JP5320502B2 - キャリア付き金属箔 - Google Patents
キャリア付き金属箔 Download PDFInfo
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- JP5320502B2 JP5320502B2 JP2012285140A JP2012285140A JP5320502B2 JP 5320502 B2 JP5320502 B2 JP 5320502B2 JP 2012285140 A JP2012285140 A JP 2012285140A JP 2012285140 A JP2012285140 A JP 2012285140A JP 5320502 B2 JP5320502 B2 JP 5320502B2
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- Prior art keywords
- carrier
- metal foil
- adhesive
- periphery
- central portion
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/06—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions for securing layers together; for attaching the product to another member, e.g. to a support, or to another product, e.g. groove/tongue, interlocking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
- B32B7/14—Interconnection of layers using interposed adhesives or interposed materials with bonding properties applied in spaced arrangements, e.g. in stripes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/106—Carbon fibres, e.g. graphite fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24488—Differential nonuniformity at margin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24777—Edge feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Insulating Bodies (AREA)
- Packaging Frangible Articles (AREA)
Description
近年、電子機器等の軽薄短小化への要求はとどまることを知らず、その電子機器等の基本部品であるプリント配線板の多層化、金属箔回路の高密度化、および、基板の厚さを極限まで薄くする薄厚化の要求が強く求められるようになっている。
定盤としてSUS(Stainless Used Steel)中間板のような金属板を用いる試みがある。具体的には、粘着剤を用いて金属板に銅箔を接着し、その上にビルドアップ層を形成するコアレス基板がある。
箔5、13A、13Bを、エッチング等し必要に応じてビア加工やメッキ加工を行うこと
で、金属箔5、13A、13Bに回路形成をする(第2の回路形成工程)。
そして、積層基板2の製造作業性を向上させることができるキャリア付き金属箔を提供することができる。
3 キャリア
5 金属箔
7 周囲
9 粘着剤
11 プレプリグ
13 金属箔
15 空隙補填材
17 中央部位
19 凹部
Claims (3)
- 板状のキャリアと、
前記キャリアの少なくとも一方の面に積層される金属箔と、
前記キャリアの中央部位の周囲に前記金属箔の中央部位の周囲を設置する設置手段とを有し、
前記設置手段が粘着剤であり、
前記キャリアの中央部位の周囲には微細な凹凸が形成されており、
前記キャリアの中央部位は鏡面になっており、
前記キャリアと前記金属箔と前記粘着剤とを真空雰囲気内で押圧することにより、前記キャリアの中央部位の周囲と前記金属箔の中央部位の周囲とは前記粘着剤によってくっつき、前記キャリアの中央部位と前記金属箔の中央部位とはお互いにくっついており、
前記キャリアの中央部位の周囲に前記金属箔の中央部位の周囲を設置する前記粘着剤よりも内側で切断した、
ことを特徴とするキャリア付き金属箔。 - 板状のキャリアと、
前記キャリアの少なくとも一方の面に積層される金属箔と、
前記キャリアの中央部位の周囲に前記金属箔の中央部位の周囲を設置する設置手段とを有し、
前記設置手段が粘着剤であり、
前記粘着剤が設けられている前記キャリアの部位に、前記粘着剤の厚さ分だけ前記キャリアの厚さを薄くしている凹部を有し、
前記キャリアと前記金属箔と前記粘着剤とを真空雰囲気内で押圧することにより、前記キャリアの中央部位の周囲と前記金属箔の中央部位の周囲とは前記粘着剤によってくっつき、前記キャリアの中央部位と前記金属箔の中央部位とはお互いにくっついており、
前記キャリアの中央部位の周囲に前記金属箔の中央部位の周囲を設置する前記粘着剤よりも内側で切断した、
ことを特徴とするキャリア付き金属箔。 - 請求項1または請求項2に記載のキャリア付き金属箔において、
温度変化による前記キャリアと前記金属箔との伸縮の差が生じても、前記粘着剤が、前記伸縮の差に応じて流動し、前記キャリアと前記金属箔とを、前記キャリアと前記金属箔との内部応力を緩和して保持し続けるように構成されている、
ことを特徴とするキャリア付き金属箔。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012285140A JP5320502B2 (ja) | 2012-03-06 | 2012-12-27 | キャリア付き金属箔 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012048847 | 2012-03-06 | ||
JP2012048847 | 2012-03-06 | ||
JP2012285140A JP5320502B2 (ja) | 2012-03-06 | 2012-12-27 | キャリア付き金属箔 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012185397A Division JP5190553B1 (ja) | 2012-03-06 | 2012-08-24 | キャリア付き金属箔 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013214713A JP2013214713A (ja) | 2013-10-17 |
JP5320502B2 true JP5320502B2 (ja) | 2013-10-23 |
Family
ID=48481490
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012185397A Active JP5190553B1 (ja) | 2012-03-06 | 2012-08-24 | キャリア付き金属箔 |
JP2012285140A Active JP5320502B2 (ja) | 2012-03-06 | 2012-12-27 | キャリア付き金属箔 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012185397A Active JP5190553B1 (ja) | 2012-03-06 | 2012-08-24 | キャリア付き金属箔 |
Country Status (9)
Country | Link |
---|---|
US (1) | US10336034B2 (ja) |
EP (1) | EP2825002A4 (ja) |
JP (2) | JP5190553B1 (ja) |
KR (1) | KR20140131572A (ja) |
CN (1) | CN104160791B (ja) |
IN (1) | IN2014DN08116A (ja) |
PH (1) | PH12014501989A1 (ja) |
TW (1) | TW201338648A (ja) |
WO (1) | WO2013132680A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI569953B (zh) * | 2012-10-04 | 2017-02-11 | Jx Nippon Mining & Metals Corp | Attached metal foil |
US9522514B2 (en) | 2013-12-19 | 2016-12-20 | Intel Corporation | Substrate or panel with releasable core |
US9434135B2 (en) | 2013-12-19 | 2016-09-06 | Intel Corporation | Panel with releasable core |
US9554472B2 (en) * | 2013-12-19 | 2017-01-24 | Intel Corporation | Panel with releasable core |
US9554468B2 (en) * | 2013-12-19 | 2017-01-24 | Intel Corporation | Panel with releasable core |
KR102236002B1 (ko) * | 2014-10-30 | 2021-04-05 | 미쓰이금속광업주식회사 | 캐리어 부착 구리박 및 그것을 이용한 프린트 배선판의 제조 방법 |
KR101898479B1 (ko) * | 2016-04-29 | 2018-09-14 | 주식회사 심텍 | 복수 캐리어 기판을 이용한 인쇄회로기판 제조 방법 |
KR102456322B1 (ko) * | 2017-11-08 | 2022-10-19 | 삼성전기주식회사 | 기판 스트립 및 이를 포함하는 전자소자 패키지 |
JP7260815B2 (ja) * | 2019-04-02 | 2023-04-19 | 日本製鉄株式会社 | 金属-炭素繊維強化樹脂材料複合体 |
JP7432178B2 (ja) * | 2020-01-31 | 2024-02-16 | 国立研究開発法人日本原子力研究開発機構 | 熱化学水素製造法のisプロセスにおけるプロセス溶液濃度の調整方法及びその装置 |
US20240090138A1 (en) * | 2021-01-19 | 2024-03-14 | Beji Sasaki | Prepreg with metal layer, method for manufacturing laminate, and method for manufacturing prepreg with metal layer |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5015318A (en) * | 1987-08-10 | 1991-05-14 | Alcan International Limited | Method of making tamper-evident structures |
MY105514A (en) | 1989-05-05 | 1994-10-31 | Gould Electronic Inc | Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing. |
JPH05144086A (ja) * | 1991-11-18 | 1993-06-11 | Pioneer Electron Corp | 光記録デイスク |
JPH10149578A (ja) * | 1996-11-20 | 1998-06-02 | Taiyo Yuden Co Ltd | 光記録媒体 |
JP3612594B2 (ja) * | 1998-05-29 | 2005-01-19 | 三井金属鉱業株式会社 | 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法 |
US6337471B1 (en) * | 1999-04-23 | 2002-01-08 | The Boeing Company | Combined superplastic forming and adhesive bonding |
US20030017357A1 (en) | 2001-07-13 | 2003-01-23 | Gould Electronics Inc. | Component of printed circuit boards |
JP4240457B2 (ja) * | 2002-05-30 | 2009-03-18 | 三井金属鉱業株式会社 | 両面銅張積層板及びその製造方法 |
US20040112516A1 (en) | 2002-12-13 | 2004-06-17 | Metallized Products, Inc. | Method and apparatus for electric-charge adhering of thin release-layered plastic firlms to thin copper foil substrates and the like and improved products thereby produced |
US6887334B2 (en) * | 2003-01-27 | 2005-05-03 | Honeywell International Inc. | Thin film lamination-delamination process for fluoropolymers |
JP2004273531A (ja) * | 2003-03-05 | 2004-09-30 | Shinko Electric Ind Co Ltd | プリント配線板用銅箔複合板およびその銅箔複合板を使用したプリント配線板の製造方法 |
JP2005142318A (ja) | 2003-11-06 | 2005-06-02 | Mitsubishi Gas Chem Co Inc | レーザーによる銅張板への孔形成方法 |
US7343872B2 (en) * | 2005-11-07 | 2008-03-18 | Temptime Corporation | Freeze indicators suitable for mass production |
TWI313915B (en) | 2005-12-30 | 2009-08-21 | Ind Tech Res Inst | Structure for stress releasing in an electronic package and fabricating the same |
JP4431123B2 (ja) | 2006-05-22 | 2010-03-10 | 日立電線株式会社 | 電子装置用基板およびその製造方法、並びに電子装置およびその製造方法 |
JP2008270697A (ja) * | 2007-03-28 | 2008-11-06 | Hitachi Chem Co Ltd | プリント配線板 |
CN101960335B (zh) * | 2008-03-21 | 2012-08-29 | 木本股份有限公司 | 光控制用薄膜、使用该薄膜的背光装置及凹凸图案形成用模具的制作方法 |
JP4805304B2 (ja) * | 2008-05-12 | 2011-11-02 | Jx日鉱日石金属株式会社 | キャリヤー付き金属箔及び多層コアレス回路基板の製造方法 |
JP4460013B2 (ja) * | 2008-08-22 | 2010-05-12 | 新光電気工業株式会社 | 配線基板の製造方法 |
JP2009143233A (ja) * | 2008-12-24 | 2009-07-02 | Nippon Mining & Metals Co Ltd | キャリア付金属箔 |
JP2009143234A (ja) * | 2008-12-24 | 2009-07-02 | Nippon Mining & Metals Co Ltd | キャリア付金属箔 |
JP4579347B1 (ja) * | 2009-12-22 | 2010-11-10 | Jx日鉱日石金属株式会社 | 積層体の製造方及び積層体 |
WO2011077764A1 (ja) | 2009-12-22 | 2011-06-30 | Jx日鉱日石金属株式会社 | 積層体の製造方及び積層体 |
TWI422000B (zh) | 2010-01-26 | 2014-01-01 | Unimicron Technology Corp | 無核心層封裝基板及其製法 |
JP5697892B2 (ja) * | 2010-05-11 | 2015-04-08 | Jx日鉱日石金属株式会社 | 銅箔積層体及び積層板の製造方法 |
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- 2012-08-31 KR KR20147027648A patent/KR20140131572A/ko not_active Application Discontinuation
- 2012-08-31 CN CN201280071209.6A patent/CN104160791B/zh not_active Expired - Fee Related
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JP2013229280A (ja) | 2013-11-07 |
TWI562692B (ja) | 2016-12-11 |
JP5190553B1 (ja) | 2013-04-24 |
US20150111000A1 (en) | 2015-04-23 |
WO2013132680A1 (ja) | 2013-09-12 |
IN2014DN08116A (ja) | 2015-05-01 |
EP2825002A4 (en) | 2015-12-30 |
US10336034B2 (en) | 2019-07-02 |
TW201338648A (zh) | 2013-09-16 |
CN104160791A (zh) | 2014-11-19 |
KR20140131572A (ko) | 2014-11-13 |
CN104160791B (zh) | 2017-07-28 |
EP2825002A1 (en) | 2015-01-14 |
JP2013214713A (ja) | 2013-10-17 |
PH12014501989A1 (en) | 2014-11-24 |
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