ATE510897T1 - Hitzebeständige strukturelle epoxidharze - Google Patents

Hitzebeständige strukturelle epoxidharze

Info

Publication number
ATE510897T1
ATE510897T1 AT08745329T AT08745329T ATE510897T1 AT E510897 T1 ATE510897 T1 AT E510897T1 AT 08745329 T AT08745329 T AT 08745329T AT 08745329 T AT08745329 T AT 08745329T AT E510897 T1 ATE510897 T1 AT E510897T1
Authority
AT
Austria
Prior art keywords
epoxy resins
heat resistant
resistant structural
structural epoxy
bisphenol
Prior art date
Application number
AT08745329T
Other languages
German (de)
English (en)
Inventor
Glenn Eagle
Andreas Lutz
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Application granted granted Critical
Publication of ATE510897T1 publication Critical patent/ATE510897T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AT08745329T 2007-04-11 2008-04-09 Hitzebeständige strukturelle epoxidharze ATE510897T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US92287707P 2007-04-11 2007-04-11
PCT/US2008/059696 WO2008127923A2 (en) 2007-04-11 2008-04-09 Heat-resistant structural epoxy resins

Publications (1)

Publication Number Publication Date
ATE510897T1 true ATE510897T1 (de) 2011-06-15

Family

ID=39639648

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08745329T ATE510897T1 (de) 2007-04-11 2008-04-09 Hitzebeständige strukturelle epoxidharze

Country Status (8)

Country Link
US (2) US8097119B2 (enExample)
EP (1) EP2137277B1 (enExample)
JP (1) JP5390505B2 (enExample)
KR (1) KR101467602B1 (enExample)
CN (1) CN101679828B (enExample)
AT (1) ATE510897T1 (enExample)
BR (1) BRPI0809752B1 (enExample)
WO (1) WO2008127923A2 (enExample)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5504266B2 (ja) * 2008-07-29 2014-05-28 ダウ グローバル テクノロジーズ エルエルシー 自動車空孔部において強度を付与し、エネルギーを散逸させるための、強化された膨張可能なエポキシ樹脂
CN102575138B (zh) 2009-09-11 2013-10-16 3M创新有限公司 固化性和固化的粘合剂组合物
KR101727345B1 (ko) 2009-09-11 2017-04-14 쓰리엠 이노베이티브 프로퍼티즈 컴파니 경화성 및 경화된 접착제 조성물
US20110294963A1 (en) * 2010-05-27 2011-12-01 Far East University Method of toughening epoxy resin and toughened epoxy resin composite
US20120299216A1 (en) * 2010-07-01 2012-11-29 Westech Aerosol Corporation Vacuum Infusion Adhesive and Methods Related Thereto
US9624411B2 (en) 2010-07-01 2017-04-18 David W. Carnahan Vacuum infusion adhesive and methods related thereto
JP5784134B2 (ja) 2010-11-12 2015-09-24 スリーエム イノベイティブ プロパティズ カンパニー 硬化性組成物
CN103189411B (zh) 2010-11-12 2015-11-25 3M创新有限公司 可固化组合物和已固化组合物
US20120129980A1 (en) * 2010-11-19 2012-05-24 Ppg Industries Ohio, Inc. Structural adhesive compositions
US20140150970A1 (en) 2010-11-19 2014-06-05 Ppg Industries Ohio, Inc. Structural adhesive compositions
US8796361B2 (en) 2010-11-19 2014-08-05 Ppg Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
US9074040B2 (en) * 2010-12-20 2015-07-07 Mitsui Chemicals, Inc. Curable adhesive compositions
WO2013028281A1 (en) * 2011-08-22 2013-02-28 Dow Global Technologies Llc Toughener and toughened epoxy adhesive
CN102391816B (zh) * 2011-10-15 2013-07-03 北京天诚宇新材料技术有限公司 一种高温修补剂
WO2013142751A2 (en) 2012-03-23 2013-09-26 Dow Global Technologies Llc Flame retardant structural epoxy resin adhesives and process for bonding metal members
CN104144959B (zh) * 2012-03-23 2018-03-09 陶氏环球技术有限责任公司 应力耐久性提高的耐碰撞粘合剂
US11008505B2 (en) 2013-01-04 2021-05-18 Carbo Ceramics Inc. Electrically conductive proppant
CN103317582B (zh) * 2013-04-23 2016-01-06 浙江林碳木业科技有限公司 一种带有表面凹凸立体浮雕效果的指接板的制造方法
MX365821B (es) 2013-04-26 2019-06-17 Carbo Ceramics Inc Composiciones y metodos para el uso de la quimica de superficies de agentes de sosten para mejorar la consolidacion del agente de sosten y el control de retorno.
US10047254B2 (en) 2013-09-23 2018-08-14 Bondek Corporation Curable composite manufacturing adhesive
JP6302207B2 (ja) * 2013-10-16 2018-03-28 株式会社カネカ 車両用部材の製造方法
ES2748241T3 (es) * 2013-10-29 2020-03-16 Kaneka Corp Composición de resina curable que contiene partículas finas de polímero que tiene estabilidad en almacenamiento mejorada
CN103665324B (zh) * 2013-11-14 2015-10-07 昆山珍实复合材料有限公司 一种环氧树脂潜伏性固化剂及相应的环氧树脂涂料
GB201411586D0 (en) * 2014-06-30 2014-08-13 Hexcel Composites Ltd Adhesive composition
BR112017000219A2 (pt) * 2014-07-08 2018-01-16 Dow Global Technologies Llc adesivo durável à falha de alta tg de cura retardada
EP3180393B2 (en) 2014-08-12 2024-10-16 3M Innovative Properties Company Film adhesive
CN104356985B (zh) * 2014-10-15 2016-08-10 安徽蓝翔电器成套设备有限公司 变压器灌封胶及其制备方法和应用
CN104293270B (zh) * 2014-10-31 2015-11-04 浙江红高梁木业有限公司 一种用于木地板的环氧树脂胶粘剂及其制备方法
CN117449809A (zh) 2015-03-27 2024-01-26 卡博陶粒有限公司 用于使用支撑剂表面化学和内部孔隙率来固结支撑剂微粒的方法和组合物
ES2758354T3 (es) * 2015-04-09 2020-05-05 Kaneka Corp Composición de resina curable que contiene partículas poliméricas finas con fuerza de unión mejorada frente al desconchado por impacto
JP2018522954A (ja) 2015-05-01 2018-08-16 ロード コーポレイション ゴム接合用接着剤
CN105062393B (zh) * 2015-07-30 2017-08-04 烟台德邦科技有限公司 一种快速粘接且快速分离的胶粘剂及其制备方法
KR102626998B1 (ko) * 2015-09-10 2024-01-19 다우 글로벌 테크놀로지스 엘엘씨 높은 종횡비의 충전제를 갖는 높은 모듈러스의 강인화된 1성분 에폭시 구조용 접착제
CN106589805A (zh) * 2015-10-14 2017-04-26 中国石油化工股份有限公司 一种增韧复合环氧树脂组成物及其制备方法
EP3170877B1 (en) 2015-11-19 2020-11-18 3M Innovative Properties Company Structural adhesive with improved failure mode
EP3170860B1 (en) 2015-11-19 2020-07-29 3M Innovative Properties Company Structural adhesive with improved corrosion resistance
US10377928B2 (en) 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10351661B2 (en) 2015-12-10 2019-07-16 Ppg Industries Ohio, Inc. Method for producing an aminimide
WO2017109620A1 (en) * 2015-12-22 2017-06-29 Aditya Birla Chemicals Thailand Epoxy Division An epoxy resin component for an adhesive composition
JP6884979B2 (ja) * 2016-03-09 2021-06-09 株式会社スリーボンド 硬化性樹脂組成物、燃料電池およびシール方法
JP6955661B2 (ja) * 2016-06-28 2021-10-27 株式会社スリーボンド エポキシ樹脂組成物
US10865297B2 (en) * 2016-07-14 2020-12-15 Threebond Co., Ltd. Curable resin composition, cured product, fuel cell, and sealing method
CN106674944A (zh) * 2016-12-06 2017-05-17 云南光电辅料有限公司 一种不饱和聚酯复合材料及其分解回收方法
JP6872944B2 (ja) * 2017-03-27 2021-05-19 セメダイン株式会社 低温加熱硬化型構造用接着剤組成物
KR101967043B1 (ko) * 2017-05-12 2019-04-08 부산대학교 산학협력단 높은 연신율 및 내충격성을 갖는 구조용 접착제 조성물
EP3642292B2 (en) 2017-06-23 2025-07-02 DDP Specialty Electronic Materials US, LLC High temperature epoxy adhesive formulations
EP3645614B1 (en) 2017-06-29 2023-02-22 Dow Global Technologies LLC Epoxy-fiber reinforced composites, method to form the composites and epoxy resin composition used therefor
EP3681966A1 (en) * 2017-09-12 2020-07-22 DDP Specialty Electronic Materials US, Inc. One-component toughened epoxy adhesives
JP7299058B2 (ja) * 2018-04-27 2023-06-27 ナガセケムテックス株式会社 接着剤
EP3802678A1 (en) 2018-06-05 2021-04-14 Dow Global Technologies, LLC Method for recycling epoxy-fiber composites into polyolefins
CN112534017B (zh) 2018-07-25 2023-06-30 株式会社Lg化学 粘合剂组合物
US12116506B2 (en) 2018-07-25 2024-10-15 Lg Chem, Ltd. Adhesive composition
CN112449650B (zh) 2018-07-25 2023-03-28 株式会社Lg化学 粘合剂组合物
KR102183705B1 (ko) 2018-07-25 2020-11-27 주식회사 엘지화학 접착제 조성물
WO2020022801A1 (ko) 2018-07-25 2020-01-30 주식회사 엘지화학 접착제 조성물
US12173195B2 (en) 2018-07-25 2024-12-24 Lg Chem, Ltd. Adhesive composition
KR102223909B1 (ko) 2018-07-25 2021-03-08 주식회사 엘지화학 접착제 조성물
EP3798246B1 (en) * 2019-09-27 2024-01-31 Henkel AG & Co. KGaA One component (1k) composition based on modified epoxy resin
EP4212567A4 (en) * 2020-09-07 2024-07-31 ThreeBond Co., Ltd. Epoxy resin composition
FR3118966B1 (fr) * 2021-01-18 2024-03-01 Gaztransport Et Technigaz Composition d’adhésif époxy comprenant des nanoparticules d’élastomère, et leurs utilisations
US12110425B2 (en) 2021-08-17 2024-10-08 Uniseal, Inc. Electromagnetic curable novel toughened epoxy-hybrid structural adhesives and applications using the same
EP4148098A1 (en) * 2021-09-08 2023-03-15 Sika Technology AG Expandable one-component thermosetting epoxy adhesive with improved adhesion
JPWO2024262261A1 (enExample) * 2023-06-22 2024-12-26
WO2026062466A1 (en) * 2024-09-17 2026-03-26 3M Innovative Properties Company Curable adhesive compositions with a low dielectric constant

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2006207A (en) * 1930-01-25 1935-06-25 Combustion Utilities Corp Oil-soluble synthetic resin and process for its manufacture
JPS59196377A (ja) * 1983-04-22 1984-11-07 Yokohama Rubber Co Ltd:The 構造用接着剤
US4594291A (en) * 1984-07-17 1986-06-10 The Dow Chemical Company Curable, partially advanced epoxy resins
US4948449A (en) * 1986-05-07 1990-08-14 Minnesota Mining And Manufacturing Company Epoxy resin composition
US5278257A (en) * 1987-08-26 1994-01-11 Ciba-Geigy Corporation Phenol-terminated polyurethane or polyurea(urethane) with epoxy resin
DE3818692A1 (de) * 1988-06-01 1989-12-07 Bayer Ag Verwendung von 1,1,1,4,4,4-hexafluorbutan als treib- und daemmgas fuer die herstellung von kunststoff-schaumstoffen
US5202390A (en) * 1988-07-28 1993-04-13 Ciba-Geigy Corporation Butadiene/polar comonomer copolymer and aromatic reactive end group-containing prepolymer
US5290857A (en) * 1991-09-04 1994-03-01 Nippon Zeon Co., Ltd. Epoxy resin adhesive composition
JP3655646B2 (ja) * 1993-05-24 2005-06-02 日産自動車株式会社 エポキシ樹脂用接着補強剤及び該補強剤を含有する自動車用エポキシ樹脂系構造接着性組成物
JP3229467B2 (ja) * 1993-12-03 2001-11-19 三菱レイヨン株式会社 エポキシ樹脂組成物
US20040181013A1 (en) * 1998-10-06 2004-09-16 Henkel Teroson Gmbh Impact resistant epoxide resin compositions
DE19858921A1 (de) * 1998-12-19 2000-06-21 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
KR20010081833A (ko) * 2000-02-19 2001-08-29 권문구 유리전이온도 조정에 의한 반도체 패키지용 드라이 패드형탄성접착제의 탄성률 고안
ES2221909T3 (es) * 2000-04-10 2005-01-16 Henkel Kommanditgesellschaft Auf Aktien Composiciones de resina epoxi resilientes.
DE10163859A1 (de) * 2001-12-22 2003-07-10 Henkel Kgaa Mehrphasige Strukturklebstoffe
US20030192643A1 (en) * 2002-03-15 2003-10-16 Rainer Schoenfeld Epoxy adhesive having improved impact resistance
US20030215588A1 (en) * 2002-04-09 2003-11-20 Yeager Gary William Thermoset composition, method, and article
ATE331748T1 (de) * 2003-03-11 2006-07-15 Hanse Chemie Ag Polymere epoxidharz-zusammensetzung
EP1457509B1 (de) * 2003-03-11 2006-06-28 hanse chemie AG Polymere Epoxidharz-Zusammensetzung
KR100780582B1 (ko) 2003-06-09 2007-11-29 카네카 코포레이션 변성 에폭시 수지의 제조방법
CA2529737C (en) * 2003-07-07 2013-05-07 Dow Global Technologies Inc. Adhesive epoxy composition and process for applying it
AU2003250972A1 (en) * 2003-07-14 2005-01-28 Mattex Leisure Industries Artificial turf filament and artificial turf system
EP1498441A1 (de) * 2003-07-16 2005-01-19 Sika Technology AG Hitzehärtende Zusammensetzungen mit Tieftemperatur-Schlagzähigkeitsmodifikatoren
ATE352576T1 (de) * 2004-03-12 2007-02-15 Dow Global Technologies Inc Epoxidharz klebstoffzusammensetzung
US20050215730A1 (en) * 2004-03-24 2005-09-29 Rainer Schoenfeld Polycarboxy-functionalized prepolymers
EP1602702B2 (en) 2004-06-01 2020-09-16 Dow Global Technologies LLC Epoxy adhesive composition
EP1695990A1 (en) * 2005-02-28 2006-08-30 Dow Global Technologies Inc. Two-component epoxy adhesive composition
ATE462762T1 (de) 2005-06-02 2010-04-15 Dow Global Technologies Inc Schlagzähmodifizierter strukturklebstoff auf epoxid basis
ATE534703T1 (de) * 2005-08-24 2011-12-15 Henkel Kgaa Epoxidzusammensetzungen mit verbesserter schlagzähigkeit

Also Published As

Publication number Publication date
US20080251202A1 (en) 2008-10-16
WO2008127923A3 (en) 2009-04-23
JP2010523800A (ja) 2010-07-15
KR101467602B1 (ko) 2014-12-01
US8097119B2 (en) 2012-01-17
US20120103517A1 (en) 2012-05-03
US8585861B2 (en) 2013-11-19
CN101679828B (zh) 2012-07-25
KR20100016407A (ko) 2010-02-12
BRPI0809752A2 (pt) 2014-09-30
JP5390505B2 (ja) 2014-01-15
BRPI0809752B1 (pt) 2017-05-16
WO2008127923A2 (en) 2008-10-23
EP2137277A2 (en) 2009-12-30
EP2137277B1 (en) 2011-05-25
CN101679828A (zh) 2010-03-24

Similar Documents

Publication Publication Date Title
WO2008127923A3 (en) Heat-resistant structural epoxy resins
ATE531777T1 (de) Hochfestes epoxid-haftmittel und seine verwendung
BR112013021411A2 (pt) endurecedores de alta latência para resinas epóxi
WO2009017690A3 (en) Curable epoxy resin-based adhesive compositions
MX2010002220A (es) Composiciones de imprimador para revestimientos y sistemas de union adhesiva.
EP2557103A4 (en) EPOXY COMPOUND, CURABLE COMPOSITION AND CURED PRODUCT THEREOF
WO2009038020A1 (ja) 電子部品用接着剤組成物およびそれを用いた電子部品用接着剤シート
WO2011014714A3 (en) Low application temperature hot melt adhesive
BR112012026694A2 (pt) inibidores da desmetilase específica para lisina 1 e seu uso
CL2008002073A1 (es) Compuestos derivados de lactama tetraciclicos, inhibidores de mk-2; procedimiento de praparacion; composicion farmaceutica; y su uso en el tratamiento de artritis, sinovitis aguda, tendinitis, soriasis, miocarditis, caquexia, asma, cancer, entre otras.
MY152093A (en) Composition comprising glycerol, process for obtaining same and use thereof in the manufacture of dichloropropanol
DE602007005002D1 (de) Modifizierte hydrocarbylphenol-aldehydharze als klebrigmacher und diese enthaltende kautschukzusammensetzungen
WO2012092332A3 (en) Structural hybrid adhesives
BRPI1005918A2 (pt) composição de resina epóxi curável, processo para preparar uma composição de resina epóxi curável, compósito, processo para formar um compósito e adesivo
SG195098A1 (en) Resin composition, prepreg and laminate
NO20084939L (no) Aminoplast- eller fenoplastharpiks basert pa minst ett glykosal-monoacetal og pa glyoksylsyre, og dens anvendelser
WO2009108001A3 (ko) 마블칩 제조용 수지 조성물과 이를 이용한 마블칩 제조방법 및, 이를 이용한 인조대리석
TW200604278A (en) Fastr curing fluoroelastomeric compositions, adhesive fluoroelastomeric compositions and methods for bonding fluoroelastomeric compositions
DK1412445T3 (da) Polysilazanmodificerede polyaminhærdere til epoxyharpikser
WO2011116050A3 (en) Curing agents for epoxy resins
WO2009051084A3 (en) Curable silicone composition and cured product thereof
JP2010523800A5 (enExample)
MX2013008856A (es) Composicion curable que tiene estabilizadores combinados.
WO2006082478A3 (en) Hot melt adhesive composition
WO2011146580A3 (en) Curable compositions

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties