MY156527A - Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product - Google Patents

Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product

Info

Publication number
MY156527A
MY156527A MYPI2012002646A MYPI2012002646A MY156527A MY 156527 A MY156527 A MY 156527A MY PI2012002646 A MYPI2012002646 A MY PI2012002646A MY PI2012002646 A MYPI2012002646 A MY PI2012002646A MY 156527 A MY156527 A MY 156527A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
resin composition
cured product
production
same
Prior art date
Application number
MYPI2012002646A
Inventor
Kaji Masashi
Ogami Koichiro
Original Assignee
Nippon Steel & Sumikin Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel & Sumikin Chem Co filed Critical Nippon Steel & Sumikin Chem Co
Publication of MY156527A publication Critical patent/MY156527A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols

Abstract

PROVIDED ARE AN EPOXY RESIN WHICH IS EXCELLENT IN LOW VISCOSITY AND HANDLING PROPERTY AS A SOLID, IS EXCELLENT IN HEAT RESISTANCE, MOISTURE RESISTANCE, AND THERMAL CONDUCTIVITY AS WELL, AND IS USEFUL FOR APPLICATIONS SUCH AS LAMINATION, MOLDING, CASTING, AND ADHESION, AN EPOXY RESIN COMPOSITION USING THE RESIN, AND A CURED PRODUCT OF THE COMPOSITION. THE EPOXY RESIN IS REPRESENTED BY THE FOLLOWING GENERAL FORMULA (1), EXHIBITS AN ENDOTHERMIC PEAK TEMPERATURE RANGING FROM 100 TO 150°C BASED ON A MELTING POINT IN DIFFERENTIAL SCANNING CALORIMETRY, AND IS CRYSTALLINE. FURTHER, THE EPOXY RESIN COMPOSITION INCLUDES AS ESSENTIAL COMPONENTS THE EPOXY RESIN AND A CURING AGENT. IN THE GENERAL FORMULA (1), N REPRESENTS 0.2 TO 4.0 AS AN AVERAGE, AND G REPRESENTS A GLYCIDYL GROUP.
MYPI2012002646A 2009-12-14 2010-12-13 Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product MY156527A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009282740 2009-12-14

Publications (1)

Publication Number Publication Date
MY156527A true MY156527A (en) 2016-02-26

Family

ID=44167269

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012002646A MY156527A (en) 2009-12-14 2010-12-13 Epoxy resin, process for production thereof, epoxy resin composition using same, and cured product

Country Status (7)

Country Link
JP (1) JP5166610B2 (en)
KR (1) KR101752222B1 (en)
CN (1) CN102656204B (en)
MY (1) MY156527A (en)
SG (1) SG181697A1 (en)
TW (1) TWI494338B (en)
WO (1) WO2011074517A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013136685A1 (en) * 2012-03-16 2013-09-19 住友ベークライト株式会社 Sealing resin composition and electronic device using same
JP2013209503A (en) * 2012-03-30 2013-10-10 Nippon Steel & Sumikin Chemical Co Ltd Epoxy resin composition and cured product thereof
KR101385005B1 (en) * 2012-04-25 2014-04-16 국도화학 주식회사 EMC and epoxy composition
JPWO2014065152A1 (en) * 2012-10-26 2016-09-08 新日鉄住金化学株式会社 Epoxy resin composition, method for producing cured epoxy resin, and semiconductor device
JP2017095524A (en) * 2014-03-28 2017-06-01 新日鉄住金化学株式会社 Epoxy resin, epoxy resin composition and cured article
CN104269096B (en) * 2014-09-19 2018-08-10 黄海龙 The construction method of digital virtual fetus systemic arterial system
JP6426966B2 (en) * 2014-10-06 2018-11-21 日鉄ケミカル＆マテリアル株式会社 Semiconductor sealing resin composition and semiconductor device
TWI728084B (en) * 2016-03-30 2021-05-21 日商日鐵化學材料股份有限公司 Polyvalent hydroxy resin, its manufacturing method, epoxy resin, epoxy resin composition and its hardened product
WO2018181813A1 (en) * 2017-03-31 2018-10-04 日立化成株式会社 Epoxy resin composition and electronic component device
CN107457951B (en) * 2017-08-08 2019-04-09 哈尔滨工业大学 A kind of restructural thermosetting property multiple stimulation composite material of shape memory preparation method
JP2019104821A (en) 2017-12-12 2019-06-27 日鉄ケミカル＆マテリアル株式会社 Epoxy resin composition and cured product of the same
WO2019171993A1 (en) * 2018-03-09 2019-09-12 日鉄ケミカル＆マテリアル株式会社 Epoxy resin composition and cured product of same
JP7059132B2 (en) 2018-06-29 2022-04-25 日鉄ケミカル＆マテリアル株式会社 Manufacturing method of multivalent hydroxy resin
JP7277136B2 (en) 2018-12-28 2023-05-18 日鉄ケミカル＆マテリアル株式会社 Epoxy resin, epoxy resin composition, and cured product thereof
KR20240026887A (en) 2021-06-30 2024-02-29 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 Epoxy resin, epoxy resin composition, and cured product thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3205566B2 (en) * 1991-02-08 2001-09-04 新日鐵化学株式会社 Polyfunctional epoxy resin and method for producing the same
JP3227180B2 (en) * 1991-08-19 2001-11-12 新日鐵化学株式会社 Multifunctional epoxy resin, intermediate thereof, and method for producing the same
JP2952094B2 (en) * 1991-10-30 1999-09-20 新日鐵化学株式会社 Epoxy compound
JP3122834B2 (en) * 1994-09-20 2001-01-09 明和化成株式会社 New phenol novolak condensate
JPH08239454A (en) * 1995-03-03 1996-09-17 Nippon Kayaku Co Ltd Novolac resin, epoxy resin, epoxy resin composition and cured product thereof
JP2000344858A (en) * 1999-03-16 2000-12-12 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device sealed therewith
JP5127160B2 (en) * 2006-05-19 2013-01-23 日本化薬株式会社 Epoxy resin, curable resin composition, and cured product thereof
CN102083881B (en) 2008-03-03 2013-01-23 新日铁化学株式会社 Modified epoxy resin, epoxy resin compositions and cured articles
JP5433294B2 (en) * 2009-04-30 2014-03-05 エア・ウォーター株式会社 Dihydroxynaphthalene-based polymer, production method thereof and use thereof

Also Published As

Publication number Publication date
KR20120115301A (en) 2012-10-17
TWI494338B (en) 2015-08-01
CN102656204A (en) 2012-09-05
WO2011074517A1 (en) 2011-06-23
CN102656204B (en) 2014-08-27
KR101752222B1 (en) 2017-06-29
TW201144347A (en) 2011-12-16
JP5166610B2 (en) 2013-03-21
SG181697A1 (en) 2012-07-30
JPWO2011074517A1 (en) 2013-04-25

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