JP6554392B2 - スピンナー装置 - Google Patents
スピンナー装置 Download PDFInfo
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- JP6554392B2 JP6554392B2 JP2015221978A JP2015221978A JP6554392B2 JP 6554392 B2 JP6554392 B2 JP 6554392B2 JP 2015221978 A JP2015221978 A JP 2015221978A JP 2015221978 A JP2015221978 A JP 2015221978A JP 6554392 B2 JP6554392 B2 JP 6554392B2
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- wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
反応部361がセンサ360に近接するとセンサ360と大地との間に発生する静電容量が変化し、発振回路の発振状態が変化する。そして、その変化を検出して反応部361の近接を検知する。
また、静電容量形近接センサ以外に反応部361が金属の場合には誘導形近接センサでもよい。
また、乾燥エアーを吹き付けない場合は、洗浄水で洗浄する時よりも高速で回転させ遠心力で洗浄水を吹き飛ばし乾燥させてもよい。
なお、図3では、保持爪の回動角度を分かりやすくするため、突出部342a〜342cをスピン回転軸40aを軸に回転させているが、スピン回転軸40aを回転させたとき保持爪31a〜31cが回転される。
ウエーハWの位置を補正する場合は、例えば、保持爪311で保持されるウエーハWが保持爪311からウエーハWを落下させない程度で僅かに保持爪311を開く方向に回動させたのち再び保持爪311でウエーハWを挟み保持させることで保持爪311で保持されるウエーハWの位置が補正される。
13:洗浄水供給手段 130:洗浄水供給源 131:給水管
3:保持機構 32:上プレート 321:ベアリング
34:下プレート 341:開口 342a〜342c:突出部
35a、35b:昇降部 351:シリンダ 352:ピストン 319:保持爪回動軸
31a〜31c:保持部 311:保持爪 312:アーム(a)、314:アーム(b)
316:ばね
315、317:柱部
36a〜36c:出力部 360:センサ 361:反応部 362:アンプ
4:スピン回転機構 40:回転シャフト 40a:スピン回転軸 40b:貫通孔
41:回転駆動部 42:軸受け 43:パッキン 44:ロータリージョイント
5:判断手段 50:記憶部 50
W:ウエーハ Wd:ウエーハの外周
Claims (2)
- 少なくとも3つの保持爪をウエーハの外周に接触させてウエーハを保持する保持機構と、スピン回転軸を軸として該保持機構を回転させる回転駆動部を備えるスピン回転機構と、を備えるスピンナー装置であって、
ウエーハの中心が該スピン回転軸の軸心と一致しているか否かを判断する判断手段を備え、
該保持機構は、保持爪の位置に応じた出力を行う出力部を備え、
該判断手段は、少なくとも3つの該保持爪が保持したウエーハの中心と該スピン回転軸の軸心とが一致したときのそれぞれの該保持爪に対応したそれぞれの出力部からの出力値を記憶する記憶部と、
該スピン回転軸が所定角度回転したときの該出力部の出力値が、該記憶部が記憶した保持爪の出力値と一致するか否かに基づきウエーハのずれを判断する判断部と、
を備えたスピンナー装置。 - 前記出力部は、保持爪回動軸を軸に前記保持爪を回動させてウエーハを保持したときの該保持爪の位置を検出するセンサと、該保持爪と共に該保持爪回動軸を軸に回動し該センサを反応させる反応部と、該反応部で該センサを反応させる量を電圧に変換するアンプと、
を備える請求項1に記載のスピンナー装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015221978A JP6554392B2 (ja) | 2015-11-12 | 2015-11-12 | スピンナー装置 |
TW105132590A TWI693110B (zh) | 2015-11-12 | 2016-10-07 | 旋轉器裝置 |
CN201610951636.3A CN107039320B (zh) | 2015-11-12 | 2016-11-02 | 旋转装置 |
KR1020160148607A KR102379116B1 (ko) | 2015-11-12 | 2016-11-09 | 스피너 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015221978A JP6554392B2 (ja) | 2015-11-12 | 2015-11-12 | スピンナー装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017092298A JP2017092298A (ja) | 2017-05-25 |
JP6554392B2 true JP6554392B2 (ja) | 2019-07-31 |
Family
ID=58768670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015221978A Active JP6554392B2 (ja) | 2015-11-12 | 2015-11-12 | スピンナー装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6554392B2 (ja) |
KR (1) | KR102379116B1 (ja) |
CN (1) | CN107039320B (ja) |
TW (1) | TWI693110B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7359583B2 (ja) | 2019-07-22 | 2023-10-11 | 株式会社ディスコ | 加工装置 |
CN114474440B (zh) * | 2022-03-16 | 2023-03-10 | 江苏京创先进电子科技有限公司 | 微调装置调整精度控制方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3457110B2 (ja) * | 1995-12-05 | 2003-10-14 | 大日本スクリーン製造株式会社 | ウエハの周縁形状検出装置 |
JP3763619B2 (ja) * | 1996-10-28 | 2006-04-05 | 大日本スクリーン製造株式会社 | 基板回転保持装置および回転式基板処理装置 |
JP3909915B2 (ja) | 1997-06-09 | 2007-04-25 | 芝浦メカトロニクス株式会社 | スピン処理装置 |
US6486550B1 (en) * | 2000-06-29 | 2002-11-26 | Lam Research Corporation | Locking mechanism for detachably securing a wafer carrier to a conveyor |
JP4376116B2 (ja) * | 2003-06-03 | 2009-12-02 | 東京エレクトロン株式会社 | 基板受け渡し位置の調整方法 |
JP4656440B2 (ja) * | 2007-02-13 | 2011-03-23 | 東京エレクトロン株式会社 | 基板位置検出装置及びその撮像手段位置調整方法 |
IL183692A0 (en) * | 2007-06-05 | 2007-09-20 | Nova Measuring Instr Ltd | Apparatus and method for substrates handling |
JP5422143B2 (ja) * | 2008-06-04 | 2014-02-19 | 株式会社荏原製作所 | 基板把持機構 |
JP5324231B2 (ja) * | 2009-01-08 | 2013-10-23 | 日東電工株式会社 | 半導体ウエハのアライメント装置 |
JP5379533B2 (ja) * | 2009-03-27 | 2013-12-25 | 大日本スクリーン製造株式会社 | 基板保持機構、およびこの基板保持機構を備える基板処理装置 |
JP5642574B2 (ja) * | 2011-01-25 | 2014-12-17 | 東京エレクトロン株式会社 | 液処理装置および液処理方法 |
CN103794529B (zh) * | 2012-11-13 | 2016-12-21 | 北京中科信电子装备有限公司 | 一种定位台上确定晶片圆心偏移矢量 |
JP6068975B2 (ja) * | 2012-12-27 | 2017-01-25 | 株式会社ディスコ | 洗浄装置 |
JP6302665B2 (ja) * | 2013-12-24 | 2018-03-28 | 株式会社ディスコ | スピンナー装置 |
JP6285275B2 (ja) * | 2014-04-30 | 2018-02-28 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
TWM502847U (zh) * | 2014-11-19 | 2015-06-11 | Innoserv Inc | 力量感測手爪 |
-
2015
- 2015-11-12 JP JP2015221978A patent/JP6554392B2/ja active Active
-
2016
- 2016-10-07 TW TW105132590A patent/TWI693110B/zh active
- 2016-11-02 CN CN201610951636.3A patent/CN107039320B/zh active Active
- 2016-11-09 KR KR1020160148607A patent/KR102379116B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW201718114A (zh) | 2017-06-01 |
CN107039320B (zh) | 2021-08-17 |
JP2017092298A (ja) | 2017-05-25 |
KR20170055915A (ko) | 2017-05-22 |
KR102379116B1 (ko) | 2022-03-25 |
TWI693110B (zh) | 2020-05-11 |
CN107039320A (zh) | 2017-08-11 |
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