CN104136516B - 阻燃结构环氧树脂粘合剂以及粘合金属构件的方法 - Google Patents
阻燃结构环氧树脂粘合剂以及粘合金属构件的方法 Download PDFInfo
- Publication number
- CN104136516B CN104136516B CN201380011788.XA CN201380011788A CN104136516B CN 104136516 B CN104136516 B CN 104136516B CN 201380011788 A CN201380011788 A CN 201380011788A CN 104136516 B CN104136516 B CN 104136516B
- Authority
- CN
- China
- Prior art keywords
- weight
- construction adhesive
- thermosetting
- welding
- hibbsite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/16—Resistance welding; Severing by resistance heating taking account of the properties of the material to be welded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/34—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/016—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0066—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3432—Six-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34922—Melamine; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/30—Iron, e.g. steel
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/387—Borates
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261614541P | 2012-03-23 | 2012-03-23 | |
US61/614,541 | 2012-03-23 | ||
PCT/US2013/033409 WO2013142751A2 (en) | 2012-03-23 | 2013-03-22 | Flame retardant structural epoxy resin adhesives and process for bonding metal members |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104136516A CN104136516A (zh) | 2014-11-05 |
CN104136516B true CN104136516B (zh) | 2016-06-01 |
Family
ID=48048282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380011788.XA Active CN104136516B (zh) | 2012-03-23 | 2013-03-22 | 阻燃结构环氧树脂粘合剂以及粘合金属构件的方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9346983B2 (zh) |
EP (1) | EP2828321B1 (zh) |
JP (1) | JP6240659B2 (zh) |
KR (1) | KR102097069B1 (zh) |
CN (1) | CN104136516B (zh) |
BR (1) | BR112014018126B1 (zh) |
WO (1) | WO2013142751A2 (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6301761B2 (ja) * | 2013-07-19 | 2018-03-28 | 三洋化成工業株式会社 | エポキシ樹脂組成物 |
WO2016025597A1 (en) | 2014-08-12 | 2016-02-18 | 3M Innovative Properties Company | Film adhesive |
JP5920431B2 (ja) * | 2014-09-19 | 2016-05-18 | 横浜ゴム株式会社 | 繊維強化複合材料用エポキシ樹脂組成物、繊維強化複合材料用エポキシ樹脂組成物の製造方法、プリプレグ及びハニカムパネル |
US10005935B2 (en) | 2015-05-01 | 2018-06-26 | Lord Corporation | Adhesive for rubber bonding |
ITUB20154910A1 (it) | 2015-10-19 | 2017-04-19 | Getters Spa | Curable adhesive compositions for flexible substrates Composizioni curabili adesive induribili per substrati flessibili |
US10116018B2 (en) * | 2016-01-07 | 2018-10-30 | GM Global Technology Operations LLC | Cure in place thermal interface material |
EP3275915B1 (en) * | 2016-07-29 | 2022-11-30 | 3M Innovative Properties Company | Non-halogeneous fast curing two-component epoxy adhesive with flame retardant properties |
EP3275914B1 (en) * | 2016-07-29 | 2022-05-11 | 3M Innovative Properties Company | Flame retardant adhesive composition |
EP3529328B1 (en) * | 2016-10-24 | 2020-06-24 | Dow Global Technologies LLC | Epoxy adhesive resistant to open bead humidity exposure |
JP6872944B2 (ja) * | 2017-03-27 | 2021-05-19 | セメダイン株式会社 | 低温加熱硬化型構造用接着剤組成物 |
KR102454520B1 (ko) | 2017-06-23 | 2022-10-17 | 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 | 고온 에폭시 접착 제형 |
GB2580283B (en) * | 2018-08-03 | 2022-02-23 | Gurit Uk Ltd | Fire-retardant epoxide resins and use thereof |
AU2019406816A1 (en) * | 2018-12-18 | 2021-07-01 | Cytec Industries Inc. | Flame-retardant epoxy composition and method of using the same |
CN110396385A (zh) * | 2019-07-25 | 2019-11-01 | 张家港爱科思汽车配件有限公司 | 一种阻燃型汽车用结构胶 |
WO2023183272A1 (en) * | 2022-03-22 | 2023-09-28 | Ddp Specialty Electronic Materials Us, Llc | Two-component thermally-conductive structural adhesive |
CN115651366B (zh) * | 2022-11-18 | 2023-09-12 | 江苏耀鸿电子有限公司 | 一种用于覆铜板的含氧化铝的树脂胶液及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0222298A2 (de) * | 1985-11-15 | 1987-05-20 | Bayer Ag | Füllstoffhaltige Intumeszenzmassen auf Epoxidharzbasis |
WO2011123356A2 (en) * | 2010-03-31 | 2011-10-06 | 3M Innovative Properties Company | Epoxy adhesive compositions comprising an adhesion promoter |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3686359A (en) | 1969-12-19 | 1972-08-22 | Union Carbide Corp | Curable polyepoxide compositions |
CA1240440A (en) | 1985-04-02 | 1988-08-09 | Madan H. Bagga | Curable compositions |
US5278257A (en) | 1987-08-26 | 1994-01-11 | Ciba-Geigy Corporation | Phenol-terminated polyurethane or polyurea(urethane) with epoxy resin |
DE3864484D1 (de) | 1987-08-26 | 1991-10-02 | Ciba Geigy Ag | Modifizierte epoxidharze. |
US5202390A (en) | 1988-07-28 | 1993-04-13 | Ciba-Geigy Corporation | Butadiene/polar comonomer copolymer and aromatic reactive end group-containing prepolymer |
GB8912952D0 (en) | 1989-06-06 | 1989-07-26 | Dow Rheinmuenster | Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones |
JP4029456B2 (ja) * | 1998-01-29 | 2008-01-09 | 日立化成工業株式会社 | 難燃性非ハロゲンエポキシ樹脂組成物、それを用いたプリプレグ及び電気配線板用積層板 |
JP2004189771A (ja) * | 2002-12-06 | 2004-07-08 | Fujikura Ltd | 難燃性接着混和物 |
US6936646B2 (en) * | 2003-04-30 | 2005-08-30 | Henkel Corporation | Flame-retardant molding compositions |
CA2789741C (en) | 2003-06-09 | 2014-11-04 | Kaneka Corporation | Process for producing modified epoxy resin |
BRPI0412062B1 (pt) | 2003-07-07 | 2015-09-29 | Dow Global Technologies Inc | Composição adesiva de epóxi |
EP1574537B2 (en) | 2004-03-12 | 2014-12-24 | Dow Global Technologies LLC | Epoxy adhesive composition |
EP1602702B2 (en) | 2004-06-01 | 2020-09-16 | Dow Global Technologies LLC | Epoxy adhesive composition |
DE102005016195A1 (de) * | 2005-04-08 | 2006-10-12 | Clariant Produkte (Deutschland) Gmbh | Stabilisiertes Flammschutzmittel |
ATE462762T1 (de) | 2005-06-02 | 2010-04-15 | Dow Global Technologies Inc | Schlagzähmodifizierter strukturklebstoff auf epoxid basis |
EP1916272A1 (de) | 2006-10-24 | 2008-04-30 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzung enthaltend ein blockiertes und ein epoxidterminiertes Polyurethanprepolymer |
EP1916270A1 (de) | 2006-10-24 | 2008-04-30 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzung mit blockiertem Polyurethanprepolymer |
EP1916285A1 (de) | 2006-10-24 | 2008-04-30 | Sika Technology AG | Derivatisiertes Epoxid-Festharz und dessen Verwendungen |
EP1916269A1 (de) | 2006-10-24 | 2008-04-30 | Sika Technology AG | Blockierte Polyurethanprepolymere und hitzehärtende Epoxidharzzusammensetzungen |
EP2137277B1 (en) | 2007-04-11 | 2011-05-25 | Dow Global Technologies LLC | Heat-resistant structural epoxy resins |
JP2008013773A (ja) * | 2007-08-09 | 2008-01-24 | Hitachi Chem Co Ltd | 難燃性非ハロゲンエポキシ樹脂組成物、それを用いたプリプレグ及び電気配線板用積層板 |
GB2472423B (en) * | 2009-08-05 | 2012-01-11 | Gurit Uk Ltd | Fire-retardant composite materials |
WO2012000171A1 (en) | 2010-06-29 | 2012-01-05 | Dow Global Technologies Llc | Storage-stable heat-activated tertiary amine catalysts for epoxy resins |
CN101921557B (zh) | 2010-08-30 | 2013-10-16 | 新高电子材料(中山)有限公司 | 无卤素阻燃粘合剂组合物及使用该组合物的挠性覆铜板 |
US20120301703A1 (en) * | 2011-05-27 | 2012-11-29 | Joseph Labock | Labock fire resistant paint |
-
2013
- 2013-03-22 EP EP13714483.8A patent/EP2828321B1/en active Active
- 2013-03-22 BR BR112014018126-8A patent/BR112014018126B1/pt active IP Right Grant
- 2013-03-22 US US14/368,916 patent/US9346983B2/en active Active
- 2013-03-22 CN CN201380011788.XA patent/CN104136516B/zh active Active
- 2013-03-22 WO PCT/US2013/033409 patent/WO2013142751A2/en active Application Filing
- 2013-03-22 JP JP2015501925A patent/JP6240659B2/ja active Active
- 2013-03-22 KR KR1020147026375A patent/KR102097069B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0222298A2 (de) * | 1985-11-15 | 1987-05-20 | Bayer Ag | Füllstoffhaltige Intumeszenzmassen auf Epoxidharzbasis |
WO2011123356A2 (en) * | 2010-03-31 | 2011-10-06 | 3M Innovative Properties Company | Epoxy adhesive compositions comprising an adhesion promoter |
Also Published As
Publication number | Publication date |
---|---|
US9346983B2 (en) | 2016-05-24 |
BR112014018126B1 (pt) | 2021-07-13 |
JP2015518065A (ja) | 2015-06-25 |
KR102097069B1 (ko) | 2020-04-06 |
BR112014018126A2 (pt) | 2017-06-20 |
BR112014018126A8 (pt) | 2017-07-11 |
US20150025176A1 (en) | 2015-01-22 |
EP2828321A2 (en) | 2015-01-28 |
JP6240659B2 (ja) | 2017-11-29 |
EP2828321B1 (en) | 2016-04-27 |
KR20140138761A (ko) | 2014-12-04 |
CN104136516A (zh) | 2014-11-05 |
WO2013142751A3 (en) | 2014-06-26 |
WO2013142751A2 (en) | 2013-09-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104136516B (zh) | 阻燃结构环氧树脂粘合剂以及粘合金属构件的方法 | |
CN102648262B (zh) | 含有用酮肟封端的弹性增韧剂的结构环氧树脂胶粘剂 | |
CN101679579B (zh) | 对温度变化的敏感性非常低的耐碰撞环氧粘合剂 | |
CN102119201B (zh) | 含有用酚和羟基封端的丙烯酸酯或羟基封端的甲基丙烯酸酯封端的弹性体增韧剂的单组分结构环氧树脂粘合剂 | |
KR102626998B1 (ko) | 높은 종횡비의 충전제를 갖는 높은 모듈러스의 강인화된 1성분 에폭시 구조용 접착제 | |
EP2828308B1 (en) | Crash-durable adhesive with enhanced stress durability | |
CN103180400B (zh) | 含有用酚、多酚或氨基酚化合物封端的扩链弹性体增韧剂的结构环氧树脂粘合剂 | |
US8097119B2 (en) | Heat-resistant structural epoxy resins | |
CN102333837A (zh) | 包含二聚脂肪酸/环氧树脂加合物和多元醇的单组分环氧树脂结构粘合剂 | |
CN107922583A (zh) | 具有改进的对油性表面的粘附力和高抗冲掉性的单组分增韧环氧粘合剂 | |
CN111315839A (zh) | 室温可固化的双组分增韧的环氧粘合剂 | |
WO2018156450A1 (en) | One-component toughened epoxy adhesives containing a mixture of latent curing agents | |
CN111630130B (zh) | 单组分增韧的环氧胶粘剂 | |
US10815405B2 (en) | One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same | |
WO2020256902A1 (en) | One-component toughened epoxy adhesives with improved humidity resistance |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Delaware Patentee after: DDP special electronic materials USA Co.,Ltd. Address before: Delaware Patentee before: DDP special electronic materials American Co. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230414 Address after: Delaware Patentee after: THE DOW CHEMICAL Co. Address before: Michigan, USA Patentee before: Dow Global Technologies Llc Effective date of registration: 20230414 Address after: Delaware Patentee after: DDP special electronic materials American Co. Address before: Delaware Patentee before: THE DOW CHEMICAL Co. |