CN101679828B - 耐热性结构环氧树脂 - Google Patents

耐热性结构环氧树脂 Download PDF

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Publication number
CN101679828B
CN101679828B CN2008800199253A CN200880019925A CN101679828B CN 101679828 B CN101679828 B CN 101679828B CN 2008800199253 A CN2008800199253 A CN 2008800199253A CN 200880019925 A CN200880019925 A CN 200880019925A CN 101679828 B CN101679828 B CN 101679828B
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China
Prior art keywords
rubber
structural adhesive
weight
adhesive
epoxy resin
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Chinese (zh)
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CN101679828A (zh
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格伦·G·伊尔高
安德烈斯·卢茨
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DDP Specialty Electronic Materials US LLC
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Dow Global Technologies LLC
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN2008800199253A 2007-04-11 2008-04-09 耐热性结构环氧树脂 Active CN101679828B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US92287707P 2007-04-11 2007-04-11
US60/922,877 2007-04-11
PCT/US2008/059696 WO2008127923A2 (en) 2007-04-11 2008-04-09 Heat-resistant structural epoxy resins

Publications (2)

Publication Number Publication Date
CN101679828A CN101679828A (zh) 2010-03-24
CN101679828B true CN101679828B (zh) 2012-07-25

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CN2008800199253A Active CN101679828B (zh) 2007-04-11 2008-04-09 耐热性结构环氧树脂

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US (2) US8097119B2 (enExample)
EP (1) EP2137277B1 (enExample)
JP (1) JP5390505B2 (enExample)
KR (1) KR101467602B1 (enExample)
CN (1) CN101679828B (enExample)
AT (1) ATE510897T1 (enExample)
BR (1) BRPI0809752B1 (enExample)
WO (1) WO2008127923A2 (enExample)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BRPI0911723A2 (pt) * 2008-07-29 2015-10-06 Dow Global Technologies Llc painel veicular reforçado, método para preparar um painel veicular reforçado, estrutura de carroceria veicular e método para preparar uma estrutura de carroceria veicular
EP2475730B1 (en) 2009-09-11 2014-10-08 3M Innovative Properties Company Curable and cured adhesive compositions
KR101719019B1 (ko) 2009-09-11 2017-03-22 쓰리엠 이노베이티브 프로퍼티즈 컴파니 경화성 및 경화된 접착제 조성물
US20110294963A1 (en) * 2010-05-27 2011-12-01 Far East University Method of toughening epoxy resin and toughened epoxy resin composite
US20120299216A1 (en) * 2010-07-01 2012-11-29 Westech Aerosol Corporation Vacuum Infusion Adhesive and Methods Related Thereto
US9624411B2 (en) 2010-07-01 2017-04-18 David W. Carnahan Vacuum infusion adhesive and methods related thereto
JP5784134B2 (ja) 2010-11-12 2015-09-24 スリーエム イノベイティブ プロパティズ カンパニー 硬化性組成物
KR101794389B1 (ko) 2010-11-12 2017-11-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 경화성 조성물 및 경화된 조성물
US20140150970A1 (en) 2010-11-19 2014-06-05 Ppg Industries Ohio, Inc. Structural adhesive compositions
US8796361B2 (en) 2010-11-19 2014-08-05 Ppg Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
US20120129980A1 (en) * 2010-11-19 2012-05-24 Ppg Industries Ohio, Inc. Structural adhesive compositions
US9074040B2 (en) * 2010-12-20 2015-07-07 Mitsui Chemicals, Inc. Curable adhesive compositions
CN103732647B (zh) * 2011-08-22 2017-08-11 陶氏环球技术有限责任公司 增韧剂和增韧的环氧粘合剂
CN102391816B (zh) * 2011-10-15 2013-07-03 北京天诚宇新材料技术有限公司 一种高温修补剂
US9346983B2 (en) * 2012-03-23 2016-05-24 Dow Global Technologies Llc Flame retardant structural epoxy resin adhesives and process for bonding metal members
JP6173424B2 (ja) * 2012-03-23 2017-08-02 ダウ グローバル テクノロジーズ エルエルシー 応力耐久性が高い破壊耐久性接着剤
US11008505B2 (en) 2013-01-04 2021-05-18 Carbo Ceramics Inc. Electrically conductive proppant
CN103317582B (zh) * 2013-04-23 2016-01-06 浙江林碳木业科技有限公司 一种带有表面凹凸立体浮雕效果的指接板的制造方法
EP2989177A4 (en) 2013-04-26 2016-12-28 Carbo Ceramics Inc COMPOSITIONS AND METHODS FOR USE OF A SUPPORT SURFACE CHEMISTRY TO IMPROVE SUPPORT CONSOLIDATION AND FLOW CONTROL
US10047254B2 (en) 2013-09-23 2018-08-14 Bondek Corporation Curable composite manufacturing adhesive
JP6302207B2 (ja) * 2013-10-16 2018-03-28 株式会社カネカ 車両用部材の製造方法
EP3428214B1 (en) * 2013-10-29 2019-09-04 Kaneka Corporation Polymer fine particle-containing curable resin composition having improved storage stability
CN103665324B (zh) * 2013-11-14 2015-10-07 昆山珍实复合材料有限公司 一种环氧树脂潜伏性固化剂及相应的环氧树脂涂料
GB201411586D0 (en) * 2014-06-30 2014-08-13 Hexcel Composites Ltd Adhesive composition
US20170107408A1 (en) * 2014-07-08 2017-04-20 Dow Europe Gmbh DELAYED CURING HIGH Tg CRASH DURABLE ADHESIVE
CA2957758A1 (en) 2014-08-12 2016-02-18 3M Innovative Properties Company Film adhesive
CN104356985B (zh) * 2014-10-15 2016-08-10 安徽蓝翔电器成套设备有限公司 变压器灌封胶及其制备方法和应用
CN104293270B (zh) * 2014-10-31 2015-11-04 浙江红高梁木业有限公司 一种用于木地板的环氧树脂胶粘剂及其制备方法
CN107614657A (zh) 2015-03-27 2018-01-19 卡博陶粒有限公司 用于使用支撑剂表面化学和内部孔隙率来固结支撑剂微粒的方法和组合物
US10017673B2 (en) * 2015-04-09 2018-07-10 Kaneka Corporation Polymer fine particle-containing curable resin composition having improved bonding strength against impact peeling
CN107567486A (zh) 2015-05-01 2018-01-09 洛德公司 用于橡胶粘接的粘合剂
CN105062393B (zh) * 2015-07-30 2017-08-04 烟台德邦科技有限公司 一种快速粘接且快速分离的胶粘剂及其制备方法
JP6923514B2 (ja) * 2015-09-10 2021-08-18 ダウ グローバル テクノロジーズ エルエルシー 高アスペクト比充填剤を伴う高弾性強靭化一液型エポキシ構造用接着剤
CN106589805A (zh) * 2015-10-14 2017-04-26 中国石油化工股份有限公司 一种增韧复合环氧树脂组成物及其制备方法
EP3170877B1 (en) 2015-11-19 2020-11-18 3M Innovative Properties Company Structural adhesive with improved failure mode
EP3170860B1 (en) 2015-11-19 2020-07-29 3M Innovative Properties Company Structural adhesive with improved corrosion resistance
US10377928B2 (en) 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10351661B2 (en) 2015-12-10 2019-07-16 Ppg Industries Ohio, Inc. Method for producing an aminimide
WO2017109620A1 (en) * 2015-12-22 2017-06-29 Aditya Birla Chemicals Thailand Epoxy Division An epoxy resin component for an adhesive composition
KR102273036B1 (ko) * 2016-03-09 2021-07-05 가부시끼가이샤 쓰리본드 경화성 수지 조성물, 연료 전지 및 씰링 방법
JP6955661B2 (ja) * 2016-06-28 2021-10-27 株式会社スリーボンド エポキシ樹脂組成物
US10865297B2 (en) * 2016-07-14 2020-12-15 Threebond Co., Ltd. Curable resin composition, cured product, fuel cell, and sealing method
CN106674944A (zh) * 2016-12-06 2017-05-17 云南光电辅料有限公司 一种不饱和聚酯复合材料及其分解回收方法
JP6872944B2 (ja) 2017-03-27 2021-05-19 セメダイン株式会社 低温加熱硬化型構造用接着剤組成物
KR101967043B1 (ko) * 2017-05-12 2019-04-08 부산대학교 산학협력단 높은 연신율 및 내충격성을 갖는 구조용 접착제 조성물
EP3642292B2 (en) 2017-06-23 2025-07-02 DDP Specialty Electronic Materials US, LLC High temperature epoxy adhesive formulations
CN110753722A (zh) 2017-06-29 2020-02-04 陶氏环球技术有限责任公司 环氧树脂-纤维增强复合材料、形成复合材料的方法以及用于复合材料的环氧树脂组合物
US20210130663A1 (en) * 2017-09-12 2021-05-06 Ddp Specialty Electronics Materials Us, Inc. One-component toughened epoxy adhesives
JP7299058B2 (ja) * 2018-04-27 2023-06-27 ナガセケムテックス株式会社 接着剤
WO2019236377A1 (en) 2018-06-05 2019-12-12 Dow Global Technologies Llc Method for recycling epoxy-fiber composites into polyolefins
JP7138764B2 (ja) 2018-07-25 2022-09-16 エルジー・ケム・リミテッド 接着剤組成物
KR102183704B1 (ko) 2018-07-25 2020-11-27 주식회사 엘지화학 접착제 조성물
CN112449650B (zh) 2018-07-25 2023-03-28 株式会社Lg化学 粘合剂组合物
WO2020022801A1 (ko) * 2018-07-25 2020-01-30 주식회사 엘지화학 접착제 조성물
US12173194B2 (en) 2018-07-25 2024-12-24 Lg Chem, Ltd. Adhesive composition
WO2020022798A1 (ko) 2018-07-25 2020-01-30 주식회사 엘지화학 접착제 조성물
EP3825377B1 (en) 2018-07-25 2022-11-02 LG Chem, Ltd. Adhesive composition
EP3798246B1 (en) * 2019-09-27 2024-01-31 Henkel AG & Co. KGaA One component (1k) composition based on modified epoxy resin
JPWO2022050005A1 (enExample) * 2020-09-07 2022-03-10
FR3118966B1 (fr) * 2021-01-18 2024-03-01 Gaztransport Et Technigaz Composition d’adhésif époxy comprenant des nanoparticules d’élastomère, et leurs utilisations
US12110425B2 (en) 2021-08-17 2024-10-08 Uniseal, Inc. Electromagnetic curable novel toughened epoxy-hybrid structural adhesives and applications using the same
EP4148098A1 (en) * 2021-09-08 2023-03-15 Sika Technology AG Expandable one-component thermosetting epoxy adhesive with improved adhesion
WO2024262261A1 (ja) * 2023-06-22 2024-12-26 株式会社スリーボンド エポキシ樹脂組成物およびその硬化物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4594291A (en) * 1984-07-17 1986-06-10 The Dow Chemical Company Curable, partially advanced epoxy resins
CN1784444A (zh) * 2003-03-11 2006-06-07 汉斯化学股份公司 聚合环氧树脂组合物
CN1816606A (zh) * 2003-07-07 2006-08-09 陶氏环球技术公司 粘合剂环氧组合物及其施用方法
CN1930206A (zh) * 2004-03-12 2007-03-14 陶氏环球技术公司 环氧粘合剂组合物

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2006207A (en) * 1930-01-25 1935-06-25 Combustion Utilities Corp Oil-soluble synthetic resin and process for its manufacture
JPS59196377A (ja) * 1983-04-22 1984-11-07 Yokohama Rubber Co Ltd:The 構造用接着剤
US4948449A (en) * 1986-05-07 1990-08-14 Minnesota Mining And Manufacturing Company Epoxy resin composition
US5278257A (en) 1987-08-26 1994-01-11 Ciba-Geigy Corporation Phenol-terminated polyurethane or polyurea(urethane) with epoxy resin
DE3818692A1 (de) 1988-06-01 1989-12-07 Bayer Ag Verwendung von 1,1,1,4,4,4-hexafluorbutan als treib- und daemmgas fuer die herstellung von kunststoff-schaumstoffen
US5202390A (en) 1988-07-28 1993-04-13 Ciba-Geigy Corporation Butadiene/polar comonomer copolymer and aromatic reactive end group-containing prepolymer
US5290857A (en) * 1991-09-04 1994-03-01 Nippon Zeon Co., Ltd. Epoxy resin adhesive composition
JP3655646B2 (ja) 1993-05-24 2005-06-02 日産自動車株式会社 エポキシ樹脂用接着補強剤及び該補強剤を含有する自動車用エポキシ樹脂系構造接着性組成物
JP3229467B2 (ja) * 1993-12-03 2001-11-19 三菱レイヨン株式会社 エポキシ樹脂組成物
US20040181013A1 (en) 1998-10-06 2004-09-16 Henkel Teroson Gmbh Impact resistant epoxide resin compositions
DE19858921A1 (de) 1998-12-19 2000-06-21 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
KR20010081833A (ko) * 2000-02-19 2001-08-29 권문구 유리전이온도 조정에 의한 반도체 패키지용 드라이 패드형탄성접착제의 탄성률 고안
JP2004515565A (ja) 2000-04-10 2004-05-27 ヘンケル・コマンディットゲゼルシャフト・アウフ・アクチエン 耐衝撃性エポキシ樹脂組成物
DE10163859A1 (de) 2001-12-22 2003-07-10 Henkel Kgaa Mehrphasige Strukturklebstoffe
US20030192643A1 (en) * 2002-03-15 2003-10-16 Rainer Schoenfeld Epoxy adhesive having improved impact resistance
US20030215588A1 (en) * 2002-04-09 2003-11-20 Yeager Gary William Thermoset composition, method, and article
EP1457509B1 (de) * 2003-03-11 2006-06-28 hanse chemie AG Polymere Epoxidharz-Zusammensetzung
CN100447196C (zh) 2003-06-09 2008-12-31 株式会社钟化 改性环氧树脂的制造方法
AU2003250972A1 (en) * 2003-07-14 2005-01-28 Mattex Leisure Industries Artificial turf filament and artificial turf system
EP1498441A1 (de) 2003-07-16 2005-01-19 Sika Technology AG Hitzehärtende Zusammensetzungen mit Tieftemperatur-Schlagzähigkeitsmodifikatoren
US20050215730A1 (en) 2004-03-24 2005-09-29 Rainer Schoenfeld Polycarboxy-functionalized prepolymers
EP1602702B2 (en) 2004-06-01 2020-09-16 Dow Global Technologies LLC Epoxy adhesive composition
EP1695990A1 (en) 2005-02-28 2006-08-30 Dow Global Technologies Inc. Two-component epoxy adhesive composition
ATE462762T1 (de) 2005-06-02 2010-04-15 Dow Global Technologies Inc Schlagzähmodifizierter strukturklebstoff auf epoxid basis
CA2620028C (en) * 2005-08-24 2014-01-28 Henkel Kommanditgesellschaft Auf Aktien Epoxy compositions having improved impact resistance

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4594291A (en) * 1984-07-17 1986-06-10 The Dow Chemical Company Curable, partially advanced epoxy resins
CN1784444A (zh) * 2003-03-11 2006-06-07 汉斯化学股份公司 聚合环氧树脂组合物
CN1816606A (zh) * 2003-07-07 2006-08-09 陶氏环球技术公司 粘合剂环氧组合物及其施用方法
CN1930206A (zh) * 2004-03-12 2007-03-14 陶氏环球技术公司 环氧粘合剂组合物

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
WOO NYON KIM.Thermal Behavior and Morphology of Rubber-Modified Epoxies.《Journal of Applied Polymer Science》.1993,第50卷1951-1957. *

Also Published As

Publication number Publication date
US8097119B2 (en) 2012-01-17
JP5390505B2 (ja) 2014-01-15
WO2008127923A3 (en) 2009-04-23
US8585861B2 (en) 2013-11-19
US20120103517A1 (en) 2012-05-03
US20080251202A1 (en) 2008-10-16
BRPI0809752A2 (pt) 2014-09-30
WO2008127923A2 (en) 2008-10-23
EP2137277B1 (en) 2011-05-25
CN101679828A (zh) 2010-03-24
BRPI0809752B1 (pt) 2017-05-16
JP2010523800A (ja) 2010-07-15
ATE510897T1 (de) 2011-06-15
EP2137277A2 (en) 2009-12-30
KR20100016407A (ko) 2010-02-12
KR101467602B1 (ko) 2014-12-01

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