangular wave shape, it is not limited to such a shape, and may be formed in other different waveform shapes. For example, it may be formed in a substantially triangular wave, a substantially sine wave, or a waveform shape obtained by deforming these.

  Further, the frame member 26 of the shield case 22 according to the present embodiment is formed into a three-dimensional shape by bending a single flat plate as shown in FIG. However, it may be formed three-dimensionally from the beginning by casting or the like.

  In the present embodiment, as shown in FIG. 5, the integrated circuit components 46 and 48 are mounted on the circuit board 24. However, these may be large-scale integrated circuits. Further, the integrated circuit components 46 and 48 may not be mounted on the circuit board 24.

  Further, as shown in FIG. 1, the lid member 28 of the shield case 22 according to the present embodiment has a side plate portion 52 so that the frame member 26 can be accommodated on the inside, and is fitted to the frame member 26. However, the structure of the lid member 28 is not limited to this, and the lid member 28 can be attached to the frame member 26 so as to cover the opening of the frame member 26. That's fine.

  In addition, the frame member 26 of the shield case 22 according to the present embodiment is provided with the overhanging portion 32 and the bridge portion 34 is connected to the overhanging portion 32. Although it can be said that the structure is connected to the wall portion 30 through the portion 32, as another structure different from such a structure, the overhang portion 32 is not provided, and the bridge portion 34 is provided as a wall portion. It may be connected directly to the upper end of 30.

It is a perspective view which shows the shield case 22 and the circuit board 24 which concern on one embodiment of this invention. FIG. 2 is an enlarged cross-sectional view taken along line AA of the frame member and the circuit board shown in FIG. 1 and shows a state in which a lid member is fitted to the frame member. FIG. 2 is a perspective view showing a state in which the suction nozzle 37 sucks the wide portion 36 of the frame member 26 shown in FIG. 1. It is the frame member 26 shown in FIG. 1, Comprising: It is an expanded view before forming in a three-dimensional shape. It is a top view which shows the frame member 26 and the circuit board 24 which are shown in FIG. FIG. 6 is a cross-sectional view taken along the line BB of the frame member 26 and the circuit board 24 shown in FIG. 5, and is an enlarged view of a main part including the vertical part 38, and below the vertical part 38 on the circuit board 24. It is a figure which shows the state which is inspecting the range of (2) by the image recognition apparatus. FIG. 6 is a cross-sectional view of the frame member 26 and the circuit board 24 shown in FIG. 5 taken along the line BB, and is an enlarged view of a main part including the vertical part 38, and an attempt is made to cut the vertical part 38 with the nipper 102. FIG. It is a perspective view which shows the conventional shield case 2 and the circuit board 4. FIG. FIG. 9 is a cross-sectional view taken along line CC of the frame member 6 and the circuit board 4 shown in FIG. 8, in which a main part including the bridge portion 14 is enlarged, and the bridge portion 14 is cut by the nipper 102. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 Shield case 4 Circuit board 4a Component attachment surface 6 Frame member 8 Lid member 10 Wall part 12 Overhang part 14 Bridge part 16 Adsorption part 20 Electronic device 22 Shield case 24 Circuit board 24a Component attachment surface 26 Frame member 28 Lid member 30 Wall Part 31 Engagement part 31a Plane cut and raised part 32 Overhang part 34 Bridge part 36 Wide part 37 Suction nozzle 38 Vertical part 40 Plane part 42 Vertical part 43 Plane part 44 Vertical part 46, 48 Integrated circuit component 50 Top plate part 52 Side plate part 54 engaged hole 100 image recognition device 102 nipper

Claims (8)

An electronic device comprising a circuit board on which electronic components are mounted, and a shield case attached to the circuit board,
The shield case includes a frame member that is attached to the circuit board so as to surround the electronic component, and a lid that is attached to the frame member so as to cover the frame member.
The frame member includes a wall portion disposed substantially perpendicular to a surface on which the electronic component is mounted on the circuit board, and a bridge portion disposed across an opening formed by the wall portion. And
The bridge portion is substantially parallel to the plane portion with respect to the opening surface of the wall portion, from the bridge end portion along the extending direction of the said planar portion, the circuit board side end the circuit board A vertical portion protruding toward the circuit board substantially perpendicularly to the opening surface of the wall portion so as to be separated from
The electronic device according to claim 1 , wherein the frame member includes the plane portion including a center of gravity of the frame member on the opening surface of the wall portion . The planar portion has a wide portion formed in a region near the barycentric point that is wider than other regions.
The electronic device according to claim 1 . The wide part is an adsorbed part adsorbed by an adsorbing device.
The electronic device according to claim 2 . Said vertical portion, an electronic device according to any one of claims 1 to 3, characterized in that it is formed so as to be disposed between the plurality of electronic components mounted on the circuit board. The electronic component includes an integrated circuit component and a chip component,
The planar section, the electronic device according to claim 2 or 3, characterized in that at least the wide portion is formed so as to be disposed in the integrated circuit component. The frame member has an engaging portion that is integrally formed with the wall portion and protrudes outward,
The lid is formed with a side plate that overlaps the wall when attached to the wall, and the side plate engages with the engaging portion to fix the lid. the electronic device according to claim 1, any one of 5, characterized in that Goana is formed. In the frame member, at least the bridge portion is formed of one sheet metal,
Said vertical portion, an electronic device according to any one of claims 1 6, characterized in that it is formed by bending from the flat part. A shield case attached to a circuit board on which electronic components are mounted,
The shield case includes a frame member in which a wall portion forming one opening portion and a bridge portion arranged across the opening portion are formed by a single sheet metal, and the frame member including the one opening portion. A lid attached to the frame member so as to cover
The bridge part includes a plane part substantially parallel to the opening part, and at least a part of the bridge part substantially perpendicularly to the opening surface of the wall part from an end part along the extending direction of the bridge part in the plane part. A length protruding in the circuit board side and a length in a direction perpendicular to a surface on which the electronic component is mounted on the circuit board is shorter than the wall portion ;
The said frame member is the shielding case characterized by the said plane part being formed including the gravity center of the said frame member in the opening surface of the said wall part .

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