JP5323501B2 - 発光ダイオードパッケージ及びその製造方法 - Google Patents

発光ダイオードパッケージ及びその製造方法 Download PDF

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Publication number
JP5323501B2
JP5323501B2 JP2008557208A JP2008557208A JP5323501B2 JP 5323501 B2 JP5323501 B2 JP 5323501B2 JP 2008557208 A JP2008557208 A JP 2008557208A JP 2008557208 A JP2008557208 A JP 2008557208A JP 5323501 B2 JP5323501 B2 JP 5323501B2
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Japan
Prior art keywords
light emitting
emitting diode
metal plate
insulating layer
diode package
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JP2008557208A
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English (en)
Japanese (ja)
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JP2009528695A (ja
JP2009528695A5 (https=
Inventor
ホ シン、ギョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
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LG Innotek Co Ltd
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Publication of JP2009528695A publication Critical patent/JP2009528695A/ja
Publication of JP2009528695A5 publication Critical patent/JP2009528695A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C7/00—Stoves or ranges heated by electric energy
    • F24C7/06—Arrangement or mounting of electric heating elements
    • F24C7/062—Arrangement or mounting of electric heating elements on stoves
    • F24C7/065—Arrangement or mounting of electric heating elements on stoves with reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24C—DOMESTIC STOVES OR RANGES ; DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION
    • F24C7/00—Stoves or ranges heated by electric energy
    • F24C7/08—Arrangement or mounting of control or safety devices
    • F24C7/081—Arrangement or mounting of control or safety devices on stoves
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2008557208A 2006-03-03 2007-02-28 発光ダイオードパッケージ及びその製造方法 Active JP5323501B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020060020305A KR101210090B1 (ko) 2006-03-03 2006-03-03 금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법
KR10-2006-0020305 2006-03-03
PCT/KR2007/001020 WO2007100209A1 (en) 2006-03-03 2007-02-28 Light-emitting diode package and manufacturing method thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012095306A Division JP5759413B2 (ja) 2006-03-03 2012-04-19 発光ダイオードパッケージ

Publications (3)

Publication Number Publication Date
JP2009528695A JP2009528695A (ja) 2009-08-06
JP2009528695A5 JP2009528695A5 (https=) 2010-01-14
JP5323501B2 true JP5323501B2 (ja) 2013-10-23

Family

ID=38459278

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008557208A Active JP5323501B2 (ja) 2006-03-03 2007-02-28 発光ダイオードパッケージ及びその製造方法
JP2012095306A Expired - Fee Related JP5759413B2 (ja) 2006-03-03 2012-04-19 発光ダイオードパッケージ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012095306A Expired - Fee Related JP5759413B2 (ja) 2006-03-03 2012-04-19 発光ダイオードパッケージ

Country Status (6)

Country Link
US (3) US7745844B2 (https=)
JP (2) JP5323501B2 (https=)
KR (1) KR101210090B1 (https=)
CN (1) CN101213892B (https=)
TW (1) TWI429100B (https=)
WO (1) WO2007100209A1 (https=)

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KR101124102B1 (ko) * 2009-08-24 2012-03-21 삼성전기주식회사 발광 소자 패키지용 기판 및 이를 포함하는 발광 소자 패키지
KR20110068689A (ko) * 2009-12-16 2011-06-22 삼성전기주식회사 광학소자용 패키지 기판 및 그 제조방법
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EP2806211A1 (en) * 2013-05-21 2014-11-26 OSRAM GmbH Solid-state lighting device and related process
KR101592649B1 (ko) * 2013-12-24 2016-02-12 현대자동차주식회사 헤드램프용 레이저 광학계
CN104613379B (zh) * 2015-02-06 2017-12-26 东莞佰鸿电子有限公司 一种蓝宝石印刷电路板led灯具及其制作方法
CN105655472A (zh) * 2016-02-02 2016-06-08 上海鼎晖科技股份有限公司 一种金属导热柱cob led光源
CN106449563B (zh) * 2016-11-29 2018-11-13 卡姆丹克太阳能（江苏）有限公司 一种具有鳍形结构的晶圆封装
CN106449443B (zh) * 2016-11-29 2019-01-01 海安浩驰科技有限公司 一种具有鳍形结构的晶圆封装方法
DE102019126021A1 (de) * 2019-09-26 2021-04-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches halbleiterbauelement und verfahren zur herstellung eines optoelektronischen halbleiterbauelements
CN111048651B (zh) * 2019-12-27 2021-12-17 广州市鸿利秉一光电科技有限公司 一种高反射率uvled基板及生产方法
US11894357B2 (en) * 2020-09-10 2024-02-06 Sj Semiconductor (Jiangyin) Corporation System-level packaging structure and method for LED chip
WO2023133720A1 (zh) * 2022-01-12 2023-07-20 谢华棣 立体散热电路板组的制造方法
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CN121336516A (zh) 2023-06-20 2026-01-13 昕诺飞控股有限公司 一种照明设备

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Also Published As

Publication number Publication date
JP2009528695A (ja) 2009-08-06
JP2012178581A (ja) 2012-09-13
CN101213892B (zh) 2012-09-05
TWI429100B (zh) 2014-03-01
US20100230707A1 (en) 2010-09-16
US20080179612A1 (en) 2008-07-31
JP5759413B2 (ja) 2015-08-05
US8796717B2 (en) 2014-08-05
CN101213892A (zh) 2008-07-02
US20120248488A1 (en) 2012-10-04
US8212274B2 (en) 2012-07-03
KR101210090B1 (ko) 2012-12-07
KR20070090509A (ko) 2007-09-06
TW200735425A (en) 2007-09-16
US7745844B2 (en) 2010-06-29
WO2007100209A1 (en) 2007-09-07

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