JP7278838B2 - 基板支持装置及び基板洗浄装置 - Google Patents
基板支持装置及び基板洗浄装置 Download PDFInfo
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- JP7278838B2 JP7278838B2 JP2019071877A JP2019071877A JP7278838B2 JP 7278838 B2 JP7278838 B2 JP 7278838B2 JP 2019071877 A JP2019071877 A JP 2019071877A JP 2019071877 A JP2019071877 A JP 2019071877A JP 7278838 B2 JP7278838 B2 JP 7278838B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
- B23Q15/007—Automatic control or regulation of feed movement, cutting velocity or position of tool or work while the tool acts upon the workpiece
- B23Q15/12—Adaptive control, i.e. adjusting itself to have a performance which is optimum according to a preassigned criterion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
Description
基板を支持するための支持部と、
前記支持部に当接し、前記支持部を軸線方向に沿って移動させるための移動部と、
少なくとも一部が前記移動部内に設けられ、流体が流れる流体管であって、前記移動部が前記支持部に当接するときに、前記支持部によって流出口が覆われる流体管と、
前記流体の状態を検知する検知部と、
を備えてもよい。
前記検知部は、前記流体管を流れる流体の圧力又は流量を検知してもよい。
前記支持部は複数設けられ、
各支持部に対応して移動部が設けられ、
移動部の各々に前記流体管が設けられてもよい。
前記流体は気体であってもよい。
前述したいずれかの基板支持装置と、
前記検知部からの情報に基づいて、前記移動部が前記支持部に当接したかどうかを判断する制御部と、
を備えてもよい。
各流体管に、当該流体管を流れる流体の圧力又は流量を検知する検知部が設けられ、
前記制御部は、各検知部からの検知結果に基づいて異常を検知してもよい。
前記制御部によって、ある移動部がある支持部に当接したと判断された時間と、別の移動部が別の支持部に当接したと判断された時間との間の間隔が第一時間以上経過した場合には、前記制御部は異常が発生したと判断してもよい。
前記制御部によって、ある移動部がある支持部から離間したと判断された時間と、別の移動部が別の支持部から離間したと判断された時間との間の間隔が第二時間以上経過した場合には、前記制御部は異常が発生したと判断してもよい。
前記制御部は、前記移動部の前記支持部に向かう方向への移動開始から第三時間以内に前記移動部が前記支持部に当接したことが前記検知部によって検知されない場合には異常が発生したと判断してもよい。
前記制御部は、前記移動部の前記支持部から離間する方向への移動開始から第四時間以内に前記移動部が前記支持部から離間したことが前記検知部によって検知されない場合には異常が発生したと判断してもよい。
前記制御部が異常が発生したと判断した場合に、前記支持部の清掃又は交換を促す情報を報知する報知部を備えてもよい。
《構成》
基板洗浄装置等を含む基板処理装置の実施の形態について説明する。
次に、上述した構成からなる本実施の形態による効果であって、未だ説明していないものを中心に説明する。「構成」で記載されていない場合であっても、「効果」で説明するあらゆる構成を本件発明において採用することができる。
Claims (8)
- 基板を支持するための支持部と、
前記支持部に当接し、前記支持部を軸線方向に沿って移動させるための移動部と、
少なくとも一部が前記移動部内に設けられ、流体が流れる流体管であって、前記移動部が前記支持部に当接するときに、前記支持部によって流出口が覆われる流体管と、
前記流体の状態を検知する検知部と、
を有する基板支持装置と、
前記検知部からの情報に基づいて、前記移動部が前記支持部に当接したかどうかを判断する制御部と、
を備え、
各流体管に、当該流体管を流れる流体の圧力又は流量を検知する検知部が設けられ、
前記制御部は、各検知部からの検知結果に基づいて異常を検知し、
前記制御部によって、ある移動部がある支持部に当接したと判断された時間と、別の移動部が別の支持部に当接したと判断された時間との間の間隔が第一時間以上経過した場合には、前記制御部は異常が発生したと判断する基板洗浄装置。 - 基板を支持するための支持部と、
前記支持部に当接し、前記支持部を軸線方向に沿って移動させるための移動部と、
少なくとも一部が前記移動部内に設けられ、流体が流れる流体管であって、前記移動部が前記支持部に当接するときに、前記支持部によって流出口が覆われる流体管と、
前記流体の状態を検知する検知部と、
を有する基板支持装置と、
前記検知部からの情報に基づいて、前記移動部が前記支持部に当接したかどうかを判断する制御部と、
を備え、
各流体管に、当該流体管を流れる流体の圧力又は流量を検知する検知部が設けられ、
前記制御部は、各検知部からの検知結果に基づいて異常を検知し、
前記制御部によって、ある移動部がある支持部から離間したと判断された時間と、別の移動部が別の支持部から離間したと判断された時間との間の間隔が第二時間以上経過した場合には、前記制御部は異常が発生したと判断する基板洗浄装置。 - 基板を支持するための支持部と、
前記支持部に当接し、前記支持部を軸線方向に沿って移動させるための移動部と、
少なくとも一部が前記移動部内に設けられ、流体が流れる流体管であって、前記移動部が前記支持部に当接するときに、前記支持部によって流出口が覆われる流体管と、
前記流体の状態を検知する検知部と、
を有する基板支持装置と、
前記検知部からの情報に基づいて、前記移動部が前記支持部に当接したかどうかを判断する制御部と、
を備え、
各流体管に、当該流体管を流れる流体の圧力又は流量を検知する検知部が設けられ、
前記制御部は、各検知部からの検知結果に基づいて異常を検知し、
前記制御部は、前記移動部の前記支持部に向かう方向への移動開始から第三時間以内に前記移動部が前記支持部に当接したことが前記検知部によって検知されない場合には異常が発生したと判断する基板洗浄装置。 - 基板を支持するための支持部と、
前記支持部に当接し、前記支持部を軸線方向に沿って移動させるための移動部と、
少なくとも一部が前記移動部内に設けられ、流体が流れる流体管であって、前記移動部が前記支持部に当接するときに、前記支持部によって流出口が覆われる流体管と、
前記流体の状態を検知する検知部と、
を有する基板支持装置と、
前記検知部からの情報に基づいて、前記移動部が前記支持部に当接したかどうかを判断する制御部と、
を備え、
各流体管に、当該流体管を流れる流体の圧力又は流量を検知する検知部が設けられ、
前記制御部は、各検知部からの検知結果に基づいて異常を検知し、
前記制御部は、前記移動部の前記支持部から離間する方向への移動開始から第四時間以内に前記移動部が前記支持部から離間したことが前記検知部によって検知されない場合には異常が発生したと判断する基板洗浄装置。 - 基板を支持するための支持部と、
前記支持部に当接し、前記支持部を軸線方向に沿って移動させるための移動部と、
少なくとも一部が前記移動部内に設けられ、流体が流れる流体管であって、前記移動部が前記支持部に当接するときに、前記支持部によって流出口が覆われる流体管と、
前記流体の状態を検知する検知部と、
を有する基板支持装置と、
前記検知部からの情報に基づいて、前記移動部が前記支持部に当接したかどうかを判断する制御部と、
を備え、
各流体管に、当該流体管を流れる流体の圧力又は流量を検知する検知部が設けられ、
前記制御部は、各検知部からの検知結果に基づいて異常を検知し、
前記制御部が異常が発生したと判断した場合に、前記支持部の清掃又は交換を促す情報を報知する報知部を備える、基板洗浄装置。 - 前記検知部は、前記流体管を流れる流体の圧力又は流量を検知する請求項1乃至5のいずれか1項に記載の基板洗浄装置。
- 前記支持部は複数設けられ、
各支持部に対応して移動部が設けられ、
移動部の各々に前記流体管が設けられる請求項1乃至6のいずれか1項に記載の基板洗浄装置。 - 前記流体は気体である請求項1乃至7のいずれか1項に記載の基板洗浄装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019071877A JP7278838B2 (ja) | 2019-04-04 | 2019-04-04 | 基板支持装置及び基板洗浄装置 |
TW109107175A TW202038369A (zh) | 2019-04-04 | 2020-03-05 | 基板支持裝置及基板洗淨裝置 |
US16/825,540 US11766756B2 (en) | 2019-04-04 | 2020-03-20 | Substrate support apparatus and substrate cleaning apparatus |
KR1020200039700A KR20200117886A (ko) | 2019-04-04 | 2020-04-01 | 기판 지지 장치 및 기판 세정 장치 |
CN202010262609.1A CN111799211A (zh) | 2019-04-04 | 2020-04-03 | 基板支承装置及基板清洗装置 |
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JP2022099107A (ja) * | 2020-12-22 | 2022-07-04 | 東京エレクトロン株式会社 | 基板処理方法、及び基板処理装置 |
TWI812123B (zh) * | 2022-03-28 | 2023-08-11 | 辛耘企業股份有限公司 | 晶圓載台 |
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JP2006179571A (ja) | 2004-12-21 | 2006-07-06 | Dainippon Screen Mfg Co Ltd | 基板載置装置 |
JP2006305666A (ja) | 2005-04-27 | 2006-11-09 | Myotoku Ltd | ワーク保持位置検出システム |
JP2009233796A (ja) | 2008-03-27 | 2009-10-15 | Citizen Machinery Co Ltd | ワーク検知装置及びワーク検知方法並びにワーク検知装置を備えた工作機械 |
JP2009295751A (ja) | 2008-06-04 | 2009-12-17 | Ebara Corp | 基板把持機構および基板把持方法 |
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JPS6294809A (ja) * | 1985-10-21 | 1987-05-01 | Hitachi Ltd | 距離検出機構 |
KR0130138Y1 (ko) * | 1994-12-15 | 1999-02-01 | 김영환 | 고온 유체 순환장비용 저량의 유체 공급 검출 장치 |
JPH1133506A (ja) * | 1997-07-24 | 1999-02-09 | Tadahiro Omi | 流体処理装置及び洗浄処理システム |
JP4482245B2 (ja) * | 2001-03-30 | 2010-06-16 | 芝浦メカトロニクス株式会社 | スピン処理装置 |
JP2003092344A (ja) * | 2001-09-19 | 2003-03-28 | Dainippon Screen Mfg Co Ltd | 基板保持機構およびこれを用いた基板処理装置、ならびに基板保持方法 |
JP2005019456A (ja) | 2003-06-23 | 2005-01-20 | Dainippon Screen Mfg Co Ltd | 基板保持装置、ならびにそれを用いた基板処理装置、基板保持方法および基板処理方法 |
JP5825898B2 (ja) * | 2011-07-20 | 2015-12-02 | 株式会社Kelk | センサ及びセンサ支持体 |
KR102385573B1 (ko) * | 2017-12-13 | 2022-04-12 | 삼성전자주식회사 | 로드 컵 및 이를 포함하는 화학기계적 연마 장치 |
KR20200061237A (ko) * | 2018-11-23 | 2020-06-02 | 삼성전자주식회사 | 반도체 설비의 세정 방법, 및 반도체 설비의 관리 시스템 |
JP7278838B2 (ja) * | 2019-04-04 | 2023-05-22 | 株式会社荏原製作所 | 基板支持装置及び基板洗浄装置 |
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- 2020-04-01 KR KR1020200039700A patent/KR20200117886A/ko unknown
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Patent Citations (4)
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JP2006179571A (ja) | 2004-12-21 | 2006-07-06 | Dainippon Screen Mfg Co Ltd | 基板載置装置 |
JP2006305666A (ja) | 2005-04-27 | 2006-11-09 | Myotoku Ltd | ワーク保持位置検出システム |
JP2009233796A (ja) | 2008-03-27 | 2009-10-15 | Citizen Machinery Co Ltd | ワーク検知装置及びワーク検知方法並びにワーク検知装置を備えた工作機械 |
JP2009295751A (ja) | 2008-06-04 | 2009-12-17 | Ebara Corp | 基板把持機構および基板把持方法 |
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KR20200117886A (ko) | 2020-10-14 |
TW202038369A (zh) | 2020-10-16 |
CN111799211A (zh) | 2020-10-20 |
US11766756B2 (en) | 2023-09-26 |
US20200316742A1 (en) | 2020-10-08 |
JP2020170800A (ja) | 2020-10-15 |
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