JPWO2011074517A1 - Epoxy resin, production method thereof, epoxy resin composition and cured product using the same - Google Patents

Abstract

Epoxy resin that has low viscosity and excellent handleability as a solid, and has excellent heat resistance, moisture resistance, and thermal conductivity, and is useful for applications such as lamination, molding, casting, and adhesion An epoxy resin composition and a cured product are used. The epoxy resin of the present invention is an epoxy resin having crystallinity represented by the following general formula (1) and having an endothermic peak temperature based on the melting point in the differential scanning calorimetry in the range of 100 to 150 ° C. Moreover, the epoxy resin composition of this invention is an epoxy resin composition which contains this epoxy resin and a hardening | curing agent as an essential component. In General formula (1), n shows 0.2-4.0 as an average value, G shows a glycidyl group.

Description

  The present invention relates to a crystalline epoxy resin, a production method thereof, an epoxy resin composition using the same, and a cured product.

  In recent years, particularly with the advancement of the advanced material field, development of higher performance base resins has been demanded. For example, in the field of semiconductor encapsulation, a base resin excellent in high heat resistance and thermal decomposition stability is demanded due to the progress of on-vehicle semiconductors. On the other hand, since high-density mounting is also progressing, an increase in the filling rate of the inorganic filler is aimed at, and a reduction in the viscosity of the base resin is also strongly demanded. Moreover, the improvement of the high temperature reliability for corresponding to a severe use environment is requested | required, and the improvement of thermal conductivity is also requested | required from a viewpoint of heat dissipation improvement.

  However, no epoxy resin known so far has yet been found to satisfy these requirements. For example, Patent Document 1 proposes a naphthol aralkyl type epoxy resin having excellent heat resistance and moisture resistance, but is not sufficient in terms of heat resistance, and has a high viscosity and a high filling rate of an inorganic filler. Not suitable for conversion. In addition, Patent Document 2 discloses an aralkyl-type epoxy resin in which 4,4′-dihydroxybiphenyl is linked by a p-xylylene group as having excellent heat resistance. However, it has high moisture resistance and flame resistance. There's a problem. Patent Document 3 discloses a biphenyl aralkyl type epoxy resin having a structure in which a bisphenol compound is linked by a biphenylene group. However, it is a resinous material having no crystallinity, and has a high viscosity and softening point, thereby improving moldability. There was a problem.

JP-A-1-252624 JP-A-4-255714 JP-A-8-239454

  Accordingly, the object of the present invention is to have low viscosity and excellent handleability as a solid, as well as excellent performance in heat resistance, moisture resistance, and thermal conductivity, such as lamination, molding, casting and adhesion. It is an object to provide an epoxy resin useful for the above, an epoxy resin composition using the same, and a cured product thereof.

（但し、ｎは平均値として０．２〜４．０を示し、Ｇはグリシジル基を示す。）That is, the present invention relates to an epoxy resin having crystallinity represented by the following general formula (1) and having an endothermic peak temperature in the range of 100 to 150 ° C. based on the melting point in differential scanning calorimetry.

(However, n represents an average value of 0.2 to 4.0, and G represents a glycidyl group.)

（但し、Ｘは水酸基、ハロゲン原子又は炭素数１〜６のアルコキシ基を示す。）

（但し、ｎは平均値として０．２〜４．０を示す。）In addition, the present invention reacts 0.1 to 0.4 mol of a biphenyl condensing agent represented by the following general formula (2) with respect to 1 mol of 4,4′-dihydroxybiphenyl, to give the following general formula (3 Epoxy resin having a crystallinity in which the endothermic peak temperature based on the melting point in the differential scanning calorimetry obtained by reacting it with epichlorohydrin is in the range of 100 to 150 ° C. It relates to resin.

(However, X shows a hydroxyl group, a halogen atom, or a C1-C6 alkoxy group.)

(However, n represents an average value of 0.2 to 4.0.)

  Furthermore, the present invention relates to an epoxy resin composition comprising an epoxy resin and a curing agent, the epoxy resin composition containing the above epoxy resin as an epoxy resin component, and a cured product obtained by curing the epoxy resin composition. .

3 is a GPC chart of the resin obtained in Reference Example 1. 2 is a GPC chart of the resin obtained in Example 1. 2 is a DSC chart of the resin obtained in Example 1.

  Hereinafter, the present invention will be described in detail.

  The epoxy resin of the present invention is a mixture of components represented by the general formula (1) and having different values of the repeating unit n. Here, n shows 0.2-4.0 as an average value. If it is smaller than this, the crystallinity becomes stronger and the melting point becomes higher, so that the handleability is lowered. When larger than this, crystallinity will fall, a viscosity will become high and a moldability will fall. From the viewpoint of low viscosity, handleability, and moldability, the content of n = 0 bodies is preferably in the range of 30 to 60%. The average value of n as used herein refers to the number average value.

  The epoxy resin of the present invention has crystallinity and is crystallized in a solid state. The crystalline solid has an endothermic peak temperature based on the melting point in differential scanning calorimetry measured at a heating rate of 10 ° C./min in the range of 100 to 150 ° C., preferably 120 to 150 ° C. When higher than this, compatibility with the hardening | curing agent at the time of adjusting an epoxy resin composition will fall, and when lower than this, problems, such as blocking of an epoxy resin composition, will generate | occur | produce and handleability will fall. Depending on the crystalline state of the epoxy resin, there may be a plurality of melting point peaks, but the endothermic peak temperature referred to here indicates the one corresponding to the largest peak. The peak endotherm is considered to indicate the degree of crystallinity, but is usually in the range of 20 to 80 J / g in terms of resin component. If it is smaller than this, the degree of crystallinity is low and the handleability is lowered.

  The epoxy resin of the present invention can be obtained by reacting a polyvalent hydroxy resin represented by the general formula (3) with epichlorohydrin. However, in the invention of the epoxy resin, the production method is not limited thereto. However, by explaining the invention of the production method, it becomes easier to understand the epoxy resin of the present invention. Therefore, the production method of the polyvalent hydroxy resin and the epoxy resin which are raw materials of the epoxy resin will be explained.

  The polyvalent hydroxy resin represented by the general formula (3) is a mixture of components having different values of n, and n is an average value of 0.2 to 4.0. If it is smaller than this, the crystallinity becomes strong, the solubility in epichlorohydrin at the time of synthesizing the epoxy resin is lowered, the melting point of the obtained epoxy resin is increased, and the handleability is lowered. When larger than this, crystallinity will fall, a viscosity will become high and a moldability will fall. From the viewpoint of low viscosity, handleability, and moldability, the content of n = 0 bodies is preferably in the range of 30 to 60%.

  Such a polyvalent hydroxy resin can be obtained by reacting 4,4'-dihydroxybiphenyl with a biphenyl condensing agent represented by the general formula (2).

  In General formula (2), X shows a hydroxyl group, a halogen atom, or a C1-C6 alkoxy group. Specifically, 4,4′-bishydroxymethylbiphenyl, 4,4′-bischloromethylbiphenyl, 4,4′-bisbromomethylbiphenyl, 4,4′-bismethoxymethylbiphenyl, 4,4′- Bisethoxymethylbiphenyl is mentioned. From the viewpoint of reactivity, 4,4′-bishydroxymethylbiphenyl and 4,4′-bischloromethylbiphenyl are preferable. From the viewpoint of reducing ionic impurities, 4,4′-bishydroxymethylbiphenyl, 4 4,4'-bismethoxymethylbiphenyl is preferred.

  The molar ratio at the time of reacting must be 1 mol or less of biphenyl condensing agent with respect to 1 mol of 4,4′-dihydroxybiphenyl, and generally ranges from 0.1 to 0.5 mol. More preferably, it is the range of 0.2-0.4 mol. If it is less than this, the crystallinity becomes strong, the solubility in epichlorohydrin when synthesizing the epoxy resin is lowered, the melting point of the obtained epoxy resin is increased, and the handleability is lowered. On the other hand, if the amount is larger than this, the crystallinity of the resin is lowered and the softening point and the melt viscosity are increased, which hinders handling workability and moldability.

  When 4,4'-bischloromethylbiphenyl is used as the condensing agent, the reaction can be carried out in the absence of a catalyst, but usually the condensation reaction is carried out in the presence of an acidic catalyst. The acidic catalyst can be appropriately selected from known inorganic acids and organic acids. For example, mineral acids such as hydrochloric acid, sulfuric acid, phosphoric acid, formic acid, oxalic acid, trifluoroacetic acid, p-toluenesulfonic acid, metasulfone Examples thereof include organic acids such as acid and trifluorometasulfonic acid, Lewis acids such as zinc chloride, aluminum chloride, iron chloride, and boron trifluoride, and solid acids.

  This reaction is carried out at 10 to 250 ° C. for 1 to 20 hours. In the reaction, alcohols such as methanol, ethanol, propanol, butanol, ethylene glycol, methyl cellosolve and ethyl cellosolve, and aromatic compounds such as benzene, toluene, chlorobenzene and dichlorobenzene can be used as a solvent. . After completion of the reaction, the solvent or water and alcohol produced by the condensation reaction are removed as necessary.

  The polyvalent hydroxy resin thus obtained can be used as an epoxy resin curing agent in addition to being used as a raw material for an epoxy resin. Furthermore, it can be applied as a phenol resin molding material by combining with a curing agent such as hexamine.

  The method for producing the epoxy resin of the present invention by the reaction of the polyvalent hydroxy resin represented by the general formula (3) and epichlorohydrin will be described. This reaction can be performed in the same manner as a well-known epoxidation reaction.

  For example, after the polyvalent hydroxy resin represented by the general formula (3) is dissolved in excess epichlorohydrin, it is 50 to 150 ° C., preferably 60 in the presence of an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide. The method of making it react for 1 to 10 hours in the range of -120 degreeC is mentioned. In this case, the amount of epichlorohydrin used is in the range of 0.8 to 2 mol, preferably 0.9 to 1.2 mol, relative to 1 mol of the hydroxyl group in the polyvalent hydroxy resin. Excess epichlorohydrin was distilled off after completion of the reaction, the residue was dissolved in a solvent such as toluene and methyl isobutyl ketone, filtered, washed with water to remove inorganic salts, and then the solvent was distilled off to remove the general formula ( The target epoxy resin represented by 1) can be obtained. When performing the epoxidation reaction, a catalyst such as a quaternary ammonium salt may be used.

The purity of the epoxy resin of the present invention, in particular the amount of hydrolyzable chlorine, is better from the viewpoint of improving the reliability of the applied electronic component. Although it does not specifically limit, Preferably it is 1000 ppm or less, More preferably, it is 500 ppm or less. In addition, the hydrolyzable chlorine as used in the field of this invention means the value measured by the following method. That is, the potential difference the sample 0.5g were dissolved in dioxane 30 ml, 1N-KOH, after the added boiled under reflux for 30 minutes 10 ml, cooled to room temperature, 80% aqueous acetone 100ml was added, with 0.002 N-AgNO ₃ aqueous solution This is a value obtained by titration.

  The epoxy resin composition of the present invention contains an epoxy resin and a curing agent, and contains an epoxy resin of the above general formula (1) as an epoxy resin component.

  In addition to the epoxy resin of the general formula (1) used as an essential component, the epoxy resin composition of the present invention may be used in combination with other ordinary epoxy resins having two or more epoxy groups in the molecule. Examples include bisphenol A, bisphenol F, 3,3 ′, 5,5′-tetramethyl-4,4′-dihydroxydiphenylmethane, 4,4′-dihydroxydiphenylsulfone, 4,4′-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl ketone, fluorene bisphenol, 4,4'-biphenol, 3,3 ', 5,5'-tetramethyl-4,4'-dihydroxybiphenyl, 2,2'-biphenol, resorcin, catechol , T-butylcatechol, t-butylhydroquinone, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7- Dihydroxynaphthalene, 1,8-dihydroxynaphth 2,3-dihydroxynaphthalene, 2,4-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 2,8-dihydroxynaphthalene, allylated products of the above-mentioned dihydroxynaphthalene Or diallylic phenols such as polyallylated products, allylated bisphenol A, allylated bisphenol F, allylated phenol novolak, or the like, or phenol novolak, bisphenol A novolak, o-cresol novolak, m-cresol novolak, p-cresol novolak, Xylenol novolak, poly-p-hydroxystyrene, tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, fluoroglyce Sinor, pyrogallol, t-butyl pyrogallol, allylated pyrogallol, polyallylated pyrogallol, 1,2,4-benzenetriol, 2,3,4-trihydroxybenzophenone, phenol aralkyl resin, naphthol aralkyl resin, dicyclopentadiene resin, etc. There are glycidyl etherified products derived from halogenated bisphenols such as tetrabromobisphenol A, and the like. These epoxy resins can be used alone or in combination of two or more.

  The epoxy resin composition of the present invention desirably contains the epoxy resin of the above general formula (1) as an epoxy resin in an amount of 50 wt% or more of the epoxy resin component. More preferably, it is 70 wt% or more of the total epoxy resin, more preferably 80 wt% or more. If the use ratio is less than this, the moldability as an epoxy resin composition deteriorates, and the improvement effects such as heat resistance, moisture resistance, thermal conductivity and solder reflow resistance when cured are small.

  As the curing agent in the epoxy resin composition of the present invention, all those generally known as curing agents for epoxy resins can be used. Examples include dicyandiamide, polyhydric phenols, acid anhydrides, aromatic and aliphatic amines. Polyhydric phenols are preferably used in the field of sealing electrical and electronic parts that require moisture resistance and heat resistance. Specific examples of these are as follows. In the resin composition of the present invention, one or more of these curing agents can be mixed and used.

  Examples of the polyhydric phenols include divalent phenols such as bisphenol A, bisphenol F, bisphenol S, fluorene bisphenol, 4,4′-biphenol, 2,2′-biphenol, hydroquinone, resorcin, and naphthalenediol, or , Tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, phenol novolak, o-cresol novolak, naphthol novolak, polyvinylphenol, Phenols, further phenols, naphthols, bisphenol A, bisphenol F, bisphenol S, fluorene bisphenol, 4,4′-biphenol, 2,2′-biphenol, hydroquinone, resorcin, Dihydric phenols formaldehyde such lid diol is acetaldehyde, benzaldehyde, p- hydroxybenzaldehyde, polyhydric phenolic compounds synthesized by condensing agent such as p- xylylene glycol. Moreover, the polyvalent hydroxy resin represented by General formula (3) can also be used.

  Examples of the acid anhydride include phthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyl hymic anhydride, nadic anhydride, and trimellitic anhydride.

  Examples of amines include aromatic amines such as 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylpropane, 4,4′-diaminodiphenylsulfone, m-phenylenediamine, and p-xylylenediamine, ethylenediamine, There are aliphatic amines such as hexamethylenediamine, diethylenetriamine, and triethylenetetramine.

  In the resin composition of the present invention, one or more of these curing agents can be mixed and used.

  Further, in the epoxy resin composition of the present invention, an oligomer or a polymer compound such as polyester, polyamide, polyimide, polyether, polyphenylene ether, polyurethane, petroleum resin, indene coumarone resin, phenoxy resin, etc. is appropriately blended. Alternatively, various additives such as an inorganic filler, a pigment, a refractory agent, a thixotropic agent, a coupling agent, and a fluidity improver may be blended.

  Furthermore, the epoxy resin composition of the present invention can contain an inorganic filler. For example, spherical or crushed fused silica, crystalline silica or other silica powder, alumina, zircon, calcium silicate, carbonic acid Powders of calcium, silicon carbide, boron nitride, beryllia, zirconia, fosterite, steatite, spinel, mullite, titania, etc., or beads made of these spheroids, potassium titanate, silicon carbide, silicon nitride, alumina, etc. Crystal fibers and glass fibers can be used alone or in combination of two or more. Among the inorganic fillers, fused silica is preferable from the viewpoint of reducing the linear expansion coefficient, and alumina is preferable from the viewpoint of high thermal conductivity. The filler shape is preferably 50% or more spherical from the viewpoint of fluidity during molding and mold wear, and it is particularly preferable to use spherical fused silica powder.

  The addition amount of the inorganic filler is usually 50 wt% or more with respect to the epoxy resin composition, but is preferably 70 wt% or more, more preferably 80 wt% or more. If it is less than this, the effects aimed by the present invention such as low hygroscopicity, low thermal expansion, high heat resistance, and high thermal conductivity will not be sufficiently exhibited. These effects are better as the added amount of the inorganic filler is larger. However, the effect is not improved according to the volume fraction, but dramatically improved from a specific added amount. On the other hand, when the added amount of the inorganic filler is larger than this, the viscosity becomes high and the moldability deteriorates, which is not preferable.

  In the epoxy resin composition of the present invention, a known curing accelerator can be blended. Examples include amines, imidazoles, organic phosphines, Lewis acids and the like. Specifically, 1,8-diazabicyclo (5,4,0) undecene-7, 1,5-diaza-bicyclo ( Cycloamidine compounds such as 4,3,0) nonene, 5,6-dibutylamino-1,8-diaza-bicyclo (5,4,0) undecene-7, and maleic anhydride, benzoquinone, diazophenylmethane Compounds having intramolecular polarization formed by adding a compound having a π bond such as, tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol, and the like Derivatives, 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methyl Imidazoles such as midazole and 2-heptadecylimidazole and derivatives thereof, organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine, and phenylphosphine, and maleic anhydride, benzoquinone, Phosphorus compounds with intramolecular polarization formed by adding a compound having a π bond such as diazophenylmethane, tetraphenylphosphonium / tetraphenylborate, tetraphenylphosphonium / ethyltriphenylborate, tetrabutylphosphonium / tetrabutylborate, etc. Substituted phosphonium, tetrasubstituted borate, 2-ethyl-4-methylimidazole, tetraphenylborate, N-methylmorpholine, tetraphenylborate, etc. Such as tetraphenyl boron salts and derivatives thereof. As addition amount, it is the range of 0.2-10 weight part normally with respect to 100 weight part of epoxy resins. These may be used alone or in combination.

  A flame retardant is used for the epoxy resin composition of this invention as needed. Examples of such flame retardants include phosphorous flame retardants such as red phosphorus and phosphoric acid compounds, nitrogen flame retardants such as triazine derivatives, phosphorus nitrogen flame retardants such as phosphazene derivatives, metal oxides, and metal hydrates. And organometallic complexes such as metallocene derivatives, zinc compounds such as zinc borate, zinc stannate, and zinc molybdate. Among these, metal hydrates are preferred. Examples of metal hydrates include aluminum hydroxide, magnesium hydroxide, calcium hydroxide, nickel hydroxide, cobalt hydroxide, iron hydroxide, tin hydroxide, zinc hydroxide, copper hydroxide, and titanium hydroxide. In addition, composite metal hydrates of these metal hydrates and metal oxides such as nickel oxide, cobalt oxide, iron oxide, tin oxide, zinc oxide, copper oxide, and palladium oxide can be used. . Magnesium hydroxide is preferred from the viewpoints of safety, flame retardancy and influence on moldability of the molding material.

  In addition to the above, the epoxy resin composition of the present invention includes higher fatty acids, higher fatty acid metal salts, release agents such as ester waxes and polyolefin waxes, colorants such as carbon black, silanes, titanates, and aluminates. Coupling agents such as system, flexible agents such as silicone powder, stress relaxation agents such as silicone oil and silicone rubber powder, ion trapping agents such as hydrotalcite and antimony-bismuth, and the like can be used as necessary.

  In addition, thermoplastic oligomers can be added to the epoxy resin composition of the present invention from the viewpoint of improving fluidity during molding and improving adhesion to a substrate such as a lead frame. Thermoplastic oligomers include C5 and C9 petroleum resins, styrene resins, indene resins, indene / styrene copolymer resins, indene / styrene / phenol copolymer resins, indene / coumarone copolymer resins, indene / benzothiophene. Examples thereof include copolymer resins. As addition amount, it is the range of 2-30 weight part normally with respect to 100 weight part of epoxy resins.

  Any method may be used for preparing the epoxy resin composition of the present invention as long as various raw materials can be uniformly dispersed and mixed. As a general method, raw materials of a predetermined blending amount are sufficiently mixed by a mixer or the like. Then, a method of melt-kneading with a mixing roll, an extruder or the like, cooling, and pulverizing can be mentioned.

  The epoxy resin composition of the present invention is particularly suitable for sealing a semiconductor device.

  The cured product of the present invention can be obtained by thermally curing the epoxy resin composition. In order to obtain a cured product using the epoxy resin composition of the present invention, for example, methods such as transfer molding, press molding, cast molding, injection molding, and extrusion molding are applied, but from the viewpoint of mass productivity. Transfer molding is preferred.

  Hereinafter, the present invention will be described more specifically with reference to examples.

Synthesis example 1
In a 2000 ml four-necked flask, 186.0 g (1.0 mol) of 4,4′-dihydroxybiphenyl and 600 g of diethylene glycol dimethyl ether were charged and heated to 150 ° C. with stirring under a nitrogen stream. A solution in which 75.3 g (0.3 mol) of 4′-bischloromethylbiphenyl was dissolved was dropped, and the mixture was heated to 170 ° C. and reacted for 2 hours. After the reaction, it was dropped into a large amount of pure water and recovered by reprecipitation to obtain 220 g of a pale yellow crystalline resin. The OH equivalent of the obtained resin was 130.8. The peak temperature in DSC measurement was 248.5 ° C., and the endothermic amount accompanying the melting of the crystals was 95.5 J / g. A GPC chart of the obtained resin is shown in FIG. As for each component ratio in the general formula (3) obtained by GPC measurement, n = 0 is 39.33%, n = 1 is 22.25%, n = 2 is 12.19%, and n = 3 is 8. 14%, n = 4 was 5.58%, and n ≧ 5 was 11.88%. Here, the DSC peak temperature is a value measured using a differential scanning calorimeter (DSC220C type manufactured by Seiko Instruments Inc.) at a heating rate of 5 ° C./min. In addition, GPC measurement was carried out using a device; Nippon Waters Co., Ltd., Model 515A, column: TSK-GEL2000 × 3 and TSK-GEL4000 × 1 (both manufactured by Tosoh Corp.), solvent: tetrahydrofuran, flow rate: 1 ml / Min, temperature: 38 ° C., detector: RI conditions were followed.

Synthesis example 2
A solution prepared by dissolving 167.4 g (0.9 mol) of 4,4′-dihydroxybiphenyl, 540 g of diethylene glycol dimethyl ether, and 90.4 g (0.36 mol) of 4,4′-bischloromethylbiphenyl in 320 g of diethylene glycol dimethyl ether was used. The reaction was conducted in the same manner as in Example 1 except that 205 g of a pale yellow crystalline resin was obtained. The OH equivalent of the obtained resin was 139.2. The DSC peak temperature is 242.4 ° C., and the ratio of each component in the general formula (3) determined by GPC measurement is 31.21% for n = 0, 21.19% for n = 1, and n = 2. 13.38%, n = 3 was 10.63%, n = 4 was 7.55%, and n ≧ 5 was 15.35%.

Synthesis example 3
A solution prepared by dissolving 186.0 g (1.0 mol) of 4,4′-dihydroxybiphenyl, 540 g of diethylene glycol dimethyl ether, and 50.2 g (0.2 mol) of 4,4′-bischloromethylbiphenyl in 320 g of diethylene glycol dimethyl ether was used. The reaction was conducted in the same manner as in Example 1 except that 195 g of a pale yellow crystalline resin was obtained. The OH equivalent of the obtained resin was 125.6. The DSC peak temperature is 255.4 ° C., and the ratio of each component in the general formula (3) determined by GPC measurement is 50.87% for n = 0, 20.67% for n = 1, and n = 2. 11.54%, n = 3 was 7.11%, n = 4 was 3.78%, and n ≧ 5 was 5.87%.

Synthesis example 4
A solution prepared by dissolving 152.5 g (0.82 mol) of 4,4′-dihydroxybiphenyl, 500 g of diethylene glycol dimethyl ether and 112.9 g (0.45 mol) of 4,4′-bischloromethylbiphenyl in 360 g of diethylene glycol dimethyl ether was used. The reaction was conducted in the same manner as in Example 1 except that 201 g of a pale yellow resin was obtained. The OH equivalent of the obtained resin was 150.1. As for each component ratio in the general formula (3) obtained by GPC measurement, n = 0 is 22.03%, n = 1 is 14.65%, n = 2 is 11.89%, and n = 3 is 9. 46%, n = 4 was 7.36%, and n ≧ 5 was 33.87%.

Synthesis example 5
Except for using 186.0 g (1.0 mol) of 4,4′-dihydroxybiphenyl, 600 g of diethylene glycol dimethyl ether, and 52.5 g (0.3 mol) of 1,4-bischloromethylbenzene in 260 g of diethylene glycol dimethyl ether. Reacted in the same manner as in Example 1 to obtain 202 g of a pale yellow crystalline resin. The OH equivalent of the obtained resin was 116.3. The DSC peak temperature is 241.7 ° C. In the general formula (3) determined by GPC measurement, each component ratio corresponding to the structure in which the biphenylene group at the cross-linked site is replaced with a phenylene group is such that n = 0 is 40. 33%, n = 1 was 23.31%, n = 2 was 11.22%, n = 3 was 7.09%, n = 4 was 5.17%, and n ≧ 5 was 12.35%. .

Synthesis Example 6
The reaction was conducted in the same manner as in Synthesis Example 1 except that 200.0 g (1.0 mol) of 4,4′-dihydroxydiphenylmethane was used instead of 4,4′-dihydroxybiphenyl (1.0 mol). The solvent was removed by distillation under reduced pressure to obtain 245 g of a light brown resin. The OH equivalent of the obtained resin was 137.6. In the general formula (3) determined by GPC measurement, each component ratio in the structure in which the 4,4′-dihydroxybiphenyl skeleton is replaced with 4,4′-dihydroxydiphenylmethane is n = 0 = 0.36.89%, n = 1 Was 20.36%, n = 2 was 12.30%, n = 3 was 9.68%, n = 4 was 6.58%, and n ≧ 5 was 13.56%.

Example 1
120 g of the resin obtained in Synthesis Example 1 was dissolved in 509 g of epichlorohydrin and 76.4 g of diethylene glycol dimethyl ether, and 76.5 g of 48% aqueous sodium hydroxide solution was added dropwise at 62 ° C. under reduced pressure (about 130 Torr) over 4 hours. During this time, the generated water was removed from the system by azeotropy with epichlorohydrin, and the distilled epichlorohydrin was returned to the system. After completion of the dropwise addition, the reaction was continued for another hour. Thereafter, epichlorohydrin was distilled off, 971 g of methyl isobutyl ketone was added, and then the salt was removed by washing with water. Thereafter, 19.3 g of a 24% aqueous sodium hydroxide solution was added and reacted at 85 ° C. for 2 hours. After the reaction, filtration and washing with water were performed, and then methyl isobutyl ketone as a solvent was distilled off under reduced pressure to obtain 148 g of epoxy resin (epoxy resin A). Epoxy equivalent was 183.7 and hydrolyzable chlorine was 1400 ppm. A GPC chart of the obtained resin is shown in FIG. Each component ratio in the general formula (1) obtained by GPC measurement is 42.49% for n = 0, 19.41% for n = 1, 12.23% for n = 2, and 8. for n = 3. 50%, n = 4 was 4.56%, and n ≧ 5 was 8.18%. The DSC measurement result is shown in FIG. The peak temperature in the DSC measurement result was 140.0 ° C., and the endotherm accompanying the melting of the crystal was 36.9 J / g. The capillary melting point was 111.5 to 143.8 ° C., and the melt viscosity at 150 ° C. was 51 mPa · s.

Example 2
122 g of the resin obtained in Synthesis Example 2 was dissolved in 486 g of epichlorohydrin and 72.9 g of diethylene glycol dimethyl ether, and 73.0 g of 48% aqueous sodium hydroxide solution was added dropwise at 62 ° C. under reduced pressure (about 130 Torr) over 4 hours. During this time, the generated water was removed from the system by azeotropy with epichlorohydrin, and the distilled epichlorohydrin was returned to the system. After completion of the dropwise addition, the reaction was continued for another hour. Thereafter, epichlorohydrin was distilled off, 970 g of methyl isobutyl ketone was added, and then the salt was removed by washing with water. Thereafter, 19.3 g of a 24% aqueous sodium hydroxide solution was added and reacted at 85 ° C. for 2 hours. After the reaction, filtration and washing with water were performed, and then methyl isobutyl ketone as a solvent was distilled off under reduced pressure to obtain 146 g of epoxy resin (epoxy resin B). Epoxy equivalent was 195.1 and hydrolyzable chlorine was 715 ppm. The peak temperature in DSC measurement was 135.1 ° C., and the endotherm accompanying the melting of the crystals was 29.8 J / g. The capillary melting point was 107.8 to 140.1 ° C., and the melt viscosity at 150 ° C. was 95 mPa · s. As for each component ratio in the general formula (1) determined by GPC measurement, n = 0 is 32.25%, n = 1 is 18.42%, n = 2 is 12.85%, and n = 3 is 9. 42%, n = 4 was 6.01%, and n ≧ 5 was 16.63%.

Example 3
110 g of the resin obtained in Synthesis Example 3 was dissolved in 486 g of epichlorohydrin and 71.5 g of diethylene glycol dimethyl ether, and 70.8 g of a 48% aqueous sodium hydroxide solution was added dropwise at 62 ° C. under reduced pressure (about 130 Torr) over 4 hours. During this time, the generated water was removed from the system by azeotropy with epichlorohydrin, and the distilled epichlorohydrin was returned to the system. After completion of the dropwise addition, the reaction was continued for another hour. Thereafter, epichlorohydrin was distilled off, 972 g of methyl isobutyl ketone was added, and then the salt was removed by washing with water. Thereafter, 15.5 g of a 24% aqueous sodium hydroxide solution was added and reacted at 85 ° C. for 2 hours. After the reaction, filtration and washing with water, methyl isobutyl ketone as a solvent was distilled off under reduced pressure to obtain 149 g of an epoxy resin (epoxy resin C). Epoxy equivalent was 182.4 and hydrolyzable chlorine was 675 ppm. The peak temperature in DSC measurement was 146.1 ° C., and the endothermic amount accompanying the melting of the crystals was 46.1 J / g. The capillary melting point was 118.2 to 147.0 ° C., and the melt viscosity at 150 ° C. was 36 mPa · s. As for each component ratio in the general formula (1) determined by GPC measurement, n = 0 is 49.16%, n = 1 is 20.11%, n = 2 is 10.52%, and n = 3 is 6. 51%, n = 4 was 3.98%, and n ≧ 5 was 6.65%.

Comparative Example 1
125 g of the resin obtained in Synthesis Example 4 was dissolved in 462 g of epichlorohydrin and 69.3 g of diethylene glycol dimethyl ether, and 69.4 g of 48% aqueous sodium hydroxide solution was added dropwise at 62 ° C. under reduced pressure (about 130 Torr) over 4 hours. During this time, the generated water was removed from the system by azeotropy with epichlorohydrin, and the distilled epichlorohydrin was returned to the system. After completion of the dropwise addition, the reaction was continued for another hour. Thereafter, epichlorohydrin was distilled off, 972 g of methyl isobutyl ketone was added, and then the salt was removed by washing with water. Thereafter, 19.3 g of a 24% aqueous sodium hydroxide solution was added and reacted at 85 ° C. for 2 hours. After the reaction, filtration and washing with water were performed, and then methyl isobutyl ketone as a solvent was distilled off under reduced pressure to obtain 148 g of an epoxy resin (epoxy resin D). Epoxy equivalent was 209.2 and hydrolyzable chlorine was 621 ppm. The crystallinity of the obtained resin was low, and no clear melting point was observed by DSC. The melt viscosity at 150 ° C. was 0.52 Pa · s. As for each component ratio in the general formula (1) determined by GPC measurement, n = 0 is 20.75%, n = 1 is 12.48%, n = 2 is 10.59%, and n = 3 is 8. 57%, n = 4 was 5.99%, and n ≧ 5 was 37.11%.

Comparative Example 2
115 g of the resin obtained in Synthesis Example 5 was dissolved in 549 g of epichlorohydrin and 82.4 g of diethylene glycol dimethyl ether, and 82.4 g of 48% sodium hydroxide aqueous solution was added dropwise at 62 ° C. under reduced pressure (about 130 Torr) over 4 hours. During this time, the generated water was removed from the system by azeotropy with epichlorohydrin, and the distilled epichlorohydrin was returned to the system. After completion of the dropwise addition, the reaction was continued for another hour. Thereafter, epichlorohydrin was distilled off, 966 g of methyl isobutyl ketone was added, and then the salt was removed by washing with water. Thereafter, 19.2 g of a 24% aqueous sodium hydroxide solution was added and reacted at 85 ° C. for 2 hours. After the reaction, filtration and washing with water were performed, and then methyl isobutyl ketone as a solvent was distilled off under reduced pressure to obtain 145 g of epoxy resin (epoxy resin E). Epoxy equivalent was 173.0 and hydrolyzable chlorine was 490 ppm. The peak temperature in DSC measurement was 133.6 ° C., and the endothermic amount accompanying the melting of the crystals was 47.6 J / g. The capillary melting point was 110.0 to 142.0 ° C., and the melt viscosity at 150 ° C. was 42 mPa · s. As for each component ratio in the general formula (1) obtained by GPC measurement, n = 0 is 42.92%, n = 1 is 19.64%, n = 2 is 11.46%, and n = 3 is 7. 67%, n = 4 was 4.91%, and n ≧ 5 was 10.64%.

Comparative Example 3
120 g of the resin obtained in Synthesis Example 6 was dissolved in 484 g of epichlorohydrin and 62.9 g of diethylene glycol dimethyl ether, and 69.0 g of 48% aqueous sodium hydroxide solution was added dropwise at 62 ° C. under reduced pressure (about 130 Torr) over 4 hours. During this time, the generated water was removed from the system by azeotropy with epichlorohydrin, and the distilled epichlorohydrin was returned to the system. After completion of the dropwise addition, the reaction was continued for another hour. Thereafter, epichlorohydrin was distilled off, 956 g of methyl isobutyl ketone was added, and then the salt was removed by washing with water. Thereafter, 17.6 g of a 24% aqueous sodium hydroxide solution was added and reacted at 85 ° C. for 2 hours. After the reaction, filtration and washing with water were performed, and then methyl isobutyl ketone as a solvent was distilled off under reduced pressure to obtain 152.5 g of a light brown amorphous epoxy resin (epoxy resin F). Epoxy equivalent was 193.5 and hydrolyzable chlorine was 450 ppm. The softening point was 82 ° C., and the melt viscosity at 150 ° C. was 68 mPa · s. In the general formula (1) determined by GPC measurement, each component ratio in the structure in which the 4,4′-dihydroxybiphenyl skeleton is replaced with 4,4′-dihydroxydiphenylmethane is as follows: n = 0 is 34.54%, n = 1 Was 18.65%, n = 2 was 12.34%, n = 3 was 10.69%, n = 4 was 8.20%, and n ≧ 5 was 15.22%.

Examples 4-6, Comparative Examples 4-7
As the epoxy resin component, the epoxy resins of Examples 1 to 3 (epoxy resins A to C) and the epoxy resins of Comparative Examples 1 to 3 (epoxy resins D to F) were used, and phenol novolac (manufactured by Gunei Chemical Co., Ltd.) as a curing agent. , PSM-4261; OH equivalent weight 103, softening point 82 ° C.). Further, triphenylphosphine was used as a curing accelerator, and spherical alumina (average particle size 12.2 μm) was used as an inorganic filler. After mixing the components shown in Table 1 and mixing thoroughly with a mixer, the kneaded mixture for about 5 minutes with a heating roll was cooled and ground to obtain the epoxy resin compositions of Examples 4 to 6 and Comparative Examples 4 to 7, respectively. Obtained. Using this epoxy resin composition, after molding at 175 ° C. for 5 minutes, post-curing was performed at 180 ° C. for 12 hours to obtain a cured molded product, and its physical properties were evaluated.

  The results are summarized in Table 1. In addition, the number of each compound in Table 1 represents parts by weight. The evaluation was performed as follows. Moreover, since the fluidity of Comparative Example 4 was extremely low and molding was difficult, the physical properties of the molded product could not be evaluated.

(1) Thermal conductivity: Measured by the unsteady hot wire method using an LFA447 type thermal conductivity meter manufactured by NETZSCH.
(2) Linear expansion coefficient, glass transition temperature: Measured using a TMA120C thermomechanical measuring device manufactured by Seiko Instruments Inc. at a rate of temperature increase of 10 ° C./min.
(3) Water absorption rate: A disk having a diameter of 50 mm and a thickness of 3 mm was formed, and after post-curing, the weight change rate after absorbing for 100 hours under the conditions of 85 ° C. and relative humidity of 85% was used.
(4) Gel time: The epoxy resin composition is poured into a concave portion of a gelation tester (Nisshin Kagaku Co., Ltd.) that has been heated to 175 ° C. in advance, and is rotated twice per second using a PTFE stirring rod. The gelation time required for the epoxy resin composition to cure was examined.
(5) Spiral flow: Spiral flow measurement mold conforming to the standard (EMMI-1-66), the epoxy resin composition is injected with spiral flow (150 kgf / cm ² ), curing temperature 175 ° C., curing time 3 minutes The flow length was examined by molding under the following conditions.

Industrial applicability

  Since the epoxy resin of the present invention is crystalline and has a melting point, it is excellent in handleability as a solid and is excellent in moldability because of its low viscosity, and is excellent when applied to an epoxy resin composition. In addition, it provides a cured product excellent in high heat resistance, thermal decomposition stability, and high thermal conductivity, and can be suitably used for applications such as sealing of electric / electronic parts, circuit board materials, and the like. In addition, the epoxy resin obtained by the present invention has a low viscosity and excellent handleability as a solid, and gives a cured product excellent in heat resistance, moisture resistance, and thermal conductivity, printed wiring board, heat dissipation board, It is suitably used for insulating materials in the electric and electronic fields such as semiconductor encapsulation.

Claims (6)

The following general formula (1)

(However, n represents an average value of 0.2 to 4.0, and G represents a glycidyl group.)
An epoxy resin having crystallinity represented by the above formula and having an endothermic peak temperature in the range of 100 to 150 ° C. based on the melting point in differential scanning calorimetry. It is represented by the following general formula (3) by reacting 0.1 to 0.4 mol of a biphenyl condensing agent represented by the following general formula (2) with respect to 1 mol of 4,4′-dihydroxybiphenyl. An epoxy resin having crystallinity in which an endothermic peak temperature based on a melting point in a differential scanning calorimetry obtained by reacting this with a polyvalent hydroxy resin and epichlorohydrin is in the range of 100 to 150 ° C.

(However, X shows a hydroxyl group, a halogen atom, or a C1-C6 alkoxy group.)

(However, n represents an average value of 0.2 to 4.0.)   The epoxy resin according to claim 1, wherein the content of n = 0 isomer in the general formula (1) is in the range of 30 to 60%.   The epoxy resin according to claim 1, wherein the softening point is 100 to 150 ° C and the melt viscosity at 150 ° C is in the range of 0.02 to 0.2 Pa · s.   The epoxy resin composition containing an epoxy resin and a hardening | curing agent contains the epoxy resin in any one of Claims 1-4 as an epoxy resin component, The epoxy resin composition characterized by the above-mentioned.   Hardened | cured material formed by hardening | curing the epoxy resin composition of Claim 5.

Images