JP2005183488A - High frequency module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To facilitate the installation of a shielding case and to achieve miniaturization. <P>SOLUTION: In the high frequency module, lands 14 are arranged at four corners of the main face 11a of a ceramic multilayer substrate 11 where an electronic component 12 is mounted, and projected parts 15 are disposed on the lands 14. Walls (abutting parts 13a) of the shielding case 13 corresponding to the projecting parts 15 are made to abut on the projecting parts so as to position them. Solder 20 is filled up between the abutting part 13a and the land 14. Thus, the shielding case 13 is mounted to the ceramic multilayer substrate 11. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a high-frequency module having a ceramic multilayer substrate on which electronic components are mounted, and a shield case mounted on the ceramic multilayer substrate.

  2. Description of the Related Art In recent years, devices that receive a signal transmitted from an artificial satellite and perform navigation of a vehicle, so-called car navigation devices, are becoming popular. In the car navigation apparatus, an antenna module that receives a signal transmitted from an artificial satellite is used.

  As shown in FIG. 9, the conventional antenna module 100 includes a ceramic multilayer substrate 101, the electronic component 102 is mounted on the main surface of the ceramic multilayer substrate 101, and a planar antenna (not shown) on the back surface side. Is implemented. Further, in the antenna module 100, a shield case 103 is mounted on the ceramic multilayer substrate 101 in order to prevent noise from being mixed into a received signal.

As shown in FIG. 10, the shield case 103 has a mounting structure in which a through hole 101a is formed on the end surface of the ceramic multilayer substrate 101, and a projection 103a provided on the edge of the shield case 103 is inserted into the through hole 101a. In such a state, the solder is joined. A similar structure is also disclosed in FIG. 4 of Japanese Patent Laid-Open No. 2001-308235.
JP 2001-308235 A

  By the way, in the mounting structure of the shield case 103 in the conventional high frequency module 100, since it is necessary to form the through-hole 101a in the end surface of the ceramic multilayer substrate 101, the mounting of the electronic component 102 mounted on the surface of the ceramic multilayer substrate 101 is required. The possible area is limited. Further, by forming the through hole 101a, the wiring area in the inner layer of the ceramic multilayer substrate 101 is also limited. For this reason, the conventional high-frequency module 100 has a limit in reducing the area of the ceramic multilayer substrate 101 and reducing the size.

  Further, in the conventional high-frequency module 100, when the through hole 101a and the protrusion 103a are not provided, the shield case 103 and the ceramic multilayer substrate 101 are both of a very small size. There was a problem that it was difficult to join in a state of being positioned with respect to 101.

  Therefore, the present invention has been made in view of the above-described conventional situation, and can shield and position the shield case with respect to the ceramic multilayer substrate with high accuracy and can further reduce the size. An object is to provide a possible high-frequency module.

The high-frequency module according to the present invention includes a ceramic multilayer substrate on which electronic components are mounted, a shield case that shields a main surface of the ceramic multilayer substrate on which the electronic components are disposed, and the ceramic multilayer substrate. A land portion formed of a conductive material at a corner portion of the main surface; and a convex portion formed on the main surface of the ceramic multilayer substrate. The shield case has a wall portion that is opposed to the convex portion. The shield case is positioned with respect to the ceramic multilayer substrate in a combined state, and the wall portion is attached to the ceramic multilayer substrate while being grounded to the land portion by soldering to the land portion. It is characterized by being.

  According to the high-frequency module according to the present invention configured as described above, the ceramic multilayer substrate and the shield case are joined by abutting the wall portion of the shield case with the convex portion formed on the main surface of the ceramic multilayer substrate. Positioning can be performed with high accuracy. Further, since the land portion formed on the main surface of the ceramic multilayer substrate and the wall portion of the shield case have a structure joined by soldering, the solder joint portion is attached to the ceramic multilayer substrate with the shield case, It can also serve as a ground for the shield case, and the module size can be reduced.

  Since the high-frequency module according to the present invention has a convex portion formed on the ceramic multilayer substrate, it can be positioned simply by placing the shield case on the ceramic multilayer substrate in accordance with the convex portion, a jig, etc. Can be made unnecessary. Further, the position of the shield case can be maintained even during solder joining, and the shield case and the land portion can be grounded by solder joining.

  Therefore, the through holes and protrusions required in the conventional mounting structure can be eliminated, and the shape of the shield case can be simplified and the cost can be reduced. Moreover, not only the mounting area of the electronic component mounted on the surface of the ceramic multilayer substrate but also a sufficient wiring area in the inner layer of the ceramic multilayer substrate can be secured.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Below, the high frequency module 10 shown in FIG.1 and FIG.2 is demonstrated. In this example, the high-frequency module 10 is described assuming an antenna module used in a car navigation apparatus, but the present invention can be applied to any high-frequency module including a ceramic multilayer substrate and a shield case. For example, the present invention may be applied to an antenna module for receiving so-called satellite radio broadcasts.

  As shown in FIGS. 1 and 2, the high-frequency module 10 includes a ceramic multilayer substrate 11, various electronic components 12 on the main surface 11a on which the ceramic multilayer substrate 11 is mounted, and a shield mounted on the main surface 11a side. Case 13 is provided.

  At the four corners on the main surface 11a side of the ceramic multilayer substrate 11, land portions 14 formed in a thin film shape with a conductive material are formed. The land portion 14 is preferably formed of a material or shape having a predetermined heat resistance since the solder 20 is deposited. Further, the land portion 14 is formed with a convex portion 15 made of a conductive material such as metal.

  The shield case 13 is formed with a height and size sufficient to cover the electronic component 12 formed on the main surface 11 a of the ceramic multilayer substrate 11. In addition, an abutting portion 13 a that abuts on the convex portion 15 is formed at a corner portion of the shield case 13 at a position corresponding to the land portion 14.

  1 and 2, the ceramic multilayer substrate 11 on which the electronic component 12 is mounted and the shield case 13 are separated, that is, an exploded view showing a state before the shield case 13 is attached to the ceramic multilayer substrate 11. FIG. 1 is a plan view and FIG. 2 is a side view.

In the high-frequency module 10 having the above structure, when the shield case 13 is mounted on the ceramic multilayer substrate 11, the abutting portion 13a (wall portion) abuts the convex portion 15 as shown in FIGS. As shown in FIG. 5 and FIG. 6, the solder 20 is placed between the abutting portion 13 a and the land portion 14 so as to be joined. Accordingly, in the high-frequency module 10, the shield case 13 is grounded to the land portion 14 via the solder 20. 4 and 6 are enlarged views showing the main parts before and after placing the solder 20 in a state where the shield case 13 is mounted on the ceramic multilayer substrate 11. FIG.

  The high-frequency module 10 configured as described above has a structure in which the abutting portion 13a (wall portion) of the shield case 13 is abutted against the convex portion 15 formed on the main surface 11a of the ceramic multilayer substrate 11. Therefore, the ceramic multilayer substrate 11 and the shield case 13 can be positioned with high accuracy. Further, since the land portion 14 formed on the main surface 11 a of the ceramic multilayer substrate 11 and the abutting portion 13 a of the shield case 13 are joined by soldering, the solder joining portion is the ceramic multilayer substrate 11. The shield case 13 can be attached to the ground and the shield case 13 can be grounded, so that the module size can be reduced.

  In the high-frequency module 10, since the convex portion 15 is formed on the ceramic multilayer substrate 11, it is possible to position the shield case 13 by simply placing it on the ceramic multilayer substrate 11 in accordance with the convex portion 15. This can eliminate the need for jigs and the like, and can improve the work efficiency during assembly. Further, the position of the shield case 13 can be maintained even during solder joining, and the shield case 13 and the land portion 14 can be grounded by solder joining.

  Therefore, the through holes and protrusions required in the conventional mounting structure can be eliminated, and the shape of the shield case 13 can be simplified and the cost can be reduced. Further, not only the mounting area of the electronic component 12 mounted on the surface of the ceramic multilayer substrate 11 but also a sufficient wiring area in the inner layer of the ceramic multilayer substrate 11 can be secured.

  In the above description, the convex portion 15 is formed of a conductive material. However, electrical connection with the solder 20 to be mounted on the land portion 14 by forming the convex portion 15 to be relatively small. May be formed of a non-conductive material such as a resin material, for example. However, even in such a case, electrical connection can be more reliably performed by forming the convex portion 15 with a conductive material.

  In the above description, the structure in which the protrusions 15 are formed on the land portions 14 formed in a thin film shape has been described. However, the size of the protrusions 15 is sufficient to ensure that the solder 20 is arranged. 7, as shown in FIG. 7, the land portion 14 is not formed, the convex portion 15 is formed of a conductive material, and the shield case 13 is formed between the abutting portion 13 a and the convex portion 15. The solder 20 may be arranged. That is, in this case, the convex portion 15 can have a function as the land portion 14.

  Further, in the above description, the convex portion 15 is formed on the land portion 14. However, for example, as shown in FIG. 8, the convex portion 15 may be formed on an edge portion that is not a corner portion of the ceramic multilayer substrate 11. Good. That is, the position where the convex portion 15 is formed is not limited to the corner portion as long as the shield case 13 can be positioned sufficiently reliably with respect to the ceramic multilayer substrate 11, and is arbitrary. In the example shown in FIG. 8, an example in which the convex portion 15 abuts against the wall portion of the shield case 13 from the inside is shown. Further, in FIG. 8, the shield case 13 is shown in a transparent manner in order to clearly show the abutting state between the convex portion 15 and the wall portion of the shield case 13.

It is a disassembled plan view which shows the high frequency module illustrated as embodiment of this invention. It is a disassembled side view which shows the high frequency module. In the high frequency module, it is a figure which shows the state which attached the shield case to the ceramic multilayer substrate, FIG. 3 (a) is a top view, FIG.3 (b) is a side view. In the high frequency module, it is a principal part enlarged view which expands and shows the site | part in which the land part was formed. FIG. 5A is a diagram illustrating a state in which the shield case and the ceramic multilayer substrate are solder-bonded in the high-frequency module, FIG. 5A is a plan view, and FIG. 5B is a side view. In the high frequency module, it is a principal part enlarged view which expands and shows the site | part in which the land part was formed. It is a principal part enlarged view which shows another example of the convex part formed in the same high frequency module. It is the schematic which shows the high frequency module illustrated as another embodiment of this invention. It is an exploded plan view showing an example of a conventional high-frequency module. It is a decomposition | disassembly side view which shows an example of the high frequency module of a conventional structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 High frequency module 11 Ceramic multilayer substrate 11a Main surface 12 Electronic component 13 Shield case 13a Abutting part (wall part)
14 Land 15 Protrusion 20 Solder

Claims (4)

A ceramic multilayer substrate on which electronic components are mounted;
A shield case that shields the main surface of the ceramic multilayer substrate on which the electronic component is disposed;
Land portions formed of a conductive material at corners on the main surface of the ceramic multilayer substrate;
A convex portion formed on the main surface of the ceramic multilayer substrate,
The shield case is positioned with respect to the ceramic multilayer substrate in a state where the wall portion is in contact with the convex portion, and the land portion is formed by soldering the wall portion to the land portion. A high-frequency module, wherein the high-frequency module is attached to the ceramic multilayer substrate in a state of being grounded on the substrate. The high-frequency module according to claim 1, wherein the convex portion is formed on the land portion. The high-frequency module according to claim 2, wherein the convex portion is made of a conductive material. The high-frequency module according to claim 1, wherein the land portion is formed in a convex shape and has a function as the convex portion.