KR20120023002A - Solder-coated component, process for producing same, and method for mounting same - Google Patents

Abstract

It is possible to form the fillet portion in the entire range of any soldered region of the housing part, and also to reliably and firmly bond to the substrate without generating solder unbonded portions or voids. As shown in FIG. 1, the shield case 100 has a surface treatment in which a nickel film and a tin alloy plating film having a predetermined film thickness are sequentially installed and lead-free molten solder is coated on the tin alloy plating film. It is provided with the implemented frame member 11. The frame member 11 is processed into the shape of the shield case 100, and then a nickel film and a tin alloy plating film are sequentially formed on one part or all parts of the shield case 100, and then subjected to the base treatment, and after the base treatment. Surface treatment in which molten solder is coated is applied to one part or all parts of the frame member 11, and a part of the shield case 100 is a solder surface for surface mounting.

Description

Solder coating parts, manufacturing method thereof and mounting method thereof {SOLDER-COATED COMPONENT, PROCESS FOR PRODUCING SAME, AND METHOD FOR MOUNTING SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield case for electromagnetically shielding an electronic component mounted on a substrate, a solder coating component applicable to a substrate reinforcement frame for reinforcing a short and thin substrate, a manufacturing method thereof, and a mounting method thereof.

Background Art In recent years, in information processing apparatuses such as mobile phones and personal computers, imaging apparatuses such as audio and video apparatuses and electron microscopes, various medical apparatuses, television tuners, and wireless communication apparatuses, several hundred MHz to several tens of GHz are required from high-speed operation. There is a tendency for electronic circuits to operate on signals of unit frequency. In an electronic circuit operating at such a high frequency, a shield case is used to prevent interference between electromagnetic components mounted on a substrate and electromagnetic circuits between the electronic circuits, electromagnetic influences to the outside, and to prevent malfunctions. Are many (EMI prevention function).

Generally, a shield case is a metal molded part mounted on a board | substrate, The method of soldering the hook part extended from a shield case through the insertion through part opened to a board | substrate to the wiring pattern on the back surface of a board | substrate, and the shield to the land pattern provided in the board surface Background Art A method of surface mounting a mounting portion of a case is known. Soldering is also performed in surface mounting. Shield cases are often used for the purpose of protecting precision modules from external forces.

In addition, a mobile phone, a digital camera, a small audio device, or the like is mounted with a short and thin mounting board, and in order to prevent warpage in resin sealing of the mounting board, board reinforcement frames are often mounted. have. Housing parts such as shield cases and substrate reinforcement frames are made of nickel silver (Cu-Zn-Ni / C7521R, C7701R, etc.), stainless steels (SUS304, etc.) from magnetic resistance, rust resistance, oxidation resistance, thermal expansion resistance, and workability. Metal members (base materials) of SUS316, SUS430, etc. are often used.

Moreover, in the metal member generally used for a housing part, finish workability is slightly difficult for a nickel silver material (C7521R, C7701R, etc.), and stainless steel materials (SUS304, SUS316, SUS430, etc.) are easy. Solder wettability is slightly easier to whitening material and difficult to stainless steel material.

Regarding the mounting method of this kind of shield case, Patent Document 1 discloses a shield case mounting structure. According to this shield case attachment structure, a board | substrate, a shield case, and a fixing member are provided. The board | substrate has an insertion through part, and the electronic component is mounted in one side. The shield case has protrusions to cover the electronic components to block electromagnetic waves. The protrusion protruding from the shield case is inserted into the insertion through portion of the substrate. On the premise of this, the fixing member is configured to fix the protrusion inserted into the insertion through portion at the other side of the substrate. By adopting the shield case mounting structure in this manner, it is possible to prevent solder debris and solder flux from entering the shield case.

Japanese Patent Laid-Open No. 2006-196664

By the way, according to the housing parts, such as a shield case and a board | substrate reinforcement frame which concerns on a prior art, there exist the following problems.

i. According to the shield case shown by patent document 1, many sheet metals are bent and produced, and the clearance gap is formed between the adjacent side surfaces. The shield case is fixed to the substrate by soldering the hook portion extending from the side surface to the land pattern provided on the substrate. However, with miniaturization of information terminal apparatuses, such as a mobile telephone, the mounting board | substrate with which a shield case is provided is also miniaturized. This miniaturization tends to reduce the area of the land pattern for soldering. If the area of the land pattern is small, workability, such as lengthening time for soldering work, becomes poor.

ii. In particular, according to the method of soldering and fixing the hook portion of the shield case to the land pattern of the substrate, the soldering area becomes small, the solder is likely to fall off, and the bonding strength of the shield case to the substrate is weakened in strength.

iii. Generally, the brazing surface of housing parts, such as a shield case and a board reinforcement frame, is surface-treated before soldering. According to the surface treatment at this time, degreasing treatment, antirust treatment, plating treatment, etc. are performed. Degreasing treatment and rust prevention treatment are only surface clean and protective effect, and it is difficult for favorable soldering. According to the plating treatment, the tin unit of a thickness of several micrometers or tin is subjected to binary solder base plating such as tin copper. When mounting a housing component subjected to this kind of surface treatment on a substrate, the solder is applied only to the substrate side, and the solder is not applied to the housing component side. In the state at the time of mounting, the amount of solder as a whole is small and the solder wettability is achieved. As this is bad, the present situation has not solved the problem of soldering such as difficult to form satisfactory fillet during surface mounting.

iv. In addition, it is conceivable to perform hot dip solder plating on the solder surface of the shield case. However, since nickel silver and stainless steel used in the shield case have poor solderability, the molten solder plating must be performed using a strongly active flux. In such a method, even if the cleaning is performed after soldering, a highly corrosive residue is likely to remain and the reliability is lowered.

In order to solve the above-mentioned problems, the solder coating component is a surface treatment in which a nickel film and a tin alloy plating film having a predetermined film thickness are sequentially provided on a base material and a lead-free molten solder is coated on the tin alloy plating film. It is characterized by comprising a metal member subjected to.

According to the solder coating part according to the present invention, for example, the metal member is processed into a shield part shape, and then a nickel film and a tin alloy plating film having a predetermined film thickness are sequentially formed on one or all parts of the metal member. Then, the surface treatment is performed by coating the molten solder on one portion or all the portions on the metal member after the ground treatment, and a part of the shield component shape is a solder surface for surface mounting. The lead-free molten solder includes Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Bi, Sn-Ag-Cu-Bi, Sn-Bi-Ag (Cu), Sn- Lead-free solder such as Ag-Cu-Ni-based or Sn-Ag-Cu-Sb-based is used.

Therefore, the solder wettability of the soldered portion of the solder coating component for surface mounting can be further improved (good) as compared with the soldering treatment by the conventional plating treatment method, rust preventing treatment, degreasing treatment, or the like.

The manufacturing method of the soldering coating component which concerns on this invention is a process of forming a nickel film and tin alloy plating film of predetermined | prescribed film thickness sequentially on the metal member for solder coating parts, and carrying out the base treatment, and the said tin alloy plating film on the base treatment. It has a surface treatment process which consists of a process of coating the lead-free molten solder.

According to the method for producing a solder coating component according to the present invention, the solder wettability of the solder portion of the solder coating component for surface mounting can be further improved as compared with the conventional plating treatment or the solder treatment by antirust treatment or degreasing treatment. It becomes possible.

The 1st mounting method of the solder coating component which concerns on this invention processes the metal member for solder coating components from one side, and forms the shield component for surface mounting, The predetermined | prescribed in the said metal member formed in the said shield component A surface treatment step comprising a step of sequentially forming a nickel film and a tin alloy plated film having a film thickness, and a step of coating the molten solder on the metal member subjected to the base treatment; and, on the other hand, at a predetermined portion of the mounting substrate. And a step of forming a solder material, performing a heat treatment by aligning the shield component for surface mounting to a predetermined portion of the mounting substrate on which the solder material is formed, and bonding the mount substrate and the shield component. It is to be done.

Moreover, the 2nd mounting method of the soldering coating component which concerns on this invention is a process of forming a nickel film of a predetermined | prescribed film thickness and a tin alloy plating film one by one on the metal member used as the base material for soldering coating parts, and carrying out base treatment. And a surface treatment step comprising a step of coating a molten solder on the metal member subjected to the ground treatment, a step of processing the surface treated metal member to form a shield component for surface mounting, and, on the other hand, the predetermined mounting of the mounting substrate. A step of forming a solder material at a portion thereof, and performing heat treatment by aligning the shield component for surface mounting at a predetermined portion of the mounting substrate on which the solder material is formed, and joining the mounting substrate and the shield component. It is characterized by having.

According to the first and second mounting methods of the solder coating component according to the present invention, the solder wettability of the solder portion of the solder coating component for surface mounting, as compared to the conventional plating treatment, or the solder treatment by antirust treatment, degreasing treatment, or the like. We can improve even more.

According to the solder coating component according to the present invention, a manufacturing method thereof, and a mounting method thereof, the solder wettability of the solder portion of the solder coating component for surface mounting is higher than that of the conventional plating treatment or the solder treatment by antirust treatment, degreasing treatment, or the like. It became possible to improve more. As a result, it is possible to form a soldering portion in the entire range of any soldering region of the housing component which is not obtained with a conventional metal member.

In addition, it is possible to form a good fillet in which a shield case, a board reinforcing frame, or the like can be reliably and firmly bonded to a printed wiring board and mounted without generating a solder unbonded portion or voids. As a result, it is possible to provide electronic parts such as shield parts having excellent bending resistance and axial resistance.

1: is a perspective view which shows the structural example of the shield case 100 as 1st Embodiment which concerns on this invention.
2 is a cross-sectional view showing a configuration example of the frame member 11 of the shield case 100.
3: A is a top view which shows the formation example (1st) at the time of the throttling of the nickel silver material 1 regarding the frame member 11. FIG.
FIG. 3B is a cross-sectional view taken along the line X1-X1 of FIG. 3A, showing a formation example (first) of the whitening material 1 in the throttling process of the frame member 11.
4: A is a top view which shows the formation example (2nd) at the time of throttling of the nickel silver material 1 regarding the frame member 11. FIG.
4: B is a side view which shows the formation example (2nd) at the time of the throttling of the nickel silver material 1 which concerns on the frame member 11. FIG.
FIG. 5: A is a top view which shows the formation example (third) at the time of the throttling of the nickel silver material 1 regarding the frame member 11. FIG.
FIG. 5B is a cross-sectional view taken along the line X1'-X1 'of FIG. 5A, showing a formation example (third) of the whitening material 1 during the throttling of the frame member 11. FIG.
FIG. 6: A is a process chart which shows the example of mounting (first) of the frame member 11 to the printed wiring board 10 which concerns on the shield case 100. As shown in FIG.
FIG. 6: B is process drawing which shows the example (2nd) of mounting on the printed wiring board 10 of the frame member 11 which concerns on the shield case 100. As shown in FIG.
FIG. 6C is a process chart showing a mounting example (third) of the frame member 11 of the shield case 100 on the printed wiring board 10.
FIG. 7: is a perspective view which shows the structural example of the shield case 200 as 2nd Embodiment.
FIG. 8: A is a top view which shows the formation example (first) at the time of bending of the nickel silver material 1 regarding the frame member 21. FIG.
FIG. 8B is a cross-sectional view taken along the line X2-X2 in FIG. 8A, showing a formation example (first) of the nickel silver material 1 in the bending process of the frame member 21.
9: A is a top view which shows the formation example (2nd) at the time of bending of the nickel silver material 1 regarding the frame member 21. FIG.
FIG. 9B is a cross-sectional view taken along the line X2'-X2 'of FIG. 9A showing a formation example (second) of the nickel silver material 1 during the bending process with respect to the frame member 21. FIG.
FIG. 10: A is a top view which shows the formation example at the time of press working of the nickel silver material 1 regarding the frame member 21. FIG.
FIG. 10B is a cross-sectional view taken along the line X3-X3 in FIG. 10A, showing an example of formation at the time of press working of the nickel silver material 1 with respect to the frame member 21.
FIG. 11: A is a process chart which shows the mounting example (first) of the frame member 21 with respect to the shield case 200 to the printed wiring board 10. FIG.
FIG. 11B is a flowchart showing a mounting example (second) of the frame member 21 of the shield case 200 on the printed wiring board 10.
FIG. 11C is a process chart showing a mounting example (third) of the frame member 21 of the shield case 200 on the printed wiring board 10.
FIG. 12: is a perspective view which shows the structural example of the tuner case 300 as 3rd Embodiment.
FIG. 13: is a perspective view which shows the structural example of the board | substrate reinforcement frame 400 as 4th Embodiment.
FIG. 14 is a meniscograph showing a test example (ESR-250) in which the whitening material 1 of the frame members 11, 21, 31, and 41 is solder wet riseability.
It is a table | surface which shows the evaluation result in M705 process and Sn plating process which concern on the whitening material 1.

The present inventors, in the shield case of the present invention, compared with the case where only the tin coating treatment or the like is performed on the metal member of the plating treatment, when the nickel coating and the tin alloy plating coating having a predetermined film thickness are sequentially formed and the base treatment is performed, the tin The present invention has been focused on the fact that a molten solder having a film thickness of several tens of times can be deposited on the alloy plating film.

The present invention enables the fillet portion to be formed over the entire range of any soldered region of the housing component even without using a highly corrosive, strongly active flux, and does not generate solder unbonded portions, voids, or the like. An object of the present invention is to provide a solder-coated part, a method for producing the same, and a method for mounting the same, which can be firmly and firmly bonded to the film.

EMBODIMENT OF THE INVENTION Hereinafter, the solder coating component, its manufacturing method, and its mounting method as an Example which concerns on this invention are demonstrated, referring drawings.

<1st embodiment>

The shield case 100 as 1st Embodiment shown in FIG. 1 comprises an example of a solder coating component, and electromagnetically shields the electronic component (not shown) mounted on the printed wiring board 10. As shown in FIG. Here, a solder coating component is a surface treatment in which a nickel film and a tin alloy plating film having a predetermined film thickness are sequentially provided on a metal part such as a shield case, and a lead-free molten solder film is coated on the tin alloy plating film. It means what was carried out. In this invention, a base material means formation materials, such as a shield case, and a base material is comprised by the raw material of metal members, such as iron and cobar, besides nickel silver and stainless steel.

In addition, a predetermined | prescribed nickel film means the nickel film of the film thickness of 0.3-2.0 micrometers of plating thickness, More preferably, it is a film thickness of 0.5-1.0 micrometer. In addition, a predetermined tin alloy film means the tin alloy film of the film thickness of 0.7-7.0 micrometers in plating thickness, More preferably, it is 1.0-3.0 micrometer film thickness. The shield case 100 is composed of a frame member 11 and a cover member 12. The frame member 11 has a frame shape having a width of W1, a length of L1, and a height of H1. The frame member 11 has a width W1 of about 38 mm, a length L1 of about 60 mm, and a height H1 of about 2 mm. The frame member 11 is soldered to the printed wiring board 10. The land pattern 10a which patterned copper foil is provided in the printed wiring board 10, and the frame member 11 is melt-sold-processed by this reflow process to this land pattern 10a. The inside of the frame of the frame member 11 is composed of an opening 13. When the lid member 12 is removed from the frame member 11, the electronic component in the opening 13 can be inspected. In this example, the hatch-shaped (shade-shaped) throttle end 11a is provided around the opening 13 at the time of throttling. The throttle end 11a is provided in order to reinforce the frame member 11, the fixed reinforcement of the cover member 12, and the wettability of the molten solder at the time of reflow process.

The lid member 12 has a rectangular cover shape, and the lid opening is freely provided to cover (cover) the frame member 11 soldered to the printed wiring board 10. The lid member 12 is made of a tin plate member (tin-plated steel sheet), a nickel white material (C7521R, C7701R, etc.), a stainless steel material (SUS304, SUS316, SUS430, etc.). The lid member 12 cuts and bends these plate members, and the lid member 12 is formed.

As shown in FIG. 2, the frame member 11 of the shield case 100 is composed of a nickel-plated material 1 constituting an example of a metal member. The nickel silver material 1 has the predetermined thickness d. The nickel silver material 1 is provided with a nickel (Ni) plating layer 2 (film) and a tin-copper (Sn-Cu) plating layer 3 (film) having a predetermined film thickness in order from the lower layer. On the Sn-Cu plating layer 3, molten solder is coated (coated). Hereinafter, the layer which coated molten solder is called the solder coating layer 4.

Hereinafter, the processing layer which consists of nickel (Ni) plating layer 2 (film), tin-copper (Sn-Cu) plating layer 3 (film), and the solder coating layer 4 is called surface treatment layer 5. The coating treatment in forming the coating layer 4 coated with the molten solder described above refers to soldering only the necessary portions of the metal member by using a method of immersing the metal member in the molten solder and depositing the solder as a whole, or locally soldering. It means surface treatment which deposits.

The thickness of the solder coating layer 4 is secured in the range of 10 µm to 30 µm in order to improve the wettability of the molten solder during the reflow treatment. As the molten solder, for example, a lead-free solder of Sn-Ag-Cu system is used. The molten solder includes, in addition to Sn-Ag-Cu, Sn-Ag, Sn-Cu, Sn-Bi, Sn-Ag-Cu-Bi, Sn-Bi-Ag (Cu), Sn-Ag- Cu-Ni-based or Sn-Ag-Cu-Sb-based alloy solder (Eco Solder (registered trademark) M705) is used. The composition of the molten solder of M705 is Sn-3.0Ag-0.5Cu. In addition, Ecosolder M20 is used. The composition of the molten solder of M20 is Sn-0.75Cu.

That is, as shown in Fig. 2, in the surface treatment layer 5 of the present invention, nickel (Ni) plating layer 2 (film) and tin-copper (Sn-Cu) plating layer 3 (film) are sequentially installed. And the solder coating layer 4 in which molten solder is coated (coated) on the Sn-Cu plating layer 3.

Next, with reference to FIGS. 3A-5B, the formation example of the frame member 11 is demonstrated about the manufacturing method of the shield case 100 which concerns on this invention. In this example, when manufacturing the shield case 100, it is presupposed that the nickel silver material 1 which comprises an example of the metal member for shield cases is processed into a shield component shape before surface treatment.

As for the shield case 100, the case where the lamella 1 is processed and the frame member 11 for surface mounting is formed is taken as an example. At this time, the case where the annealed material 1 which can be melt-sold-coated can be throttled, and the throttle end part for surface mounting on the frame member 11 is mentioned, for example. The coating treatment is an example in which the Eco Solder M705 (registered trademark) used for soldering at the time of mounting the shield case is coated with solder on both sides of the shield case with 15 µm on one side.

For example, in order to obtain the frame member 11 as shown in FIG. 1, the biconductor 1 whose thickness W1 'shown in FIG. 3B is d1 with the magnitude | size of width W1' x length L1 'shown in FIG. 3A. Prepare (C7521R, C7701, etc.). 3B is a cross-sectional view of the X1-X1 arrow of the nickel silver material 1. In addition to the nickel silver material 1, stainless steel materials (SUS304, SUS316, SUS430, etc.) etc. may be used for the frame member 11, for example. The thickness d1 of the nickel silver material 1 is 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, etc., for example. The width W1 'of the nickel silver material 1 is slightly larger (about 5% to 10%) than the width W1 of the finishing dimensions of the frame member 11, and the length L1' is also the frame member 11 in order to throttle and obtain the height H1. ), Slightly longer (about 5% to 10%) than the length L1 of the finished dimension is prepared.

The broken line in a figure is a part (projection part) which puts the convex part front end press part of the throttle machine which is not shown in figure. Although not shown, the throttling machine is equipped with an end pressing mechanism for forming the throttle end 11a so that a part of the frame member 11 becomes a solder surface for surface mounting. In this example, as shown in FIG. 1, the case where the circumferential edge part 11a of a hat shape (shade shape) is provided in the L periphery of the axial bending part 13 in the L-shape as shown in FIG. Holding

When the whitening material 1 of the size shown to FIG. 3A and FIG. 3B is prepared, it sets the whitening material 1 to the throttling machine which is not shown in figure, and presses the convex-tip pressurization part to the said whitening material 1, and throttles. The machining process is executed. By this throttling treatment, a het-shaped nickel silver material 1 shown in Fig. 4A can be obtained. According to the het-shaped nickel silver material 1, the convex part 1a is comprised. Around its outer circumference it consists of a sunshade-shaped throttle end 11a. As a result, a het-shaped intermediate member 11 ′ in which the opening 13 of the frame member 11 as shown in FIG. 1 is not yet opened is obtained.

When the het-shaped intermediate member 11 'shown in Figs. 4A and 4B is prepared, an opening 13 is formed in the convex portion 1a of the intermediate member 11'. The opening part 13 is formed by, for example, setting the intermediate member 11 'in a press working machine and punching with the press working member. Thereby, the frame member 11 of the dough which has the opening part 13 shown in FIG. 5A can be obtained. FIG. 5B is a cross-sectional view taken along the X1'-X1 'arrow of the frame member 11. The processing process of obtaining this frame member 11 can be suitably selected from the hoop material of the whitening material 1 wound by roll shape, such that it forms continuously by a forward type press.

When the frame member 11 of the dough shown in Figs. 5A and 5B is prepared, nickel (Ni) and tin copper (Sn-Cu) having a predetermined film thickness are sequentially formed on the frame member 11, and subjected to substrate treatment. First, the degreasing process of the frame member 11 is performed. According to this degreasing treatment, pretreatment of the frame member 11 is performed using NaOH (sodium hydroxide) or NaCN (sodium cyanide). Next, the cyanide immersion degreasing and / or cyanide electrolytic degreasing step is performed to the frame member 11 after pretreatment.

When the above-mentioned degreasing process is complete | finished, the base process of the frame member 11 is further continued. In this example, Ni plating is performed on the frame member 11 after the degreasing treatment. The said frame member 11 is set to the electroplating apparatus which is not shown in figure, and a base process is performed. The electroplating apparatus is filled with electrolyte solution in a plating bath. The frame member 11 is connected to the cathode electrode, and a target material such as Ni is connected to the anode electrode to conduct a DC current. In this example, Ni plating is performed on the first layer on the nickel silver material 1 by electroplating.

The plating bath constitutes a sulfonic acid bath. Electrolyte solution is comprised with Ni plating liquid. Nickel sulfamate (Ni (NH ₂ SO ₃ ) _{2 to} 4H ₂ O) or nickel chloride (NiCl _{2 to} 6H ₂ O) is used for the Ni plating solution. By this electroplating process, as shown in FIG. 2, the Ni plating layer 2 can be provided in the upper layer of the nickel silver material 1. As shown in FIG. The undertreatment of the Ni plating layer 2 on the upper layer of the nickel silver material 1 prevents the occurrence of whiskers.

In this example, Sn-Cu plating is performed on the upper layer of the Ni plating layer 2 by electroplating as a finish of the base treatment. As this pretreatment, the frame member 11 is immersed in an acid immersion bath for a short time, and the metal surface of the Ni plating layer 2 is polished. H ₂ SO ₄ (sulfuric acid) is used for the acid immersion bath. In the case of performing the Sn plating treatment, an organic acid bath is used for the plating bath 51. Methane sulfonic acid (CH ₃ SO ₃ H) or metal sulfamate (CH ₃ SO ₃ ) ₂ Sn) is used for the Sn plating solution.

When performing a Cu plating process, the electrolyte bath containing a copper ion or a copper complex ion is used for a plating bath. As the Cu plating solution, an electrolytic solution containing copper ions or copper complex ions is used. Metal copper is used for the cathode. By this electroplating process, Sn-Cu plating layer 3 can be provided in the upper layer of Ni plating layer 2 as shown in FIG. In addition, phosphoric acid is used for the antioxidant treatment of the frame member 11.

As the plating method, as described above, the metal member can be partially plated by the method of immersing the metal member as a whole, the stamp plating method, and the means can be appropriately selected.

Subsequently, a solder coating process is performed on the required portion of the frame member 11 on which the base treatment is completed. In the solder coating process of this example, Eco Solder M705 was used. Ecosolder M705 is a lead-free molten solder. Lead-free molten solders include Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Bi, Sn-Ag-Cu-Bi, Sn-Bi-Ag (Cu) and Sn-Ag Lead-free solder such as -Cu-Ni or Sn-Ag-Cu-Sb is used.

The coating thickness of lead-free molten solder is about 15 micrometers per single side | surface of metal members, such as the whitening material 1, and this coating process was performed to single side | surface and / or both surfaces. Control of the coating thickness was made to adjust using the well-known technique which performs control by applying an ultrasonic wave to the molten solder immersed in a metal member, for example. By this coating process, the solder coating layer 4 can be provided in the upper layer of the Sn-Cu plating layer 3 as shown in FIG. Thereby, as shown in FIG. 2, the frame member for shield cases in which the surface treatment layer 5 which consists of the nickel plating layer 2, the tin alloy plating layer 3, and the solder coating layer 4 which coat | coated molten solder was formed was formed. (11) is completed.

The frame member 11 for the shield case after the surface treatment is filled with the embossing tape, wound around the reel, and conveyed to the component supply path. Or, it is packed in a general purpose or dedicated tray and packed and conveyed to a component supply path. In addition, the surface treatment which consists of the base treatment of a nickel film and a tin alloy plating film, and the coating process by fusion | melting solder selects well-known appropriate means, such as a stamping plating method and a local soldering method, to the whole or required part of a shield part. Is carried out.

6A-6C, the mounting example of the shield member 100 to the printed wiring board 10 about the mounting method of the shield case 100 which concerns on this invention is demonstrated. In this example, a solder material is used for a predetermined portion of the printed wiring board 10 (mounting board) by using the frame member 11 for surface mounting after the surface treatment obtained by the forming step of FIGS. 3A to 5B. Take the case of bonding.

First, in FIG. 6A, the solder material 16 ′ (material) is formed in a predetermined portion of the printed wiring board 10. Solder paste is used for the solder material 16 '. The printed wiring board 10 uses what has the land pattern 10a (grounding pattern) which patterned copper foil. The land pattern 10a uses what patterned copper foil at the part which opposes the mounting surface of the frame member 11 at least. If the solder material 16 'can be formed in the land pattern 10a of the printed wiring board 10, the land pattern 10a and the frame member 11 are aligned.

And in FIG. 6A, the frame member 11 shown in FIG. 6B is mounted in the predetermined site | part of the land pattern 10a in which the solder material 16 'was formed. The mounting of the frame member 11 may be performed by a component mounting machine, or may be carried out by manual loading.

Next, the printed wiring board 10 including the frame member 11 mounted on the land pattern 10a through the solder material 16 'is introduced into a reflow furnace (not shown) to perform a reflow process. . By this reflow process, the printed wiring board 10 and the frame member 11 are joined. At this time, the reflow furnace is heated and controlled according to a predetermined temperature profile.

For example, the target set temperature is set to 250 ° C., and the speed of the conveyor to the reflow is set to about 1.25 m / sec. The heating atmosphere of the printed wiring board 10 is in an atmospheric atmosphere, Preferably it is in the atmosphere which consists of inert gas, such as nitrogen gas. In this manner, when the heat treatment of the printed wiring board 10 on which the frame member 11 is mounted is performed, the solder material 16 'on the land pattern 10a is melted to form the axial end 11a of the frame member 11. Wetting up nicely. The fillet part 16 is formed by the riding of this molten solder. As a result, as shown in FIG. 6C, the frame member 11 and the printed wiring board 10 can be soldered satisfactorily.

In addition, in the above-mentioned embodiment, since the frame member 11 is provided with the throttle end 11a of the hat shape (shade shape) around it, the fillet formed as shown in FIG. 6C is the frame member 11 It is hardly equal at the outer side and the inner side of). That is, the fillet is formed in the inner side thickly.

In the case where the fillet is to be formed almost evenly on the outside and the inside of the frame member 11, the axial end 11a shown in Fig. 6A is further folded by folding the end portion so as to be U-shaped in cross-sectional shape. When formed, the frame member 11 may be reinforced and at the same time, the bottom portion of the U-shape becomes symmetrical, so that the fillet formed after the frame member 11 is mounted on the printed wiring board 10 is the frame member 11. It is formed almost evenly on the outside and the inside of the.

As a result, the mechanical bonding strength of the printed wiring board 10 and the frame member 11 increases compared with the mounting state shown in FIG. 6C, and the reliability on quality also becomes high.

Thus, according to the shield case 100 and its manufacturing method as 1st Embodiment, after processing the frame member 11 whose part became the soldering surface for surface mounting from the whitening material 1, the frame member 11 Ni-plating layer 2 and Sn-Cu plating layer 3 having a predetermined film thickness are sequentially formed on a portion of the substrate) and subjected to substrate treatment, and lead-free melting of all portions on the Sn-Cu plating layer 3 after the substrate treatment. The solder is coated to form the solder coating layer 4, and the surface treatment layer 5 consisting of three layers as a whole is formed. The molten solder includes Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Bi, Sn-Ag-Cu-Bi, Sn-Bi-Ag (Cu), Sn-Ag-Cu Lead-free solder such as -Ni or Sn-Ag-Cu-Sb is used.

Therefore, the solder wettability of the soldered portion (hereinafter referred to as the fillet portion 16) of the shield case 100 for surface mounting is further improved as compared to the soldering treatment by the conventional plating treatment, antirust treatment, degreasing treatment, or the like. I can do it. This makes it possible to provide electronic parts such as the frame member 11 excellent in bending resistance and axial resistance. In addition, it is possible to form a satisfactory fillet in which electronic components such as the frame member 11 and the like can be reliably and firmly bonded to and mounted on a printed wiring board without generating unbonded parts or voids.

In addition, with solder paste alone, a solid solder (hereinafter referred to as a chip) processed to a rectangular size (dimension shapes such as # 1005, # 1608, # 0603, etc.) similar to a chip-type electronic component at a place where mounting defects may occur due to insufficient solder amount. May be used).

The chip solder is lead-free solder such as the above-described eco solder M705, and is processed to a rectangular size similar to that of a chip-type electronic component. Therefore, the amount of chip solder is required in any place in an existing equipment such as a component mounter such as a chip mounter. Can supply solder. When the chip solder is used, even if the supply amount of the solder material 16 'is reduced by the micronization of the parts, it is possible to cope with the supply of the fixed amount.

Here, as to the procedure for using the chip solder, first of all, since a mounting failure may occur due to insufficient amount of solder on the printed wiring board 10 to be mounted, a frequent location is specified. Next, the chip solder of the magnitude | size according to the mounting workpiece dimension shape of a specific mounting defective frequency location, a land area shape, and a required supply amount is selected. Then, the mounting parameters are programmed into the chip mounter.

Thereafter, the chip solder magazine is set in the chip mounter. At this time, the reflow process is executed while the above-described chip solder is mounted. Moreover, even when a chip solder is used, since there is no big difference from the procedure of mounting a chip component using a chip mounter, not only a special facility is needed but also special training by an operator is not necessary at all.

In addition, it is possible to cope with surface mounting on the land pattern 10a in which a large housing part, which is difficult to obtain flatness, is cooperative with the component mounter and the chip solder. In using this chip solder in place suitably, it is the same also in other embodiment.

A solder coating part is a metal part such as a shield case, in which a nickel film and a tin alloy plating film having a predetermined film thickness are sequentially installed, and a surface treatment made of a lead-free molten solder film coated on the tin alloy plating film is performed. Say that.

In addition, after forming a nickel film and a tin alloy plating film sequentially, and the base treatment is performed, when obtaining the shield component by which the surface treatment which consists of a lead-free molten solder film coated on the said tin alloy plating film was performed, it mentioned above. In the mounting method of the solder coating component which concerns on this invention, the process of processing the metal member for solder coating components and forming the shield component for surface mounting is performed first. Subsequently, a nickel film and a tin alloy plating film were sequentially formed on the formed shield member, and after the substrate treatment, the molten solder was coated on the metal member to perform surface treatment, but the present invention is not limited thereto. For example, first, a nickel film and a tin alloy plating film having a predetermined film thickness are sequentially formed on the metal member serving as the base material for the solder coating component, and then subjected to the base treatment, and then the molten solder is coated on the metal member to perform a surface treatment. Then, the surface-treated metal member may be processed to form a shield component for surface mounting. The same applies to other embodiments.

<2nd embodiment>

Subsequently, with reference to FIG. 7, the shield case 200 as 2nd Embodiment is demonstrated. The shield case 200 shown in FIG. 7 constitutes an example of a solder coating component, and electromagnetically shields electronic components (not shown) mounted on the printed wiring board 10 in the same manner as in the first embodiment. It is. The shield case 200 is composed of a cover member 12 and a body reinforced frame member 21. As in the first embodiment, the frame member 21 has a width W2 of about 38 mm, a length L2 of about 60 mm, and a height H2 of about 2 mm. The frame member 21 is soldered to the printed wiring board 10. As the printed wiring board 10, the one described in the first embodiment is used.

In the shield case 200, the inner side of the frame member 21 is body reinforced. In this example, the frame member 21 has beam portions 21a and 21b that cross each other. The beam portion 21a is set wider than the width of the beam portion 21b. This setting is for preventing distortion of the longitudinal direction of the frame member 21 in the beam part 21a. The openings 13 described in the first embodiment are divided into four by the cross beam portions 21a and 21b, and the openings 13a to 13d are provided inside the frame member 21. When the lid member 12 is removed from the frame member 21, the electronic component in the four divided openings 13a to 13d can be inspected.

In this example, below the outer periphery of the four opening parts 13a-13d, the cut end surface of the biferrous material 1 has the shape which contacts the land pattern 10a as it is. Of course, similarly to 1st Embodiment, you may bend the cut end surface of the nickel silver material 1 inward or outward, and provide a bending end part. In order to improve the wettability of the molten solder at the time of the reflow process to the inside and the outside of the frame member 21 when the above-mentioned cut end surface contacts the land pattern 10a, predetermined | prescribed as shown in FIG. Ni-plating layer 2 and Sn-Cu plating layer 3 having a film thickness are sequentially formed and subjected to substrate treatment, and lead-free molten solder is coated on the Sn-Cu plating layer 3 after the substrate treatment as a finishing layer. The surface treatment layer 5 which consists of the solder coating layer 4 which consists of is formed.

In the same manner as in the first embodiment, the thickness of the solder coating layer 4 is ensured to about 18 µm to 30 µm in order to improve the wettability of the molten solder during reflow treatment. Similarly to the first embodiment, for example, Sn-Ag-Cu-based lead-free solder is used for the molten solder. The molten solder includes, in addition to Sn-Ag-Cu, Sn-Ag, Sn-Cu, Sn-Bi, Sn-Ag-Cu-Bi, Sn-Bi-Ag (Cu), Sn-Ag- Lead-free solder such as Cu-Ni-based or Sn-Ag-Cu-Sb-based is used. In addition, since the cover member 12 is demonstrated in 1st Embodiment, the description is abbreviate | omitted.

Subsequently, with reference to FIGS. 8A-10B, the formation example of the frame member 21 about the manufacturing method of the shield case 200 which concerns on this invention is demonstrated. In this example, it is assumed that the whitening material 1 is processed into a shield part shape having a cross structure.

For example, in order to obtain the frame member 21 of the finished dimension as shown in FIG. 7, width x length x height = W2 x L2 x H2, the width W2 '(W2'> W2) x shown in FIG. A sheep white material 1 (C7521R, C7701R, etc.) having a thickness d1 shown in Fig. 8B is prepared with the size of the length L2 '(L2'> L2). 8B is a cross-sectional view taken along the arrow X2-X2 of the two white materials 1. In this example, since the frame member 21 is formed by bending, the four openings 1b, 1b, 1b, and 1b are opened at predetermined positions at the four corners of the nickel silver material 1. These openings 1b and the like are used as stress absorbing holes during bending.

When the whitening material 1 having the openings 1b and the like at the four corners is prepared, as shown in FIG. 9A, based on the openings 1b, 1b, 1b and 1b of the four corners, The rectangular shape piece is cut out from the corner part of 1) using a cutting tool (cut off). Here, the site | part from which the rectangular piece fell from the corner | angular part of the nickel silver material 1 is called notch part 22a, 22b, 22c, 22d. Thereby, the intermediate member 21 'with the notch parts 22a, 22b, 22c, and 22d is obtained.

Thereafter, the nickel silver material 1 is set in a bending machine not shown, and the main body pressing portion and the end bending mechanism are pressed against the nickel silver material 1 to perform bending processing. At this time, the C-shaped portions of the openings 1b, 1b, 1b, and 1b remaining in the cutouts 22a, 22b, 22c, and 22d absorb the stress at the time of bending. By this bending processing, the cap-shaped intermediate member 21a 'in which the opening part 13a-13d of the frame member 21 as shown in FIG. 7 is not yet opened is obtained. According to the cap-shaped bismuth material 1 according to the second embodiment, the lower end around the outer circumference has a shape such that the cut end surface of the bismuth material 1 is in contact with the land pattern 10a as it is.

When such a cap-shaped intermediate member 21a 'is prepared, beam portions 21a and 21b that cross each other are formed on the convex portions of the intermediate member 21a' to open the openings 13a to 13d. The beam parts 21a and 21b are formed by setting an intermediate member in a press working not shown, for example, and punching the convex part of an intermediate member into a cross shape with a press working member. Thereby, the frame member 21 of the dough which has the beam part 21a, 21b which cross | intersects the cross shown in FIG. 10A can be obtained. 10B is a cross-sectional view taken along the X3-X3 arrow of the intermediate member 21a '.

When the frame member 21 of the dough shown in FIGS. 10A and 10B is prepared, the Ni plating layer 2 and the Sn-Ag plating layer 3 having a predetermined film thickness are sequentially formed and subjected to substrate treatment. Since the ground process at this time is the same as that of the first embodiment, the description thereof is omitted. Subsequently, a solder coating process is performed as a finishing layer on the required part of the frame member 21 which completed the base process similarly to 1st Embodiment. Since the solder coating process and the component supply process thereof are the same as in the first embodiment, the description thereof is omitted.

Next, with reference to FIGS. 11A-11C, the mounting example of the shield case 200 to the printed wiring board 10 of the frame member 21 is demonstrated. In this example, a solder material is placed on a predetermined portion of the printed wiring board 10 (mounting board) by the frame member 21 for surface mounting after the solder coating process obtained by the forming step shown in FIGS. 8A to 10B. Take the example of joining using.

First, in FIG. 11A, the solder material 26 ′ (material) is formed in a predetermined portion of the printed wiring board 10. Since the printed wiring board 10 and the solder material 26 'are as described in the first embodiment, their description is omitted. If the solder material 26 'can be formed in the land pattern 10a of the printed wiring board 10, the land pattern 10a and the frame member 21 are aligned. And in FIG. 11A, the frame member 21 shown in FIG. 11B is mounted in the predetermined site | part of the land pattern 10a in which the solder material 26 'was formed. The mounting of the frame member 21 may be performed by a component mounting machine, by manual loading, or by either.

Next, the printed wiring board 10 including the frame member 21 mounted on the land pattern 10a through the solder material 26 'is introduced into a reflow furnace (not shown) for reflow processing. By this reflow process, the printed wiring board 10 and the frame member 21 are joined. At this time, the reflow furnace is heated and controlled in accordance with the temperature profile in the same manner as in the first embodiment.

In this way, when the heat treatment of the printed wiring board 10 on which the frame member 21 is mounted is performed in accordance with the temperature profile, the solder material 26 'on the land pattern 10a is melted to form an inner side below the frame member 21. And the outside is wetted with good wettability. The fillet part 26 is formed by the riding of this molten solder. As a result, as shown in FIG. 11C, the frame member 21 and the printed wiring board 10 can be soldered satisfactorily.

Thus, according to the shield case 200 and the manufacturing method thereof according to the second embodiment, the frame member 21 having the cross structure in the frame, in which a part thereof becomes a solder surface for surface mounting, is processed from the nickel-plated material 1. After that, the Ni plating layer 2 and the Sn-Ag plating layer 3 having a predetermined film thickness are sequentially formed and subjected to substrate treatment, and after the substrate treatment, lead-free molten solder is coated as a finishing layer. The molten solder includes Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Bi, Sn-Ag-Cu-Bi, Sn-Bi-Ag (Cu), Sn-Ag-Cu Lead-free solders such as -Ni and Sn-Ag-Cu-Sb are used.

Therefore, the fillet part 26 of the shield case 200 for surface mounting can improve solder wettability more compared with the soldering process by the conventional plating process, an antirust process, a degreasing process, or the like. This makes it possible to provide electronic parts such as the frame member 21 having excellent bending resistance and axial resistance. In addition, it is possible to form a good fillet capable of reliably and firmly bonding electronic components such as the frame member 21 to the printed wiring board 10 without generating unbonded portions, voids, or the like. .

Third Embodiment

Next, with reference to FIG. 12, the tuner case 300 as 3rd Embodiment is demonstrated. The tuner case 300 shown in FIG. 12 constitutes an example of a solder coating component, and electromagnetically shields a tuner component (not shown) mounted on the tuner circuit board 30.

The tuner case 300 is composed of a frame member 31 and a cover member 32. The frame member 31 has a width W3 of about 18 mm, a length L3 of about 22 mm, and a height H3 of about 2 mm. The frame member 31 is soldered to the tuner circuit board 30. The land pattern 30a is provided in the tuner circuit board 30, and the thing in which the tuner circuit was built into the printed wiring board 10 demonstrated in 1st Embodiment is used. As the frame member 31 and the lid member 32, those produced from the nickel silver material 1, SUS304, SUS316, SUS430, or the like are used. The frame member 31 is soldered to the land pattern 30a.

In this example, the inside of the frame member 31 is flat reinforced. In this planar reinforcement, an uneven portion is provided in the end face (wood surface) direction of the opening portion 33 inside the frame member 31. The concave-convex portion is provided in order to prevent distortion and warping in the longitudinal direction and the width direction of the frame member 31. Also in this example, when the cover member 32 is peeled off from the frame member 31, the tuner component in the opening part 33 in which the inside was flatly reinforced can be inspected.

In this example, the periphery of the outer circumference of the opening 33 is different from the hith-shaped throttle end 11a as in the first embodiment, and the cut end face of the lamella 1 as described in the second embodiment is the land pattern as it is. It is a shape like contacting 30a. Of course, you may make the circumference | surroundings the circumference end 11a similar to 1st Embodiment. The lid member 32 is provided with a grounding lead 32a in addition to that described in the first embodiment. The lid 32a has a leaf spring property, and when the tuner circuit board 30 on which the tuner case 300 is mounted is housed in a housing such as a cellular phone, the lead 32a is in contact with the contact point provided in the housing and electrically. Conductive and grounded.

As for the frame member 31 of the tuner case 300, Ni plating layer 2 and Sn-Cu plating layer 3 of predetermined film thickness as shown in FIG. 2 are provided one by one, and the said Sn-Cu plating layer 3 is also provided. ) Is composed of a nickel-plated material 1 having a surface treatment layer 5 formed of a solder coating layer 4 coated with molten solder. The thickness of the solder coating layer 4 is similar to 1st and 2nd embodiment, and about 18 micrometers-30 micrometers are ensured in order to improve the wettability of the molten solder at the time of a reflow process. As the molten solder, for example, a lead-free solder of Sn-Ag-Cu system is used.

The molten solder includes, in addition to Sn-Ag-Cu, Sn-Ag, Sn-Cu, Sn-Bi, Sn-Ag-Cu-Bi, Sn-Bi-Ag (Cu), Sn-Ag- Lead-free solder such as Cu-Ni-based or Sn-Ag-Cu-Sb-based is used.

In addition, about the mounting method of the tuner case 300, please refer to 2nd Embodiment. The fillet portion 36 in the figure performs heat treatment of the tuner circuit board 30 on which the frame member 31 is mounted, and the solder material on the land pattern 30a melts to form an inner side of the cut end surface of the frame member 31. And the outside was wetted with good wettability, and was caused by the burning of this molten solder.

As described above, according to the tuner case 300 according to the third embodiment, the Ni-plated layer is formed from the nickel-plated material 1 after processing the frame member 31 in-frame reinforcement in which a part thereof becomes a solder surface for surface mounting. (2) and the under-treatment of the Sn-Ag plating layer 3, and after the under-treatment, the lead-free molten solder is coated so that the fillet portion 36 of the tuner case 300 for surface mounting is The solder wettability can be further improved as compared with the soldering treatment by the conventional plating treatment method, antirust treatment, degreasing treatment, or the like.

As a result, it is possible to provide an electronic component such as a frame member 31 having excellent bending resistance and axial resistance. In addition, it is possible to form a good fillet in which a tuner component such as the frame member 31 and the like can be reliably and firmly bonded to and mounted on the tuner circuit board 30 without generating an unbonded portion or voids. .

&Lt; Fourth Embodiment &

Subsequently, with reference to FIG. 13, the board | substrate reinforcement frame 400 as 4th Embodiment is demonstrated. The board reinforcement frame 400 shown in FIG. 13 constitutes an example of a solder coating component, electromagnetically shields an electronic component (not shown) mounted on the thin circuit board 40, and the thin circuit It is to prevent the warping and torsion of the substrate 40 itself.

The substrate reinforcement frame 400 is composed of a pentagon-shaped frame member 41 having a slope portion in part and a lid member not shown. The frame member 41 has a width W4 of about 40 mm, a length L4 of about 80 mm, and a height H4 of about 2 mm. The frame member 41 is soldered to the light and thin circuit board 40. The light and thin circuit board 40 has flexibility, and the land pattern 40a is provided in the light and thin circuit board 40. The frame member 41 and the lid member are made of a nickel silver material 1, a stainless steel material, iron, a kovar, or the like. The frame member 41 is soldered to the land pattern 40a.

In this example, the inside of the frame member 41 is flat reinforced in the same manner as in the third embodiment. In this planar reinforcement, the inclined portion (corresponding to the circumference) is provided in the end face (neck surface) direction of the two opening portions 43a and 43b inside the frame member 41. The inclination-shaped portion is provided in order to prevent twisting or bending in the longitudinal direction or the width direction of the frame member 41. Also in this example, when the lid member is removed from the frame member 41, the electronic component in the openings 43a and 43b whose inner side is flatly reinforced can be inspected.

Also in this example, unlike the throttle end 11a like 1st Embodiment, around the outer periphery which fits opening part 43a, 43b, the cut end surface of the frame member 31 as described in 2nd Embodiment has a land pattern. It is provided so that it may contact 40a. Of course, you may make the circumference | surroundings the circumference end 11a similar to 1st Embodiment.

Also in the frame member 41 of the substrate reinforcement frame 400, a Ni plating layer 2 and a Sn-Cu plating layer 3 having a predetermined film thickness as shown in FIG. 2 are sequentially provided, and the Sn-Cu plating layer ( 3) is made of a nickel silver material 1 on which a surface treatment layer 5 composed of a solder coating layer 4 coated with molten solder is formed. In the same manner as in the first embodiment, the thickness of the solder coating layer 4 is ensured to about 18 µm to 30 µm in order to improve the wettability of the molten solder during reflow treatment. As the molten solder, for example, a lead-free solder of Sn-Ag-Cu system is used.

The molten solder includes, in addition to Sn-Ag-Cu, Sn-Ag, Sn-Cu, Sn-Bi, Sn-Ag-Cu-Bi, Sn-Bi-Ag (Cu), Sn-Ag- Lead-free solder such as Cu-Ni-based or Sn-Ag-Cu-Sb-based is used.

In addition, please refer to 2nd Embodiment regarding the mounting method of the board | substrate reinforcement frame 400. FIG. The fillet portion 46 in the figure performs heat treatment of the light and thin circuit board 40 reinforced with the frame member 41, and the solder material on the land pattern 40a melts so that the inside and the outside of the frame member 41 are below. It was burned with good wettability, and it was caused by the burning of this molten solder.

Thus, according to the board | substrate reinforcement frame 400 as 4th Embodiment, after processing the frame member 41 in-plane gradient reinforcement which the part of which became the solder surface for surface mounting from the lamella 1, Since the lead-free molten solder is coated, the fillet portion 46 of the substrate reinforcement frame 400 for surface-mounting has a higher solder wettability than the soldering treatment by conventional plating treatment, antirust treatment, degreasing treatment, or the like. It became possible to improve more.

Thereby, the board | substrate reinforcement frame 400, such as the frame member 41 excellent in bending resistance and axial resistance, can be provided. In addition, a good fillet capable of reliably and firmly bonding the substrate reinforcement frame 400 such as the frame member 41 to the light and thin circuit board 40 without generating unbonded portions, voids, or the like is formed. I can do it.

<Evaluation Example>

Subsequently, the solder wetting rise (menisco) test based on JISZ3198-4 about the frame members 11, 21, 31, 41 demonstrated in 1st-4th embodiment is demonstrated.

According to the test example of the solder wetting riseability shown in FIG. 14, even if it is the nickel silver material 1 (C7521R; C7701R, etc.) as a metal member with respect to the frame members 11, 21, 31, 41 using a meniscograph measuring apparatus, ), Ni plating treatment on the first layer, Sn-Cu plating on the second layer, and solder coating treatment (hereinafter referred to as M705 treatment) on the third layer (finishing layer). Wetting force [mN] by molten solder was measured at each elapsed time for the case where the nickel silver material 1 was subjected to Sn plating treatment only (when wet balance method and contact angle method were used). ). ESR250 is used for the flux, and it is an example of solder fusion plating of the nickel silver material 1 using eco solder M705 as a molten solder.

Immersion conditions were 20 [mN], the immersion speed | rate 20 mm / sec, the immersion depth of 2 [mm], and the immersion holding time of a mesicograph measuring apparatus of 20 [mN]. The temperature in the reflow process is 240 degrees. Based on this measurement, a meniscograph was produced, and the solder wet-rising property was evaluated about the case where the said nickel silver material 1 was solder-coated and the nickel silver material 1 was Sn-plated.

The vertical axis shown in FIG. 14 is the action force (wetting force) [mN] by molten solder, and the horizontal axis is time [second] which shows the progress of a measurement. According to the meniscograph shown in FIG. 14, the solid line in a figure is M705 process characteristic of the nickel silver material 1. As shown in FIG. The broken line is Sn plating treatment characteristic of the nickel silver material (1). The meniscograph takes the time from the start of heating, to the immersion complete → wet start → zero cross → wet rise → start of raise → finish of the raise, from the start of heating of the silver white material (1) treated with M705 or the silver plated material (1) with Sn plating treatment. Was followed, and the action force (wetting force) [mN] by the molten solder was measured.

In the meniscograph shown in FIG. 14, T11 is a zero cross time from the heating start time t0 of the nickel white material 1 of M705 process to zero cross time t11. The zero cross time T11 includes the immersion time of the molten solder, its nonwetting time and its wet time. Wet time means the wetting speed of the molten solder of the M705 treatment. The shorter the wet time, the faster the wet rate. In the figure, the black circle p1 is the zero cross point of the two white materials 1 of M705 processing. M1 is the maximum working force (= Fmax) of the two white materials 1 of M705 processing. Moreover, it is shown that wettability is high, so that an action force (wetting power) is large.

In addition, in the meniscograph shown in FIG. 14, T21 is the zero cross time from the heating start time t0 of the nickel-plated material 1 of Sn plating process to zero cross time t21. The zero cross time T21 includes the immersion time of the molten solder, its nonwetting time and its wet time. Wetting time means the wetting speed of the molten solder of the Sn plating treatment. The wet time of the Sn plating treatment is longer than that of the M705 treatment. The wet-up rate of the Sn plating process is slower than that of the M705 process. In the figure, the black circle mark q1 is the zero cross point of the nickel plating material 1 of Sn plating treatment, and M2 is the maximum working force (= Fmax) of the nickel plating material 1 of Sn plating treatment.

Subsequently, with reference to FIG. 15, the evaluation result in M705 process and Sn plating process which concern on the nickel silver material 1 is demonstrated. In the vertical direction of the table shown in FIG. 15, the processing contents of the embodiment and the comparative example relating to the frame member made of the two white materials 1 are described, and in the horizontal direction, the zero cross time and the frame member shown in FIG. 6C ( It is a photograph which photographed the soldering-mounted state of the front and rear side, making one side of the side of the longitudinal direction of 11) front, and the other side of the side of a longitudinal direction back. Each part lift part is described.

According to the M705 treatment of the whitening material 1 employed as the base material of the frame member 11 according to the present invention, shown in the photographic diagram according to the embodiment of FIG. 15, based on the wet rising test shown in FIG. 14. As described above, satisfactory bonding could be confirmed in both the front and the rear of the frame member 11 without causing warping in the two white materials 1.

According to the M705 treatment, the wettability of the molten solder is good, and at the time of mounting, it is possible to form a good fillet at any soldering point which is not obtained by a conventional product. As a result, the fillet portion 16 can be formed at the portion indicated by the double-dotted line in FIG. 6C. In addition, the fillet portion 26 shown in FIG. 11C, the fillet portion 36 shown in FIG. 12, the fillet portion 46 shown in FIG. 13, and the like can be formed.

In this regard, the zero cross time T11 of the molten solder of the M705 coating treatment is 1.34 [sec], and the wet rise time is 1.50 [sec]. The maximum force M1 (= Fmax) was 7.06 [mN], and the time required from the measurement start time t = 0 to Fmax was 10.85 [sec].

On the other hand, in the Sn plating process which concerns on the comparative example shown in FIG. 15, as shown in the photograph figure, the front side of the said frame member 11 is bonded, but the back side is excited from the printed wiring board 10. FIG. It climbed up and could not form a satisfactory fillet. The raised part is the part which is black in strip shape in the photograph of the back side. In this connection, the zero cross time T21 of the molten solder of the Sn plating treatment is 2.45 [sec]. The wet rise time was 1.83 [sec], the maximum working force M2 (= Fmax) was 4.39 [mN], and the required time from the measurement start time t = 0 to Fmax was 10.86 [sec]. As is also clear from this drawing, the frame member 11 subjected to the M705 treatment compared to the frame member subjected to the Sn plating treatment, in the case where the solder coating component is manufactured, shows that a good solder wettability can be obtained during the reflow treatment. I could prove it.

In addition, stainless steel SUS304 is used as the metal member for the frame members 11, 21, 31, and 41, and ground treatment is performed in the same manner as the nickel white material 1, and ESR250 is used for the flux. The solder wetting rise (menisco) test based on JISZ3198-4 is also carried out when solder M705 is used to solder the frame member made of SUS304 and when the Sn member is subjected to Sn plating only. It was done.

Although not shown, a good joining was confirmed in both the front and the rear of the frame member made of SUS304 without warping in the frame member made of SUS304.

According to the M705 treatment, the wettability of the molten solder is good, and at the time of mounting, it is possible to form a good fillet at any soldering point which is not obtained by a conventional product. In this connection, the zero cross time T11 of the molten solder of the M705 coating treatment is 7.16 [sec], and the wet rise time is 1.79 [sec].

On the other hand, in the Sn plating process, the front of the frame member made of SUS304 is joined, similarly to the frame member made of the nickel silver material, but the back thereof is raised from the printed wiring board 10 to form satisfactory fillets. There was no. In this connection, the zero cross time T21 of the molten solder of the Sn plating treatment is 10.00 [sec]. Wet rise time is 0.00 [sec]. As is clear from this drawing, SUS304 subjected to M705 treatment compared to SUS304 subjected to Sn plating treatment showed that when solder coating parts were manufactured, a good solder wettability was obtained during reflow treatment. .

Further, an attempt was made to immerse only the molten solder in the nickel silver material 1, SUS304, or the like without performing the Sn plating treatment, the M705 treatment, or the like, but the molten solder was only thrown off and was not deposited (not loaded).

INDUSTRIAL APPLICABILITY The present invention is extremely suitable for application to a shield case that electromagnetically shields an electronic component mounted on a substrate, or a substrate reinforcement frame that reinforces a short and thin substrate.

1: yangbaekjae (metal member)
2: Ni plating layer
3: Sn-Cu plating layer
4: Sn-Ag-Cu coating layer
10: printed wiring board
10a, 30a, 40a: land pattern
11, 21, 31, 41: frame member
12: cover member
16, 26: fillet part
20, 30: tuner circuit board
40: thin-film circuit board
100, 200: shield case (solder coated parts)
300: tuner case (solder coating parts)
400: substrate reinforcement frame (solder coated parts)

Claims (8)

A solder coating component comprising a metal member formed of a surface treatment in which a nickel film and a tin alloy plating film are sequentially provided on a base material, and a lead-free molten solder is coated on the tin alloy plating film. The method of claim 1, wherein the surface-treated metal member,
It is made by processing into the shape of a shield component, The shape of a part of the said shield component becomes a solder surface for surface mounting,
At least, the solder coating part which has a soldering part inside the said shield part. The molten solder of claim 1, wherein
Sn-Ag-based, Sn-Cu-based, Sn-Ag-Cu-based, Sn-Bi-based, Sn-Ag-Cu-Bi-based, Sn-Bi-Ag (Cu) -based, Sn-Ag-Cu-Ni-based or A solder coating component characterized by using an alloy solder such as Sn-Ag-Cu-Sb system. Surface treatment consisting of a step of sequentially forming a nickel film and a tin alloy plating film having a predetermined film thickness on a metal member for solder coating parts, and a step of coating lead-free molten solder on the treated metal member. The manufacturing method of the solder coating part which has a process. The said metal member is processed before or after the surface treatment process which consists of the said process of ground treatment and the process of coating process of a molten solder, The process of forming a shield component for surface mounting of Claim 4 characterized by the above-mentioned. Method of manufacturing solder coated parts. The molten solder of claim 4, wherein
Sn-Ag-based, Sn-Cu-based, Sn-Ag-Cu-based, Sn-Bi-based, Sn-Ag-Cu-Bi-based, Sn-Bi-Ag (Cu) -based, Sn-Ag-Cu-Ni-based or Lead-free solder, such as Sn-Ag-Cu-Sb system, is used. The manufacturing method of the solder coating part characterized by the above-mentioned. Processing a metal member for solder coating parts on one side to form a shield part for surface mounting;
A surface treatment step comprising a step of sequentially forming a nickel film and a tin alloy plating film on the metal member formed on the shield component, and a step of coating the molten solder on the treated metal member;
On the other hand, forming a solder material at a predetermined portion of the mounting substrate;
And a step of performing heat treatment by aligning the shield component for surface mounting on a predetermined portion of the mounting substrate on which the solder material is formed, and joining the mounting substrate and the shield component. . On one side, a surface treatment process comprising a step of sequentially forming a nickel film and a tin alloy plating film on a metal member serving as a base material for solder coating parts, and a step of coating molten solder on the metal member subjected to the ground treatment; Processing the surface-treated metal member to form a shield component for surface mounting; and, on the other hand, forming a solder material at a predetermined portion of the mounting substrate; and a predetermined process of the mounting substrate on which the solder material is formed. A method of mounting a solder coating part, comprising the step of performing heat treatment by aligning the shield component for surface mounting at a site and joining the mounting substrate and the shield component.

Images