KR101970831B1 - 땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법 - Google Patents

땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법 Download PDF

Info

Publication number
KR101970831B1
KR101970831B1 KR1020117027704A KR20117027704A KR101970831B1 KR 101970831 B1 KR101970831 B1 KR 101970831B1 KR 1020117027704 A KR1020117027704 A KR 1020117027704A KR 20117027704 A KR20117027704 A KR 20117027704A KR 101970831 B1 KR101970831 B1 KR 101970831B1
Authority
KR
South Korea
Prior art keywords
solder
frame member
metal member
treatment
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020117027704A
Other languages
English (en)
Korean (ko)
Other versions
KR20120023002A (ko
Inventor
이사무 사또
고지 와따나베
미찌오 스즈끼
다께노리 아즈마
무쯔미 데구찌
마사야 이또
Original Assignee
센주긴조쿠고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 센주긴조쿠고교 가부시키가이샤 filed Critical 센주긴조쿠고교 가부시키가이샤
Publication of KR20120023002A publication Critical patent/KR20120023002A/ko
Application granted granted Critical
Publication of KR101970831B1 publication Critical patent/KR101970831B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0233—Sheets or foils
    • B23K35/0238—Sheets or foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
KR1020117027704A 2009-05-22 2010-05-19 땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법 Active KR101970831B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2009-124716 2009-05-22
JP2009124716A JP5439950B2 (ja) 2009-05-22 2009-05-22 はんだコート部品、その製造方法及びその実装方法
PCT/JP2010/058466 WO2010134552A1 (ja) 2009-05-22 2010-05-19 はんだコート部品、その製造方法及びその実装方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020167023297A Division KR102134500B1 (ko) 2009-05-22 2010-05-19 땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법

Publications (2)

Publication Number Publication Date
KR20120023002A KR20120023002A (ko) 2012-03-12
KR101970831B1 true KR101970831B1 (ko) 2019-08-27

Family

ID=43126229

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020117027704A Active KR101970831B1 (ko) 2009-05-22 2010-05-19 땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법
KR1020167023297A Active KR102134500B1 (ko) 2009-05-22 2010-05-19 땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020167023297A Active KR102134500B1 (ko) 2009-05-22 2010-05-19 땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법

Country Status (5)

Country Link
JP (1) JP5439950B2 (https=)
KR (2) KR101970831B1 (https=)
CN (1) CN102440091B (https=)
TW (1) TWI524964B (https=)
WO (1) WO2010134552A1 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101029221B1 (ko) * 2011-01-14 2011-04-14 에프엔티주식회사 부분 도금층이 마련된 전자파 차단용 쉴드캔 고정클립
US9391029B2 (en) 2014-06-12 2016-07-12 Kabushiki Kaisha Toshiba Electronic device
DE102014110459A1 (de) * 2014-07-24 2016-01-28 Mahle International Gmbh Wärmeübertrager
KR102311677B1 (ko) 2014-08-13 2021-10-12 삼성전자주식회사 반도체소자 및 그 제조방법
CN108029222B (zh) * 2015-09-18 2020-08-28 东丽株式会社 电子设备壳体
KR102717102B1 (ko) 2016-09-06 2024-10-16 삼성디스플레이 주식회사 디스플레이 장치
CN109079270A (zh) * 2018-10-26 2018-12-25 南通舟舰钣金有限公司 一种锡焊方法
JP6871524B1 (ja) * 2020-03-23 2021-05-12 千住金属工業株式会社 積層接合材料、半導体パッケージおよびパワーモジュール
US11744019B2 (en) * 2020-11-18 2023-08-29 Murata Manufacturing Co., Ltd. Component mounted on circuit board
EP4325568B1 (en) * 2021-04-28 2025-10-22 Senju Metal Industry Co., Ltd. Layered bonding material, semiconductor package, and power module
CN113205957B (zh) * 2021-05-26 2023-01-10 厦门匠锐科技有限公司 一种骨架线圈的生产线
CN115642773A (zh) 2021-07-19 2023-01-24 台达电子企业管理（上海）有限公司 电路模块和固态变压器系统
CN115643738B (zh) * 2021-07-19 2026-04-24 台达电子企业管理（上海）有限公司 功率模块和固态变压器系统
CN117161499A (zh) * 2023-09-05 2023-12-05 西安微电子技术研究所 一种j形引脚陶瓷封装器件的搪锡方法
JP7632924B1 (ja) * 2024-02-16 2025-02-19 Ｎｅｃプラットフォームズ株式会社 シールド部品、電子機器、及び、シールド部品の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001007588A (ja) 1999-06-21 2001-01-12 Alps Electric Co Ltd 電子回路ユニット
JP2002141456A (ja) * 2000-10-30 2002-05-17 Hitachi Ltd 電子装置
JP2004156147A (ja) * 2004-03-04 2004-06-03 Kobe Steel Ltd 多極端子用錫又は錫合金めっき銅合金及びその製造方法
JP2004186502A (ja) * 2002-12-04 2004-07-02 Murata Mfg Co Ltd 電子部品、電子部品の実装構造及び電子部品の製造方法
WO2006035542A1 (ja) * 2004-09-27 2006-04-06 Murata Manufacturing Co., Ltd. シールドケース

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01289298A (ja) * 1988-05-17 1989-11-21 Alps Electric Co Ltd シールドケースの製造方法
JPH03104197A (ja) * 1989-09-18 1991-05-01 Canon Inc シールドケース
JPH0563100U (ja) * 1992-01-30 1993-08-20 京セラ株式会社 シールドケース付電子部品
JPH07147495A (ja) * 1993-11-26 1995-06-06 Nec Corp プリント基板表面実装用シールドケース
US5911356A (en) * 1996-08-19 1999-06-15 Sony Corporation Method for attaching lead parts and shield case to printed circuit board, and method for attaching chip parts, lead parts and shield case to printed circuit board
JPH10117062A (ja) * 1996-08-19 1998-05-06 Sony Corp リード部品及び高周波信号が漏洩するのを防ぐシールドケースのプリント基板への取付け方法並びに取付け装置、チップ部品、リード部品及び高周波信号が漏洩するのを防ぐシールドケースのプリント基板への取付け方法並びに取付け装置
JP2001155955A (ja) * 1999-11-30 2001-06-08 Taiyo Kagaku Kogyo Kk 外部端子電極具備電子部品及びその搭載電子用品
JP2001217588A (ja) * 2000-01-31 2001-08-10 Sharp Corp シールドケース及びそれを用いたｒｆ通信ユニット
JP4685274B2 (ja) * 2001-05-31 2011-05-18 京セラキンセキ株式会社 電子部品容器
WO2004070836A1 (ja) * 2003-02-06 2004-08-19 Neomax Co., Ltd. 気密封止用キャップおよびその製造方法
JP2006196664A (ja) 2005-01-13 2006-07-27 Fuji Photo Film Co Ltd 基板へのシールドケース取付構造及び携帯電話

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001007588A (ja) 1999-06-21 2001-01-12 Alps Electric Co Ltd 電子回路ユニット
JP2002141456A (ja) * 2000-10-30 2002-05-17 Hitachi Ltd 電子装置
JP2004186502A (ja) * 2002-12-04 2004-07-02 Murata Mfg Co Ltd 電子部品、電子部品の実装構造及び電子部品の製造方法
JP2004156147A (ja) * 2004-03-04 2004-06-03 Kobe Steel Ltd 多極端子用錫又は錫合金めっき銅合金及びその製造方法
WO2006035542A1 (ja) * 2004-09-27 2006-04-06 Murata Manufacturing Co., Ltd. シールドケース

Also Published As

Publication number Publication date
CN102440091A (zh) 2012-05-02
JP2010272774A (ja) 2010-12-02
KR20160105913A (ko) 2016-09-07
CN102440091B (zh) 2014-09-03
KR20120023002A (ko) 2012-03-12
TWI524964B (zh) 2016-03-11
JP5439950B2 (ja) 2014-03-12
KR102134500B1 (ko) 2020-07-15
TW201102208A (en) 2011-01-16
WO2010134552A1 (ja) 2010-11-25

Similar Documents

Publication Publication Date Title
KR101970831B1 (ko) 땜납 코팅 부품, 그의 제조 방법 및 그의 실장 방법
US11688555B2 (en) Chip electronic component
EP2474383B1 (en) Lead-free solder alloy, joining member and manufacturing method thereof, and electronic component
CN108133810B (zh) 绕线型线圈部件以及绕线型线圈部件的制造方法
JP5353839B2 (ja) 電子部品
EP2926940A1 (en) Layered solder material for bonding dissimilar electrodes, and method for bonding dissimilar electrodes to electronic components
US20070264496A1 (en) Solderable Plastic EMI Shielding
KR20050030237A (ko) 무연 솔더 합금
US20170245404A1 (en) Rf shield with selectively integrated solder
US5639014A (en) Integral solder and plated sealing cover and method of making same
JP2004186602A (ja) 電子部品
JP2012140678A (ja) 曲げ加工部のウィスカ発生を防止するめっき被膜部材、これを用いた電気電子部品、並びにめっき被膜部材の製造方法とめっき皮膜部材のウィスカ発生防止方法
EP1211011B1 (en) Method of manufacturing a solder coated material ; corresponding solder coated material
EP0568087A2 (en) Reflow mounting of electronic component on mounting board
KR20120068560A (ko) 도금을 이용한 마그네슘 합금의 솔더링 방법 및 이를 이용한 이동통신 안테나용 마그네슘 합금 위상가변기
CN113728406A (zh) 电子部件和安装结构体
JP3827487B2 (ja) はんだコーティング長尺材の製造方法
JP3801893B2 (ja) 部材の接合方法
KR100431090B1 (ko) 저융점 도금층을 이용한 무연솔더
JPS6011822B2 (ja) チユ−ナ等のシヤ−シの製造方法
JPH1041193A (ja) 固体電解コンデンサの製造方法
KR20120068563A (ko) 스퍼터링을 이용한 마그네슘 합금의 솔더링 방법 및 이를 이용한 이동통신 안테나용 마그네슘 합금 위상가변기
Lee et al. Developing the stencil printing process for 01005 lead-free assemblies
JP2014138065A (ja) プリント基板のはんだ付け方法
WO1994023888A1 (en) Non lead soldering in a substantially oxygen free atmosphere

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20111121

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20150217

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20151119

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20160530

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20151119

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

A107 Divisional application of patent
J201 Request for trial against refusal decision
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20160825

PJ0201 Trial against decision of rejection

Patent event date: 20160825

Comment text: Request for Trial against Decision on Refusal

Patent event code: PJ02012R01D

Patent event date: 20160530

Comment text: Decision to Refuse Application

Patent event code: PJ02011S01I

Appeal kind category: Appeal against decision to decline refusal

Decision date: 20180710

Appeal identifier: 2016101004962

Request date: 20160825

J301 Trial decision

Free format text: TRIAL NUMBER: 2016101004962; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20160825

Effective date: 20180710

PJ1301 Trial decision

Patent event code: PJ13011S01D

Patent event date: 20180710

Comment text: Trial Decision on Objection to Decision on Refusal

Appeal kind category: Appeal against decision to decline refusal

Request date: 20160825

Decision date: 20180710

Appeal identifier: 2016101004962

PS0901 Examination by remand of revocation
S901 Examination by remand of revocation
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20180720

Patent event code: PE09021S01D

GRNO Decision to grant (after opposition)
PS0701 Decision of registration after remand of revocation

Patent event date: 20190328

Patent event code: PS07012S01D

Comment text: Decision to Grant Registration

Patent event date: 20180710

Patent event code: PS07011S01I

Comment text: Notice of Trial Decision (Remand of Revocation)

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20190415

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20190415

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
FPAY Annual fee payment

Payment date: 20220408

Year of fee payment: 4

PR1001 Payment of annual fee

Payment date: 20220408

Start annual number: 4

End annual number: 4