JP2004179594A - Mounting structure of shielding member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting structure of a shield member which suppresses variations in the mounting position of the shielding member on a substrate, eases the work of detaching/attaching a cover from/to a metal case, and furthermore easily carries out maintenance of an electronic part housed inside the metal case. <P>SOLUTION: The shielding member A comprises a housing frame 10 made of a metal in which the electronic part is housed and a cover 20 for covering the opening of the housing frame 10. A pair of engaging recesses 11a, 12a are formed on each of the sidewalls 11, 12 of the housing frame 10, while a pair of engaging protrusions 21a, 22a furnished with elasticity are formed on the inside of each side face 21, 22 of the cover 20 at positions that correspond to those of the recesses 11a, 12a. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a mounting structure of a shield member for shielding an electronic component mounted on a substrate, and more particularly, to a mounting structure of a metal case and a cover constituting the shield member.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, as a shield member for shielding electronic components such as high-frequency devices mounted on a substrate, for example, as shown in FIG. 7, an integrated metal member is bent into a box shape and formed into a box shape. It is provided (see Patent Document 1).
As shown in the drawing, the box-shaped shield member C has a large number of holes formed on the upper surface and side surfaces thereof, and the infrared energy passing through the plurality of holes causes electrons arranged inside the shield member to be disposed. The component 31 is configured to be reflow soldered to the substrate 30.
[0003]
However, since the shield member C configured as described above is configured to reflow solder the electronic component 31 by infrared energy passing through the plurality of holes, the energy required for soldering is not sufficient. Therefore, there is a possibility that the electronic component 31 cannot be reliably mounted on the substrate 30.
[0004]
In addition, a shield member B shown in FIG. 6 is provided separately from the shield member C.
The shield member B is composed of a metal case 50 having an opening 51 on one side for storing electronic components therein and a cover 60 closing the opening 51 of the metal case 50 (see Patent Document 2). ).
[0005]
According to the shield member B, since the metal case 50 has the opening 51, when the electronic components housed in the metal case 50 are reflow-soldered to a substrate (neither is shown), the opening is formed. A sufficient supply of infrared energy can be obtained from 51, and the electronic components housed inside the metal case 50 can be reliably mounted on the substrate.
[0006]
[Patent Document 1]
Japanese Patent Publication No. 7-52789 [Patent Document 2]
Japanese Utility Model Publication No. 1-214747
[Problems to be solved by the invention]
However, the conventional shield member B has the following problems.
That is, when the metal case 50 of the shield member B is attached to the board by hand, there is a problem that if the soldering is manually performed, the mounting position of the shield member on the board varies.
[0008]
If the shield member B is configured to be automatically mounted on the substrate in order to prevent the above-mentioned variation in the mounting position, the adsorption target member 52 for automatic mounting provided in the opening 51 of the metal case 50 is required. When performing maintenance of the electronic components housed inside the case 50, there is a possibility that the electronic components may become a hindrance.
[0009]
That is, as shown in FIG. 6, the to-be-adsorbed member 52 is formed in a substantially cross shape and is formed over the opening surface of the opening 51 of the metal case 50, and the electronic component housed inside the metal case 50 is There is a problem that the work efficiency during maintenance cannot be improved because the work cannot be taken out of the metal case 50.
[0010]
Furthermore, since the metal case 50 and the cover 60 constituting the shield member B are joined to each other by soldering or the like, when the electronic components housed in the metal case 50 are maintained, the cover 60 may be removed. Moreover, in order to join the metal case 50 and the cover 60, an operation such as soldering is required.
[0011]
The present invention has been made in order to solve the above-described problems, and can prevent a variation in a mounting position of a shield member on a substrate, and facilitate the work of attaching and detaching a metal case and a cover. It is another object of the present invention to provide a mounting structure of a shield member that can easily perform maintenance of an electronic component housed inside a metal case.
[0012]
[Means for Solving the Problems]
In order to achieve the above object, the invention of claim 1 is:
In a mounting structure of a shield member, which is disposed on the substrate in a state where the electronic component is housed therein, and has a storage frame having an opening that is open on one side, and a cover that closes the opening of the storage frame,
In a state where the cover and the storage frame are electrically connected to each other, a mounting structure capable of detachably mounting the cover to the storage frame is provided.
[0013]
According to a second aspect of the present invention, in the mounting structure of the shield member according to the first aspect,
The mounting structure includes a locked concave portion formed on a side wall of the storage frame, and a locking convex portion having elasticity formed at a position corresponding to the locked concave portion inside the cover.
The cover is mounted on the storage frame in a state where the locking projection is fitted into the locked concave portion of the storage frame by the elastic urging force.
[0014]
According to a third aspect of the present invention, in the mounting structure of the shield member according to the first or second aspect,
The storage frame has a member to be sucked sucked by the suction nozzle for automatic mounting,
The suction target member includes a nozzle suction unit that is suctioned by the suction nozzle, and a breakable support unit that supports the nozzle suction unit on the storage frame,
By breaking the breakable support portion, the nozzle suction portion can be removed.
[0015]
According to a fourth aspect of the present invention, in the mounting structure of the shield member according to the third aspect,
A breakable joining point between the support portion of the suctioned member and the storage frame is located below the upper end of the side wall of the storage frame.
[0016]
[Action]
According to the first aspect of the present invention, the cover is attached to and detached from the storage frame in a state where the cover of the shield member and the storage frame are electrically connected by the mounting structure in which the cover can be attached to and detached from the storage frame.
According to the invention of claim 2, the cover is mounted on the storage frame in a state where the elastic projection of the mounting structure is fitted into the locked concave portion of the storage frame by the elastic urging force. .
[0017]
According to the third aspect of the present invention, the breakable support portion of the member to be sucked is broken, thereby removing the nozzle suction portion.
According to the fourth aspect of the present invention, the breakable joining point between the support portion of the member to be attracted and the storage frame is located below the upper end of the side wall of the storage frame.
[0018]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of a mounting structure of a shield member according to the present invention will be described in detail with reference to the drawings.
FIG. 1 is a perspective view showing a shield member used in the shield member mounting structure of the present invention.
As shown in FIG. 1, the shield member A includes a metal storage frame 10 for storing electronic components therein, and a cover 20 for closing an opening of the storage frame 10.
[0019]
FIG. 2 is a diagram showing the storage frame 10. 2A is a plan view of the storage frame 10, FIG. 2B is a rear view of the storage frame 10, FIG. 2C is a side view of the storage frame 10, and FIG. 2D is FIG. 3 is a sectional view showing a section taken along line aa ′ of FIG.
[0020]
As shown in FIG. 1, the storage frame 10 is disposed on the substrate 30 in a state where the electronic component 31 is stored therein. In this embodiment, as shown in FIG. It is formed in a substantially rectangular frame shape provided with the portion 10a.
As shown in FIG. 2C, a pair of locked recesses 11a, 11a are formed in the side wall 11 of the storage frame 10, and in the present embodiment, the locked recess penetrates the side wall 11. And a pair of round holes.
[0021]
The side wall 12 (see FIG. 1) of the storage frame 10 facing the side wall 11 on which the locked concave portions 11a, 11a are formed has a pair of locked concave portions 11a, 11a at positions corresponding to the locked concave portions 11a, 11a. Recesses 12a are formed (see FIG. 1).
[0022]
Here, in the opening 10a of the storage frame 10, a sucked member 13 sucked by a suction nozzle for automatic mounting is provided.
As shown in FIGS. 2A and 2B, the sucked member 13 is a nozzle suction portion 13a actually sucked by a suction nozzle for automatic mounting, and the nozzle suction portion 13a is supported by the storage frame 10. And a breakable support portion 13b.
[0023]
In the present embodiment, the to-be-adsorbed member 13 is formed in a substantially circular shape in the vicinity of a central portion thereof to form a nozzle attraction portion 13a, and has a narrower width at both end portions near the nozzle attraction portion 13a. The supporting portion 13b is formed in a thin plate shape.
The nozzle suction portion 13a is supported by the storage frame 10 by joining both ends of the support portion 13b of the member 13 to be suctioned to the side walls 11 and 12 of the storage frame 10.
[0024]
Here, as shown in FIGS. 2A and 2B, the joining point X between the supporting portion 13b of the member 13 to be sucked and the side walls 11 and 12 of the storage frame 10 is narrower than the supporting portion 13b. The contact area between the support portion 13b and the side walls 11, 12 of the storage frame 10 is very small.
Thus, the support portion 13b is configured to be breakable at the joining point X.
In addition, as shown in FIG. 2D, the breakable joining point X is located at a position one step lower than the upper ends of the side walls 11 and 12 of the storage frame 10.
[0025]
Next, the cover 20 will be described with reference to FIG. 2A is a plan view of the cover 20, FIG. 2B is a rear view of the cover 20, FIG. 2C is a side view of the cover 20, and FIG. 2D is a front view of the cover 20. ing.
[0026]
As shown in FIGS. 3A and 3B, the cover 20 is formed in a lid shape with its front side and back side opened, and has a substantially rectangular shape having a size to close the opening 10a of the storage frame 10. Is formed.
Inside the side surfaces 21 and 22 of the cover 20, elasticity is provided at positions corresponding to the pair of locked concave portions 11a, 11a and 12a, 12a formed on the side walls 11, 12 of the storage frame 10, respectively. A pair of locking projections 21a, 21a and 22a, 22a are provided.
[0027]
In the present embodiment, the locking projections 21a and 22a are fitted into the locked recesses 11a, 11a and 12a, 12a of the storage frame 10 as shown in FIGS. 3B and 3C. It is formed in a hemispherical shape having possible dimensions.
In addition, the front side of each of the side surfaces 21 and 22 provided with the locking projections 21a and 21a and 22a and 22a, that is, the front end of the cover 20 is open as described above. The locking projections 21a, 21a and 22a, 22a formed on the side surfaces 21, 22 are configured to have elasticity in the outer direction of the cover 20.
[0028]
As shown in FIG. 3D, projecting pieces 21 b and 22 b are provided on the front sides of the side surfaces 21 and 22 of the cover 20 to easily remove the cover 20 from the storage frame 10. It protrudes in a direction that opens outward.
[0029]
As shown in FIGS. 3A and 3B, four notches 23a to 23d serving as soldering points between the cover 20 and the storage frame 10 are formed on the upper surface, both side surfaces, and the rear surface of the cover 20. When the cover 20 is attached to the storage frame 10, a concave portion is formed by abutting on both side surfaces and the back surface of the storage frame 10, and points for soldering are formed.
[0030]
To mount the storage frame 10 and the cover 20 configured as described above, first, as shown in FIG. 1, with the electronic component 31 placed on the substrate 30, the electronic component 31 is stored inside. The storage frame 10 of the shield member A is disposed at a position where the shield member A is to be placed.
Here, the placement of the storage frame 10 on the substrate 30 is performed by an automatic mounting machine (not shown). Specifically, the nozzle suction section 13a of the suction target member 13 of the storage frame 10 is mounted on the automatic mounting machine. And is arranged at a predetermined position on the substrate.
[0031]
Next, the storage frame 10 placed on the substrate 30 with the electronic components 31 stored therein as described above is reflow soldered to the substrate 30 together with the electronic components 31.
At this time, sufficient infrared energy can be supplied from the opening 10a of the storage frame 10 for reflow soldering, and the electronic components 31 stored in the storage frame 10 can be reliably mounted on the substrate 30. .
[0032]
Then, the electronic component 31 mounted on the substrate 30 is shielded by closing the opening 10 a of the storage frame 10 mounted on the substrate 30 with the cover 20. Hereinafter, an operation when the cover 20 is mounted on the storage frame 10 will be described with reference to FIG. FIGS. 4A and 4B are views showing the mounting state of the storage frame 10 and the cover 20. FIG. 4A is a plan view showing the mounting state of the storage frame 10 and the cover 20, and FIG. FIG. 3C is a rear view showing the state, FIG. 3C is a side view showing the mounting state, and FIG.
[0033]
First, to attach the cover 20 to the storage frame 10, the cover 20 is placed over the opening 10 a of the storage frame 10.
At this time, the locking projections 21a, 21a and 22a, 22a formed inside the side surfaces 21, 22 of the cover 20 come into contact with the side walls 11 and 12 of the storage frame 10, and the side surfaces 21, 22 of the cover 20 are It elastically deforms to the outside of the side walls 11 and 12 of the storage frame 10.
[0034]
Then, in this state, when the cover 20 is further pushed downward, the locking projections 21a, 21a and 22a, 22a formed on the cover 20 are stored as shown in FIGS. The cover 20 is mounted on the storage frame 10 by being fitted into the locked concave portions 11a, 11a and 12a, 12a formed on the side walls 11, 12 of the frame 10.
Thereby, the storage frame 10 and the cover 20 are brought into contact with each other, and the electronic component 31 stored in the storage frame 10 is shielded by the storage frame 10 and the cover 20.
[0035]
When the cover 20 is detached from the storage frame 10, the projecting pieces 21 b and 22 b protruding from the cover 20 are pushed out in a direction to open to the outside of the storage frame 10, thereby forming the cover 20 on each side wall of the cover 20. The fitted state of the locking projections 21a, 21a and 22a, 22a and the locked concave portions 11a, 11a and 12a, 12a of the storage frame 10 is released.
[0036]
At this time, as described above, each of the locked projections 21a and 22a formed on each of the side surfaces 21 and 22 of the cover 20 has elasticity in a direction to open to the outside of the storage frame 10; The state can be easily released.
[0037]
As described above, in the mounting structure of the shield member A of the present invention, since the nozzle suction portion 13a of the suctioned member 13 of the storage frame 10 is sucked by the suction nozzle for automatic mounting and arranged on the substrate. In addition, it is possible to eliminate variation in the arrangement position of the storage frame 10 of the shield member A on the substrate 30.
[0038]
The cover 20 is attached to the storage frame 10 in a state where the elastic projections 21a and 22a having elasticity of the cover 20 are fitted into the locked recesses 11a and 12a of the storage frame 10 by elastic biasing force. Therefore, the work of mounting the storage frame 10 and the cover 20 can be facilitated.
Further, at the time of this mounting, work such as soldering becomes unnecessary.
[0039]
Next, an operation of maintaining the electronic components 31 stored in the storage frame 10 with the cover 20 removed from the storage frame 10 as described above will be described.
The maintenance of the electronic component 31 is performed by removing the nozzle suction portion 13a supported by the storage frame 10.
[0040]
Here, the nozzle suction portion 13a is removed by breaking the support portion 13b of the to-be-adsorbed member 13, but specifically, in the rotation direction using the nozzle suction portion 13a as the support portion 13b as a rotation axis. , The support portion 13b is broken.
[0041]
At this time, a force generated by the rotation of the nozzle suction portion 13a is applied to the breakable joint point X between the support portion 13b of the member 13 to be sucked and the storage frame 10, and the support portion 13b and the storage frame 10 at this joint point X are applied. Since the contact area with the side wall is very small, the support portion 13b is broken.
Then, the nozzle suction portion 13a supported by the storage frame 10 by the support portion 13b is removed.
[0042]
As a result, maintenance of the internal electronic component 31 can be performed through the opening 10a of the storage frame 10 in a state where the to-be-adsorbed member 13 joined to the storage frame 10 is removed from the storage frame 10. Since a worker can secure a sufficient work space for maintenance, the replacement work of the electronic component 31 can be performed quickly, and work efficiency can be improved.
[0043]
Further, an upward burr may be formed at the joining point X of the storage frame 10 after the nozzle suction portion 13a is removed, but as described above, the burr is formed between the support portion 13b of the suctioned member 13 and the support portion 13b. Since the breakable joining point X of the storage frame 10 is formed at a position one step lower than the upper ends of the side walls 11 and 12 of the storage frame 10, the burrs are formed on the side walls 11 and 12 of the storage frame 10 as shown in FIG. Of the storage frame 10 can be closed with the cover 20 smoothly.
[0044]
As described above, when the maintenance of the electronic component 31 is completed with the member 13 to be removed removed, the electronic component 31 can be shielded by closing the opening 10 a of the storage frame 10 again with the cover 20.
[0045]
As mentioned above, although one Embodiment of the mounting structure of the shield member of this invention was described in detail, this invention is not limited to said Embodiment.
For example, in the above-described embodiment, the storage frame 10 and the cover 20 are configured to be detachable by fitting the locking projection to the locked concave portion. The cover 20 may be closed by soldering the notches 23a to 23d formed in the cover 20 while the cover 10a is closed.
[0046]
Further, the mounting structure of the storage frame 10 and the cover 20 is not limited to the locked concave portions 11a and 12a and the locking convex portions 21a and 22a of the above-described embodiment. Any configuration may be used as long as it can be mounted on the device.
For example, as an example of the mounting structure, it is possible to adopt a configuration in which the storage frame has a locking projection and the cover has a locking recess.
[0047]
【The invention's effect】
According to the first aspect of the present invention, the cover can be attached to and detached from the storage frame while the cover of the shield member and the storage frame are electrically connected by the mounting structure.
As a result, there is no need to solder the housing frame and the cover, and the cover can be easily removed when replacing the electronic components housed in the housing frame, thereby improving the workability during maintenance of the electronic components. is there.
[0048]
According to the invention of claim 2, the cover is mounted on the storage frame in a state where the locking projection of the mounting structure is fitted into the locked concave portion of the storage frame by the elastic urging force. There is an effect that the operation for removing the cover can be facilitated.
[0049]
According to the third aspect of the present invention, the nozzle suction surface of the to-be-sucked member provided in the storage frame is suctioned to the suction nozzle for automatic mounting, so that the storage frame of the shield member can be automatically mounted on the substrate, Variations in the arrangement position of the shield member on the substrate can be eliminated.
[0050]
Further, the breakable joint between the support portion of the member to be sucked and the storage frame is broken by the application of the force generated by the rotation of the nozzle suction portion, and the nozzle suction portion can be easily removed.
As a result, the work efficiency of the maintenance can be improved without the member to be attracted becoming an obstacle during the maintenance of the electronic components housed in the housing frame.
[0051]
According to the fourth aspect of the present invention, the breakable joining point between the supporting portion of the member to be sucked and the storage frame is located below the upper end of the side wall of the storage frame. Is formed, the burr can be prevented from jumping out from the upper end of the side wall of the storage frame.
As a result, the burr does not hinder the closing of the opening of the storage frame by the cover, and the opening of the storage frame can be smoothly closed by the cover.
[0052]
[Brief description of the drawings]
FIG. 1 is a perspective view for explaining a mounting structure of a shield member of the present invention.
FIG. 2 is a view showing a storage frame used in the mounting structure of the shield member of the present invention.
FIG. 3 is a view showing a cover used in the mounting structure of the shield member of the present invention.
FIG. 4 is a diagram illustrating a mounting state of a storage frame and a cover of the mounting structure of the shield member according to the present invention.
FIG. 5 is a view showing a state after the suctioned member 13 of the storage frame used for the mounting structure for the shield member of the present invention has been removed.
FIG. 6 is a view showing a conventional shield member.
FIG. 7 is a view showing a conventional shield member.
[Explanation of symbols]
A Shielding member 10 Storage frame 10a Opening 11 Side wall 11a Locked concave portion 12 Side wall 12a Locked concave portion 13 Adsorbed member 13a Nozzle suction portion 13b Support portion 20 Cover 21 Side surface 21a Locking convex portion 22 Side surface 22a Locking convex portion 30 substrate 31 electronic component

Claims (4)

In a mounting structure of a shield member, which is disposed on the substrate in a state where the electronic component is housed therein, and has a storage frame having an opening that is open on one side, and a cover that closes the opening of the storage frame,
A mounting structure for a shield member, comprising: a mounting structure capable of detachably mounting the cover to the storage frame in a state where the cover and the storage frame are in conduction. The mounting structure includes a locked concave portion formed on a side wall of the storage frame, and a locking convex portion having elasticity formed at a position corresponding to the locked concave portion inside the cover.
The shield according to claim 1, wherein the cover is mounted on the storage frame in a state where the locking projection is fitted into the locked concave portion of the storage frame by the elastic urging force. Mounting structure of the member. The storage frame has a member to be sucked sucked by the suction nozzle for automatic mounting,
The suction target member includes a nozzle suction unit that is suctioned by the suction nozzle, and a breakable support unit that supports the nozzle suction unit on the storage frame,
The mounting structure for a shield member according to claim 1, wherein the nozzle suction portion is removed by breaking the breakable support portion. 4. The shield member mounting structure according to claim 3, wherein a breakable joint point between the support portion of the member to be sucked and the storage frame is located below an upper end of a side wall of the storage frame.

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