JP2007299998A - High-frequency unit manufacturing method and high-frequency unit manufactured by the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an inexpensive and excellent-productivity high-frequency unit that has a sure grounding connection, and to provide a high-frequency unit manufactured by the same. <P>SOLUTION: A protruding part 2a of a shield plate 2 is soldered to a land part 4a and a covering member 7. Therefore, a circuit pattern 4 is surely grounded to the covering member 7 from the land part 4a via the protruding part 2a. When transferring a frame body, in which the shield plate, a circuit board, and the covering member are arranged, is transferred to a reflow-soldering device, it is possible to also provide cream solder 9 for soldering an electronic component 6 onto the circuit board 3 in addition to cream solder 9 for the protruding part. In this case, it is possible to obtain the inexpensive and excellent-productivity high-frequency unit by executing the soldering of the protruding part 2a and that of the electronic component 6 in the same step. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a high-frequency unit suitable for use in a television tuner or the like, and a high-frequency unit manufactured by the method.

  FIG. 11 is a cross-sectional view of a main part showing a conventional high-frequency unit manufacturing method and a high-frequency unit manufactured by the method. Next, the configuration of the conventional high-frequency unit will be described with reference to FIG. A box-shaped frame 51 having a shield plate 52 for partitioning the inside of the frame 51 into a plurality of compartments and an electronic component (not shown) mounted on a circuit pattern (not shown) A circuit board 53 on which an electric circuit is formed is attached, and a convex part 52 a provided on the shield plate 52 projects through the through hole 53 a of the circuit board 53 to the open part 51 a side.

  The cover 54 covering the opening 51a has a cut piece 54a that is cut and bent. The cover 54 is attached to the frame 51 so as to cover the opening 51a, and when the cover 54 is attached, the protrusion 54a is attached. Is close to the convex portion 52a, and the protruding piece 54a and the convex portion 52a are soldered 55 from the outside of the cover 54 to form a conventional high-frequency unit (see, for example, Patent Document 1).

In the manufacturing method of the conventional high-frequency unit having such a configuration, first, the shield plate 52 is attached in the frame 51, then the circuit board 53 on which electronic components are mounted is attached to the frame 51, and then the cover is covered. After the 54 is attached to the frame 51, the soldering operation is performed from the outside of the cover 54, and when the projecting piece 54a and the projecting portion 52a are soldered 55, the manufacture is completed.
Japanese Patent No. 3645393

  However, in the conventional method for manufacturing a high-frequency unit and the high-frequency unit manufactured thereby, the convex portion 52a of the shield plate 52 is soldered only to the protruding piece 54a of the cover 54. Since the circuit pattern provided on the circuit board 53 is not sufficiently grounded and the solder 5 is attached to the outside of the cover 54, the solder 55 is attached to the cover 54 and the electronic component is attached to the circuit board 53. There is a problem that it is necessary to carry out in a separate process, resulting in poor productivity and high cost.

  The present invention has been made in view of the situation of the prior art as described above, and its object is to provide a method for manufacturing a high-frequency unit that is reliably grounded, has good productivity, and is inexpensive, and a high-frequency unit manufactured by the method. Is to provide.

  In order to achieve the above object, the present invention provides a frame body in which a shield plate having a convex portion is disposed, a through hole disposed in the frame body and passing through the convex portion, and a periphery of the through hole. A circuit board having a land portion provided on the cover, a covering member that covers the open portion of the frame on the side facing the convex portion that penetrates the through-hole, a space between the convex portion and the land portion, and a convex portion and the covering member And a soldering part for soldering between the two and the cream solder for forming the soldering part is provided on the land part, and then the shield plate, the circuit board, and the frame on which the covering member is arranged are reflow soldered. It is conveyed to an apparatus, and the solder part which solders between a convex part and a land part and between a convex part and a covering member was formed by melting of cream solder, It is characterized by the above-mentioned.

  In the present invention configured as described above, since the convex portion of the shield plate is soldered to the land portion and the covering member, the circuit pattern can be grounded from the land portion to the covering member via the convex portion. It is possible to provide a solder paste for soldering electronic components on the circuit board in addition to the cream solder for the projecting portion, and in this case, the projecting portion can be provided. And electronic parts can be soldered in the same process, resulting in high productivity and low cost.

  In addition, according to the present invention, in the above invention, the circuit board includes a first land portion for soldering the convex portion and a second land portion for soldering the electronic component. In a state where the cream solder provided in the land portion and the electronic component are in contact with each other, the solder is conveyed to the reflow soldering apparatus, and the soldering between the electronic component and the second land portion is performed in the same process as the soldering of the convex portion. It is characterized by doing so.

  In the present invention configured as described above, the cream solder for the convex portion and the cream solder for the electronic component can be melted by the reflow soldering apparatus, and the soldering of the convex portion and the electronic component can be performed in the same process. Good productivity and low cost can be obtained.

  Further, the present invention is characterized in that, in the above invention, the covering member has a projecting piece projecting toward the convex portion, and the projecting piece and the convex portion are soldered by the solder portion.

  In the present invention configured as described above, the distance between the land portion and the projecting piece can be reduced by the presence of the projecting piece, the solder flow distance to the projecting piece is shortened, and soldering to the projecting piece is ensured. Can be.

  Further, the present invention is characterized in that, in the above invention, the projecting piece and the projecting portion are soldered in a state where the tip of the projecting portion is in contact with the surface of the projecting piece.

  In the present invention configured as described above, since the tip of the convex portion is in contact with the surface of the protruding piece, the solder pool on the protruding piece is improved, and soldering to the protruding piece can be ensured.

  Further, the present invention is characterized in that, in the above-mentioned invention, the projecting piece is formed in a cantilever shape.

  In the present invention configured as described above, even if there is a slight processing error in the convex portion and the protruding piece, the protruding portion and the protruding piece can be reliably brought into contact with each other by the cantilevered protruding piece.

  Moreover, the present invention is characterized in that, in the above-mentioned invention, the cover member is soldered with a plurality of convex portions.

  The present invention configured as described above can reliably ground the shield plate and the circuit pattern covering member.

  Moreover, the present invention is characterized in that, in the above-mentioned invention, the covering member is formed of a cover made of a separate part from the frame.

  The present invention configured as described above is suitable for use in a configuration in which the circuit board is attached to the frame after the shield plate is attached to the frame.

  Moreover, the present invention is characterized in that, in the above-mentioned invention, the covering member is formed by a wall portion connected to the frame.

  In the present invention configured as described above, the presence of the wall portion eliminates the need for one of the covers, resulting in high productivity and low cost.

  In order to achieve the above object, the present invention provides a frame having a shield plate having a convex portion disposed therein, a circuit board having a through-hole disposed in the frame and passing through the convex portion, and a through hole. And a cover member that covers the open part of the frame on the side facing the convex part that penetrates the hole, and a land part that faces the cover member is provided around the through hole of the circuit board, and the convex part and the land part And between the convex part and the covering member are soldered by a solder part.

  In the present invention configured as described above, since the convex portion of the shield plate is soldered to the land portion and the covering member, the circuit pattern can be grounded from the land portion to the covering member via the convex portion. Assuredly, the soldering of the convex part and the soldering of the electronic component onto the circuit board can be carried out in the same process by transporting to the reflow soldering apparatus, and a product with good productivity and low cost can be obtained. .

  In addition, according to the present invention, in the above invention, the circuit board includes a first land portion for soldering the convex portion and a second land portion for soldering the electronic component. An electronic component is soldered to the land portion.

  According to the present invention configured as described above, the soldering of the convex portion and the soldering of the electronic component onto the circuit board can be performed in the same process by the conveyance to the reflow soldering apparatus, and the productivity is high and the cost is low. Things are obtained.

  Further, the present invention is characterized in that, in the above invention, the covering member has a projecting piece projecting toward the convex portion, and the projecting piece and the convex portion are soldered.

  In the present invention configured as described above, due to the presence of the projecting piece, the interval between the land portion and the projecting piece can be reduced, and soldering to the projecting piece can be ensured.

  Moreover, the present invention is characterized in that, in the above-mentioned invention, the tip of the convex portion is in contact with the surface of the protruding piece.

  In the present invention configured as described above, since the tip of the convex portion is in contact with the surface of the protruding piece, the solder pool on the protruding piece is improved, and soldering to the protruding piece can be ensured.

  Further, the present invention is characterized in that, in the above-mentioned invention, the projecting piece is formed in a cantilever shape.

  In the present invention configured as described above, even if there is a slight processing error in the convex portion and the protruding piece, the protruding portion and the protruding piece can be reliably brought into contact with each other by the cantilevered protruding piece.

  Moreover, the present invention is characterized in that, in the above-mentioned invention, the cover member is soldered with a plurality of convex portions.

  The present invention configured as described above can reliably ground the shield plate and the circuit pattern covering member.

  Moreover, the present invention is characterized in that, in the above-mentioned invention, the covering member is formed of a cover made of a separate part from the frame.

  The present invention configured as described above is suitable for use in a configuration in which the circuit board is attached to the frame after the shield plate is attached to the frame.

  Moreover, the present invention is characterized in that, in the above-mentioned invention, the covering member is formed by a wall portion connected to the frame.

  In the present invention configured as described above, the presence of the wall portion eliminates the need for one of the covers, resulting in high productivity and low cost.

  In the present invention, since the convex portion of the shield plate is soldered to the land portion and the covering member, the circuit pattern can be grounded from the land portion to the covering member via the convex portion, and the grounding of the circuit pattern can be surely achieved. When transporting to the reflow soldering apparatus, in addition to the cream solder for the convex portions, it is also possible to provide cream solder for soldering electronic components on the circuit board. Attaching can be performed in the same process, and a product with good productivity and low cost can be obtained.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings, an embodiment of the present invention will be described. FIG. 1 is a cross-sectional view of a main part according to a first example of a high-frequency unit of the present invention. FIG. 3 is an explanatory view showing a first step according to the first embodiment of the manufacturing method of the high-frequency unit of the present invention, and FIG. 4 is a first embodiment of the manufacturing method of the high-frequency unit of the present invention. FIG. 5 is an explanatory view showing a first step according to the third embodiment of the method for manufacturing a high-frequency unit of the present invention, and FIG. 6 is a first view of the method for manufacturing the high-frequency unit of the present invention. It is explanatory drawing which shows the 4th process which concerns on an Example.

  FIG. 7 is a cross-sectional view of a main part according to the second embodiment of the high-frequency unit of the present invention. FIG. 8 is an explanatory view showing a first step according to the second embodiment of the method of manufacturing the high-frequency unit of the present invention. FIG. 10 is an explanatory view showing a second step according to the second embodiment of the method for manufacturing a high-frequency unit of the present invention, and FIG. 10 is an explanatory view showing a third step according to the second embodiment of the method for manufacturing a high-frequency unit of the present invention. is there.

  Next, the configuration according to the first embodiment of the high-frequency unit of the present invention will be described with reference to FIGS. 1 and 2. A box-shaped frame body 1 made of a metal plate includes a side wall 1 a having a square shape, The shield plate 2 that has an open portion 1b provided at the upper and lower positions and partitions the inside of the frame body 1 into a plurality of compartments is connected to the frame body 1 and is integrally formed, or a separate part from the frame body 1 And is attached to the frame 1, and has a plurality of convex portions 2 a protruding from one end portion of the shield plate 2 toward the one open portion 1 b.

  The circuit board 3 has a plurality of through holes 3a. The circuit board 3 is provided with a circuit pattern 4 having first and second land portions 4a and 4b, and the first and second land portions. 4a and 4b are provided around the through hole 1a, and the ground pattern of the circuit pattern 4 is connected to the first land portion 4a.

  And the circuit board 4 is attached in the frame 1 in the state which penetrated the convex part 2a of the shield board 2 to the through-hole 1a in which the 1st land part 4a was provided, and the convex part 2a and the 1st The land portion 4a is soldered by the solder portion 5, and various electronic components 6 such as a coil, a capacitor, and a resistor are soldered by the solder portion 5 to the second land portion 4b. The desired electrical circuit is formed.

  Two covering members 7 and 8 formed of a cover made of a metal plate are attached to the frame body 1 so as to cover each of the open portions 1b of the frame body 1 and penetrate the first land portion 4a. The covering member 7 disposed to face the convex portion 2a protruding from the hole 3a has a plurality of cantilevered protruding pieces 7a cut and raised toward the inside of the frame body 1.

  And the front-end | tip part of the convex part 2a contact | abuts on the surface (upper surface in FIG. 1) of the protrusion piece 7a of the covering member 7, and the protrusion piece 7a and the convex part 2a are soldered by the solder part 5, and this The high frequency unit of the invention is formed.

  Next, the first embodiment of the manufacturing method of the high frequency unit of the present invention having such a configuration will be described with reference to FIGS. 3 to 6. First, as shown in FIG. A semi-finished product to which the circuit board 3 is attached is prepared in the frame 1 to which is attached. Next, as shown in FIG. 4, as the second step, the semi-finished product is turned upside down, An application step of applying the cream solder 9 to the land portions 4a and 4b is performed.

  Next, as shown in FIG. 5, as a third step, an attaching step for attaching the covering member 7 to the frame body 1 is performed to bring the projecting piece 7a into contact with the convex portion 2a, and then, as shown in FIG. As a fourth step, a mounting step of mounting the electronic component 6 on the circuit board 1 is performed in a state where the electronic component 6 is in contact with the cream solder 9 on the second land portion 4b.

  Next, when a transporting process for transporting these to a reflow soldering apparatus (not shown) is performed, the cream solder 9 is melted, and the melted cream solder 9 is formed on the convex portion 2a on the first land portion 4a side. As shown in FIG. 1, the first land portion 4a and the convex portion 2a and the convex portion 2a and the convex piece 7a are soldered to form a solder portion 5 as shown in FIG. At the same time, on the second land portion 4b side, as shown in FIG. 1, when the electronic component 6 is soldered to the second land portion 4b and the solder portion 5 is formed, the manufacture is completed.

  In addition, in the manufacturing method in this 1st Example, the application | coating process of the cream solder 9, the attachment process of the cover member 7, and the mounting process of the electronic component 6 may change the order of the process.

  FIG. 7 shows a second embodiment of the high-frequency unit according to the present invention. The second embodiment will be described. One cover member 7 is formed by a wall portion 1c provided to be connected to the side wall 1a of the frame 1. The wall portion 1c is provided with a plurality of cantilevered projecting pieces 7a, and the side wall 1a in the frame 1 is provided with a plurality of support portions 1d.

  A third land portion 4c is provided in the peripheral portion of the circuit board 3 to which the electronic component 6 is attached. The third land portion 4c is soldered to the support portion 1d by the solder portion 5, and the shield plate 2 is provided. Is formed as a separate part from the frame 1.

  Other configurations have the same configurations as those in the above-described embodiment, and the same parts are denoted by the same reference numerals, and the description thereof is omitted here.

  Next, a second embodiment of the manufacturing method of the high frequency unit of the present invention having such a configuration will be described with reference to FIGS. 8 to 10. First, as shown in FIG. A frame body 1 provided with a covering member 7 made of the above, and a circuit board 3 on which an electronic component 6 is placed by applying cream solder 9 to the first, second, and third land portions 4a, 4b, and 4c are prepared. To do.

  Next, as shown in FIG. 9, as a second step, the circuit board 3 is arranged in the frame body 1 and hooked on the support portion 1d at the position of the third land portion 4c, and then as shown in FIG. As a third step, the shield plate 2 is inserted through the through hole 3a at the position of the first land portion 4a, and the tip of the convex portion 2a is brought into contact with the protruding piece 7a.

  Next, when a transporting process for transporting these to a reflow soldering apparatus (not shown) is performed, the cream solder 9 is melted, and the melted cream solder 9 is formed on the convex portion 2a on the first land portion 4a side. As shown in FIG. 7, the first land portion 4a and the convex portion 2a and between the convex portion 2a and the convex piece 7a are soldered to form a solder portion 5, as shown in FIG. At the same time, on the second land portion 4b side, as shown in FIG. 7, the electronic component 6 is soldered to the second land portion 4b to form the solder portion 5, and further, the third land portion 4c. On the side, as shown in FIG. 7, when the third land portion 4c is soldered to the support portion 1d to form the solder portion 5, the manufacture is completed.

It is principal part sectional drawing which concerns on 1st Example of the high frequency unit of this invention. FIG. 4 is a perspective view of the high-frequency unit according to the first embodiment of the present invention with the frame body turned over. It is explanatory drawing which shows the 1st process which concerns on 1st Example of the manufacturing method of the high frequency unit of this invention. It is explanatory drawing which shows the 2nd process which concerns on 1st Example of the manufacturing method of the high frequency unit of this invention. It is explanatory drawing which shows the 1st process which concerns on 3rd Example of the manufacturing method of the high frequency unit of this invention. It is explanatory drawing which shows the 4th process which concerns on 1st Example of the manufacturing method of the high frequency unit of this invention. It is principal part sectional drawing which concerns on 2nd Example of the high frequency unit of this invention. It is explanatory drawing which shows the 1st process which concerns on 2nd Example of the manufacturing method of the high frequency unit of this invention. It is explanatory drawing which shows the 2nd process which concerns on 2nd Example of the manufacturing method of the high frequency unit of this invention. It is explanatory drawing which shows the 3rd process which concerns on 2nd Example of the manufacturing method of the high frequency unit of this invention. It is principal part sectional drawing which shows the manufacturing method of the conventional high frequency unit, and the high frequency unit manufactured by the method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Frame 1a Side wall 1b Open part 1c Wall part 1d Support part 2 Shield board 2a Protrusion part 3 Circuit board 3a Through-hole 4 Circuit pattern 4a-4c 1st-3rd land part 5 Solder part 6 Electronic component 7 Cover member 7a Projection piece 8 Covering member 9 Cream solder

Claims (16)

A circuit board having a shield body having a convex portion disposed therein, a through-hole disposed in the frame body and penetrating the convex portion, and a land portion provided around the through-hole; Solder the covering member that covers the open part of the frame on the side facing the convex part that has penetrated the through hole, between the convex part and the land part, and between the convex part and the covering member. A solder part to be attached, and after the cream solder for forming the solder part is provided on the land part, the frame body on which the shield plate, the circuit board, and the covering member are arranged is reflow solder. The solder portion that is transported to the attaching device and soldered between the convex portion and the land portion and between the convex portion and the covering member is formed by melting the cream solder. A method for manufacturing a high-frequency unit. The circuit board has a first land portion for soldering the convex portion and a second land portion for soldering an electronic component, and is provided on the second land portion. The cream solder and the electronic component are brought into contact with each other and conveyed to the reflow soldering apparatus, and the soldering between the electronic component and the second land portion is performed in the same process as the soldering of the convex portion. 2. The method of manufacturing a high frequency unit according to claim 1, wherein the high frequency unit is manufactured. 3. The cover member according to claim 1, wherein the covering member has a projecting piece projecting toward the projecting portion, and the projecting piece and the projecting portion are soldered by the solder portion. A method for manufacturing a high-frequency unit. 4. The high frequency unit according to claim 3, wherein the projecting piece and the projecting portion are soldered in a state in which a tip portion of the projecting portion is in contact with a surface of the projecting piece. 5. The method of manufacturing a high-frequency unit according to claim 3, wherein the protruding piece is formed in a cantilever shape. The method for manufacturing a high-frequency unit according to claim 1, wherein a plurality of the convex portions are soldered to the covering member. The method for manufacturing a high-frequency unit according to any one of claims 1 to 6, wherein the covering member is formed of a cover made of a separate part from the frame body. The method for manufacturing a high-frequency unit according to any one of claims 1 to 6, wherein the covering member is formed by a wall portion provided to be connected to the frame body. A frame body in which a shield plate having a convex portion is disposed, a circuit board disposed in the frame body and having a through hole through which the convex portion is inserted, and a side facing the convex portion through the through hole A cover member that covers the open portion of the frame body, and a land portion that opposes the cover member is provided around the through hole of the circuit board, and between the convex portion and the land portion, And the high frequency unit characterized by soldering between the said convex part and the said cover member with the solder part. The circuit board includes a first land portion for soldering the convex portion and a second land portion for soldering an electronic component, and the second land portion includes the second land portion. 10. The high frequency unit according to claim 9, wherein the electronic component is soldered. 11. The high-frequency unit according to claim 9, wherein the covering member has a projecting piece projecting toward the projecting portion, and the projecting piece and the projecting portion are soldered. The high-frequency unit according to claim 11, wherein a tip portion of the convex portion is in contact with a surface of the protruding piece. The high-frequency unit according to claim 11 or 12, wherein the protruding piece is formed in a cantilever shape. The high-frequency unit according to claim 9, wherein a plurality of the convex portions are soldered to the covering member. The high frequency unit according to any one of claims 9 to 14, wherein the covering member is formed of a cover made of a separate part from the frame. The high frequency unit according to any one of claims 9 to 14, wherein the covering member is formed by a wall portion provided to be connected to the frame body.

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