JP5390505B2 - 耐熱性構造用エポキシ樹脂 - Google Patents

耐熱性構造用エポキシ樹脂 Download PDF

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Publication number
JP5390505B2
JP5390505B2 JP2010503168A JP2010503168A JP5390505B2 JP 5390505 B2 JP5390505 B2 JP 5390505B2 JP 2010503168 A JP2010503168 A JP 2010503168A JP 2010503168 A JP2010503168 A JP 2010503168A JP 5390505 B2 JP5390505 B2 JP 5390505B2
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rubber
epoxy resin
structural adhesive
adhesive
weight
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Japanese (ja)
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JP2010523800A5 (enExample
JP2010523800A (ja
Inventor
エーグル，グレン，ジー．
ルッツ，アンドレアス
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ダウ グローバル テクノロジーズ エルエルシー
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2010503168A 2007-04-11 2008-04-09 耐熱性構造用エポキシ樹脂 Active JP5390505B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US92287707P 2007-04-11 2007-04-11
US60/922,877 2007-04-11
PCT/US2008/059696 WO2008127923A2 (en) 2007-04-11 2008-04-09 Heat-resistant structural epoxy resins

Publications (3)

Publication Number Publication Date
JP2010523800A JP2010523800A (ja) 2010-07-15
JP2010523800A5 JP2010523800A5 (enExample) 2011-06-30
JP5390505B2 true JP5390505B2 (ja) 2014-01-15

Family

ID=39639648

Family Applications (1)

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JP2010503168A Active JP5390505B2 (ja) 2007-04-11 2008-04-09 耐熱性構造用エポキシ樹脂

Country Status (8)

Country Link
US (2) US8097119B2 (enExample)
EP (1) EP2137277B1 (enExample)
JP (1) JP5390505B2 (enExample)
KR (1) KR101467602B1 (enExample)
CN (1) CN101679828B (enExample)
AT (1) ATE510897T1 (enExample)
BR (1) BRPI0809752B1 (enExample)
WO (1) WO2008127923A2 (enExample)

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Also Published As

Publication number Publication date
US8097119B2 (en) 2012-01-17
WO2008127923A3 (en) 2009-04-23
US8585861B2 (en) 2013-11-19
US20120103517A1 (en) 2012-05-03
US20080251202A1 (en) 2008-10-16
BRPI0809752A2 (pt) 2014-09-30
WO2008127923A2 (en) 2008-10-23
EP2137277B1 (en) 2011-05-25
CN101679828A (zh) 2010-03-24
CN101679828B (zh) 2012-07-25
BRPI0809752B1 (pt) 2017-05-16
JP2010523800A (ja) 2010-07-15
ATE510897T1 (de) 2011-06-15
EP2137277A2 (en) 2009-12-30
KR20100016407A (ko) 2010-02-12
KR101467602B1 (ko) 2014-12-01

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