JP2003309390A - Shielding member, receiving device and production method of the shielding member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a shielding member, a receiving device and a production method of the shielding member which sets the space of the parts to partition off the inside the shielding member, without restrictions according to a circuit design, and which realizes a lower cost. <P>SOLUTION: A protruding part 300 has a second bending part 330, which makes a terminal part 310 protrude toward a substrate 20, by bending the terminal part 310 for an electrical connection to the substrate 20; a first bending part 320 to bend the terminal part 310 in the first direction with respect to partition surface parts 100, 101, 102, and 103; and the terminal part 310, which is bent by the first bending part 320 into the second direction which transverses with the first direction. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield member formed by pressing a metal plate member and mounted on a substrate, a receiver having the shield member, and a method for manufacturing the shield member. It is a thing.

[0002]

2. Description of the Related Art A shield member mounted on a substrate is formed by pressing a metal plate member. This shield member has a complicated shape,
For example, it is attached to a high-frequency circuit board in which high-frequency current is easily induced and high-frequency energy is radiated again into the space by the induced current. A receiving device as a high-frequency device having such a high-frequency circuit board is built in, for example, a television receiver.
The television receiver receives a high frequency input signal to the circuit board via the receiving antenna of the receiving device.

FIG. 9 shows a conventionally used shield member, which is formed by pressing a metal plate member. The shield member 1000 has, for example, four side surface portions 1001, 1002, 1003, 1004. Another separating surface portion 1006 is provided between the side surface portions 1001 and 1003.

FIG. 10 shows an example in which the shield member 1000 of FIG. 9 is bent and formed three-dimensionally. The shield member 1000 has an upper surface side and a lower surface side covered with a cover 1010 and another cover 1014. The surface portion 1006 of the shield member 1000 has the circuit board 101.
Face to face 3. The circuit board 1013 has a hole 1020, and the solder surface terminal 1015 of the surface portion 1006 passes through the hole 1020. This solder side terminal 1015
Are electrically connected to the circuit board 1013 using solder 1016. Tip 1 of solder side terminal 1015
030 is in elastic contact with the claw 1017 of the cover 1014. The claw 1040 of the cover 1010 elastically contacts the convex portion 1043 of the shield member 1000. As a result, the shield member 1000 can be grounded to the cover 1014 through the solder surface terminal 1015.

FIG. 11 shows a part of the three-dimensional shape of the shield member 1000 of FIG. The shield member 1000 shown in FIG. 11 is a case including a side surface portion 1001, a side surface portion 1003, and a side surface portion 1004.
One surface portion 1006 is provided between 01 and 1003. In the lower portion of the surface portion 1006, the solder surface terminal 1015 described above is projected downward from the beginning, that is, the solder surface terminal 1015 is formed in the hole 102 of the circuit board 1013.
Circuit board 10 as shown in FIG.
It is electrically connected to 13 by solder 1016.

FIG. 12 shows the shield member 1000 of FIG.
A part of is expanded and shown. In FIG. 10, the side surface portion 10
01, a side surface portion 1004, and a surface portion 1006, and the surface portion 1006 has a solder surface terminal 1015. The solder surface terminal 1015 faces the side surface portion 1004.

In FIGS. 11 and 12, the shield member 1
The longitudinal direction of 000 is X, and the short direction is Y. The side surface portion 1001 is bent 90 degrees along the bending line 1050 shown in FIG.
It is folded 90 degrees at 51. And face 100
6 is bent 90 degrees at the bending line 1053. These folding lines 1050, 1051, 1053
Is indicated by a broken line.

The dimension L shown in FIG.
This is the width of 1004 in the height direction, and this dimension L is a dimension required in terms of design as the thickness of the shield member of the receiving device, and is defined to be 13 mm, for example. This dimension L
Will be standardized and designed with 13 mm as described above, for example. Due to the restriction of sheet metal pressing, the distance L1 between the side surface portion 1004 and the side surface portion 1006 which is the shield plate arranged in the shield member 1000 as the shield case is equal to or larger than this dimension L, that is, 13 mm or more. . That is, as shown in FIG. 10, from the bent line 1053 of the surface portion 1006 to the solder surface terminal 101.
The dimension L2 up to the tip portion 1015A of No. 5 must be equal to or greater than the dimension L. Solder side terminal 1015
Is the hole 102 of the circuit board 13 as shown in FIGS.
This is because it has to be passed through 0, exposed to the back side of the circuit board 1013, and elastically contacted with the claws 1017 of the cover 1014. Therefore, as shown in FIG. 11, the side surface portion 1 is directed toward the circuit board 1013 and the side surface portion 1
When formed between 001 and 1003, the side surface portion 100
The distance L1 between the surface 4 and the surface portion 1006 needs to be 13 mm or more, for example. This means that even with the distance L3 between the plurality of adjacent surface portions 1006 and 1006 in FIG. 9, the distance L3 becomes equal to or larger than the dimension L.

[0009]

However, the distance L1 between the side surface portion 1004 and the surface portion 1006 shown in FIG.
If, for example, 10 mm, which is smaller than m and smaller than m, must be set in design, the following problem occurs. The surface portion 1006 shown in FIGS. 11 and 12 is press-molded so as to be integrally formed with the side surface portions 1001 and 1003. However, in such an integral surface portion 1006, the distance L1 is required to be 13 mm or more as described above. Therefore, for example, when it is desired to set the distance L1 to 10 mm, this surface portion 1006 is not the integrally molded surface portion 1006. It is necessary to stop the above, prepare a surface portion of another member, and attach the surface portion of this other member to the side surface portions 1001 and 1003. That is, the additional mounting of the surface portion of this separate member reduces the distance L1 between the surface portion and the side surface portion to 1
It is set to 0 mm. If the surface portion as a shield plate which is a separate member is prepared in this way, the cost increases, which is a constraint on the circuit design. Therefore, the present invention solves the above-mentioned problems, and the interval between the sections for partitioning the shield member can be set without restriction according to the circuit design, and the cost can be reduced. And it aims at providing the manufacturing method of a shield member.

[0010]

According to a first aspect of the present invention, there is provided a shield member which is formed by pressing a metal plate member and is attached to a substrate. And a partition surface for partitioning an internal space formed by the substrate and the frame portion, which is formed by bending from a side surface portion facing the frame portion, and is formed continuously with the partition surface portion. A protrusion for grounding that is electrically connected to the substrate, the protrusion having a terminal portion for electrically connecting to the substrate, and the partition surface portion for connecting the terminal portion. A first bent portion for bending in a first direction, and the terminal portion bent by the first bent portion in a second direction intersecting the first direction, so that the terminal portion is formed on the substrate. To A second bent portion for only by projecting a shield member and having a.

According to the first aspect of the present invention, the frame portion of the shield member is formed of a plurality of side surface portions by bending. The separation surface part is
It is formed by bending from the facing side parts of the frame part,
The partition surface portion is for partitioning the internal space formed by the substrate and the frame portion. The protrusion for grounding is formed continuously with the partition surface and is electrically connected to the substrate. The terminal portion of the protruding portion is a portion for electrically connecting to the substrate. The first bent portion of the protruding portion is a portion for bending the terminal portion with respect to the partition surface portion in the first direction. The second bent portion of the protruding portion has the terminal portion bent by the first bent portion as the first bent portion.
By bending in a second direction that intersects the direction, the terminal portion is a portion that projects toward the substrate.

Thus, even if the terminal portion of the projecting portion is not formed continuously with respect to the partition surface portion in the direction toward the substrate side at the beginning, the terminal portion of the projecting portion will be the same as the first bent portion. By bending by the second bending portion, as a result, it is possible to finally project toward the facing substrate. Therefore, when the shield member is formed by pressing a metal plate-shaped member, it is not necessary to press it so as to face the substrate in advance, unlike the conventional case. Therefore, since it is not necessary to set the formation direction of the terminal portion of the protruding portion continuously formed on the separation surface portion to initially face the substrate side, the formation direction of the terminal portion of the protrusion portion from the separation surface portion can be arbitrarily set. Can be set. Therefore, the amount of protrusion of the protruding portion can be reduced, and the distance between the partition surface portion and the side surface portion or the distance between adjacent partition surface portions can be set to be small according to the situation of the design pattern of the substrate. Therefore, it is not necessary to mount a separate member which has been conventionally required in order to reduce the interval between the separation surface portions according to the situation of the design pattern of the board, the constraint on the circuit design is eased, and the cost can be reduced.

According to a second aspect of the invention, in the shield member according to the first aspect, the first bent portion bends the terminal portion by 90 degrees with respect to the partition surface portion, and the second bent portion includes the terminal. The part is further bent 90 degrees.

According to a third aspect of the present invention, in the shield member according to the first aspect, the substrate is a substrate for high frequency equipment.

According to a fourth aspect of the present invention, there is provided a receiving device having a shield member which is formed by pressing a plate member made of metal and is attached to a substrate. A frame portion formed of side surface portions, a partition surface portion formed by bending from the side surface portion facing the frame portion, and a partition surface portion for partitioning an internal space formed by the substrate and the frame portion, and a continuous partition surface portion. And a grounding protrusion that is electrically connected to the substrate, and the protrusion has a terminal portion for electrically connecting to the substrate and the terminal portion. First for bending in the first direction with respect to the partition surface portion
A bent portion and a second bent portion that projects the terminal portion toward the substrate by bending the terminal portion bent by the first bent portion in a second direction intersecting the first direction; It is a receiving device characterized by having.

According to the present invention, the frame portion of the shield member is formed by bending a plurality of side surface portions. The separation surface part is
It is formed by bending from the facing side parts of the frame part,
The partition surface portion is for partitioning the internal space formed by the substrate and the frame portion. The protrusion for grounding is formed continuously with the partition surface and is electrically connected to the substrate. The terminal portion of the protruding portion is a portion for electrically connecting to the substrate. The first bent portion of the protruding portion is a portion for bending the terminal portion with respect to the partition surface portion in the first direction. The second bent portion of the protruding portion has the terminal portion bent by the first bent portion as the first bent portion.
By bending in a second direction that intersects the direction, the terminal portion is a portion that projects toward the substrate.

Thus, even if the terminal portion of the projecting portion is not formed continuously with respect to the partition surface portion in the direction toward the substrate side, the terminal portion of the projecting portion is the same as the first bent portion. By bending by the second bending portion, as a result, it is possible to finally project toward the facing substrate. Therefore, when the shield member is formed by pressing a metal plate-shaped member, it is not necessary to press it so as to face the substrate in advance, unlike the conventional case. Therefore, since it is not necessary to set the formation direction of the terminal portion of the protruding portion continuously formed on the separation surface portion to initially face the substrate side, the formation direction of the terminal portion of the protrusion portion from the separation surface portion can be arbitrarily set. Can be set. Therefore, the amount of protrusion of the protruding portion can be reduced, and the distance between the partition surface portion and the side surface portion or the distance between adjacent partition surface portions can be set to be small according to the situation of the design pattern of the substrate. Therefore, it is not necessary to mount a separate member which has been conventionally required in order to reduce the interval between the separation surface portions according to the situation of the design pattern of the board, the constraint on the circuit design is eased, and the cost can be reduced.

According to a fifth aspect of the present invention, in the receiving device according to the fourth aspect, the first bent portion bends the terminal portion by 90 degrees with respect to the partition surface portion, and the second bent portion includes the terminal. The part is further bent 90 degrees.

A sixth aspect of the present invention is a method of manufacturing a shield member, which is formed by pressing a metal plate-shaped member and is attached to a substrate. The shield member is formed by bending the frame. Forming a part, a partition surface part for partitioning the internal space formed by the substrate and the frame part is formed by bending the partition surface part from the side surface part facing the frame part; and the partition surface part. And a direction setting step for setting a direction of a protrusion for grounding for electrically connecting to the substrate, the direction setting step comprising: A first bending step for bending a terminal portion to be electrically connected to the partition surface portion in a first direction by the first bending portion, and bending by the first bending portion A second bending step of projecting the terminal portion toward the substrate by bending the separated terminal portion in a second direction intersecting the first direction by a second bending portion. It is a method of manufacturing a shield member.

According to a sixth aspect of the present invention, in the step of forming the partition surface portion, the partition surface portion for partitioning the internal space formed by the substrate and the frame portion is formed when the frame portion including the plurality of side surface portions is formed by bending. It is formed by bending from the side surface portions facing each other. In the orientation setting step, the orientation of the protrusion for grounding, which is formed continuously on the partition surface and is electrically connected to the substrate, is set. In the first bending step of this orientation setting step, the terminal portion electrically connected to the substrate is bent in the first direction by the first bending portion with respect to the partition surface portion. Then, in the second bending step of the orientation setting step, the terminal portion bent by the first bending portion is bent by the second bending portion in the second direction intersecting the first direction, so that the terminal portion is projected toward the substrate. .

Accordingly, even if the terminal portion of the projecting portion is not formed continuously with respect to the partition surface portion in the direction toward the substrate side at the beginning, the terminal portion of the projecting portion is formed as the first bent portion. By bending by the second bending portion, as a result, it is possible to finally project toward the facing substrate. Therefore, when the shield member is formed by pressing a metal plate-shaped member, it is not necessary to press it so as to face the substrate in advance, unlike the conventional case. Therefore, since it is not necessary to set the formation direction of the terminal portion of the protruding portion continuously formed on the separation surface portion to initially face the substrate side, the formation direction of the terminal portion of the protrusion portion from the separation surface portion can be arbitrarily set. Can be set. Therefore, the amount of protrusion of the protruding portion can be reduced, and the distance between the partition surface portion and the side surface portion or the distance between adjacent partition surface portions can be set to be small according to the situation of the design pattern of the substrate. Therefore, it is not necessary to mount a separate member which has been conventionally required in order to reduce the interval between the separation surface portions according to the situation of the design pattern of the board, the constraint on the circuit design is eased, and the cost can be reduced.

According to a seventh aspect of the invention, in the method of manufacturing the shield member according to the sixth aspect, the first bent portion is
The terminal portion is bent 90 degrees with respect to the partition surface portion, and the second bent portion bends the terminal portion further 90 degrees.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The embodiment described below is a preferred specific example of the present invention,
Although various technically preferable limitations are given, the scope of the present invention is not limited to these forms unless otherwise specified in the description below.

FIG. 1 shows a television receiver as an example of an electronic apparatus in which the receiver of the present invention is mounted. The television receiver 14 includes a receiving device 10 which is a high frequency device. This receiving device 10
It has a substrate (also referred to as a high-frequency circuit substrate) 20, and this substrate 20 has an amplification unit 30, a filter unit 34, a direct conversion unit 36, and a digital demodulation unit 40. The amplification unit 30, the filter unit 34, the direct conversion unit 36, and the digital demodulation unit 40 are functional blocks formed on the substrate 20. Amplifier 30
Is connected to the receiving antenna 44 via the connector 90A, and the receiving antenna 44 receives the high frequency input signal f. The high frequency input signal f is amplified in the amplifier 30. The filter unit 34 generates a tuning frequency (local frequency) f.

The direct conversion section 36 subtracts the local frequency f generated by the filter section 34 from the high frequency input signal f to obtain the baseband (f
-F) is generated. That is, the direct conversion unit 36 has a function of selecting the amplified high frequency input signal f by the local frequency f generated by the filter unit 34, directly converting it, and detecting it. The digital demodulation unit 40 has a variable demodulation function of varying the obtained base band in the range of DC (direct current) to several tens of MHz. The input signal thus digitally demodulated is subjected to Y / C separation (separation of a luminance signal and a chrominance signal) through detection, and then a chrominance signal is amplified to separate a synchronization signal from the luminance signal. For example, an image is displayed on a CRT. The voice input signal is output through a speaker after voice detection.

FIG. 2 shows the substrate 20 shown in FIG. 1, the shield member 60 and the shield cover 61 mounted on the substrate 20. FIG. 3 is an example of a sectional structure of the shield member 60, the substrate 20, the shield cover 61, and the shield cover 63 of FIG. The upper shield cover 63 shown in FIG. 3 is omitted in FIG. The shield member 60, the shield cover 61, and the shield cover 63 are made by pressing metal, and are made of a metal material suitable for shielding high frequencies, such as aluminum, zinc, tin, or nickel. Made of material or its alloy. The shield member 60 is also called a shield case, and the board 20 is also called a high-frequency circuit board.

As shown in FIG. 2, the substrate 20 is slightly larger than the size of the shield member 60, but the shield member 60 is fixed to the substrate 20 by, for example, fitting the convex portion of the shield member and the hole of the substrate. Has been done. The portion of the substrate 20 surrounded by the shield member 60 is shown in FIG. 3, and the substrate 20 has a plurality of holes 20H.

In FIG. 2, the shield member 60 has, for example, four side surface portions 80, 81, 82, 83.
These four side surface portions 80, 81, 82, 83 form a frame portion 90. The four side surface portions 80 to 83 are arranged at the four corners so as to surround a part of the substrate. The side surface portions 80, 83 are short side portions, and the side surface portions 81, 82
Is the part of the long side. The side surface portions 80 and 83 are parallel and face each other, and the side surface portions 81 and 82 are also parallel and face each other.
The longitudinal direction of the frame portion 90 is X, and the short direction of the frame portion 90 is Y.
And The X direction and the Y direction are orthogonal to each other. The direction orthogonal to the X and Y directions is indicated by Z. Side direction 80-
83 in the width or thickness direction.

Side surface portions 80 and 8 of the shield member 60 shown in FIG.
Between the three, a plurality of separation surface parts 100, 101, 10
2, 103 are arranged in parallel. Separation surface 100
Numerals 103 to 103 are also called shield plates and are parallel to the Y direction. The side surface portion 80 and the dividing surface portion 100 divide the amplifying portion 30 of FIG.
01 and 102 partition the filter unit 34. The partition surfaces 102 and 103 partition the direct conversion unit 36 shown in FIG. Separating surface portion 103 and side surface portion 8
3 delimits the digital demodulation unit 40. The amplification section 30, the filter section 34, the direct conversion section 36, and the digital demodulation section 40 shield the high-frequency radiant energy by the partition surface sections 100 to 103.

In FIG. 2, for example, the distance D1 between the side surface portion 80 and the partition surface portion 100 is the other distances D2, D3.
It is set smaller than D4 and D5. This is set small due to the requirements of the circuit design of the amplification section 30. The interval D2 is the interval between the partition surface portions 100 and 101, the interval D3 is the interval between the partition surface portions 101 and 102, the interval D4 is the interval between the partition surface portions 102 and 103, and the interval D5 is the interval between the partition surface portions 103 and 103. Side part 8
3 intervals. Side surface portions 80 to 83 of the shield member 60
The width L in the Z direction is set to 13 mm, for example. On the other hand, the distance D1 between the side surface portion 80 and the partition surface portion 100 is set to a value smaller than this dimension L1 and, for example, 10 mm depending on the circuit design requirements of the amplification section 30.

FIG. 6 is a development view when the shield member 60 of FIG. 2 is pressed. Shield member 60 shown in FIG.
By appropriately bending, the three-dimensional shield member 60 as shown in FIG. 2 is formed.

As shown in FIGS. 2 and 6, the separating surface portion 10
Solder surface terminals 200 are respectively formed on the terminals 1, 102 and 103 so as to protrude through the holes of the substrate 20. In FIG. 2, these solder surface terminals 200 have a simple linear pin shape along the Z direction. Therefore, these solder surface terminals 200 pass through the holes of the substrate 20 along the surface direction of each partition surface portion, that is, along the Z direction in FIG. On the other hand, the separation surface portion 100 in which the distance D1 is set smaller than the dimension L is
It has a plurality of protrusions 300 for grounding which are completely different in shape from the solder surface terminals 200. These multiple protrusions 30
The shape of 0 has the same shape.

FIG. 4 shows a part of the shield member 60 of FIG. 2, and in FIG. 4, the side surface portion 80 and the side surface portions 81, 82 are shown.
And the part of the separation surface part 100 is shown. The distance D1 between the partition surface portion 100 and the side surface portion 80 is determined by the dimension L of the side surface portions 80, 81, 82 according to the circuit design requirements as described above.
Is set smaller than.

FIG. 5 is a developed view of the portion of the shield member 60 of FIG. 4, showing the side surface portions 80 and 82 and the separating surface portion 100. The side surface portion 82 is bent by about 90 degrees along a bending line 82A indicated by a broken line, and the side surface portion 80
Is bent by about 90 degrees along a bending line 80A indicated by a broken line. In addition, the separating surface portion 100 is formed by the bending line 100.
It can be bent by 90 degrees. The above-mentioned protruding portion 300 for grounding is integrally formed on the partition surface portion 100 shown in FIG. The protruding portion 300 has a terminal portion 3
10, the first bent portion 320 and the second bent portion 3
Has 30.

The terminal portion 310 of the protruding portion 300 is also referred to as a solder surface terminal as another name, and is fitted into the hole 20H of the substrate 20 as shown in FIG. 4 to the claw 61T of the shield cover 61 as shown in FIG. It is a portion for elastically contacting and electrically connecting. Thereby, the shield member 60
Are electrically connected to the wiring pattern of the substrate 20 using the solder 340. The terminal portion 310 is provided with the claw 6
Since it is electrically connected to the shield cover 61 via 1T, the shield member 60 is grounded to the shield cover 61. The protrusion 60P of the partition surface portion 100 is also electrically connected to the claw 63T of the shield cover 63 and grounded.

The first bent portion 320 in FIG. 5 is a portion for bending the terminal portion 310 with respect to the partition surface portion 100 in the first direction, for example, 90 degrees. The second bending portion 330 bends the terminal portion 310 bent by the first bending portion 320 in the second direction intersecting the first direction, for example, by 90 degrees, and as a result, the terminal portion 310 is finally placed on the substrate 20 side. It is a part for projecting toward.

FIG. 7 shows a procedure for bending the protrusion 300. As shown in FIG. 7A, the terminal portion 310 of the protruding portion 300 is parallel to the longitudinal direction of the partition surface portion 100 and parallel to the Y direction. The entire protruding portion 300 is the separation surface portion 1.
00 is on the same plane as 100A. The surface 100A of the separating surface portion 100 faces the substrate. Next, as shown in FIG. 7B, the terminal portion 310 is bent in the first direction R1 about the central axis CL1 by the bending line 321 of the first bending portion 320. As a result, the terminal portion 31
Although the longitudinal direction of 0 is oriented in the Y direction,
Surface 310A is oriented 90 degrees with respect to the surface 100A of the separation surface portion 100.

Next, as shown in FIG. 7C, the central axis CL2 is defined by the bending line 331 of the second bending portion 330.
Fold it about 90 degrees in the direction of R2. As a result, the terminal portion 310 finally faces downward in the Z direction and faces the hole 20H of the substrate 20. In this way, the terminal portion 310 at the tip of the protruding portion 300 is bent twice at about 90 degrees by the first bending portion 320 and the second bending portion 330 to change its direction, as shown in FIG. It can be directed to the hole 20H of the substrate 20.

As shown in FIGS. 5 and 7A, the protrusion 3
When the terminal part 310 of No. 00 is press-molded, the surface 310A of the terminal part 310 is the surface 100A of the separation surface part 100.
And the surface 310A is parallel to the Y direction. Therefore, the dimension L10 from the bending line 100A of the partition surface portion 100 to the end portion of the terminal portion 310 as shown in FIG. 5 can be set smaller than the dimension L of the side surface portions 80, 82, 83. That is, unlike the conventional case, the protruding portion 300 faces the Y direction, and therefore when the dimension L10 is reduced, the terminal portion 3 of the protruding portion 300 is reduced.
This is because the existence of 10 does not get in the way. In this way, the presence of the protrusion 300 for grounding does not hinder the reduction of the dimension L10. The dimension L10 is, for example, 10 mm, but is not limited to this and can be set freely according to the design of the circuit board.

Next, a method of manufacturing the shield member will be described with reference to FIG. FIG. 8 shows a separation surface portion forming step ST1 and an orientation setting step ST2. The orientation setting step ST2 is the first bending step ST2.
-1 and the second bending step ST2-2 are included. First, in a partition surface forming step ST1 of FIG. 8, a metal plate-shaped member is prepared, and the plate-shaped member is pressed to form a shield member as shown in FIG. The four side surfaces 8 of the shield member 60
Bend 0 to approximately 90 degrees and frame part 90 as shown in FIG.
And the partition surface portions 100 to 103 are also bent at approximately 90 degrees. Thereby, the partition surfaces 100 to 103 can partition the internal space in the frame 90. The partition surfaces 100 to 103 are bent between the facing side surfaces 81 and 82 to partition the internal space.

Next, when the process proceeds to the orientation setting step ST2 in FIG. 8, in this step ST2, for example, the separation surface portion 1
00 is formed in succession to the ground protrusion 300.
Is set to electrically connect to the substrate 20. In the first bending step ST2-1 of this orientation setting step ST2, as shown in FIG. 7B, the terminal portion 310 is moved along the bending line 321 of the first bending portion 320 about the central axis CL1 in the first direction R1. Fold it 90 degrees.

Next, in the second bending step ST2-2, as shown in FIG. 7C, the terminal portion 310 is moved along the bending line 331 of the second bending portion 330 and the central axis CL2.
Is bent about 90 degrees in the second direction R2. As a result, the terminal portion 310 faces the hole 20H of the substrate 20.

Next, in the electrical connection step ST3 of FIG. 8, the terminal portion 310 is connected to the shield cover 6 as shown in FIG.
1 is elastically and electrically connected to the claw 61T that is bent inward. At this time, the terminal part 310 is electrically connected to the conductor pattern of the substrate 20 by the solder 340. Incidentally, as shown in FIG.
The projection 60P of the partition surface portion 100 of the
3 is elastically and electrically connected to the claw 63T formed on the inside. Thereby, the partition surface portion 100 can be grounded to the shield cover 61 and the shield cover 63 via the terminal portion 310 and the protrusion 60P, respectively.

As described above, in the embodiment of the present invention, as shown in FIG.
, For example, the distance D between the partition surface portion 100 and the side surface portion 80
1 is set to be smaller than the predetermined dimension L of the side surface of the shield member 60, the protrusion 300
By adopting this structure, the distance D1 can be set small according to the circuit design of the substrate 20 regardless of the size L. For this reason, in the present invention, it is not necessary to attach the separating surface portion of the separate component to the frame portion, which has been conventionally required, so that the cost can be reduced and the board 20
The circuit design can be relatively freely designed without being affected by the distance between the separation surface portion and the side surface portion of the shield member 60 or the distance between the adjacent separation surface portions.

As a result, even if the terminal portion of the projecting portion is not continuously formed with respect to the partition surface portion in the direction that initially faces the substrate side, the terminal portion of the projecting portion is the same as the first bent portion. By bending by the second bending portion, as a result, it is possible to finally project toward the facing substrate. Therefore, when the shield member is formed by pressing a metal plate-shaped member, it is not necessary to press it so as to face the substrate in advance, unlike the conventional case. Therefore, since it is not necessary to set the formation direction of the terminal portion of the protruding portion continuously formed on the separation surface portion to initially face the substrate side, the formation direction of the terminal portion of the protrusion portion from the separation surface portion can be arbitrarily set. Can be set. Therefore, the amount of protrusion of the protruding portion can be reduced, and the distance between the partition surface portion and the side surface portion or the distance between adjacent partition surface portions can be set to be small according to the situation of the design pattern of the substrate. Therefore, it is not necessary to mount a separate member which has been conventionally required in order to reduce the interval between the separation surface portions according to the situation of the design pattern of the board, the constraint on the circuit design is eased, and the cost can be reduced.

The present invention is not limited to the above embodiment. In the above-described embodiment, as shown in FIG. 2, the distance D1 between one partition surface portion 100 and the side surface portion.
Shows an example in which is set smaller than the dimension L1. However, the invention is not limited to this, and the adjacent separation surface portions 100, 101, 10
Of course, one or more intervals of the intervals D2, D3, D4, D5 of 2, 103 may be set smaller than the dimension L. In this case, the projecting portion 300 may be provided in place of the solder surface terminal 200 on the partition surface portion of the interval to be set to be small.

The frame portion 90 does not necessarily have to have four side surface portions, but may have three side surface portions or two side surface portions as required. Further, the terminal portion of the protruding portion 300 is bent by approximately 90 degrees at the first bending portion and further bent by 90 degrees by the second bending portion, but the present invention is not limited to this, and the bending angle may be an angle other than 90 degrees. Of course it doesn't matter.

[0048]

As described above, according to the present invention,
According to the circuit design, it is possible to set the interval between the sections for partitioning the shield member without restriction, and it is possible to reduce the cost.

[Brief description of drawings]

FIG. 1 is a diagram showing a television receiver including a receiving device of the present invention.

FIG. 2 is a perspective view showing a substrate, a shield member and the like of the receiving device of FIG.

3 is a sectional view taken along line AA of FIG.

FIG. 4 is a perspective view showing a part of a shield member.

5 is a development view of a portion of the shield member of FIG.

FIG. 6 is a development view of the entire shield member.

FIG. 7 is a diagram illustrating a procedure for bending the protruding portion of the partition surface portion.

FIG. 8 is a diagram illustrating a method of manufacturing a shield member according to the present invention.

FIG. 9 is a development view of a conventional shield member

FIG. 10 is a cross-sectional view showing a conventional shield member, shield cover, circuit and the like.

FIG. 11 is a view showing a part of a conventional shield member.

12 is a development view showing a part of the conventional shield member of FIG.

[Explanation of symbols]

10 ... Receiving device, 20 ... Substrate, 60 ... Shield member, 80, 81, 82, 83 ... Side part, 90
... Frame portion, 100, 101, 102, 103 ... Separation surface portion, 300 ... Ground protrusion portion, 310 ...
・ Terminal portion, 320 ... First bent portion, 330 ...
Second bent part

Claims (7)

[Claims] 1. A shield member which is formed by pressing a metal plate-shaped member and is attached to a substrate, the frame member having a plurality of side surface parts when folded, and the frame member facing each other. A partition surface portion formed by bending from the side surface portion for partitioning an internal space formed by the substrate and the frame portion; and a partition surface portion continuously formed on the partition surface portion and electrically connected to the substrate. A protruding portion for grounding, and the protruding portion includes a terminal portion for electrically connecting to the substrate, and a first portion for bending the terminal portion with respect to the partition surface portion in a first direction. By bending the first bending portion and the terminal portion bent by the first bending portion in a second direction intersecting the first direction,
A second bent portion for projecting the terminal portion toward the substrate, and a shield member. 2. The shield according to claim 1, wherein the first bent portion bends the terminal portion by 90 degrees with respect to the partition surface portion, and the second bent portion bends the terminal portion by 90 degrees. Element. 3. The shield member according to claim 1, wherein the substrate is a substrate for a high frequency device. 4. A receiving device having a shield member which is formed by pressing a metal plate-shaped member and is mounted on a substrate, wherein the shield member is formed by bending a plurality of side surface portions. A frame portion, a partition surface portion formed by bending from the side surface portion facing the frame portion, for partitioning an internal space formed by the substrate and the frame portion, and a partition surface portion formed continuously with the partition surface portion A protrusion for grounding that is electrically connected to the substrate, wherein the protrusion has a terminal portion for electrically connecting to the substrate, and the terminal portion with respect to the partition surface portion. A first bending portion for bending in a first direction, and the terminal portion bent by the first bending portion in a second direction intersecting the first direction,
A second bent portion for projecting the terminal portion toward the substrate, the receiving device. 5. The reception according to claim 4, wherein the first bent portion bends the terminal portion by 90 degrees with respect to the partition surface portion, and the second bent portion bends the terminal portion by 90 degrees. apparatus. 6. A method of manufacturing a shield member, which is formed by pressing a metal plate member and is attached to a substrate, wherein a frame portion having a plurality of side surface portions is formed by bending. A step of forming a partition surface for partitioning an internal space formed by the substrate and the frame from the side surface facing the frame, and forming the partition surface continuously with the partition surface. And a direction setting step for setting the direction of the grounding protrusion for electrically connecting to the substrate, wherein the direction setting step electrically connects to the substrate. A first bending step for bending the terminal portion with respect to the partition surface portion in a first direction by a first bending portion; and the terminal bent by the first bending portion. And a second bending step of bending the terminal portion toward the substrate by bending the second portion in a second direction intersecting the first direction by a second bending portion. . 7. The shield according to claim 6, wherein the first bent portion bends the terminal portion by 90 degrees with respect to the partition surface portion, and the second bent portion bends the terminal portion by 90 degrees. A method of manufacturing a member.