JP5422143B2 - 基板把持機構 - Google Patents

基板把持機構 Download PDF

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Publication number
JP5422143B2
JP5422143B2 JP2008147220A JP2008147220A JP5422143B2 JP 5422143 B2 JP5422143 B2 JP 5422143B2 JP 2008147220 A JP2008147220 A JP 2008147220A JP 2008147220 A JP2008147220 A JP 2008147220A JP 5422143 B2 JP5422143 B2 JP 5422143B2
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Japan
Prior art keywords
substrate
substrate support
support member
magnet
gripping
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JP2008147220A
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English (en)
Japanese (ja)
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JP2009295751A (ja
JP2009295751A5 (enExample
Inventor
充 宮崎
誠司 勝岡
尚起 松田
淳次 國澤
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Ebara Corp
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Ebara Corp
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Publication date
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Priority to JP2008147220A priority Critical patent/JP5422143B2/ja
Priority to US12/457,175 priority patent/US8795032B2/en
Priority to KR1020090049190A priority patent/KR101958874B1/ko
Priority to TW103145187A priority patent/TWI550705B/zh
Priority to CN200910141394.1A priority patent/CN101599423B/zh
Priority to TW098118507A priority patent/TWI550760B/zh
Priority to CN201410084660.2A priority patent/CN103839857B/zh
Priority to EP20090007434 priority patent/EP2131387A3/en
Publication of JP2009295751A publication Critical patent/JP2009295751A/ja
Publication of JP2009295751A5 publication Critical patent/JP2009295751A5/ja
Application granted granted Critical
Publication of JP5422143B2 publication Critical patent/JP5422143B2/ja
Priority to US14/309,152 priority patent/US9358662B2/en
Priority to US14/530,589 priority patent/US9687957B2/en
Priority to KR1020160042031A priority patent/KR101725268B1/ko
Priority to US15/601,575 priority patent/US10486285B2/en
Priority to US16/657,901 priority patent/US11426834B2/en
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2008147220A 2008-06-04 2008-06-04 基板把持機構 Active JP5422143B2 (ja)

Priority Applications (13)

Application Number Priority Date Filing Date Title
JP2008147220A JP5422143B2 (ja) 2008-06-04 2008-06-04 基板把持機構
US12/457,175 US8795032B2 (en) 2008-06-04 2009-06-03 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
KR1020090049190A KR101958874B1 (ko) 2008-06-04 2009-06-03 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법
CN200910141394.1A CN101599423B (zh) 2008-06-04 2009-06-04 基板处理装置及方法、基板把持机构以及基板把持方法
TW098118507A TWI550760B (zh) 2008-06-04 2009-06-04 基板處理裝置、基板處理方法、基板保持機構及基板保持方法
CN201410084660.2A CN103839857B (zh) 2008-06-04 2009-06-04 基板处理装置及方法、基板把持机构以及基板把持方法
EP20090007434 EP2131387A3 (en) 2008-06-04 2009-06-04 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
TW103145187A TWI550705B (zh) 2008-06-04 2009-06-04 硏磨裝置及硏磨方法
US14/309,152 US9358662B2 (en) 2008-06-04 2014-06-19 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
US14/530,589 US9687957B2 (en) 2008-06-04 2014-10-31 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
KR1020160042031A KR101725268B1 (ko) 2008-06-04 2016-04-06 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법
US15/601,575 US10486285B2 (en) 2008-06-04 2017-05-22 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
US16/657,901 US11426834B2 (en) 2008-06-04 2019-10-18 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008147220A JP5422143B2 (ja) 2008-06-04 2008-06-04 基板把持機構

Publications (3)

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JP2009295751A JP2009295751A (ja) 2009-12-17
JP2009295751A5 JP2009295751A5 (enExample) 2011-05-12
JP5422143B2 true JP5422143B2 (ja) 2014-02-19

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JP2008147220A Active JP5422143B2 (ja) 2008-06-04 2008-06-04 基板把持機構

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JP (1) JP5422143B2 (enExample)
CN (1) CN101599423B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023095345A (ja) * 2021-12-24 2023-07-06 株式会社荏原製作所 基板処理方法および基板処理装置

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JP5511190B2 (ja) * 2008-01-23 2014-06-04 株式会社荏原製作所 基板処理装置の運転方法
US8608146B2 (en) * 2009-12-18 2013-12-17 Lam Research Ag Reinforced pin for being used in a pin chuck, and a pin chuck using such reinforced pin
US8613288B2 (en) * 2009-12-18 2013-12-24 Lam Research Ag High temperature chuck and method of using same
CN101712130B (zh) * 2009-12-22 2012-11-14 中国电子科技集团公司第四十五研究所 应用于硅片化学机械抛光设备中的定位转换装置
KR101110268B1 (ko) * 2010-04-30 2012-02-16 삼성전자주식회사 로터리 유니온을 구동하는 공압 공급관의 꼬임을 방지하는 화학 기계식 연마시스템
JP2012064300A (ja) * 2010-08-18 2012-03-29 Showa Denko Kk 引き上げ乾燥装置、これを用いた磁気記録媒体用基板又は磁気記録媒体の製造方法
US9153464B2 (en) * 2011-05-31 2015-10-06 Semes Co., Ltd. Substrate processing apparatus and substrate processing method
CN103367105B (zh) * 2012-03-26 2016-08-10 上海华虹宏力半导体制造有限公司 一种笔形海绵固定装置
CN103659569B (zh) * 2012-09-25 2016-06-15 中芯国际集成电路制造(上海)有限公司 一种化学机械研磨方法、模块及装置
JP6055648B2 (ja) * 2012-10-26 2016-12-27 株式会社荏原製作所 研磨装置及び研磨方法
JP6053528B2 (ja) 2013-01-11 2016-12-27 株式会社荏原製作所 基板把持装置
JP2014167996A (ja) * 2013-02-28 2014-09-11 Ebara Corp 研磨装置および研磨方法
US9004564B2 (en) * 2013-03-13 2015-04-14 Varian Semiconductor Equipment Associates, Inc. Wafer handling apparatus
TWI636518B (zh) * 2013-04-23 2018-09-21 荏原製作所股份有限公司 基板處理裝置及處理基板之製造方法
JP6181438B2 (ja) 2013-06-24 2017-08-16 株式会社荏原製作所 基板保持装置および基板洗浄装置
JP6400977B2 (ja) * 2013-09-25 2018-10-03 芝浦メカトロニクス株式会社 スピン処理装置
JP6183137B2 (ja) * 2013-10-17 2017-08-23 東京エレクトロン株式会社 液処理装置
JP2015090890A (ja) * 2013-11-05 2015-05-11 株式会社荏原製作所 基板処理装置
JP6331189B2 (ja) * 2014-03-07 2018-05-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6159282B2 (ja) * 2014-03-27 2017-07-05 株式会社荏原製作所 基板処理装置、および基板処理装置の配管洗浄方法
KR102323430B1 (ko) * 2014-03-31 2021-11-09 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
CN106457511B (zh) * 2014-05-14 2019-12-13 株式会社荏原制作所 研磨台更换装置及半导体元件制造装置的构成零件更换装置
CN105529284A (zh) * 2014-09-29 2016-04-27 盛美半导体设备（上海）有限公司 一种抛光及清洗晶圆的半导体设备及方法
JP6335103B2 (ja) * 2014-11-14 2018-05-30 株式会社荏原製作所 基板保持装置
US10553421B2 (en) * 2015-05-15 2020-02-04 Tokyo Electron Limited Substrate processing apparatus, substrate processing method and storage medium
US9687885B2 (en) * 2015-07-17 2017-06-27 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-cycle wafer cleaning method
CN106541329B (zh) * 2015-09-16 2019-01-01 泰科电子(上海)有限公司 集成设备
JP6554392B2 (ja) * 2015-11-12 2019-07-31 株式会社ディスコ スピンナー装置
JP6777985B2 (ja) 2015-11-19 2020-10-28 株式会社荏原製作所 基板保持装置
JP6596375B2 (ja) * 2016-03-31 2019-10-23 株式会社荏原製作所 ティーチング装置およびティーチング方法
JP6727044B2 (ja) * 2016-06-30 2020-07-22 株式会社荏原製作所 基板処理装置
CN109239097A (zh) * 2016-08-23 2019-01-18 王永超 集成电路板的外观检测机构
CN106328569B (zh) * 2016-11-07 2021-04-09 北京七星华创电子股份有限公司 半导体清洗设备工作状态的监测系统及检测方法
KR102479206B1 (ko) * 2017-04-06 2022-12-20 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 기판 반송 방법
JPWO2019017489A1 (ja) * 2017-07-21 2020-07-16 東邦化成株式会社 半導体素子の製造装置および半導体素子の製造方法
CN108266972A (zh) * 2017-12-26 2018-07-10 德淮半导体有限公司 晶圆干燥方法
CN108273774A (zh) * 2018-01-19 2018-07-13 德淮半导体有限公司 清洁装置及清洁方法、晶圆加工装置及加工方法
JP6930734B2 (ja) * 2018-01-25 2021-09-01 株式会社ブイ・テクノロジー 基板保持装置及び基板検査装置
CN109499984B (zh) * 2018-10-13 2022-03-18 广东嗨学云教育科技有限公司 一种集成电路通用制造装置
JP7128713B2 (ja) * 2018-10-15 2022-08-31 株式会社荏原製作所 基板保持装置、および該基板保持装置を動作させる方法
JP7278838B2 (ja) * 2019-04-04 2023-05-22 株式会社荏原製作所 基板支持装置及び基板洗浄装置
JP7446073B2 (ja) * 2019-09-27 2024-03-08 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7681587B2 (ja) * 2019-11-22 2025-05-22 ラム リサーチ コーポレーション コインスロットおよびボールロックセラミックリフトピンホルダ
CN110919526A (zh) * 2019-11-24 2020-03-27 湖南凯通电子有限公司 陶瓷基板研磨机
CN111633531B (zh) * 2020-06-10 2022-03-04 华海清科股份有限公司 一种具有单腔清洗装置的减薄设备
CN111633532A (zh) * 2020-06-10 2020-09-08 华海清科股份有限公司 一种具有化学机械抛光单元的基板减薄设备
JP6892176B1 (ja) * 2020-11-19 2021-06-23 不二越機械工業株式会社 ワーク洗浄装置
CN112720119B (zh) * 2020-12-19 2021-11-30 华中科技大学 一种晶圆快速定位装置及方法
KR20230127998A (ko) * 2021-01-08 2023-09-01 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치 및 기판 처리 방법
KR102307687B1 (ko) * 2021-06-25 2021-10-05 (주) 티로보틱스 기판 이송 로봇을 진공 챔버 내에서 주행하기 위한 주행 로봇
CN113829233B (zh) * 2021-08-21 2023-07-18 浙江晶盛机电股份有限公司 一种抛光载体
CN114290229B (zh) * 2021-12-23 2023-02-24 北京通美晶体技术股份有限公司 一种半导体晶片的抛光方法及磷化铟晶片
CN115193789B (zh) * 2022-09-16 2023-03-24 核欣(苏州)医药科技有限公司 一种酶标板清洁方法及其具有清洁结构的酶标仪设备
CN119638205B (zh) * 2025-02-19 2025-04-08 深圳市泰科思特精密工业有限公司 一种玻璃基板垂直式蚀刻用装置

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JPH10144774A (ja) * 1996-11-13 1998-05-29 Dainippon Screen Mfg Co Ltd 基板保持装置
SG97860A1 (en) * 1999-03-05 2003-08-20 Ebara Corp Polishing apparatus
JP4552222B2 (ja) * 2001-09-21 2010-09-29 ムラテックオートメーション株式会社 ウェハのアライナー装置
JP4095613B2 (ja) * 2005-01-13 2008-06-04 大日本スクリーン製造株式会社 基板保持装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023095345A (ja) * 2021-12-24 2023-07-06 株式会社荏原製作所 基板処理方法および基板処理装置

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JP2009295751A (ja) 2009-12-17
CN101599423B (zh) 2014-03-12
CN101599423A (zh) 2009-12-09

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