BRPI0809752B1 - "adesivo estrutural de um componente e método" - Google Patents
"adesivo estrutural de um componente e método" Download PDFInfo
- Publication number
- BRPI0809752B1 BRPI0809752B1 BRPI0809752A BRPI0809752A BRPI0809752B1 BR PI0809752 B1 BRPI0809752 B1 BR PI0809752B1 BR PI0809752 A BRPI0809752 A BR PI0809752A BR PI0809752 A BRPI0809752 A BR PI0809752A BR PI0809752 B1 BRPI0809752 B1 BR PI0809752B1
- Authority
- BR
- Brazil
- Prior art keywords
- rubber
- structural adhesive
- epoxy resin
- adhesive
- weight percent
- Prior art date
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 115
- 239000000853 adhesive Substances 0.000 title claims abstract description 113
- 238000000034 method Methods 0.000 title claims description 12
- 239000003822 epoxy resin Substances 0.000 claims abstract description 68
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 68
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000004593 Epoxy Substances 0.000 claims abstract description 17
- 229920001971 elastomer Polymers 0.000 claims description 91
- 239000005060 rubber Substances 0.000 claims description 91
- 239000004848 polyfunctional curative Substances 0.000 claims description 31
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 24
- -1 amino, hydroxyl Chemical group 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 150000002739 metals Chemical class 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 10
- 239000012948 isocyanate Substances 0.000 claims description 8
- 230000009477 glass transition Effects 0.000 claims description 6
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 6
- 150000002513 isocyanates Chemical class 0.000 claims description 4
- 239000013536 elastomeric material Substances 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000000203 mixture Substances 0.000 abstract description 26
- 229930185605 Bisphenol Natural products 0.000 abstract description 17
- 229920005989 resin Polymers 0.000 abstract description 14
- 239000011347 resin Substances 0.000 abstract description 14
- 230000015556 catabolic process Effects 0.000 abstract description 4
- 238000006731 degradation reaction Methods 0.000 abstract description 4
- 229920006332 epoxy adhesive Polymers 0.000 abstract 1
- 239000010408 film Substances 0.000 description 49
- 239000000758 substrate Substances 0.000 description 19
- 238000012360 testing method Methods 0.000 description 19
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 18
- 239000002245 particle Substances 0.000 description 17
- 229920001577 copolymer Polymers 0.000 description 14
- 239000000463 material Substances 0.000 description 11
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- 239000000126 substance Substances 0.000 description 11
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- 238000000576 coating method Methods 0.000 description 10
- 239000003054 catalyst Substances 0.000 description 9
- 239000000178 monomer Substances 0.000 description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 125000003118 aryl group Chemical group 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 150000002118 epoxides Chemical group 0.000 description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- 239000004721 Polyphenylene oxide Substances 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 6
- 239000010960 cold rolled steel Substances 0.000 description 6
- 229910000267 dualite Inorganic materials 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
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- 150000001875 compounds Chemical class 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
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- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical group C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 4
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 239000008119 colloidal silica Substances 0.000 description 4
- 238000010411 cooking Methods 0.000 description 4
- 150000001993 dienes Chemical class 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
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- 125000002947 alkylene group Chemical group 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 description 3
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 3
- 239000000292 calcium oxide Substances 0.000 description 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 3
- 150000002825 nitriles Chemical class 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 229920000768 polyamine Polymers 0.000 description 3
- 229920005862 polyol Polymers 0.000 description 3
- 150000003077 polyols Chemical class 0.000 description 3
- 150000008442 polyphenolic compounds Chemical class 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000006254 rheological additive Substances 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- CZAZXHQSSWRBHT-UHFFFAOYSA-N 2-(2-hydroxyphenyl)-3,4,5,6-tetramethylphenol Chemical compound OC1=C(C)C(C)=C(C)C(C)=C1C1=CC=CC=C1O CZAZXHQSSWRBHT-UHFFFAOYSA-N 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 2
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 2
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 2
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 2
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 2
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- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 229910001335 Galvanized steel Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical group [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
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- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
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- 229920001730 Moisture cure polyurethane Polymers 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
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- 239000007983 Tris buffer Substances 0.000 description 2
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- 239000012790 adhesive layer Substances 0.000 description 2
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
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- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 2
- 125000002993 cycloalkylene group Chemical group 0.000 description 2
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- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
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- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
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- ZWOULFZCQXICLZ-UHFFFAOYSA-N 1,3-dimethyl-1-phenylurea Chemical compound CNC(=O)N(C)C1=CC=CC=C1 ZWOULFZCQXICLZ-UHFFFAOYSA-N 0.000 description 1
- MCMFEZDRQOJKMN-UHFFFAOYSA-N 1-butylimidazole Chemical compound CCCCN1C=CN=C1 MCMFEZDRQOJKMN-UHFFFAOYSA-N 0.000 description 1
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical group CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
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- XAYDWGMOPRHLEP-UHFFFAOYSA-N 6-ethenyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1CCCC2OC21C=C XAYDWGMOPRHLEP-UHFFFAOYSA-N 0.000 description 1
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- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 description 1
- IDSLNGDJQFVDPQ-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-yl) hexanedioate Chemical compound C1CC2OC2CC1OC(=O)CCCCC(=O)OC1CC2OC2CC1 IDSLNGDJQFVDPQ-UHFFFAOYSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical class [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 125000002837 carbocyclic group Chemical group 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 229940072282 cardura Drugs 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- JXCGFZXSOMJFOA-UHFFFAOYSA-N chlorotoluron Chemical compound CN(C)C(=O)NC1=CC=C(C)C(Cl)=C1 JXCGFZXSOMJFOA-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
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- 201000004440 congenital dyserythropoietic anemia Diseases 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- DGJMPUGMZIKDRO-UHFFFAOYSA-N cyanoacetamide Chemical compound NC(=O)CC#N DGJMPUGMZIKDRO-UHFFFAOYSA-N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920003244 diene elastomer Polymers 0.000 description 1
- 125000006222 dimethylaminomethyl group Chemical group [H]C([H])([H])N(C([H])([H])[H])C([H])([H])* 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical class C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
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- RUZYUOTYCVRMRZ-UHFFFAOYSA-N doxazosin Chemical compound C1OC2=CC=CC=C2OC1C(=O)N(CC1)CCN1C1=NC(N)=C(C=C(C(OC)=C2)OC)C2=N1 RUZYUOTYCVRMRZ-UHFFFAOYSA-N 0.000 description 1
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- 125000003700 epoxy group Chemical group 0.000 description 1
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- 239000003063 flame retardant Substances 0.000 description 1
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- 125000000524 functional group Chemical group 0.000 description 1
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- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
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- 239000013628 high molecular weight specie Substances 0.000 description 1
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
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- KFZAUHNPPZCSCR-UHFFFAOYSA-N iron zinc Chemical compound [Fe].[Zn] KFZAUHNPPZCSCR-UHFFFAOYSA-N 0.000 description 1
- VYFOAVADNIHPTR-UHFFFAOYSA-N isatoic anhydride Chemical compound NC1=CC=CC=C1CO VYFOAVADNIHPTR-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
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- 230000000813 microbial effect Effects 0.000 description 1
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- 239000005011 phenolic resin Substances 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
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- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
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- 238000000518 rheometry Methods 0.000 description 1
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- 239000000377 silicon dioxide Substances 0.000 description 1
- BPILDHPJSYVNAF-UHFFFAOYSA-M sodium;diiodomethanesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C(I)I BPILDHPJSYVNAF-UHFFFAOYSA-M 0.000 description 1
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- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US92287707P | 2007-04-11 | 2007-04-11 | |
| US60/922,877 | 2007-04-11 | ||
| PCT/US2008/059696 WO2008127923A2 (en) | 2007-04-11 | 2008-04-09 | Heat-resistant structural epoxy resins |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BRPI0809752A2 BRPI0809752A2 (pt) | 2014-09-30 |
| BRPI0809752B1 true BRPI0809752B1 (pt) | 2017-05-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0809752A BRPI0809752B1 (pt) | 2007-04-11 | 2008-04-09 | "adesivo estrutural de um componente e método" |
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|---|---|
| US (2) | US8097119B2 (enExample) |
| EP (1) | EP2137277B1 (enExample) |
| JP (1) | JP5390505B2 (enExample) |
| KR (1) | KR101467602B1 (enExample) |
| CN (1) | CN101679828B (enExample) |
| AT (1) | ATE510897T1 (enExample) |
| BR (1) | BRPI0809752B1 (enExample) |
| WO (1) | WO2008127923A2 (enExample) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5504266B2 (ja) * | 2008-07-29 | 2014-05-28 | ダウ グローバル テクノロジーズ エルエルシー | 自動車空孔部において強度を付与し、エネルギーを散逸させるための、強化された膨張可能なエポキシ樹脂 |
| JP5530524B2 (ja) | 2009-09-11 | 2014-06-25 | スリーエム イノベイティブ プロパティズ カンパニー | 硬化性及び硬化済み接着剤組成物 |
| US9528035B2 (en) | 2009-09-11 | 2016-12-27 | 3M Innovative Properties Company | Curable and cured adhesive compositions |
| US20110294963A1 (en) * | 2010-05-27 | 2011-12-01 | Far East University | Method of toughening epoxy resin and toughened epoxy resin composite |
| US20120299216A1 (en) * | 2010-07-01 | 2012-11-29 | Westech Aerosol Corporation | Vacuum Infusion Adhesive and Methods Related Thereto |
| US9624411B2 (en) | 2010-07-01 | 2017-04-18 | David W. Carnahan | Vacuum infusion adhesive and methods related thereto |
| JP5840219B2 (ja) | 2010-11-12 | 2016-01-06 | スリーエム イノベイティブ プロパティズ カンパニー | 硬化性組成物及び硬化済み組成物 |
| WO2012064724A2 (en) | 2010-11-12 | 2012-05-18 | 3M Innovative Properties Company | Curable and cured compositions |
| US8796361B2 (en) | 2010-11-19 | 2014-08-05 | Ppg Industries Ohio, Inc. | Adhesive compositions containing graphenic carbon particles |
| US20140150970A1 (en) | 2010-11-19 | 2014-06-05 | Ppg Industries Ohio, Inc. | Structural adhesive compositions |
| US20120129980A1 (en) * | 2010-11-19 | 2012-05-24 | Ppg Industries Ohio, Inc. | Structural adhesive compositions |
| US9074040B2 (en) * | 2010-12-20 | 2015-07-07 | Mitsui Chemicals, Inc. | Curable adhesive compositions |
| US20140171550A1 (en) * | 2011-08-22 | 2014-06-19 | Gary L. Jialanella | Epoxy resin with enhanced viscosity stability and use thereof |
| CN102391816B (zh) * | 2011-10-15 | 2013-07-03 | 北京天诚宇新材料技术有限公司 | 一种高温修补剂 |
| BR112014018129B1 (pt) | 2012-03-23 | 2021-07-20 | Dow Global Technologies Llc | Adesivo estrutural termocurável e método para unir um membro de alumínio a um segundo membro metálico |
| CN104136516B (zh) | 2012-03-23 | 2016-06-01 | 陶氏环球技术有限责任公司 | 阻燃结构环氧树脂粘合剂以及粘合金属构件的方法 |
| US11008505B2 (en) | 2013-01-04 | 2021-05-18 | Carbo Ceramics Inc. | Electrically conductive proppant |
| CN103317582B (zh) * | 2013-04-23 | 2016-01-06 | 浙江林碳木业科技有限公司 | 一种带有表面凹凸立体浮雕效果的指接板的制造方法 |
| EP2989177A4 (en) | 2013-04-26 | 2016-12-28 | Carbo Ceramics Inc | COMPOSITIONS AND METHODS FOR USE OF A SUPPORT SURFACE CHEMISTRY TO IMPROVE SUPPORT CONSOLIDATION AND FLOW CONTROL |
| US10047254B2 (en) | 2013-09-23 | 2018-08-14 | Bondek Corporation | Curable composite manufacturing adhesive |
| JP6302207B2 (ja) * | 2013-10-16 | 2018-03-28 | 株式会社カネカ | 車両用部材の製造方法 |
| ES2748241T3 (es) | 2013-10-29 | 2020-03-16 | Kaneka Corp | Composición de resina curable que contiene partículas finas de polímero que tiene estabilidad en almacenamiento mejorada |
| CN103665324B (zh) * | 2013-11-14 | 2015-10-07 | 昆山珍实复合材料有限公司 | 一种环氧树脂潜伏性固化剂及相应的环氧树脂涂料 |
| GB201411586D0 (en) * | 2014-06-30 | 2014-08-13 | Hexcel Composites Ltd | Adhesive composition |
| CN106715577A (zh) * | 2014-07-08 | 2017-05-24 | 陶氏环球技术有限责任公司 | 延迟固化的高Tg碰撞耐用粘合剂 |
| CN106574100A (zh) | 2014-08-12 | 2017-04-19 | 3M创新有限公司 | 膜粘合剂 |
| CN104356985B (zh) * | 2014-10-15 | 2016-08-10 | 安徽蓝翔电器成套设备有限公司 | 变压器灌封胶及其制备方法和应用 |
| CN104293270B (zh) * | 2014-10-31 | 2015-11-04 | 浙江红高梁木业有限公司 | 一种用于木地板的环氧树脂胶粘剂及其制备方法 |
| MX2017012043A (es) | 2015-03-27 | 2018-03-06 | Carbo Ceramics Inc | Metodos y composiciones para el uso de quimica de superficie de agente apuntalante o proppant y porosidad interna para consolidar particulas de agente apuntalante o proppant. |
| ES2758354T3 (es) * | 2015-04-09 | 2020-05-05 | Kaneka Corp | Composición de resina curable que contiene partículas poliméricas finas con fuerza de unión mejorada frente al desconchado por impacto |
| JP2018522954A (ja) | 2015-05-01 | 2018-08-16 | ロード コーポレイション | ゴム接合用接着剤 |
| CN105062393B (zh) * | 2015-07-30 | 2017-08-04 | 烟台德邦科技有限公司 | 一种快速粘接且快速分离的胶粘剂及其制备方法 |
| JP6923514B2 (ja) * | 2015-09-10 | 2021-08-18 | ダウ グローバル テクノロジーズ エルエルシー | 高アスペクト比充填剤を伴う高弾性強靭化一液型エポキシ構造用接着剤 |
| CN106589805A (zh) * | 2015-10-14 | 2017-04-26 | 中国石油化工股份有限公司 | 一种增韧复合环氧树脂组成物及其制备方法 |
| EP3170877B1 (en) | 2015-11-19 | 2020-11-18 | 3M Innovative Properties Company | Structural adhesive with improved failure mode |
| EP3170860B1 (en) | 2015-11-19 | 2020-07-29 | 3M Innovative Properties Company | Structural adhesive with improved corrosion resistance |
| US10377928B2 (en) | 2015-12-10 | 2019-08-13 | Ppg Industries Ohio, Inc. | Structural adhesive compositions |
| US10351661B2 (en) | 2015-12-10 | 2019-07-16 | Ppg Industries Ohio, Inc. | Method for producing an aminimide |
| WO2017109620A1 (en) * | 2015-12-22 | 2017-06-29 | Aditya Birla Chemicals Thailand Epoxy Division | An epoxy resin component for an adhesive composition |
| JP6884979B2 (ja) * | 2016-03-09 | 2021-06-09 | 株式会社スリーボンド | 硬化性樹脂組成物、燃料電池およびシール方法 |
| JP6955661B2 (ja) * | 2016-06-28 | 2021-10-27 | 株式会社スリーボンド | エポキシ樹脂組成物 |
| WO2018012631A1 (ja) * | 2016-07-14 | 2018-01-18 | 株式会社スリーボンド | 硬化性樹脂組成物、硬化物、燃料電池およびシール方法 |
| CN106674944A (zh) * | 2016-12-06 | 2017-05-17 | 云南光电辅料有限公司 | 一种不饱和聚酯复合材料及其分解回收方法 |
| JP6872944B2 (ja) | 2017-03-27 | 2021-05-19 | セメダイン株式会社 | 低温加熱硬化型構造用接着剤組成物 |
| KR101967043B1 (ko) * | 2017-05-12 | 2019-04-08 | 부산대학교 산학협력단 | 높은 연신율 및 내충격성을 갖는 구조용 접착제 조성물 |
| EP3642292B2 (en) | 2017-06-23 | 2025-07-02 | DDP Specialty Electronic Materials US, LLC | High temperature epoxy adhesive formulations |
| CN110753722A (zh) | 2017-06-29 | 2020-02-04 | 陶氏环球技术有限责任公司 | 环氧树脂-纤维增强复合材料、形成复合材料的方法以及用于复合材料的环氧树脂组合物 |
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| JP7299058B2 (ja) * | 2018-04-27 | 2023-06-27 | ナガセケムテックス株式会社 | 接着剤 |
| US20210115215A1 (en) | 2018-06-05 | 2021-04-22 | Dow Global Technologies Llc | Method for Recycling Epoxy-Fiber Composites into Polyolefins |
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| CN112469798B (zh) | 2018-07-25 | 2023-07-25 | 株式会社Lg化学 | 粘合剂组合物 |
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| EP3816253B1 (en) | 2018-07-25 | 2024-06-26 | Lg Chem, Ltd. | Adhesive composition |
| JP7238092B2 (ja) | 2018-07-25 | 2023-03-13 | エルジー・ケム・リミテッド | 接着剤組成物 |
| JP7176090B2 (ja) | 2018-07-25 | 2022-11-21 | エルジー・ケム・リミテッド | 接着剤組成物 |
| EP3798246B1 (en) * | 2019-09-27 | 2024-01-31 | Henkel AG & Co. KGaA | One component (1k) composition based on modified epoxy resin |
| KR20230062479A (ko) * | 2020-09-07 | 2023-05-09 | 가부시끼가이샤 쓰리본드 | 에폭시 수지 조성물 |
| FR3118966B1 (fr) * | 2021-01-18 | 2024-03-01 | Gaztransport Et Technigaz | Composition d’adhésif époxy comprenant des nanoparticules d’élastomère, et leurs utilisations |
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2008
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- 2008-04-09 AT AT08745329T patent/ATE510897T1/de not_active IP Right Cessation
- 2008-04-09 EP EP08745329A patent/EP2137277B1/en active Active
- 2008-04-09 WO PCT/US2008/059696 patent/WO2008127923A2/en not_active Ceased
- 2008-04-09 KR KR1020097023461A patent/KR101467602B1/ko active Active
- 2008-04-09 US US12/099,804 patent/US8097119B2/en active Active
- 2008-04-09 CN CN2008800199253A patent/CN101679828B/zh active Active
- 2008-04-09 BR BRPI0809752A patent/BRPI0809752B1/pt active IP Right Grant
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Also Published As
| Publication number | Publication date |
|---|---|
| ATE510897T1 (de) | 2011-06-15 |
| JP5390505B2 (ja) | 2014-01-15 |
| KR101467602B1 (ko) | 2014-12-01 |
| BRPI0809752A2 (pt) | 2014-09-30 |
| KR20100016407A (ko) | 2010-02-12 |
| CN101679828B (zh) | 2012-07-25 |
| JP2010523800A (ja) | 2010-07-15 |
| EP2137277A2 (en) | 2009-12-30 |
| US20120103517A1 (en) | 2012-05-03 |
| WO2008127923A2 (en) | 2008-10-23 |
| CN101679828A (zh) | 2010-03-24 |
| US8585861B2 (en) | 2013-11-19 |
| US8097119B2 (en) | 2012-01-17 |
| WO2008127923A3 (en) | 2009-04-23 |
| US20080251202A1 (en) | 2008-10-16 |
| EP2137277B1 (en) | 2011-05-25 |
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