JP2010258821A - Mobile wireless device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mobile wireless device, including a shield case for strengthening protection of electronic components with respect to a load from the outside. <P>SOLUTION: A mobile telephone 1 includes: a casing 2; a circuit board 70 arranged inside the casing 2; each electronic component 71 mounted on at least one face 70a of the circuit board 70; and a shield case 60. The shielding case is arranged so as to cover at least one face 70a of the circuit board 70. The shielding case includes: a flat plate 62; each recess 63 provided at a position, overlapping in the thickness direction with each electronic component 71, mounted on the circuit board 70, in the flat plate 62 and recessed from the outer-face side to the inner-face side so as to be brought into contact with or brought close to each electronic component 71; and each resin member 64 filled into each recess 63. The shielding case has an outer face constituted into a substantially planar shape. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a mobile radio apparatus such as a mobile phone.

  2. Description of the Related Art Conventionally, in a mobile phone as a portable wireless device, a mounting surface of an electronic component on a circuit board on which the electronic component is mounted is covered with a shield case. The shield case includes a flat plate portion and a rib portion that protrudes substantially perpendicularly from one surface of the flat plate portion. By covering the electronic component mounted on the circuit board with such a shield case, the influence of noise on the electronic component is reduced. In addition, this shield case protects the electronic components from external loads such as impact caused by dropping of the mobile phone.

  For example, Patent Document 1 proposes a technique in which the thickness of a region overlapping with the electronic component in the flat plate portion of the shield case is increased by die casting to bring the flat plate portion and the electronic component into contact with each other. .

JP 2006-310451 A

  By the way, in recent years, there has been a strong demand for thinner mobile phones. Here, since the shield case proposed in Patent Document 1 is formed by die casting, the shield case needs to have a certain thickness. Therefore, with the technique proposed in Patent Document 1, it is difficult to reduce the thickness of the shield case that is required to reduce the thickness of the mobile phone.

  Therefore, an object of the present invention is to provide a portable wireless device including a shield case that can enhance protection of electronic components against external loads.

  The present invention provides a casing, a circuit board disposed in the casing, an electronic component mounted on at least one surface of the circuit board, and the one surface of the circuit board so as to cover the one surface. A flat plate portion and a concave portion provided in a position overlapping with the electronic component mounted on the circuit board in the thickness direction in the flat plate portion and recessed from the outer surface side to the inner surface side and in contact with or close to the electronic component, The present invention relates to a portable wireless device including a shielding member having a resin member filled in a recess and having an outer surface configured in a substantially planar shape.

  Moreover, it is preferable that the said resin member is comprised with a thermosetting resin.

  In addition, an underfill member that is injected into a gap formed between the circuit board and the electronic component and cured at a predetermined temperature is further provided, and the thermosetting resin is cured at the predetermined temperature. Is preferred.

  Moreover, it is preferable that a portable electronic device is further provided with the key board | substrate arrange | positioned at the outer surface side in the flat plate part of the said shield case.

  The portable wireless device may further include a sheet metal member disposed on an outer surface side of the flat plate portion of the shield case, and the key board is preferably disposed on the outer surface side of the flat plate portion via the sheet metal member. .

  Moreover, it is preferable that the said flat part in the said shield case is provided with the said several recessed part, and each of this recessed part has a substantially equal dent capacity | capacitance.

  Moreover, it is preferable that the plurality of recesses include recesses having two or more different planar shapes.

  ADVANTAGE OF THE INVENTION According to this invention, the portable radio | wireless apparatus provided with the shield case which can strengthen the protection of the electronic component with respect to the load from the outside can be provided.

It is a perspective view which shows the mobile phone which concerns on one Embodiment of this invention in an open state. It is a disassembled perspective view of the operation part side housing | casing in the mobile telephone shown in FIG. It is a disassembled perspective view of the display part side housing | casing in the mobile telephone shown in FIG. It is XX sectional drawing in the mobile telephone shown in FIG. It is a figure which shows an example of the shape of the recessed part provided in the flat plate part. It is a figure which shows the mounting process of the main circuit board 70, and is a figure which shows the process of printing a solder paste. It is a figure which shows the mounting process of the main circuit board 70, and is a figure which shows the process of arrange | positioning an electronic component. It is a figure which shows the mounting process of the main circuit board 70, and is a figure which shows the process of apply | coating an underfill member. It is a figure which shows the mounting process of the main circuit board 70, and is a figure which shows the process of attaching a flat plate part. It is a figure which shows the mounting process of the main circuit board 70, and is a figure which shows the process of filling thermosetting resin. It is a figure which shows the mounting process of the main circuit board 70, and is a figure which shows the process of heating the main circuit board 70 to which the shield case 60 was fixed.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, the basic structure of a mobile phone 1 that is an embodiment of the mobile wireless device of the present invention will be described with reference to FIGS.
FIG. 1 is a perspective view showing a mobile phone 1 according to an embodiment of the present invention in an open state. FIG. 2 is an exploded perspective view of the operation unit side body 2, and FIG. 3 is an exploded perspective view of the display unit side body 3.

  As shown in FIG. 1, a mobile phone 1 according to the present embodiment is a foldable mobile phone 1, which includes an operation unit side case 2 as a substantially rectangular parallelepiped case and a display unit side case having a substantially rectangular parallelepiped shape. A body 3, and a connecting portion 4 that connects the operation unit side body 2 and the display unit side body 3.

  An upper end portion of the operation unit side body 2 and a lower end portion of the display unit side body 3 are connected to each other through a connection unit 4 so as to be opened and closed. That is, the connection part 4 connects the display part side housing | casing 3 and the operation part side housing | casing 2 so that opening and closing is possible centering on an opening-and-closing axis | shaft. The mobile phone 1 is configured such that the operation unit side body 2 and the display unit side body 3 and the display unit side body 3 connected via the connection unit 4 are relatively rotated (rotated), thereby displaying the operation unit side body 2 and the display. Deformed in a state in which the unit-side housing 3 is open to each other (open state, see FIG. 1) or a state in which the operation unit-side housing 2 and the display unit-side housing 3 are folded (closed state, not shown) Is done.

  First, the operation unit side body 2 will be described. As shown in FIGS. 1 and 2, the operation unit side body 2 includes a front case 21, a front cover 24, and a rear case 22 that form an outer shell. The front case 21 and the front cover 24 constitute the front surface 2 a side of the operation unit side body 2. The front surface 2 a of the operation unit side body 2 is a surface facing the display unit side body 3 in a state in which the mobile phone 1 is folded. The rear case 22 constitutes a back surface 2b side that is a surface opposite to the front surface 2a in the operation unit side body 2.

  The front case 21 constitutes an outer peripheral portion of the front surface 2a, and the inside of the outer peripheral portion is opened. The front cover 24 is disposed so as to close the opening of the front case 21. The front cover 24 is configured such that the operation key group 11 is exposed to the front surface 2a. The operation key group 11 includes input of a function setting operation key 13 for operating various settings, various functions such as a telephone book function and a mail function, and a numeric keypad for inputting a telephone number and characters such as mail. An operation key 14 and a determination operation key 15 for determining various operations and scrolling in the up, down, left, and right directions are provided.

  A predetermined function is assigned to each key constituting the operation key group 11 according to the open / closed state of the operation unit side body 2 and the display unit side body 3 and the type of application being activated (key).・ Assign). In the mobile phone 1, when each key constituting the operation key group 11 is pressed by the user, an operation corresponding to the function assigned to each key is executed.

  On the front surface 2 a of the operation unit side body 2, a voice input unit 12 to which a voice uttered by the user of the mobile phone 1 during a call is input. The voice input unit 12 is disposed in the vicinity of the end (lower end) on the opposite side of the connection unit 4 in the longitudinal direction of the operation unit side body 2.

The side surface of the operation unit side body 2 is charged with, for example, an interface for transmitting / receiving data to / from an external device (for example, a host device), a headphone / microphone terminal, a removable external memory interface, or a battery. Charging terminals and the like are provided.
The internal structure of the operation unit side body 2 will be described later.

  Next, the display unit side body 3 will be described. As shown in FIGS. 1 and 3, the display unit side body 3 includes a front case 30a, a cover member 33, and a rear case 30b that form an outer shell. The front case 30 a and the cover member 33 constitute the front surface 3 a side of the display unit side body 3. The front surface 3a of the display unit side body 3 is a surface facing the operation unit side body 2 in a state where the mobile phone 1 is folded. The rear case 30b constitutes a back surface 3b side that is a surface opposite to the front surface 3a in the display unit side body 3.

  The front case 30a is provided with a voice output unit 31 that outputs voice on the other side of the call. The audio output unit 31 is disposed on the end side opposite to the connection unit 4 in the longitudinal direction of the display unit side body 3.

As shown in FIG. 3, between the front case 30a and the rear case 30b, a display unit side circuit board 35, a main liquid crystal module 34 disposed on the front case 30a side of the display unit side circuit board 35, A sub liquid crystal module 36 disposed on the rear case 30b side of the display unit side circuit board 35 is incorporated.
A main display portion 34a is provided on one surface of the main liquid crystal module 34 (the surface on the front case 30a side), and various information is displayed on the main display portion 34a. The main display part 34a is visible from the front surface 3a side of the display unit side body 3 through a cover member 33 that is entirely or partially transparent.

  A sub display unit 36a is provided on one surface of the sub liquid crystal module 36 (the surface on the rear case 30b side), and various types of information are displayed on the sub display unit 36a. The sub display unit is visible from the rear surface 3b side of the display unit side body 3 through a transparent portion (not shown) of the rear case 30b.

  Each of the main liquid crystal module 34 and the sub liquid crystal module 36 includes a liquid crystal panel, a drive circuit that drives the liquid crystal panel, and a backlight that emits light from the back side of the liquid crystal panel.

Next, the internal structure of the operation unit side body 2 will be described with reference to FIGS. 2 and 4.
4 is a cross-sectional view taken along line XX of FIG.
2 and 4, the operation unit side body 2 includes a front cover 24, a key structure 40, a key substrate 50, a front case 21, a shield case 60, and a main circuit as a circuit board. A substrate 70, a rear case 22, a battery Q, and a battery lid 23 are provided.

The front case 21 is configured by integrally forming a metal sheet metal member 25 and a resin member 26 covering a part of the sheet metal member 25 by insert molding.
The resin member 26 mainly forms the outer periphery of the front case 30a in a frame shape. The sheet metal member 25 mainly forms a portion inside the frame-shaped resin member 26 in the front case 21. That is, the sheet metal member 25 forms a surface of the front case 21 that faces the rear case 22.
The front cover 24 is disposed so as to close an opening formed by being surrounded by a frame-shaped resin member 26 in the front case 21. Further, the front case 21 and the rear case 22 are arranged so that the inner surfaces of the concave shapes face each other, and are joined so that the outer peripheral edges thereof overlap each other.

As shown in FIG. 2, the key structure 40 and the key substrate 50 are housed between the front cover 24 and the sheet metal member 25 in the front case 21 so as to be sandwiched therebetween. In addition, the shield case 60 and the main circuit board 70 are interposed between the front case 21 and the rear case 22 so as to be sandwiched therebetween.
That is, in the operation unit side body 2, as shown in FIG. 2, the battery lid 23, the battery Q, the rear case 22, the main circuit board 70, the shield case 60, the sheet metal member 25, the key board 50, and the key structure part 40. The front cover 24 is laminated in this order.

  In the front cover 24, key holes 13 a, 14 a, and 15 a are formed on the inner surface facing the main display portion 34 a of the display unit side body 3 in the closed state of the mobile phone 1. From each of the key holes 13a, 14a, 15a, the pressing surface of the function setting operation key member 13b constituting the function setting operation key 13, the pressing surface of the input operation key member 14b constituting the input operation key 14, and the determination operation key 15 The pressing surface of the determination operation key member 15b that constitutes is exposed.

  A plurality of electronic components 71 are arranged on the main circuit board 70. These electronic components 71 form a plurality of circuit blocks by a predetermined combination. For example, various circuit blocks including an RF (Radio Frequency) circuit, a power supply circuit, and the like are formed on the main circuit board 70.

  On the first surface 70a on the shield case 60 side, which is one surface of the main circuit board 70, a plurality of electronic components 71 to be mounted and a reference potential pattern layer (not shown) constituting a reference potential portion are formed. Is done. The reference potential pattern layer is formed by printing a conductive member in a predetermined pattern on the surface of the first surface 70a of the main circuit board 70. The reference potential pattern layer is formed at a position where a rib portion 61 of a shield case 60 described later is provided.

  As the plurality of electronic components 71, as shown in FIG. 4, an electronic component 71 having a plurality of connection terminals 72 (solder balls) such as a BGA is used. When mounting such an electronic component 71 on the first surface 70 a of the main circuit board 70, first, the electronic component 71 is arranged at a predetermined position on the first surface 70 a of the main circuit board 70, and a plurality of the electronic components 71 are arranged. The connection terminal 72 and the main circuit board 70 are connected by soldering or the like. Also, as shown in FIG. 4, an underfill member 73 made of a thermosetting resin is applied to a gap formed between the electronic component 71 and the main circuit board 70, and the electronic component 71 and the main circuit are then applied. Fixability with the substrate 70 is enhanced.

The shield case 60 includes, on the first surface 70 a of the main circuit board 70, a rib portion 61 disposed so as to surround the plurality of electronic components 71, and a flat plate that is fixed to the distal end side of the rib portion 61 and covers the plurality of electronic components 71. And a plurality of recesses 63 formed in the flat plate part 62 so as to be recessed from the outer surface side to the inner surface side, and a resin member 64 filled in each of the plurality of recesses 63.
The rib portion 61 is disposed on the reference potential pattern layer 75 formed on the first surface 70 a of the main circuit board 70. The rib portion 61 is formed to be equal to or higher than the height of the highest electronic component among the various electronic components mounted on the main circuit board 70.

The flat plate portion 62 and the plurality of concave portions 63 provided in the flat plate portion 62 are integrally formed by pressing a sheet metal member.
The flat plate portion 62 covers a region surrounded by the rib portion 61 of the first surface 70 a in the main circuit board 70.

The plurality of recesses 63 are respectively provided at positions overlapping the plurality of electronic components 71 in the thickness direction in a state where the rib portion 61 and the flat plate portion 62 are attached to the main circuit board 70.
The shape (planar shape) in plan view of each of the plurality of recesses 63 is formed substantially equal to the shape in plan view of the electronic component 71 overlapping in the thickness direction. That is, when the plurality of electronic components 71 have a plurality of shapes in plan view, the plurality of recesses 63 also have a plurality of types of planar shapes.
Further, the depth of the plurality of recesses 63 is formed such that the rib portion 61 and the flat plate portion 62 are in contact with or close to the electronic component 71 overlapping in the thickness direction when the rib portion 61 and the flat plate portion 62 are attached to the main circuit board 70. . That is, the depth of the recess 63 provided at a position overlapping the electronic component 71 having a low height is configured to be deeper than the depth of the recess 63 provided at a position overlapping the electronic component 71 having a high height.

  Moreover, the volume (dent capacity | capacitance) of the recessed part in each of the some recessed part 63 is formed substantially equal. Specifically, the recess 63 corresponding to the electronic component 71 having a large planar shape and the recess 63 corresponding to the electronic component 71 having a low height correspond to the planar shape of the electronic component 71 as shown in FIG. A part of the region is recessed. Thereby, the recessed capacity | capacitance of each of the some recessed part 63 can be formed substantially equally.

  As shown in FIG. 4, the resin member 64 is filled in each of the plurality of recesses 63, and the outer surface of the portion where the flat plate portion 62 is disposed in the shield case 60 is configured to be substantially planar. That is, the outer surface of the shield case 60 is formed flush with the plurality of recesses 63 filled with the resin member 64. As the resin member 64, a thermosetting resin that is cured by being heated at a predetermined temperature can be suitably used. In the present embodiment, the same material as the above-described underfill member 73 is used as the resin member 64.

  The shield case 60 described above is electrically connected to the reference potential pattern layer by bringing the bottom surface of the rib portion 61 into contact with the reference potential pattern layer. The shield case 60 is electrically connected to the reference potential pattern layer and has the same potential as the reference potential pattern layer.

  The shield case 60 prevents external noise such as high frequency from acting on the plurality of electronic components 71 disposed on the main circuit board 70. Specifically, the bottom surface of the rib portion 61 in the shield case 60 is disposed on the reference potential pattern layer, so that the plurality of electronic components 71 are surrounded by the rib portion 61 and covered with the flat plate portion 62. Thereby, it can suppress that noise, such as a high frequency from the outside, acts on the electronic component 71 arrange | positioned at the main circuit board 70. FIG.

The key substrate 50 is a flexible substrate formed by interposing a wiring between a plurality of insulating layers (insulating films). The key substrate 50 is disposed on the outer surface side of the flat plate portion 62 in the shield case 60 via the sheet metal member 25 constituting the front case 21.
That is, in the present embodiment, the sheet metal member 25 is disposed on the outer surface side of the flat plate portion 62 in the shield case 60, and the key substrate 50 is stacked on the sheet metal member 25.
The key board 50 includes a plurality of key switches 51, 52, 53 formed on the key structure 40 side corresponding to the function setting operation key 13, the input operation key 14, and the determination operation key 15, respectively. The key switches 51, 52, and 53 have a metal dome that is a metal plate that is three-dimensionally curved in a bowl shape. When the top of the bowl-shaped metal dome is pressed, the metal dome comes into contact with a switch terminal formed on an electric circuit (not shown) printed on the surface of the key substrate 50 so as to be electrically connected. Composed.

  The key structure unit 40 is disposed to face the key substrate 50. The key structure portion 40 is a base sheet in which a pusher capable of pressing a plurality of key switches 51, 52, 53 and a key top having a pressing surface of the operation key group 11 are made of elastic silicon rubber or the like. It is provided and configured. The function setting operation key 13, the input operation key 14, and the determination operation key 15 constituting the operation key group 11 in the key structure unit 40 are arranged at positions facing the key switches 51, 52, 53 on the key substrate 50, It arrange | positions so that it may expose from the key holes 13a, 14a, and 15a formed in the front cover 24. FIG.

  A removable battery lid 23 is provided on one end side of the rear case 22. The battery lid 23 is attached to the rear case 22 after storing the battery Q from the outside of the rear case 22. Moreover, the microphone (not shown) of the audio | voice input part 12 which inputs a user's audio | voice is accommodated in the one end side in the rear case 22. FIG.

Next, the mounting process of the main circuit board 70 in the mobile phone 1 of the present embodiment described above will be described with reference to FIGS. 6A to 6F. 6A to 6F are diagrams illustrating an assembly process of the operation unit side body 2.
In the mounting process of the main circuit board 70 in the mobile phone 1 of the present embodiment, first, as shown in FIG. 6A, the solder paste 74 is printed by screen printing at a predetermined position on the first surface 70a of the main circuit board 70. .
Next, as shown in FIG. 6B, an electronic component 71 having a plurality of connection terminals 72 (solder balls) such as BGA on the main circuit board 70 on which the solder paste 74 is printed, and a rib portion 61 constituting the shield case 60 are provided. Deploy.

  Next, the main circuit board 70 on which the plurality of electronic components 71 are arranged is heated in a reflow furnace that performs heating at a predetermined temperature (not shown). Then, the solder printed on the main circuit board 70 and the plurality of solder balls 72 of the electronic component 71 are melted, and the main circuit board 70 and the electronic component 71 are coupled. Further, the solder printed on the main circuit board 70 is melted, and the main circuit board 70 and the rib portion 61 are coupled. Thereby, the wiring (not shown) formed on the main circuit board 70 and the electronic component 71 are electrically connected. Further, a reference potential pattern layer (not shown) formed on the main circuit board 70 and the rib portion 61 are electrically connected. In this state, a gap is formed between the main circuit board 70 and the electronic component 71 mounted on the main circuit board 70 (see FIG. 4).

Next, as illustrated in FIG. 6C, an underfill member 73 is applied to a gap formed between the main circuit board 70 and the electronic component 71. The underfill member 73 is applied using a despacer (not shown).
Next, as shown in FIG. 6D, the flat plate portion 62 is disposed and fixed on the leading end side of the rib portion 61 in the main circuit board 70 to which the underfill member 73 is applied. The flat plate portion 62 is provided with a plurality of concave portions 63 at predetermined positions by press working. Further, the flat plate portion 62 is fixed so that the plurality of concave portions 63 are arranged at positions where the corresponding plurality of electronic components 71 respectively overlap in the thickness direction.

Next, as shown in FIG. 6E, the plurality of recesses 63 are filled with a thermosetting resin 64. The thermosetting resin 64 is made of the same material as the underfill member 73. The thermosetting resin 64 is filled with an amount substantially equal to the recess capacity of the plurality of recesses 63. Thereby, the upper surface of the thermosetting resin 64 filled in the plurality of recesses 63 substantially coincides with the surface of the flat plate portion 62 where the plurality of recesses 63 are not provided. That is, the outer surface of the shield case 60 is formed in a substantially flat shape.
Next, as shown in FIG. 6F, the main circuit board 70 on which the shield case 60 in which the plurality of recesses 63 are filled with the thermosetting resin 64 is fixed is heated to a predetermined temperature in a reflow furnace. Thereby, the underfill member 73 is cured, and the connection state between the electronic component 71 and the main circuit board 70 is reinforced. Further, the filled thermosetting resin 64 is cured, and the outer surface of the shield case 60 is formed flush.

  As shown in FIG. 2, the shield case 60 fixed to the main circuit board 70 in this way is disposed between the sheet metal member 25 and the rear case 22 constituting the front case 21. It is inserted and accommodated so that it may be located in. In addition, the key substrate 50 and the key structure 40 are sandwiched and accommodated between the sheet metal member 25 and the front cover 24.

According to the mobile phone 1 of the present embodiment described above, the following effects are obtained.
A plurality of recesses 63 are provided at positions overlapping the plurality of electronic components 71 mounted on the main circuit board 70 in the thickness direction, and the resin members 64 are filled in the plurality of recesses 63 so that the outer surface of the shield case 60 is covered. It was comprised in the substantially planar shape. As a result, the electronic component 71 mounted on the main circuit board 70 is applied by the recess 63. Moreover, since the recessed part 63 is filled with the resin member 64 and is formed in the same plane, the shield case 60 can receive the load from the outside uniformly over a wide range. Therefore, the protection of the electronic component 71 against an external load can be strengthened. Further, it is possible to prevent the shield case 60 from being deformed when receiving a load from outside.

  Further, the resin member 64 is made of a thermosetting resin. Accordingly, by heating the shield case 60 in which the concave portion 63 is filled with the thermosetting resin, the outer surface of the shield case 60 can be easily configured in a substantially planar shape.

  Moreover, the same material as the underfill member 73 was used as the thermosetting resin. Thereby, the process of hardening the underfill member 73 and the process of hardening the thermosetting resin with which the recessed part 63 was filled can be performed simultaneously (refer FIG. 6F). Therefore, an increase in assembly man-hours of the mobile phone 1 can be suppressed.

  Further, the sheet metal member 25 is disposed between the flat plate portion 62 of the shield case 60 and the key substrate 50. Thereby, when the key switch which comprises the key board | substrate 50 is pressed down, the load added to the flat plate part 62 can be made more uniform. Therefore, the protection of the electronic component 71 against an external load can be further strengthened. Moreover, the deformation of the shield case 60 when receiving a load from the outside can be further reduced.

  The planar shape of each of the plurality of recesses 63 is substantially the same as the shape of the corresponding electronic component 71 in plan view. That is, corresponding to the electronic components 71 having different planar shapes, the plurality of recesses 63 are configured to include recesses having two or more different planar shapes. Thereby, the application | coating effect of the electronic component 71 by the some recessed part 63 can be improved.

  Further, the recessed capacities of the plurality of recessed portions 63 are configured to be substantially equal. Specifically, in the recess 63 corresponding to the electronic component 71 having a large planar shape or the recess 63 corresponding to the electronic component 71 having a low height, a part of the region corresponding to the planar shape of the electronic component 71 is recessed. I didn't. Thereby, the quantity of the thermosetting resin with which each recessed part 63 is filled can be made equal. Therefore, since the thermosetting resin can be filled into the plurality of recesses 63 with a single despacer (filling device), the cost for manufacturing the mobile phone 1 can be reduced.

  Further, if the resin member to be filled has a good thermal conductivity, the heat generated in the electronic component 71 can be efficiently radiated. In particular, since the resin member is in contact with the sheet metal member 25 having high conduction efficiency, the heat dissipation is further enhanced. Thereby, it can avoid that the heat which generate | occur | produced in the electronic component 71 concentrates on one place.

As mentioned above, although one Embodiment of this invention was described, this invention is not restrict | limited to embodiment mentioned above, It can change suitably.
For example, in the present embodiment, the sheet metal member 25 is disposed on the outer surface side of the shield case 60, and the key substrate 50 is stacked on the sheet metal member 25. However, the present invention is not limited thereto. That is, the key board may be directly stacked on the outer surface of the shield case.
In this case, the outer surface side of the shield case is configured to be substantially planar. Thereby, when the key switch which comprises a key board | substrate is pressed down, the load added to the flat plate part 62 can be made more uniform. Therefore, the protection of the electronic component against external loads can be further strengthened. Moreover, the deformation of the shield case 60 when receiving a load from the outside can be further reduced.

  In addition, the portable wireless device of the present invention is not foldable as in the above embodiment, and one casing is slid in one direction from the state in which the operation unit side casing 2 and the display unit side casing 3 are overlapped. It may be a slide-type portable wireless device. Further, the portable wireless device of the present invention is a rotary type (turn type) in which one casing is rotated around an axis line along the overlapping direction of the operation unit side casing 2 and the display unit side casing 3. It may be a portable wireless device.

  The present invention can be applied to portable wireless devices other than cellular phones. Examples of portable wireless devices other than mobile phones include PHS (registered trademark: Personal Handyphone System), portable game machines, portable navigation devices, PDAs (Personal Digital Assistants), and notebook computers.

1 Mobile phone (mobile wireless device)
2 Operation unit side case (case)
3 Display unit side body 25 Sheet metal member 50 Key substrate 60 Shield case 61 Rib part 62 Flat plate part 63 Concave part 64 Thermosetting resin (resin member)
70 Main circuit board (circuit board)
70a First surface (one surface)
71 Electronic parts 73 Underfill material

Claims (7)

A housing,
A circuit board disposed inside the housing;
Electronic components mounted on at least one surface of the circuit board;
It is disposed so as to cover the one surface of the circuit board, and is provided at a position overlapping with the flat plate portion and the electronic component mounted on the circuit board in the thickness direction in the flat plate portion, and is recessed from the outer surface side to the inner surface side. A shield case having a concave portion in contact with or close to the electronic component, and a resin member filled in the concave portion, the outer surface of which is substantially planar;
A portable wireless device.   The portable wireless device according to claim 1, wherein the resin member is made of a thermosetting resin.   3. An underfill member that is injected into a gap formed between the circuit board and the electronic component and is cured at a predetermined temperature, and further, the thermosetting resin is cured at the predetermined temperature. The portable wireless device described in 1.   The portable wireless device according to any one of claims 1 to 3, further comprising a key board disposed on an outer surface side of the flat plate portion of the shield case.   The portable wireless device according to claim 4, further comprising a sheet metal member disposed on an outer surface side of the flat plate portion of the shield case, wherein the key board is disposed on an outer surface side of the flat plate portion via the sheet metal member.   The mobile plate according to any one of claims 1 to 5, wherein the flat plate portion of the shield case is provided with a plurality of the recesses, and each of the plurality of recesses has a substantially equal recess capacity. Wireless device.   The portable wireless device according to claim 6, wherein the plurality of recesses include recesses having two or more different planar shapes.

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