JP6302665B2 - スピンナー装置 - Google Patents
スピンナー装置 Download PDFInfo
- Publication number
- JP6302665B2 JP6302665B2 JP2013265112A JP2013265112A JP6302665B2 JP 6302665 B2 JP6302665 B2 JP 6302665B2 JP 2013265112 A JP2013265112 A JP 2013265112A JP 2013265112 A JP2013265112 A JP 2013265112A JP 6302665 B2 JP6302665 B2 JP 6302665B2
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- Prior art keywords
- holding
- wafer
- rotation axis
- holding claw
- spin rotation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 210000000078 claw Anatomy 0.000 claims description 78
- 238000004140 cleaning Methods 0.000 claims description 33
- 239000007788 liquid Substances 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 67
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 23
- 230000003028 elevating effect Effects 0.000 description 6
- 238000001035 drying Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000009987 spinning Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
前記保持爪回動軸は、前記スピン回転軸の方向と平行な方向であり、該スピン回転軸に対して周方向に等間隔に配置されていることが好ましい。
前記保持爪回動軸は、前記スピン回転軸の方向に対して垂直な方向であり、該スピン回転軸に対して周方向に等間隔に配置されていることが好ましい。
まず、図2に示すように、昇降部35a,35bが下プレート34を+Z方向へ上昇させて、下プレート34の突出部342a〜342cを、保持部33a〜33cのアーム334と同じ高さにする。
このように、保持爪回動軸は、スピン回転軸と平行でなくてもよい。
保持爪回動軸は、洗浄・乾燥時においてスピン回転機構が回転する方向に対して、アームよりも前側にあってもよいし、後側にあってもよい。
揚力発生部の形状は、上述した形状に限らず、保持爪をスピン回転軸の方向へ付勢する揚力を発生するものであればよい
11 基台、12 ケース、121 排水口、
13 保持機構、31 回転シャフト、311 貫通孔、319 スピン回転軸、
32 上プレート、321a〜321c,42 ベアリング、
33a〜33c,33A〜33D 保持部、331,331A〜331D 保持爪、
332,332A〜332D,334,334D アーム、
333,333A,333C 軸部、335,337,337B 柱部、336 ばね、338,338A,338D 揚力発生部、339 保持爪回動軸、34 下プレート、341 開口、342a〜342c 突出部、
35a,35b 昇降部、351 シリンダ、352 ピストン、
14 スピン回転機構、41 回転駆動部、43 パッキン、
15 洗浄水供給手段、51 洗浄水供給源、52 ロータリージョイント、
53 洗浄ノズル、60 ウェーハ
Claims (3)
- ウェーハの外周を保持する保持部を少なくとも3つ備える保持機構と、
スピン回転軸を中心として該保持機構を回転させる回転駆動部を備えるスピン回転機構と、
該保持機構によって保持された該ウェーハに洗浄液を供給する洗浄液供給手段と、
を備え、該保持機構によって保持された該ウェーハを該スピン回転機構によって回転させ該ウェーハを洗浄し乾燥させるスピンナー装置であって、
該保持部は、
該ウェーハの外周に接触する保持爪と、
保持爪回動軸を軸として該保持爪を回動させるアームと、
該スピン回転軸に近づく方向へ該保持爪を付勢するばねと、を備え、
該アームは、
該スピン回転機構による回転により、該保持爪回転軸と該保持爪との間で該保持爪を該スピン回転軸から遠ざける方向の遠心力を打ち消す方向の揚力を発生する揚力発生部を備え、
該揚力発生部によって発生した揚力により、該スピン回転軸に近づく方向へ該保持爪を更に付勢し、該ウェーハの保持を維持する、スピンナー装置。 - 前記保持爪回動軸は、前記スピン回転軸の方向と平行な方向であり、該スピン回転軸に対して周方向に等間隔に配置されている、請求項1記載のスピンナー装置。
- 前記保持爪回動軸は、前記スピン回転軸の方向に対して垂直な方向であり、該スピン回転軸に対して周方向に等間隔に配置されている、請求項1記載のスピンナー装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013265112A JP6302665B2 (ja) | 2013-12-24 | 2013-12-24 | スピンナー装置 |
CN201410766632.9A CN104733349B (zh) | 2013-12-24 | 2014-12-11 | 旋转装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013265112A JP6302665B2 (ja) | 2013-12-24 | 2013-12-24 | スピンナー装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015122400A JP2015122400A (ja) | 2015-07-02 |
JP6302665B2 true JP6302665B2 (ja) | 2018-03-28 |
Family
ID=53457133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013265112A Active JP6302665B2 (ja) | 2013-12-24 | 2013-12-24 | スピンナー装置 |
Country Status (2)
Country | Link |
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JP (1) | JP6302665B2 (ja) |
CN (1) | CN104733349B (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6554392B2 (ja) * | 2015-11-12 | 2019-07-31 | 株式会社ディスコ | スピンナー装置 |
JP6634154B2 (ja) * | 2016-05-24 | 2020-01-22 | 三益半導体工業株式会社 | 回転テーブル用ウェーハ保持機構及び方法並びにウェーハ回転保持装置 |
CN109461678B (zh) * | 2018-10-22 | 2020-06-16 | 南京溧水高新创业投资管理有限公司 | 兆声清洗中晶圆转速检测装置 |
CN109107970A (zh) * | 2018-11-07 | 2019-01-01 | 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) | 晶圆清洁设备及晶圆生产线 |
CN110335834B (zh) * | 2019-06-03 | 2021-05-25 | 厦门通富微电子有限公司 | 晶圆甩干机以及用于晶圆甩干机的限位机构 |
KR20210128064A (ko) * | 2020-04-16 | 2021-10-26 | 주식회사 제우스 | 기판 처리용 통전장치 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02138737A (ja) * | 1987-08-31 | 1990-05-28 | Oki Electric Ind Co Ltd | 半導体ウエハの枚葉式スピン乾燥装置 |
JPH08335624A (ja) * | 1995-06-06 | 1996-12-17 | Dainippon Screen Mfg Co Ltd | 回転式基板処理装置 |
JPH11251414A (ja) * | 1998-03-05 | 1999-09-17 | Zetekku Kk | 機械式スピンチャック |
JP3766615B2 (ja) * | 2001-07-27 | 2006-04-12 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP4362414B2 (ja) * | 2003-12-18 | 2009-11-11 | 株式会社リコー | ワークセンタリング・クランプ装置、回転駆動装置及び電子ビーム露光装置 |
JP3933670B2 (ja) * | 2005-03-29 | 2007-06-20 | 東京エレクトロン株式会社 | 基板洗浄方法及び基板洗浄装置 |
JP2007049005A (ja) * | 2005-08-11 | 2007-02-22 | Speedfam Co Ltd | スピン乾燥機のためのワーク把持装置 |
US8714169B2 (en) * | 2008-11-26 | 2014-05-06 | Semes Co. Ltd. | Spin head, apparatus for treating substrate, and method for treating substrate |
JP5943588B2 (ja) * | 2011-11-29 | 2016-07-05 | 株式会社ディスコ | 洗浄装置 |
-
2013
- 2013-12-24 JP JP2013265112A patent/JP6302665B2/ja active Active
-
2014
- 2014-12-11 CN CN201410766632.9A patent/CN104733349B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
JP2015122400A (ja) | 2015-07-02 |
CN104733349A (zh) | 2015-06-24 |
CN104733349B (zh) | 2019-04-19 |
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